CN204791111U - Compound SIM card - Google Patents

Abstract

The utility model discloses a compound SIM card, it includes the standard card substrate, the blunderbuss surely has a 2FF SIM cutting ferrule on this standard card substrate, the blunderbuss surely has 3FF SIM cutting ferrule on the 2FFSIM cutting ferrule, the blunderbuss surely has 4FF SIM card on the 3FFSIM cutting ferrule, just the 2FFSIM cutting ferrule with seamless connection between the standard card substrate, the 3FFSIM cutting ferrule with seamless connection between the 2FFSIM cutting ferrule, the 4FFSIM card with seamless connection between the 3FFSIM cutting ferrule. The utility model discloses an among the compound SIM card, have 10 2FF+3FF+4FF's SIM card on standard card substrate, the utilization ratio of standard card substrate can reach 81%, material saving cost 60%, and the productivity is 2.5 times of one calorie of four -core.

Description

A kind of compound SIM card

Technical field

The utility model relates to a kind of smart card and wireless communication technique field, especially relates to a kind of compound SIM card.

Background technology

At present, a large amount of uses of mobile electronic device, the kind of SIM card and the quantity of use also get more and more, and have higher requirement to the making of SIM card and use.The making of existing sim card mainly contains following several mode:

1, the SIM card making a 2FF+3FF+4FF needs 2 standard card substrates, on a standard card substrate, seamless link has 4FFSIM card, another standard card substrate is connected with 2FF cutting ferrule+3FF cutting ferrule, wherein, adopt seamless link between 2FF cutting ferrule and 3FF cutting ferrule, between 2FF cutting ferrule with standard card substrate, adopt seamed connection.Therefore, when making the SIM card of a 2FF+3FF+4FF, the making of 4FFSIM card needs a standard card substrate, and the making of 3FF cutting ferrule+2FF cutting ferrule needs a standard card substrate, so altogether needs two card substrates.Secondly, the size that 4FFSIM card is seamless after blunderbuss cuts need with the groove milling of 3FF cutting ferrule after the size of draw-in groove match, in order to make 4FFSIM card can large batch be arranged on 3FF draw-in groove, need the size making the draw-in groove size on 3FF slightly larger than 4FFSIM card, if device action is error slightly, just easily result in 4FFSIM card to drop from 3FF draw-in groove, manufacturing process requires high, and needs to expend more starting material.

2, the SIM card making a 2FF+3FF+4FF needs 1 standard card base (the single core of a card), wherein, adopt seamless link between 4FFSIM card and 3FF cutting ferrule, 3FF cutting ferrule and 2FF cutting ferrule adopt seamless link, adopt seamed connection between 2FF cutting ferrule with standard card substrate.During making, general selection thickness is the card substrate of 0.80 ± 0.04mm, is met the thickness requirement of 4FFSIM card by the mode of card substrate being carried out to groove milling.The production method of the single core of a this card, the utilization factor of standard card substrate only has 8%, cause the waste of standard card substrate, and production efficiency is low.

3, the SIM card making four 2FF+3FF+4FF needs 1 standard card substrate (a card four-core), and 4FFSIM card and 3FF cutting ferrule adopt seamless link, and 3FF cutting ferrule and 2FF cutting ferrule adopt seamless link, adopt seamless link between 2FF cutting ferrule and standard card substrate.Need to select thickness to be the standard card substrate of 0.80 ± 0.04mm.The thickness requirement of 4FFSIM card is met by the mode of standard card substrate being carried out to groove milling.The utilization factor of SIM card to standard card substrate of a this card four-core also only has 32%, and cost of manufacture is higher, and production efficiency is lower.

As can be seen here, existing SIM card is in structure and use, and all there is the defects such as cost of manufacture is high, waste of material, production efficiency are low, urgently improves further.

Utility model content

The purpose of this utility model is to provide a kind of compound SIM card, and it has standard card substrate utilization factor high, saves material cost, the advantage that production capacity is high.

For solving the problems of the technologies described above, the utility model provides a kind of compound SIM card, it comprises standard card substrate, on this standard card substrate, blunderbuss has cut 2FFSIM cutting ferrule, on described 2FFSIM cutting ferrule, blunderbuss has cut 3FFSIM cutting ferrule, and on described 3FFSIM cutting ferrule, blunderbuss has cut 4FFSIM card, and seamless link between described 2FFSIM cutting ferrule and described standard card substrate, seamless link between described 3FFSIM cutting ferrule and described 2FFSIM cutting ferrule, seamless link between described 4FFSIM card and described 3FFSIM cutting ferrule.

In an embodiment of the present utility model, on described standard card substrate, blunderbuss has cut 10 2FFSIM cutting ferrules.

In an embodiment of the present utility model, 10 described 2FFSIM are fastened in two row arrangements on the on-chip Width of described standard card, in the longitudinal direction in five column distributions.

In an embodiment of the present utility model, the line space of described 2FFSIM cutting ferrule is 1.76mm.

In an embodiment of the present utility model, the column pitch of described 2FFSIM cutting ferrule is 1.2mm.

In an embodiment of the present utility model, the thickness of described standard card substrate is 0.68mm-0.70mm.

In an embodiment of the present utility model, described 3FFSIM cutting ferrule has ground floor groove and second layer groove;

The lateral dimension of described ground floor groove is the Outside Dimensions of 4FFSIM card module carrier band, and the degree of depth of described ground floor groove is: 0.18mm-0.20mm;

The lateral dimension of described second layer groove is the Outside Dimensions of 4FFSIM the core of the card sheet, and the degree of depth of described second layer groove is: 0.35mm-0.37mm.

In an embodiment of the present utility model, described 4FFSIM card module is arranged in described ground floor groove, and the upper surface of described 4FFSIM card module exceeds ground floor bottom land at least 0.03mm.

The beneficial effects of the utility model are:

Compound SIM card of the present utility model can make the SIM card of 10 2FF+3FF+4FF on a standard card substrate, and the utilization factor of standard card substrate can reach 81%, and save material cost 60%, only production capacity is exactly 2.5 times of a card four-core.Compound SIM card of the present utility model had both met the thickness requirement of 4FFSIM card, met again the demand be used alone of 4FFSIM, 3FFSIM, 2FFSIM card, and when making, utilized the one-shot forming of machine 10 4FFSIM cards, improve production efficiency.

Accompanying drawing explanation

Fig. 1 is the one-piece construction schematic diagram of compound SIM card of the present utility model;

Fig. 2 is compound SIM card sectional view of the present utility model;

Fig. 3 is the enlarged drawing of compound SIM card part A of the present utility model.

Embodiment

Please refer to shown in Fig. 1 to Fig. 3, compound SIM card of the present utility model, it comprises standard card substrate 1, on this standard card substrate 1, blunderbuss has cut 2FFSIM cutting ferrule 2, on 2FFSIM cutting ferrule 2, blunderbuss has cut 3FFSIM cutting ferrule 3, on 3FFSIM cutting ferrule, blunderbuss has cut 4FFSIM card 4, and 2FFSIM cutting ferrule 2 respectively with standard card substrate 1 and 3FFSIM cutting ferrule 3 seamless link, seamless link between 4FFSIM card 4 and 3FFSIM cutting ferrule.Preferably, on standard card substrate 1, blunderbuss has cut 10 2FFSIM cutting ferrules 2.

Concrete, 10 2FFSIM cutting ferrules 2, on standard card substrate 1, in the direction of the width in two row arrangements, are five column distributions in the longitudinal direction.The quantity that the 2FFSIM cutting ferrule 2 of wherein often going distributes is 5.The line space of 2FFSIM cutting ferrule 2 is 1.76mm.The column pitch of 2FFSIM cutting ferrule 2 is 1.2mm.Such layout makes full use of the material of standard card substrate.

Compound SIM card of the present utility model comprises 4FFSIM card 4,3FF cutting ferrule 3,2FFSIM cutting ferrule 2, wherein, 4FFSIM card 4 seamless link is on 3FF cutting ferrule 3,3FF cutting ferrule 3 seamless link is on 2FF cutting ferrule 2, form a 2FF(plug-in) SIM card, 10 such SIM card are to be distributed on same standard card substrate 1 with the mode of standard card substrate 1 seamless link.

Wherein, shown in Fig. 2 and Fig. 3, the thickness of standard card substrate 1 of the present utility model is 0.68mm-0.70mm, 3FFSIM cutting ferrule 3 has ground floor groove 11 and second layer groove 12; The lateral dimension of ground floor groove 11 is the Outside Dimensions of 4FFSIM card module carrier band 41, and the degree of depth b of ground floor groove 12 is: 0.18mm-0.20mm; The lateral dimension of second layer groove 12 is the Outside Dimensions of 4FFSIM the core of the card sheet, and the degree of depth c of second layer groove is: 0.35mm-0.37mm.4FFSIM card module is arranged in ground floor groove 11, and the upper surface of 4FFSIM card module exceeds ground floor bottom land at least 0.03mm.

In order to further understand the structure of the compound SIM card of the utility model, the present embodiment additionally provides a kind of method making compound SIM card, and the method mainly comprises the following steps:

Step one: selection thickness d is the standard card substrate 1 of 0.68-0.70mm, and please coordinate shown in Fig. 2,10 4FFSIM cards, 3FFSIM cutting ferrule and 4FFSIM card layouts are on same standard card substrate.

Step 2: according to the layout of Fig. 1, carries out groove milling to standard card substrate, opens ground floor groove 11 and second layer groove 12 respectively on the 3FFSIM cutting ferrule of card substrate.

Wherein, the lateral dimension of ground floor groove 11 is the Outside Dimensions of 4FFSIM card, and the lateral dimension of ground floor groove 11 is the Outside Dimensions of 4FFSIM card module carrier band, and the degree of depth b of ground floor groove 11 is: 0.18mm-0.20mm; The lateral dimension of second layer groove is the Outside Dimensions of 4FFSIM the core of the card sheet, and the degree of depth of the c of second layer groove is: 0.35mm-0.37mm.

Step 3: 4FFSIM card module is encapsulated.

According to 4FFSIM card production standard, 4FFSIM module is loaded in draw-in groove, 4FFSIM module is fixedly connected with standard card substrate 1, concrete, when being fixedly connected with, the level height of the upper surface of 4FFSIM module be made to exceed the first bottom land at least 0.03mm.

Step 4: carry out seamless blunderbuss respectively on the standard card substrate installing 4FFSIM module and cut.

Concrete, utilize blunderbuss incision technology to carry out three seamless blunderbuss to the standard card substrate 1 after encapsulation to cut, seamless blunderbuss was cut and was of a size of 4FFSIM card Outside Dimensions first time, and blunderbuss can realize being separated of standard 4FFSIM card and standard card substrate 1 after cutting, 4FFSIM card and 3FFSIM cutting ferrule 3 seamless link.

The seamless blunderbuss of second time is cut and is of a size of 3FFSIM cutting ferrule 3 Outside Dimensions, and after blunderbuss is cut, 3FFSIM cutting ferrule 3 can be separated with 2FF cutting ferrule 2 with standard card substrate 1 respectively, 3FFSIM cutting ferrule 3 and 2FF cutting ferrule 2 seamless link.

Seamless blunderbuss was cut and was of a size of 2FF cutting ferrule 2 Outside Dimensions third time, and after blunderbuss is cut, 2FFSIM cutting ferrule 2 is separated with standard card substrate 1,2FFSIM cutting ferrule 2 respectively with standard card substrate 1 and 3FF cutting ferrule 3 seamless link.So far, compound SIM card of the present utility model completes.

During concrete use, according to concrete needs, 4FFSIM card is peeled off from standard card substrate by available hand, or is peeled off from standard card substrate together by 3FF cutting ferrule 3+4FFSIM card, or is peeled off from card substrate by 2FFSIM cutting ferrule 2+3FF cutting ferrule 3+4FFSIM card.

The beneficial effects of the utility model are:

In compound SIM card of the present utility model, a standard card substrate has the SIM card of 10 2FF+3FF+4FF, card substrate utilization factor can reach 81%, and save material cost 60%, production capacity is 2.5 times of a card four-core.The mode that 2FFSIM, 3FFSIM, 4FFSIM lesser calorie of the present utility model is cut by seamless blunderbuss and standard card substrate separation, and compound SIM card blunderbuss of the present utility model cuts through Cheng Liyong blunderbuss cuts machine on equipment and to have produced once the SIM card of 10 2FF+3FF+4FF, substantially increase production efficiency.

Compound SIM card of the present utility model have employed thinner standard card substrate, the thickness of card substrate is 0.68-0.70mm, has both met thickness (0.65-0.7mm) requirement of 4FFSIM card, and has met again being used alone of 4FFSIM, 3FFSIM, 2FFSIM card, easy to use, production efficiency is high.

These are only preferred embodiment of the present utility model, be not able to this limit the utility model implement protection domain, therefore all with reference to description of the present utility model do simple equivalence change with modify, still belong to protection domain of the present utility model.

Claims (8)

1. a compound SIM card, it is characterized in that, comprise standard card substrate, on this standard card substrate, blunderbuss has cut 2FFSIM cutting ferrule, on described 2FFSIM cutting ferrule, blunderbuss has cut 3FFSIM cutting ferrule, and on described 3FFSIM cutting ferrule, blunderbuss has cut 4FFSIM card, and seamless link between described 2FFSIM cutting ferrule and described standard card substrate, seamless link between described 3FFSIM cutting ferrule and described 2FFSIM cutting ferrule, seamless link between described 4FFSIM card and described 3FFSIM cutting ferrule.

2. compound SIM card according to claim 1, is characterized in that,

On described standard card substrate, blunderbuss has cut 10 2FFSIM cutting ferrules.

3. compound SIM card according to claim 2, is characterized in that,

10 described 2FFSIM are fastened in two row arrangements on the on-chip Width of described standard card, in the longitudinal direction in five column distributions.

4. compound SIM card according to claim 3, is characterized in that,

The line space of described 2FFSIM cutting ferrule is 1.76mm.

5. compound SIM card according to claim 3, is characterized in that,

The column pitch of described 2FFSIM cutting ferrule is 1.2mm.

6. compound SIM card according to claim 1, is characterized in that,

The thickness of described standard card substrate is 0.68mm-0.70mm.

7. compound SIM card according to claim 1, is characterized in that,

Described 3FFSIM cutting ferrule has ground floor groove and second layer groove;

The lateral dimension of described ground floor groove is the Outside Dimensions of 4FFSIM card module carrier band, and the degree of depth of described ground floor groove is: 0.18mm-0.20mm;

The lateral dimension of described second layer groove is the Outside Dimensions of 4FFSIM the core of the card sheet, and the degree of depth of described second layer groove is: 0.35mm-0.37mm.

8. compound SIM card according to claim 7, is characterized in that,

Described 4FFSIM card module is arranged in described ground floor groove, and the upper surface of described 4FFSIM card module exceeds ground floor bottom land at least 0.03mm.