WO2018161210A1 - Device and method for testing fingerprint chip - Google Patents

Device and method for testing fingerprint chip Download PDF

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Publication number
WO2018161210A1
WO2018161210A1 PCT/CN2017/075744 CN2017075744W WO2018161210A1 WO 2018161210 A1 WO2018161210 A1 WO 2018161210A1 CN 2017075744 W CN2017075744 W CN 2017075744W WO 2018161210 A1 WO2018161210 A1 WO 2018161210A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint chip
tray
cover plate
testing
fingerprint
Prior art date
Application number
PCT/CN2017/075744
Other languages
French (fr)
Chinese (zh)
Inventor
李亮
江建威
肖裕权
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN201780000120.3A priority Critical patent/CN107000920A/en
Priority to PCT/CN2017/075744 priority patent/WO2018161210A1/en
Publication of WO2018161210A1 publication Critical patent/WO2018161210A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22Details
    • B65D77/24Inserts or accessories added or incorporated during filling of containers
    • B65D77/26Elements or devices for locating or protecting articles

Definitions

  • the present application relates to the field of terminal devices and, more particularly, to an apparatus and method for testing a fingerprint chip.
  • the test for the fingerprint identification chip has changed from the original single chip test to the entire substrate.
  • a substrate can be packaged in different numbers according to the size of the chip. Therefore, there is a need for a technology that enables testing of such chips.
  • the embodiment of the present application provides an apparatus and method for testing a fingerprint chip, which can implement testing of a whole board fingerprint chip.
  • an apparatus for testing a fingerprint chip comprising:
  • the outer ring of the cover plate is a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, and the M and the N are positive integers;
  • the inner ring of the tray is a trapezoidal structure
  • the main body portion of the tray is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers;
  • the trapezoidal structure and the trapezoidal structure have an anti-fracture space, and the height of the anti-fracture space is greater than the thickness of the whole plate fingerprint chip;
  • the cover plate and the tray are configured to fix the whole board fingerprint chip to the anti-fracture space when the cover plate is closed.
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, thereby The entire panel fingerprint chip can be fixed to the anti-fracture space by the cover plate and the tray, and the chip is not fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space is set to be slightly larger than the thickness of the entire fingerprint chip, thereby enabling It is enough to ensure that the whole board fingerprint chip can be flattened, but not to be fractured.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the means for testing the fingerprint chip further comprises a linker for linking the cover plate and the tray.
  • the device for testing a fingerprint chip further comprises a locking structure for fixing the cover plate and the tray when the cover plate is closed.
  • the locking structure is a locking buckle.
  • the device for testing a fingerprint chip further comprises at least one positioning pin, wherein when the at least one positioning pin is used to place the device in the testing machine, the positioning device configuration in the testing machine is The device is fixed in the test machine.
  • a method for testing a fingerprint chip comprising: a cover plate, an outer ring of the cover plate
  • the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is
  • the main body portion is provided with a hollow structure of an A-row B-column grid, and the A and the B are positive integers, and in the case where the cover plate is closed, the trapezoidal structure and the trapezoidal structure are provided with anti-fracture
  • the height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip to be tested, and the method includes:
  • the pressed whole plate fingerprint chip is fixed to the anti-fracture space by the cover plate and the tray.
  • the method for testing a fingerprint chip in the embodiment of the present application can pass through a net on a cover plate.
  • the lattice hollow structure realizes the test of the surface of the chip by the fake finger
  • the grid type hollow structure on the tray realizes the needle connection of the test pad of the test chip of each chip in the whole fingerprint chip, so
  • the method for testing a fingerprint chip in the embodiment of the present application can implement testing of a whole board fingerprint chip.
  • the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, and therefore, through the cover
  • the board and the tray are capable of fixing the entire board fingerprint chip in the anti-fracture space without causing the fingerprint chip to be fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space is set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the device for testing a fingerprint chip further includes a linker, the method further comprising:
  • the cover and the tray are linked by the linker.
  • the device for testing a fingerprint chip further includes a locking structure, the method further comprising:
  • the cover and the tray are secured by the locking structure when the cover is closed.
  • the locking structure is a locking buckle.
  • the device also includes at least one locating peg for securing the device to the test in cooperation with the locating device under test when the device is placed in the testing machine.
  • the device for testing a fingerprint chip includes a cover plate and a tray, and the main body of the cover plate and the tray are provided with a mesh type hollow structure, and a grid on the cover plate
  • the type hollow structure can be used for the test of the surface of the chip by the dummy finger
  • the grid type hollow structure on the tray can be used for the pad of each chip in the whole board fingerprint chip to be tested to leak out from the grid, so as to facilitate The test probe of the test machine is connected to the needle. Therefore, the device for testing the fingerprint chip of the embodiment of the present application can implement the test of the whole board fingerprint chip.
  • FIG. 1 is a schematic diagram of an apparatus for testing a fingerprint chip in accordance with an embodiment of the present application.
  • Figure 2 is a cross-sectional view of the apparatus for testing a fingerprint chip in a closed state of the cover.
  • Fig. 3 is a view showing a state in which the whole board fingerprint chip is in the tray in a state where the cover is opened.
  • FIG. 4 is a schematic view showing the state of the whole board fingerprint chip in the tray in a closed state of the cover plate;
  • FIG. 5 is a schematic flow chart of a method for testing a fingerprint chip according to the present application.
  • Figure 6 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
  • Figure 7 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
  • the apparatus 100 for testing a fingerprint chip includes:
  • a cover plate 110 the outer ring of the cover plate 110 is a trapezoidal structure 111, the main body portion of the cover plate 110 is provided with a hollow structure 112 of M rows and N columns of meshes, and M and N are positive integers;
  • the inner circumference of the tray 120 is a trapezoidal structure 121, and the main body portion of the tray 120 is provided with a hollow structure 122 of a row A and a column B grid, and the A and the B are positive integers;
  • the trapezoidal structure 111 and the trapezoidal structure 121 have an anti-fracture space 20, and the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip;
  • the cover plate 110 and the tray 120 are used to fix the whole board fingerprint chip to the anti-fracture space 20 when the cover plate 110 is closed.
  • the inner ring of the tray 120 has a trapezoidal structure, that is, the tray 120 is a trapezoidal groove as a whole, and the main body portion of the tray 120 is provided with a hollow structure 122 of A rows and B columns of grids, and the tray 120 can be used.
  • the hollow structure 122 of the A row and B column grid can be used for the pad of each chip in the whole board fingerprint chip to pass the A line B.
  • the column grid leaks from the bottom surface of the tray so that the test probe of the test machine can be connected to the pad of each chip through the bottom surface of the tray.
  • the hollow structure 112 of the M rows and N columns of grids on the cover plate 110 enables the fake finger for testing the fingerprint chip to still touch each of the fingerprint chips in the whole fingerprint chip when the cover 110 is closed.
  • the surface is thus capable of testing the fingerprint recognition function of the fingerprint chip. Therefore, the apparatus for testing a fingerprint chip of the embodiment of the present application can implement testing of the whole board fingerprint chip.
  • the solid portions of the adjacent two grids in the M rows and N columns of grids can be used to press the warped portion of the whole board fingerprint chip to be tested, thereby causing the fake finger to press the surface of the fingerprint chip When the test item on the surface of the fingerprint chip can be better fitted with the fake finger.
  • Figure 2 shows a front cross-sectional view of the apparatus for testing a fingerprint chip when the cover is closed, as shown in Figure 2, the trapezoidal structure 111 of the cover 110 and the trapezoid of the tray 120 when the cover 110 is closed
  • the structure 121 has a fracturing prevention space 20, the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip to be tested, and therefore, when the cover plate 110 is closed, the trapezoidal structure 111 of the cover plate 110 and the tray 120 are The trapezoidal structure 121 cooperates with each other, so that the whole-plate fingerprint chip to be tested can be fixed to the anti-fracture space 20, and the height of the anti-fracture space 20 is greater than the thickness of the whole-plate fingerprint chip. Therefore, the embodiment of the present application
  • the device for testing the fingerprint chip can ensure that the entire fingerprint chip to be tested is not crushed due to excessive pressure while flattening the entire fingerprint chip.
  • the smallest inner ring of the trapezoidal structure 121 (that is, the inner ring where the anti-fracturing space 20 is located) has the same size as the entire fingerprint chip.
  • the size of the smallest inner ring of the trapezoidal structure 121 can be set to be the same as the size of the whole board fingerprint chip, so that the displacement of the whole board fingerprint chip in the tray can be prevented.
  • the tray 120 is provided with an A-row B-column grid, and the A-row B-column grid may be disposed to exactly correspond to each chip in the whole-plate fingerprint chip, so that when the whole-board fingerprint chip is placed in the tray 120, The pads of each chip can leak out just from the A-row B-column grid, so that the pads of each chip in the whole-plate fingerprint chip and the test probe of the test machine can be connected to the needle faster.
  • the size of the minimum inner ring of the tray 120 may also be larger than the size of the whole board fingerprint chip to be tested. In this case, it is only necessary to manually adjust the grid of each chip pad of the whole board fingerprint chip from the tray. The entire fingerprint chip is fixed in the anti-fracture space by leaking out and then closing the cover, so that the displacement of the whole fingerprint chip in the tray can be prevented.
  • FIG. 3 is a schematic view showing the state of the whole board fingerprint chip in the tray when the cover is opened.
  • FIG. 4 is a schematic view showing the state of the whole fingerprint chip in the tray after the cover is closed, as can be seen from FIG.
  • the warped whole-plate fingerprint chip can be flattened, and the whole-board fingerprint chip can be fixed in the anti-fracture space 20 by the cooperation of the cover plate and the trapezoidal structure of the tray, The height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be prevented from being fractured.
  • the difference between the height of the anti-fracturing space 20 and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the height of the anti-fracture space may be set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
  • the apparatus for testing a fingerprint chip of the embodiment of the present application can flatten the whole fingerprint chip by the physical part of two adjacent grids in the cover plate before testing the whole board fingerprint chip to be tested. And fixing the whole board fingerprint chip to the anti-fracture space through the trapezoidal structure of the cover plate and the tray. Since the height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip, the whole can be guaranteed The board fingerprint chip is flat and does not cause the chip to be fractured due to excessive pressure.
  • the A and the B are determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the tray 120 can be determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip.
  • the size of each grid can be slightly larger than the size of the pad of the fingerprint chip, and the spacing between adjacent grids can also be The arrangement of the fingerprint chips in the whole board fingerprint chip is determined.
  • the apparatus 100 for testing a fingerprint chip further includes a linker 130 for linking the cover plate 110 and the tray 120.
  • the apparatus 100 for testing a fingerprint chip may further include a linker 130, which may be active, and the trapezoidal structure of the cover plate 110 may be implemented by adjusting the linker 130. Alignment of the trapezoidal structure of the tray 120.
  • the device 100 for testing a fingerprint chip further includes a locking structure 140, the locking The structure 140 is used to secure the cover plate 110 and the tray 120 when the cover is closed.
  • the apparatus 100 for testing a fingerprint chip further includes a locking structure 140 that can be used to secure the cover 110 and the tray 120 when the cover is closed.
  • the locking structure may be a locking buckle. Therefore, after the whole board fingerprint chip to be tested is placed in the tray 120, the cover plate 110 is closed, and the locking structure 140 is locked, and the device 100 for testing the fingerprint chip can be placed in the testing machine for testing. Since the whole board fingerprint chip is placed in the device 100 for testing the fingerprint chip for moving and testing, the fingerprint chip is prevented from being scratched by the fingerprint chip by directly clamping the chip, or the fingerprint chip is affected by the collision. The appearance even affects the problem of use. At the same time, the problem that the fingerprint chip is moved by the adsorption method is easy to leave a fingerprint on the surface of the fingerprint chip or the fingerprint chip is deformed due to excessive suction.
  • the apparatus 100 for testing a fingerprint chip may further include at least one positioning pin for cooperating with a positioning device in the testing machine when the device 100 is placed in the testing machine, The device 100 is fixed in the test machine.
  • FIG. 1 exemplarily shows four positioning pins 150.
  • the device 100 may include fewer than four positioning pins, for example, two, or more than four, for example, six, The number of the positioning pins is not limited in the application embodiment.
  • the position of the positioning pin in the device 100 is not limited in the embodiment of the present application.
  • the device embodiment of the present application is described in detail above with reference to FIG. 1 to FIG. 4 .
  • the method embodiment of the present application is described in detail below with reference to FIG. 5 to FIG. 7 . It should be understood that the method embodiment and the device embodiment correspond to each other. The description can be made with reference to the device embodiment.
  • FIG. 5 shows a schematic flow chart of a method for testing a fingerprint chip according to an embodiment of the present application, the method being applied to a device for testing a fingerprint chip
  • the device for testing a fingerprint chip comprising: a cover plate,
  • the outer ring of the cover plate has a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is
  • the main body portion is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers.
  • the method 500 includes:
  • the whole board fingerprint chip is placed on the main body portion of the tray;
  • the fake finger can perform the test of the fingerprint recognition function on the surface of the chip through the mesh type hollow structure on the cover plate, and the test probe of the test machine can pass through the tray.
  • the mesh type hollow structure is connected to the pad of each chip in the whole board fingerprint chip. Therefore, the method for testing the fingerprint chip in the embodiment of the present application can implement the test of the whole board fingerprint chip.
  • the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because
  • the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, so that the entire plate can be passed through the trapezoidal structure of the cover plate and the tray in the case where the cover plate is closed
  • the fingerprint chip is fixed in the anti-fracture space, and since the height of the anti-fracture space is larger than the thickness of the whole-plate fingerprint chip to be tested, the fingerprint chip is not fractured due to excessive pressure.
  • the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
  • the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
  • the A and the B are determined according to the number of fingerprint chips included in the whole board fingerprint chip.
  • the device for testing the fingerprint chip further includes a linker, the method further comprising:
  • the cover and the tray are linked by the linker.
  • the device for testing the fingerprint chip further includes a locking structure, the method further comprising:
  • the cover and the tray are secured by the locking structure when the cover is closed.
  • the locking structure is a locking buckle.
  • the device for testing the fingerprint chip may further comprise at least one positioning pin, wherein the at least one positioning pin is used to cooperate with the positioning device in the testing machine when the device is placed in the testing machine, and fix the device In the test machine.
  • the operation flow may include the following steps:
  • the device for testing the fingerprint chip is opened, and the whole board fingerprint chip is placed in the tray of the device for testing the fingerprint chip;
  • a device for testing the fingerprint chip with the entire fingerprint chip can be obtained.
  • the device for testing the fingerprint chip equipped with the whole board fingerprint chip can be placed in the testing machine by the robot, so that the whole board fingerprint chip can be tested by the testing machine, because The whole board fingerprint chip is placed in the device for testing the fingerprint chip for movement, so the robot grips the device for testing the fingerprint chip, so that the fingerprint chip is not scratched or bumped.
  • the size of the sequence numbers of the foregoing processes does not mean the order of execution sequence, and the order of execution of each process should be determined by its function and internal logic, and should not be applied to the embodiment of the present application.
  • the implementation process constitutes any limitation.
  • the disclosed systems, devices, and methods may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the unit described as a separate component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, may be located in one place, or It can also be distributed to multiple network elements. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the functions may be stored in a computer readable storage medium if implemented in the form of a software functional unit and sold or used as a standalone product.
  • the technical solution of the present application which is essential or contributes to the prior art, or a part of the technical solution, may be embodied in the form of a software product, which is stored in a storage medium, including
  • the instructions are used to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present application.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .

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Abstract

Disclosed are a device (100) for testing a fingerprint chip and a method for testing a fingerprint chip, allowing testing of an entire substrate of fingerprint chips. The device (100) for testing a fingerprint chip comprises: a cover plate (110), an outer ring of the cover plate (110) being a first trapezoidal structure (111), and a main part of the cover plate (110) being provided with a recessed structure (112) being a grid of M rows and N columns, wherein M and N are positive integers; a tray (120), an inner ring of the tray (120) being a second trapezoidal structure (121), a main part of the tray (120) being provided with a recessed structure (122) being a grid of A rows and B columns, wherein A and B are positive integers. When the cover plate (110) is closed, there is an anti-cracking space (20) between the first trapezoidal structure (111) and the second trapezoidal structure (121), the height of the anti-cracking space (20) being greater than the thickness of the entire substrate of fingerprint chips. The cover plate (110) and the tray (120) are used to fix the entire substrate of fingerprint chips in the anti-cracking space (20) when the cover plate (110) is closed.

Description

用于测试指纹芯片的装置和方法Apparatus and method for testing a fingerprint chip 技术领域Technical field
本申请涉及终端设备领域,并且更具体地,涉及用于测试指纹芯片的装置和方法。The present application relates to the field of terminal devices and, more particularly, to an apparatus and method for testing a fingerprint chip.
背景技术Background technique
随着移动设备对指纹识别芯片需求的大量提升,对于指纹识别芯片的生产、测试产能的需求也大幅上升,于是,对于指纹识别芯片的测试由原有的单颗芯片测试变成了整条基板的测试,一条基板根据芯片的尺寸大小可以封装不同数量的颗数。因此,需要一种技术,能够实现对此类芯片的测试。With the increase in the demand for fingerprint identification chips by mobile devices, the demand for the production and test capacity of fingerprint identification chips has also increased significantly. Therefore, the test for the fingerprint identification chip has changed from the original single chip test to the entire substrate. In the test, a substrate can be packaged in different numbers according to the size of the chip. Therefore, there is a need for a technology that enables testing of such chips.
发明内容Summary of the invention
本申请实施例提供一种用于测试指纹芯片的装置和方法,能够实现对整板指纹芯片的测试。The embodiment of the present application provides an apparatus and method for testing a fingerprint chip, which can implement testing of a whole board fingerprint chip.
第一方面,提供了一种用于测试指纹芯片的装置,其特征在于,包括:In a first aspect, an apparatus for testing a fingerprint chip is provided, comprising:
盖板,所述盖板的外圈为梯形结构,所述盖板的主体部分设置有M行N列网格的镂空结构,所述M和所述N为正整数;a cover plate, the outer ring of the cover plate is a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, and the M and the N are positive integers;
托盘,所述托盘的内圈为梯形结构,所述托盘的主体部分设置有A行B列网格的镂空结构,所述A和所述B为正整数;a tray, the inner ring of the tray is a trapezoidal structure, the main body portion of the tray is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers;
在所述盖板闭合的情况下,所述梯形结构和所述梯形结构之间具有防压裂空间,所述防压裂空间的高度大于所述整板指纹芯片的厚度;In the case that the cover plate is closed, the trapezoidal structure and the trapezoidal structure have an anti-fracture space, and the height of the anti-fracture space is greater than the thickness of the whole plate fingerprint chip;
所述盖板和所述托盘用于在所述盖板闭合时,将所述整板指纹芯片固定于所述防压裂空间。The cover plate and the tray are configured to fix the whole board fingerprint chip to the anti-fracture space when the cover plate is closed.
因此,该用于测试的装置的盖板的梯形结构和托盘的梯形结构在盖板闭合时具有防压裂空间,并且该防压裂空间的高度大于待测试的整板指纹芯片的厚度,从而通过盖板和托盘能够将该整板指纹芯片固定于该防压裂空间,并且不会由于压力过当造成芯片压裂。Therefore, the trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, thereby The entire panel fingerprint chip can be fixed to the anti-fracture space by the cover plate and the tray, and the chip is not fractured due to excessive pressure.
可选地,所述防压裂空间的高度与所述整板指纹芯片的厚度的差值小于高度阈值。Optionally, the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
因此,设置该防压裂空间的高度略大于该整板指纹芯片的厚度,从而能 够保证该整板指纹芯片能够被压平,但不至于被压裂。Therefore, the height of the anti-fracture space is set to be slightly larger than the thickness of the entire fingerprint chip, thereby enabling It is enough to ensure that the whole board fingerprint chip can be flattened, but not to be fractured.
可选地,所述梯形结构的最小的内圈的尺寸与所述整板指纹芯片的尺寸相同。Optionally, the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
因此,能够保证将该整板指纹芯片放置于该托盘中时,能够使得该整板指纹芯片中的每个芯片的焊盘和测试机的测试探针能够更快的对针连接。Therefore, it can be ensured that when the whole board fingerprint chip is placed in the tray, the pad of each chip in the whole board fingerprint chip and the test probe of the testing machine can be connected to the needle more quickly.
可选地,所述A和所述B根据所述整板指纹芯片中的指纹芯片的排布情况确定。Optionally, the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
因此,能够保证该整板指纹芯片中的每个芯片都能够从该托盘中的A行B列网格露出。Therefore, it can be ensured that each of the entire board fingerprint chips can be exposed from the A row and B column grids in the tray.
可选地,所述用于测试指纹芯片的装置还包括链接器,用于链接所述盖板和所述托盘。Optionally, the means for testing the fingerprint chip further comprises a linker for linking the cover plate and the tray.
可选地,所述用于测试指纹芯片的装置还包括锁紧结构,所述锁紧结构用于所述盖板闭合时,固定所述盖板和所述托盘。Optionally, the device for testing a fingerprint chip further comprises a locking structure for fixing the cover plate and the tray when the cover plate is closed.
可选地,所述锁紧结构为锁紧扣。Optionally, the locking structure is a locking buckle.
可选地,所述用于测试指纹芯片的装置还包括至少一个定位栓,所述至少一个定位栓用于将所述装置放置于测试机中时,与所述测试机中的定位装置配置将所述装置固定于所述测试机中。Optionally, the device for testing a fingerprint chip further comprises at least one positioning pin, wherein when the at least one positioning pin is used to place the device in the testing machine, the positioning device configuration in the testing machine is The device is fixed in the test machine.
第二方面,提供了一种用于测试指纹芯片的方法,所述方法应用于用于测试指纹芯片的装置,所述用于测试指纹芯片的装置包括:盖板,所述盖板的外圈为梯形结构,所述盖板的主体部分设置有M行N列网格的镂空结构,所述M和所述N为正整数,托盘,所述托盘的内圈为梯形结构,所述托盘的主体部分设置有A行B列网格的镂空结构,所述A和所述B为正整数,在所述盖板闭合的情况下,所述梯形结构和所述梯形结构之间具有防压裂空间,所述防压裂空间的高度大于待测试的整板指纹芯片的厚度,所述方法包括:In a second aspect, a method for testing a fingerprint chip is provided, the method being applied to a device for testing a fingerprint chip, the device for testing a fingerprint chip comprising: a cover plate, an outer ring of the cover plate In the trapezoidal structure, the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is The main body portion is provided with a hollow structure of an A-row B-column grid, and the A and the B are positive integers, and in the case where the cover plate is closed, the trapezoidal structure and the trapezoidal structure are provided with anti-fracture The height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip to be tested, and the method includes:
将所述整板指纹芯片放置于所述托盘的主体部分;Placing the whole board fingerprint chip on a main body portion of the tray;
闭合所述盖板,通过所述M行N列网格中的相邻两个网格之间的实体部分按压所述整板指纹芯片的翘曲位置;Closing the cover plate, pressing a warpage position of the whole board fingerprint chip through a physical portion between two adjacent grids in the M rows and N columns of grids;
通过所述盖板和所述托盘将按压后的所述整板指纹芯片固定于所述防压裂空间。The pressed whole plate fingerprint chip is fixed to the anti-fracture space by the cover plate and the tray.
因此,本申请实施例的用于测试指纹芯片的方法,可以通过盖板上的网 格型镂空结构实现假手指对芯片表面的测试,通过该托盘上的网格型镂空结构实现对整板指纹芯片中的每个芯片的焊盘与测试机的测试探针进行对针连接,因此,本申请实施例的用于测试指纹芯片的方法,能够实现对整板指纹芯片的测试。Therefore, the method for testing a fingerprint chip in the embodiment of the present application can pass through a net on a cover plate. The lattice hollow structure realizes the test of the surface of the chip by the fake finger, and the grid type hollow structure on the tray realizes the needle connection of the test pad of the test chip of each chip in the whole fingerprint chip, so The method for testing a fingerprint chip in the embodiment of the present application can implement testing of a whole board fingerprint chip.
进一步地,本申请实施例的用于测试指纹芯片的方法,通过该M行N列网格中的相邻两个网格之间的实体部分按压该整板指纹芯片的翘曲位置,由于该用于测试的装置的盖板的梯形结构和托盘的梯形结构在盖板闭合时具有防压裂空间,并且该防压裂空间的高度大于待测试的整板指纹芯片的厚度,因此,通过盖板和托盘能够将该整板指纹芯片固定于该防压裂空间中,并且不会由于压力过当造成指纹芯片压裂。Further, the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because The trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, and the height of the anti-fracture space is greater than the thickness of the entire plate fingerprint chip to be tested, and therefore, through the cover The board and the tray are capable of fixing the entire board fingerprint chip in the anti-fracture space without causing the fingerprint chip to be fractured due to excessive pressure.
可选地,所述防压裂空间的高度与所述整板指纹芯片的厚度的差值小于高度阈值。Optionally, the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
因此,设置该防压裂空间的高度略大于该整板指纹芯片的厚度,从而能够保证该整板指纹芯片能够被压平,但不至于被压裂。Therefore, the height of the anti-fracture space is set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
可选地,所述梯形结构的最小的内圈的尺寸与所述整板指纹芯片的尺寸相同。Optionally, the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
因此,能够保证将该整板指纹芯片放置于该托盘中时,能够使得该整板指纹芯片中的每个芯片的焊盘和测试机的测试探针能够更快的对针连接。Therefore, it can be ensured that when the whole board fingerprint chip is placed in the tray, the pad of each chip in the whole board fingerprint chip and the test probe of the testing machine can be connected to the needle more quickly.
可选地,所述A和所述B根据所述整板指纹芯片中的指纹芯片的排布情况确定。Optionally, the A and the B are determined according to an arrangement of the fingerprint chips in the whole board fingerprint chip.
可选地,所述用于测试指纹芯片的装置还包括链接器,所述方法还包括:Optionally, the device for testing a fingerprint chip further includes a linker, the method further comprising:
通过所述链接器链接所述盖板和所述托盘。The cover and the tray are linked by the linker.
可选地,所述用于测试指纹芯片的装置还包括锁紧结构,所述方法还包括:Optionally, the device for testing a fingerprint chip further includes a locking structure, the method further comprising:
在所述盖板闭合时,通过所述锁紧结构固定所述盖板和所述托盘。The cover and the tray are secured by the locking structure when the cover is closed.
可选地,所述锁紧结构为锁紧扣。Optionally, the locking structure is a locking buckle.
所述装置还包括至少一个定位栓,所述至少一个定位栓用于将所述装置放置于测试机中时,与所述测试中的定位装置配合将所述装置固定于所述测试中。The device also includes at least one locating peg for securing the device to the test in cooperation with the locating device under test when the device is placed in the testing machine.
基于上述技术方案,本申请实施例的用于测试指纹芯片的装置,包括盖板和托盘,该盖板和托盘的主体都设置有网格型的镂空结构,盖板上的网格 型镂空结构可以用于假手指对芯片表面的测试,该托盘上的网格型镂空结构可以用于待测试的整板指纹芯片中的每个芯片的焊盘从网格中漏出,以便于与测试机的测试探针进行对针连接,因此,本申请实施例的用于测试指纹芯片的装置,能够实现对整板指纹芯片的测试。Based on the above technical solution, the device for testing a fingerprint chip according to an embodiment of the present application includes a cover plate and a tray, and the main body of the cover plate and the tray are provided with a mesh type hollow structure, and a grid on the cover plate The type hollow structure can be used for the test of the surface of the chip by the dummy finger, and the grid type hollow structure on the tray can be used for the pad of each chip in the whole board fingerprint chip to be tested to leak out from the grid, so as to facilitate The test probe of the test machine is connected to the needle. Therefore, the device for testing the fingerprint chip of the embodiment of the present application can implement the test of the whole board fingerprint chip.
附图说明DRAWINGS
图1是根据本申请实施例的用于测试指纹芯片的装置的示意图。1 is a schematic diagram of an apparatus for testing a fingerprint chip in accordance with an embodiment of the present application.
图2是盖板闭合状态下用于测试指纹芯片的装置的剖视图。Figure 2 is a cross-sectional view of the apparatus for testing a fingerprint chip in a closed state of the cover.
图3是盖板打开状态下整板指纹芯片在托盘中的状态的示意图。Fig. 3 is a view showing a state in which the whole board fingerprint chip is in the tray in a state where the cover is opened.
图4是盖板闭合状态下整板指纹芯片在托盘中的状态的示意图4 is a schematic view showing the state of the whole board fingerprint chip in the tray in a closed state of the cover plate;
图5是根据本申请所述的用于测试指纹芯片的方法的示意性流程图。FIG. 5 is a schematic flow chart of a method for testing a fingerprint chip according to the present application.
图6是用于测试指纹芯片的装置的操作流程图。Figure 6 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
图7是用于测试指纹芯片的装置的操作流程图。Figure 7 is a flow chart showing the operation of the apparatus for testing a fingerprint chip.
具体实施方式detailed description
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行地描述。The technical solutions in the embodiments of the present application are described below in conjunction with the accompanying drawings in the embodiments of the present application.
图1示出了根据本申请实施例的用于测试指纹芯片的装置的示意图,如图1所示,该用于测试指纹芯片的装置100包括:1 shows a schematic diagram of an apparatus for testing a fingerprint chip according to an embodiment of the present application. As shown in FIG. 1, the apparatus 100 for testing a fingerprint chip includes:
盖板110,该盖板110的外圈为梯形结构111,该盖板110的主体部分设置有M行N列网格的镂空结构112,该M和该N为正整数;a cover plate 110, the outer ring of the cover plate 110 is a trapezoidal structure 111, the main body portion of the cover plate 110 is provided with a hollow structure 112 of M rows and N columns of meshes, and M and N are positive integers;
托盘120,该托盘120的内圈为梯形结构121,该托盘120的主体部分设置有A行B列网格的镂空结构122,该A和该B为正整数;The inner circumference of the tray 120 is a trapezoidal structure 121, and the main body portion of the tray 120 is provided with a hollow structure 122 of a row A and a column B grid, and the A and the B are positive integers;
在该盖板110闭合的情况下,该梯形结构111和该梯形结构121之间具有防压裂空间20,该防压裂空间20的高度大于该整板指纹芯片的厚度;In the case that the cover plate 110 is closed, the trapezoidal structure 111 and the trapezoidal structure 121 have an anti-fracture space 20, and the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip;
该盖板110和该托盘120用于在该盖板110闭合时,将该整板指纹芯片固定于该防压裂空间20。The cover plate 110 and the tray 120 are used to fix the whole board fingerprint chip to the anti-fracture space 20 when the cover plate 110 is closed.
具体而言,该托盘120的内圈为梯形结构,也就是说该托盘120整体为一个梯形槽,该托盘120的主体部分设置有A行B列网格的镂空结构122,该托盘120可以用于放置待测试的整板指纹芯片,该A行B列网格的镂空结构122可以用于整板指纹芯片中的每个芯片的焊盘(pad)通过该A行B 列网格从该托盘的底面漏出,从而测试机的测试探针可以通过托盘的底面连接该每个芯片的pad。该盖板110上的M行N列网格的镂空结构112使得在该盖板110闭合时,用于对指纹芯片进行测试的假手指依然能够触摸该整板指纹芯片中的每个指纹芯片的表面,从而能够测试指纹芯片的指纹识别功能。因此,本申请实施例的用于测试指纹芯片的装置,能够实现对整板指纹芯片的测试。Specifically, the inner ring of the tray 120 has a trapezoidal structure, that is, the tray 120 is a trapezoidal groove as a whole, and the main body portion of the tray 120 is provided with a hollow structure 122 of A rows and B columns of grids, and the tray 120 can be used. For placing the whole board fingerprint chip to be tested, the hollow structure 122 of the A row and B column grid can be used for the pad of each chip in the whole board fingerprint chip to pass the A line B. The column grid leaks from the bottom surface of the tray so that the test probe of the test machine can be connected to the pad of each chip through the bottom surface of the tray. The hollow structure 112 of the M rows and N columns of grids on the cover plate 110 enables the fake finger for testing the fingerprint chip to still touch each of the fingerprint chips in the whole fingerprint chip when the cover 110 is closed. The surface is thus capable of testing the fingerprint recognition function of the fingerprint chip. Therefore, the apparatus for testing a fingerprint chip of the embodiment of the present application can implement testing of the whole board fingerprint chip.
在该盖板110闭合时,该M行N列网格中的相邻两个网格的实体部分可以用于按压待测试的整板指纹芯片的翘曲部分,从而使得假手指按压指纹芯片表面时,指纹芯片表面的测试项能够和假手指更好的贴合。When the cover plate 110 is closed, the solid portions of the adjacent two grids in the M rows and N columns of grids can be used to press the warped portion of the whole board fingerprint chip to be tested, thereby causing the fake finger to press the surface of the fingerprint chip When the test item on the surface of the fingerprint chip can be better fitted with the fake finger.
图2示出了将盖板闭合时,该用于测试指纹芯片的装置的正面剖视图,如图2所示,在该盖板110闭合时,该盖板110的梯形结构111和托盘120的梯形结构121具有防压裂空间20,该防压裂空间20的高度大于待测试的整板指纹芯片的厚度,因此,在盖板110闭合时,通过该盖板110的梯形结构111和托盘120的梯形结构121相互配合,使得该待测试的整板指纹芯片能够被固定于该防压裂空间20,由于该防压裂空间20的高度大于该整板指纹芯片的厚度,因此,本申请实施例的用于测试指纹芯片的装置能够保证在压平该整板指纹芯片的同时,不会由于压力过当导致压裂待测试的整板指纹芯片。Figure 2 shows a front cross-sectional view of the apparatus for testing a fingerprint chip when the cover is closed, as shown in Figure 2, the trapezoidal structure 111 of the cover 110 and the trapezoid of the tray 120 when the cover 110 is closed The structure 121 has a fracturing prevention space 20, the height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip to be tested, and therefore, when the cover plate 110 is closed, the trapezoidal structure 111 of the cover plate 110 and the tray 120 are The trapezoidal structure 121 cooperates with each other, so that the whole-plate fingerprint chip to be tested can be fixed to the anti-fracture space 20, and the height of the anti-fracture space 20 is greater than the thickness of the whole-plate fingerprint chip. Therefore, the embodiment of the present application The device for testing the fingerprint chip can ensure that the entire fingerprint chip to be tested is not crushed due to excessive pressure while flattening the entire fingerprint chip.
可选地,该梯形结构121的最小的内圈(也就是防压裂空间20所在的内圈)的尺寸与该整板指纹芯片的尺寸相同。Optionally, the smallest inner ring of the trapezoidal structure 121 (that is, the inner ring where the anti-fracturing space 20 is located) has the same size as the entire fingerprint chip.
在实际应用中,可以设置该梯形结构121的最小的内圈的尺寸与整板指纹芯片的尺寸相同,从而能够防止该整板指纹芯片在该托盘中的移位。托盘120中设置有A行B列网格,该A行B列网格可以设置为正好对应该整板指纹芯片中的每个芯片,从而将该整板指纹芯片放置在该托盘120中时,该每个芯片的焊盘可以正好从该A行B列网格漏出,从而能够实现该整板指纹芯片中的每个芯片的焊盘和测试机的测试探针能够更快的对针连接。In practical applications, the size of the smallest inner ring of the trapezoidal structure 121 can be set to be the same as the size of the whole board fingerprint chip, so that the displacement of the whole board fingerprint chip in the tray can be prevented. The tray 120 is provided with an A-row B-column grid, and the A-row B-column grid may be disposed to exactly correspond to each chip in the whole-plate fingerprint chip, so that when the whole-board fingerprint chip is placed in the tray 120, The pads of each chip can leak out just from the A-row B-column grid, so that the pads of each chip in the whole-plate fingerprint chip and the test probe of the test machine can be connected to the needle faster.
应理解,该托盘120的最小内圈的尺寸也可以大于该待测试的整板指纹芯片的尺寸,此情况下,只需手动调整该整板指纹芯片的每个芯片pad从托盘中的网格中漏出,然后闭合盖板,即可将该整板指纹芯片固定在该防压裂空间,从而能够防止该整板指纹芯片在该托盘中的移位。It should be understood that the size of the minimum inner ring of the tray 120 may also be larger than the size of the whole board fingerprint chip to be tested. In this case, it is only necessary to manually adjust the grid of each chip pad of the whole board fingerprint chip from the tray. The entire fingerprint chip is fixed in the anti-fracture space by leaking out and then closing the cover, so that the displacement of the whole fingerprint chip in the tray can be prevented.
图3所示为盖板打开状态时,整板指纹芯片在托盘中的状态的示意图, 从图3可以看出,盖板打开时,该整板指纹芯片处于翘曲状态,图4所示为盖板闭合后,该整板指纹芯片在托盘中的状态的示意图,从图4可以看出,该盖板闭合后,可以将翘曲的整板指纹芯片压平,并且通过该盖板和托盘的梯形结构的配合,能够将该整板指纹芯片固定于该防压裂空间20,由于该防压裂空间20的高度大于该整板指纹芯片的厚度,从而能够防止压裂该整板指纹芯片。Figure 3 is a schematic view showing the state of the whole board fingerprint chip in the tray when the cover is opened. As can be seen from FIG. 3, when the cover is opened, the whole fingerprint chip is in a warped state, and FIG. 4 is a schematic view showing the state of the whole fingerprint chip in the tray after the cover is closed, as can be seen from FIG. After the cover is closed, the warped whole-plate fingerprint chip can be flattened, and the whole-board fingerprint chip can be fixed in the anti-fracture space 20 by the cooperation of the cover plate and the trapezoidal structure of the tray, The height of the anti-fracturing space 20 is greater than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be prevented from being fractured.
可选地,该防压裂空间20的高度与该整板指纹芯片的厚度的差值小于高度阈值。Optionally, the difference between the height of the anti-fracturing space 20 and the thickness of the whole board fingerprint chip is less than a height threshold.
在具体实现中,可以设置该防压裂空间的高度略大于该整板指纹芯片的厚度,从而能够保证该整板指纹芯片能够被压平,但不至于被压裂。In a specific implementation, the height of the anti-fracture space may be set to be slightly larger than the thickness of the whole board fingerprint chip, so that the whole board fingerprint chip can be flattened without being fractured.
因此,本申请实施例的用于测试指纹芯片的装置,在对待测试的整板指纹芯片进行测试之前,可以通过盖板中的相邻两个网格的实体部分将该整板指纹芯片压平,并且可以通过该盖板和托盘的梯形结构将该整板指纹芯片固定于该防压裂空间,由于该防压裂空间的高度大于该整板指纹芯片的厚度,因此,能够保证将该整板指纹芯片压平并且不会因为压力过当造成芯片被压裂。Therefore, the apparatus for testing a fingerprint chip of the embodiment of the present application can flatten the whole fingerprint chip by the physical part of two adjacent grids in the cover plate before testing the whole board fingerprint chip to be tested. And fixing the whole board fingerprint chip to the anti-fracture space through the trapezoidal structure of the cover plate and the tray. Since the height of the anti-fracture space is greater than the thickness of the whole board fingerprint chip, the whole can be guaranteed The board fingerprint chip is flat and does not cause the chip to be fractured due to excessive pressure.
可选地,该A和该B根据该整板指纹芯片中的指纹芯片的排布情况确定。Optionally, the A and the B are determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip.
具体地,为了实现该整板指纹芯片中的每个芯片都能够从该托盘中的A行B列网格露出,可以根据该整板指纹芯片中的指纹芯片的排布情况确定该托盘120中的网格的行数A和列数B,例如,该整板指纹芯片包括4行12列指纹芯片,可以设置该托盘120中的网格数也为4行12列,即A=4,B=12,每个网格的大小可以根据指纹芯片的pad的大小确定,可选地,每个网格的大小可以略大于指纹芯片的pad的大小,相邻网格之间的间距也可以根据整板指纹芯片中的指纹芯片的排布情况确定。Specifically, in order to realize that each chip in the whole board fingerprint chip can be exposed from the A row and B column grids in the tray, the tray 120 can be determined according to the arrangement of the fingerprint chips in the whole board fingerprint chip. The number of rows A and the number of columns B of the grid. For example, the whole board fingerprint chip includes 4 rows and 12 columns of fingerprint chips, and the number of grids in the tray 120 can also be set to 4 rows and 12 columns, that is, A=4, B. =12, the size of each grid can be determined according to the size of the pad of the fingerprint chip. Optionally, the size of each grid can be slightly larger than the size of the pad of the fingerprint chip, and the spacing between adjacent grids can also be The arrangement of the fingerprint chips in the whole board fingerprint chip is determined.
可选地,该用于测试指纹芯片的装置100还包括链接器130,用于链接该盖板110和该托盘120。Optionally, the apparatus 100 for testing a fingerprint chip further includes a linker 130 for linking the cover plate 110 and the tray 120.
具体地,如图1所示,该用于测试指纹芯片的装置100还可以包括链接器130,该链接器130可以是活动的,通过调整该链接器130可以实现盖板110的梯形结构的该托盘120的梯形结构的对齐。Specifically, as shown in FIG. 1, the apparatus 100 for testing a fingerprint chip may further include a linker 130, which may be active, and the trapezoidal structure of the cover plate 110 may be implemented by adjusting the linker 130. Alignment of the trapezoidal structure of the tray 120.
可选地,该用于测试指纹芯片的装置100还包括锁紧结构140,该锁紧 结构140用于该盖板闭合时,固定该盖板110和该托盘120。Optionally, the device 100 for testing a fingerprint chip further includes a locking structure 140, the locking The structure 140 is used to secure the cover plate 110 and the tray 120 when the cover is closed.
如图1所示,该用于测试指纹芯片的装置100还包括锁紧结构140,该锁紧结构140可以用于在该盖板闭合时,固定该盖板110和该托盘120。可选地,该锁紧结构可以为锁紧扣。因此,将待测试的整板指纹芯片放置于该托盘120中后,闭合盖板110,锁紧该锁紧结构140,即可将该用于测试指纹芯片的装置100放置于测试机中进行测试,由于整板指纹芯片是放置于用于测试指纹芯片的装置100中进行搬移和测试的,因此,避免了采用直接夹取芯片方式搬移指纹芯片造成指纹芯片表面划伤,或造成指纹芯片磕碰影响外观甚至影响使用的问题。同时也避免了采用吸附方式搬移指纹芯片容易在指纹芯片表面留有印记或因吸力过大造成指纹芯片形变的问题。As shown in FIG. 1, the apparatus 100 for testing a fingerprint chip further includes a locking structure 140 that can be used to secure the cover 110 and the tray 120 when the cover is closed. Alternatively, the locking structure may be a locking buckle. Therefore, after the whole board fingerprint chip to be tested is placed in the tray 120, the cover plate 110 is closed, and the locking structure 140 is locked, and the device 100 for testing the fingerprint chip can be placed in the testing machine for testing. Since the whole board fingerprint chip is placed in the device 100 for testing the fingerprint chip for moving and testing, the fingerprint chip is prevented from being scratched by the fingerprint chip by directly clamping the chip, or the fingerprint chip is affected by the collision. The appearance even affects the problem of use. At the same time, the problem that the fingerprint chip is moved by the adsorption method is easy to leave a fingerprint on the surface of the fingerprint chip or the fingerprint chip is deformed due to excessive suction.
可选地,该用于测试指纹芯片的装置100还可以包括至少一个定位栓,该至少一个定位栓用于将该装置100放置于测试机中时,与测试机中的定位装置配合,将该装置100固定于该测试机中。图1示例性的示出了四个定位栓150,可选地,该装置100包括的定位栓的数量可以少于四个,例如,两个,或多于四个,例如,六个,本申请实施例对该定位栓的个数不作限定,另外,本申请实施例对定位栓在装置100中的位置也不做限定。Optionally, the apparatus 100 for testing a fingerprint chip may further include at least one positioning pin for cooperating with a positioning device in the testing machine when the device 100 is placed in the testing machine, The device 100 is fixed in the test machine. FIG. 1 exemplarily shows four positioning pins 150. Optionally, the device 100 may include fewer than four positioning pins, for example, two, or more than four, for example, six, The number of the positioning pins is not limited in the application embodiment. In addition, the position of the positioning pin in the device 100 is not limited in the embodiment of the present application.
上文结合图1至图4,详细描述了本申请的装置实施例,下文结合图5至图7,详细描述本申请的方法实施例,应理解,方法实施例与装置实施例相互对应,类似的描述可以参照装置实施例。The device embodiment of the present application is described in detail above with reference to FIG. 1 to FIG. 4 . The method embodiment of the present application is described in detail below with reference to FIG. 5 to FIG. 7 . It should be understood that the method embodiment and the device embodiment correspond to each other. The description can be made with reference to the device embodiment.
图5示出了根据本申请实施例的用于测试指纹芯片的方法的示意性流程图,该方法应用于用于测试指纹芯片的装置,该用于测试指纹芯片的装置包括:盖板,该盖板的外圈为梯形结构,该盖板的主体部分设置有M行N列网格的镂空结构,该M和该N为正整数,托盘,该托盘的内圈为梯形结构,该托盘的主体部分设置有A行B列网格的镂空结构,该A和该B为正整数,在该盖板闭合的情况下,该梯形结构和该梯形结构之间具有防压裂空间,该防压裂空间的高度大于待测试的整板指纹芯片的厚度,如图5所示,该方法500包括:FIG. 5 shows a schematic flow chart of a method for testing a fingerprint chip according to an embodiment of the present application, the method being applied to a device for testing a fingerprint chip, the device for testing a fingerprint chip comprising: a cover plate, The outer ring of the cover plate has a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers, the tray, the inner ring of the tray is a trapezoidal structure, and the tray is The main body portion is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers. When the cover plate is closed, the trapezoidal structure and the trapezoidal structure have an anti-fracture space, and the pressure is prevented. The height of the crack space is greater than the thickness of the whole board fingerprint chip to be tested. As shown in FIG. 5, the method 500 includes:
501,将该整板指纹芯片放置于该托盘的主体部分;501, the whole board fingerprint chip is placed on the main body portion of the tray;
502,闭合该盖板,通过该M行N列网格中的相邻两个网格之间的实体部分按压该整板指纹芯片的翘曲位置,并通过该盖板和该托盘将按压后的该整板指纹芯片固定于该防压裂空间。 502, closing the cover plate, pressing a warpage position of the whole board fingerprint chip through a physical portion between two adjacent grids in the M-row N-column grid, and pressing the cover plate and the tray after pressing The whole board fingerprint chip is fixed in the anti-fracture space.
因此,本申请实施例的用于测试指纹芯片的方法,假手指可以通过盖板上的网格型镂空结构实现对芯片表面的指纹识别功能的测试,测试机的测试探针可以通过该托盘上的网格型镂空结构与整板指纹芯片中的每个芯片的焊盘进行对针连接,因此,本申请实施例的用于测试指纹芯片的方法,能够实现对整板指纹芯片的测试。Therefore, in the method for testing a fingerprint chip in the embodiment of the present application, the fake finger can perform the test of the fingerprint recognition function on the surface of the chip through the mesh type hollow structure on the cover plate, and the test probe of the test machine can pass through the tray. The mesh type hollow structure is connected to the pad of each chip in the whole board fingerprint chip. Therefore, the method for testing the fingerprint chip in the embodiment of the present application can implement the test of the whole board fingerprint chip.
进一步地,本申请实施例的用于测试指纹芯片的方法,通过该M行N列网格中的相邻两个网格之间的实体部分按压该整板指纹芯片的翘曲位置,由于该用于测试的装置的盖板的梯形结构和托盘的梯形结构在盖板闭合时具有防压裂空间,因此,在盖板闭合的情况下,通过盖板和托盘的梯形结构能够将该整板指纹芯片固定于该防压裂空间中,并且由于该防压裂空间的高度大于待测试的整板指纹芯片的厚度,因此不会由于压力过当造成指纹芯片压裂。Further, the method for testing a fingerprint chip in the embodiment of the present application presses a warpage position of the whole fingerprint chip by a physical portion between two adjacent grids in the M-row N-column grid, because The trapezoidal structure of the cover plate of the device for testing and the trapezoidal structure of the tray have an anti-fracture space when the cover plate is closed, so that the entire plate can be passed through the trapezoidal structure of the cover plate and the tray in the case where the cover plate is closed The fingerprint chip is fixed in the anti-fracture space, and since the height of the anti-fracture space is larger than the thickness of the whole-plate fingerprint chip to be tested, the fingerprint chip is not fractured due to excessive pressure.
可选地,该防压裂空间的高度与该整板指纹芯片的厚度的差值小于高度阈值。Optionally, the difference between the height of the anti-fracture space and the thickness of the whole board fingerprint chip is less than a height threshold.
可选地,该梯形结构的最小的内圈的尺寸与该整板指纹芯片的尺寸相同。Optionally, the smallest inner ring of the trapezoidal structure has the same size as the full-board fingerprint chip.
可选地,该A和该B根据该整板指纹芯片包括的指纹芯片的个数确定。Optionally, the A and the B are determined according to the number of fingerprint chips included in the whole board fingerprint chip.
可选地,该用于测试指纹芯片的装置还包括链接器,该方法还包括:Optionally, the device for testing the fingerprint chip further includes a linker, the method further comprising:
通过该链接器链接该盖板和该托盘。The cover and the tray are linked by the linker.
可选地,该用于测试指纹芯片的装置还包括锁紧结构,该方法还包括:Optionally, the device for testing the fingerprint chip further includes a locking structure, the method further comprising:
在该盖板闭合时,通过该锁紧结构固定该盖板和该托盘。The cover and the tray are secured by the locking structure when the cover is closed.
可选地,该锁紧结构为锁紧扣。Optionally, the locking structure is a locking buckle.
可选地,该用于测试指纹芯片的装置还可以包括至少一个定位栓,该至少一个定位栓用于将该装置放置于测试机中时,与测试机中的定位装置配合,将该装置固定于该测试机中。Optionally, the device for testing the fingerprint chip may further comprise at least one positioning pin, wherein the at least one positioning pin is used to cooperate with the positioning device in the testing machine when the device is placed in the testing machine, and fix the device In the test machine.
下面结合图6,介绍如何使用该用于测试指纹芯片的装置进行整板指纹芯片的测试,如图6所示,该操作流程可以包括以下步骤:Referring to FIG. 6, the following describes how to use the device for testing the fingerprint chip to test the whole board fingerprint chip. As shown in FIG. 6, the operation flow may include the following steps:
在S1中,打开该用于测试指纹芯片的装置,将该整板指纹芯片放置于该用于测试指纹芯片的装置的托盘中;In S1, the device for testing the fingerprint chip is opened, and the whole board fingerprint chip is placed in the tray of the device for testing the fingerprint chip;
在S2中,闭合盖板,锁紧该锁紧结构,即可通过该M行N列网格中的相邻两个网格之间的实体部分按压该整板指纹芯片的翘曲位置,并通过该盖 板和该托盘将按压后的该整板指纹芯片固定于该防压裂空间。In S2, closing the cover plate and locking the locking structure, the warpage position of the whole fingerprint chip is pressed by the physical portion between two adjacent grids in the M-row N-column grid, and Through the cover The plate and the tray fix the pressed whole plate fingerprint chip to the anti-fracture space.
上述步骤操作完毕之后,可以得到一个装有整板指纹芯片的用于测试指纹芯片的装置。此时,如图7所示,可以通过机械手将该装有整板指纹芯片的用于测试指纹芯片的装置放置于测试机中,从而可以通过该测试机对整板指纹芯片进行测试,由于该整板指纹芯片是放置于该用于测试指纹芯片的装置中进行搬移的,所以机械手夹取的是该用于测试指纹芯片的装置,因此不会造成指纹芯片的划伤或磕碰问题。After the above steps are completed, a device for testing the fingerprint chip with the entire fingerprint chip can be obtained. At this time, as shown in FIG. 7, the device for testing the fingerprint chip equipped with the whole board fingerprint chip can be placed in the testing machine by the robot, so that the whole board fingerprint chip can be tested by the testing machine, because The whole board fingerprint chip is placed in the device for testing the fingerprint chip for movement, so the robot grips the device for testing the fingerprint chip, so that the fingerprint chip is not scratched or bumped.
应理解,本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。It should be understood that the term "and/or" herein is merely an association relationship describing an associated object, indicating that there may be three relationships, for example, A and/or B, which may indicate that A exists separately, and A and B exist simultaneously. There are three cases of B alone. In addition, the character "/" in this article generally indicates that the contextual object is an "or" relationship.
应理解,在本申请的各种实施例中,上述各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定,而不应对本申请实施例的实施过程构成任何限定。It should be understood that, in the various embodiments of the present application, the size of the sequence numbers of the foregoing processes does not mean the order of execution sequence, and the order of execution of each process should be determined by its function and internal logic, and should not be applied to the embodiment of the present application. The implementation process constitutes any limitation.
本领域普通技术人员可以意识到,结合本文中所公开的实施例描述的各示例的单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本申请的范围。Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the various examples described in connection with the embodiments disclosed herein can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the solution. A person skilled in the art can use different methods to implement the described functions for each particular application, but such implementation should not be considered to be beyond the scope of the present application.
所属领域的技术人员可以清楚地了解到,为描述的方便和简洁,上述描述的系统、装置和单元的具体工作过程,可以参考前述方法实施例中的对应过程,在此不再赘述。A person skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the system, the device and the unit described above can refer to the corresponding process in the foregoing method embodiment, and details are not described herein again.
在本申请所提供的几个实施例中,应该理解到,所揭露的系统、装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,该单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the device embodiments described above are merely illustrative. For example, the division of the unit is only a logical function division. In actual implementation, there may be another division manner, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
该作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或 者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。The unit described as a separate component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, may be located in one place, or It can also be distributed to multiple network elements. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
另外,在本申请各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质中,包括若干指令用以使得一台计算机设备(可以是个人计算机,服务器,或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括:U盘、移动硬盘、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。The functions may be stored in a computer readable storage medium if implemented in the form of a software functional unit and sold or used as a standalone product. Based on such understanding, the technical solution of the present application, which is essential or contributes to the prior art, or a part of the technical solution, may be embodied in the form of a software product, which is stored in a storage medium, including The instructions are used to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and the like. .
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。 The foregoing is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application. It should be covered by the scope of protection of this application. Therefore, the scope of protection of the present application should be determined by the scope of the claims.

Claims (16)

  1. 一种用于测试指纹芯片的装置,其特征在于,包括:An apparatus for testing a fingerprint chip, comprising:
    盖板,所述盖板的外圈为梯形结构,所述盖板的主体部分设置有M行N列网格的镂空结构,所述M和所述N为正整数;a cover plate, the outer ring of the cover plate is a trapezoidal structure, and the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, and the M and the N are positive integers;
    托盘,所述托盘的内圈为梯形结构,所述托盘的主体部分设置有A行B列网格的镂空结构,所述A和所述B为正整数;a tray, the inner ring of the tray is a trapezoidal structure, the main body portion of the tray is provided with a hollow structure of a row A and a column B grid, and the A and the B are positive integers;
    在所述盖板闭合的情况下,所述盖板的梯形结构和所述托盘的梯形结构之间具有防压裂空间,所述防压裂空间的高度大于所述整板指纹芯片的厚度;In the case that the cover plate is closed, the trapezoidal structure of the cover plate and the trapezoidal structure of the tray have an anti-fracture space, and the height of the anti-fracture space is greater than the thickness of the whole plate fingerprint chip;
    所述盖板和所述托盘用于在所述盖板闭合时,将所述整板指纹芯片固定于所述防压裂空间。The cover plate and the tray are configured to fix the whole board fingerprint chip to the anti-fracture space when the cover plate is closed.
  2. 根据权利要求1所述的装置,其特征在于,所述防压裂空间的高度与所述整板指纹芯片的厚度的差值小于高度阈值。The device according to claim 1, wherein a difference between a height of the anti-fracture space and a thickness of the entire plate fingerprint chip is less than a height threshold.
  3. 根据权利要求1或2所述的装置,其特征在于,所述托盘的梯形结构的最小的内圈的尺寸与所述整板指纹芯片的尺寸相同。A device according to claim 1 or 2, wherein the smallest inner ring of the trapezoidal structure of the tray has the same size as the entire fingerprint chip.
  4. 根据权利要求1至3中任一项所述的装置,其特征在于,所述A和所述B根据所述整板指纹芯片中的指纹芯片的排布情况确定。The apparatus according to any one of claims 1 to 3, wherein the A and the B are determined according to an arrangement of fingerprint chips in the whole board fingerprint chip.
  5. 根据权利要求1至4中任一项所述的装置,其特征在于,所述用于测试指纹芯片的装置还包括链接器,用于链接所述盖板和所述托盘。The apparatus according to any one of claims 1 to 4, wherein the means for testing the fingerprint chip further comprises a linker for linking the cover and the tray.
  6. 根据权利要求1至5中任一项所述的装置,其特征在于,所述用于测试指纹芯片的装置还包括锁紧结构,所述锁紧结构用于所述盖板闭合时,固定所述盖板和所述托盘。The apparatus according to any one of claims 1 to 5, wherein the means for testing the fingerprint chip further comprises a locking structure for fixing the cover when the cover is closed The cover plate and the tray.
  7. 根据权利要求6所述的装置,其特征在于,所述锁紧结构为锁紧扣。The device of claim 6 wherein said locking structure is a locking buckle.
  8. 根据权利要求1至7中任一项所述的装置,其特征在于,所述装置还包括至少一个定位栓,所述至少一个定位栓用于将所述装置放置于测试机中时,与所述测试机中的定位装置配合将所述装置固定于所述测试机中。Apparatus according to any one of claims 1 to 7 wherein said apparatus further comprises at least one locating peg for placing said device in a test machine, The positioning device in the test machine cooperates to secure the device in the test machine.
  9. 一种用于测试指纹芯片的方法,其特征在于,所述方法应用于用于测试指纹芯片的装置,所述用于测试指纹芯片的装置包括:盖板,所述盖板的外圈为梯形结构,所述盖板的主体部分设置有M行N列网格的镂空结构,所述M和所述N为正整数;托盘,所述托盘的内圈为梯形结构,所述托盘的主体部分设置有A行B列网格的镂空结构,所述A和所述B为正整数; 在所述盖板闭合的情况下,所述盖板的梯形结构和所述托盘的梯形结构之间具有防压裂空间,所述防压裂空间的高度大于待测试的整板指纹芯片的厚度,所述方法包括:A method for testing a fingerprint chip, wherein the method is applied to a device for testing a fingerprint chip, the device for testing a fingerprint chip comprises: a cover plate, and an outer ring of the cover plate is trapezoidal a structure, the main body portion of the cover plate is provided with a hollow structure of M rows and N columns of meshes, the M and the N are positive integers; the tray, the inner ring of the tray is a trapezoidal structure, and the main part of the tray a hollow structure having an A-row B-column grid, wherein the A and the B are positive integers; In the case that the cover plate is closed, an anti-fracture space is provided between the trapezoidal structure of the cover plate and the trapezoidal structure of the tray, and the height of the anti-fracture space is greater than the thickness of the whole-plate fingerprint chip to be tested. , the method includes:
    将所述整板指纹芯片放置于所述托盘的主体部分;Placing the whole board fingerprint chip on a main body portion of the tray;
    闭合所述盖板,通过所述M行N列网格中的相邻两个网格之间的实体部分按压所述整板指纹芯片的翘曲位置,并通过所述盖板和所述托盘将按压后的所述整板指纹芯片固定于所述防压裂空间。Closing the cover plate, pressing a warp position of the whole board fingerprint chip through a solid portion between two adjacent grids in the M rows and N columns of grids, and passing the cover plate and the tray The pressed whole plate fingerprint chip is fixed to the anti-fracture space.
  10. 根据权利要求9的方法,其特征在于,所述防压裂空间的高度与所述整板指纹芯片的厚度的差值小于高度阈值。The method of claim 9 wherein the difference between the height of the anti-fracture space and the thickness of the full-board fingerprint chip is less than a height threshold.
  11. 根据权利要求9或10所述的方法,其特征在于,所述托盘的梯形结构的最小的内圈的尺寸与所述整板指纹芯片的尺寸相同。The method according to claim 9 or 10, wherein the smallest inner ring of the trapezoidal structure of the tray has the same size as the whole plate fingerprint chip.
  12. 根据权利要求9至11中任一项所述的方法,其特征在于,所述A和所述B根据所述整板指纹芯片中的指纹芯片的排布情况确定。The method according to any one of claims 9 to 11, wherein the A and the B are determined according to an arrangement of fingerprint chips in the whole board fingerprint chip.
  13. 根据权利要求9至12中任一项所述的方法,其特征在于,所述用于测试指纹芯片的装置还包括链接器,所述方法还包括:The method according to any one of claims 9 to 12, wherein the means for testing the fingerprint chip further comprises a linker, the method further comprising:
    通过所述链接器链接所述盖板和所述托盘。The cover and the tray are linked by the linker.
  14. 根据权利要求9至13中任一项的方法,其特征在于,所述用于测试指纹芯片的装置还包括锁紧结构,所述方法还包括:The method according to any one of claims 9 to 13, wherein the means for testing the fingerprint chip further comprises a locking structure, the method further comprising:
    在所述盖板闭合时,通过所述锁紧结构固定所述盖板和所述托盘。The cover and the tray are secured by the locking structure when the cover is closed.
  15. 根据权利要求14所述的方法,其特征在于,所述锁紧结构为锁紧扣。The method of claim 14 wherein said locking structure is a locking buckle.
  16. 根据权利要求9至15中任一项所述的方法,其特征在于,所述装置还包括至少一个定位栓,所述至少一个定位栓用于将所述装置放置于测试机中时,与所述测试中的定位装置配合将所述装置固定于所述测试中。 The method according to any one of claims 9 to 15, wherein the apparatus further comprises at least one positioning pin for placing the device in the testing machine, The positioning device in the test cooperates to secure the device in the test.
PCT/CN2017/075744 2017-03-06 2017-03-06 Device and method for testing fingerprint chip WO2018161210A1 (en)

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