CN204360404U - Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board - Google Patents
Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board Download PDFInfo
- Publication number
- CN204360404U CN204360404U CN201420858267.XU CN201420858267U CN204360404U CN 204360404 U CN204360404 U CN 204360404U CN 201420858267 U CN201420858267 U CN 201420858267U CN 204360404 U CN204360404 U CN 204360404U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- thickness
- chip
- fabrication assembly
- upper strata
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000012856 packing Methods 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 238000003475 lamination Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
Landscapes
- Telephone Set Structure (AREA)
Abstract
The application relates to moving communicating field, the smart card particularly relate to a kind of circuit board, making containing fabrication assembly and this fabrication assembly of this circuit board.Circuit board comprises chip, the flexible circuit board substrate for arranging chip, the circle bearing course that arranges around the periphery of described flexible circuit board substrate, and the upper surface of described bearing course is higher than the upper surface of described chip.Fabrication assembly containing circuit board comprises circuit board, for covering the upper strata of the upper surface of described circuit board and the lower floor for the lower surface that covers described circuit board.Smart card is made up of the fabrication assembly containing circuit board.The smart card that the application provides arranges the thicker bearing course of a circle by the periphery of the flexible circuit board substrate at circuit board, can play and support stressed effect preferably, effectively prevent hot pressing chips because of stressed damage, the yield rate of smart card is improved.
Description
Technical field
The application relates to moving communicating field, the smart card particularly relate to a kind of circuit board, making containing fabrication assembly and the fabrication assembly of circuit board.
Background technology
Along with the application of card is more and more extensive, the market demand also changes multiple demand into from the access of original normal smart cards, payment function, such as, and the display of band display screen, band button operation, the functional intelligent cards such as band bluetooth.Because function increases, the chip of card inside is corresponding also to be increased, thus proposes requirements at the higher level to smart card manufacturing card.Product qualified rate in the market with display, button smart card is very low, and this easily causes wafer damage mainly due to lamination process.
In correlation technique, as shown in Figure 1, smart card generally comprises upper strata 4, circuit board 2 and lower floor 6 three layers, during making, first at upper strata 4 and lower floor 6 brush coating, bind according to sequencing (upper strata 4, circuit board 2, lower floor 6) afterwards, carry out lamination finally by hot pressing mode and form.Owing to needing to apply certain pressure in lamination process, be easy to after the direct effect that the chip on circuit board 2 is under pressure damage, cause product qualified rate low, thus the spread of check strap display, button smart card card.
Utility model content
The smart card this application provides a kind of circuit board, making containing fabrication assembly and the fabrication assembly of circuit board, can improve yield rate.
The circuit board that the first aspect of the application provides, comprises chip, for the flexible circuit board substrate that arranges described chip and the circle bearing course arranged around the periphery of described flexible circuit board substrate; The upper surface of described bearing course is higher than the upper surface of described chip.
Further, described bearing course is packing ring, and the lower surface of described packing ring and the upper surface of described flexible circuit board substrate are fitted, and the thickness of described packing ring is greater than the thickness of described chip.
Further, described bearing course is hard circuit board, and the lower surface of described hard circuit board flushes with the lower surface of described flexible circuit board substrate, and the thickness of described hard circuit board is greater than the thickness of described chip and the thickness sum of described flexible circuit board substrate.
The smart card fabrication assembly that the second aspect of the application provides, comprises foregoing circuit plate, upper strata and lower floor; Described upper strata is for covering the upper surface of described circuit board, and described lower floor is for covering the lower surface of described circuit board.
Further, described upper strata comprises upper strata basic unit and is arranged on through hole in described upper strata basic unit and corresponding with described chip, and the thickness of described upper strata basic unit is greater than the thickness of described chip.
Further, described lower floor comprise basic unit of lower floor and around the periphery of basic unit of described lower floor arrange one circle edge protuberance; The lower surface of described edge protuberance flushes with the lower surface of basic unit of described lower floor and is jointly configured for holding the groove of described circuit board; The thickness of described edge protuberance is greater than the thickness sum of the thickness of described flexible circuit board substrate, the thickness of described chip and basic unit of described lower floor.
Further, described circuit board embeds described groove.
Further, the upper surface of described lower floor is provided with reference column; On described circuit board, corresponding described reference column is provided with the pilot hole passed for described reference column; On described upper strata, corresponding described reference column is provided with the location counterbore passed for described reference column.
Further, described smart card fabrication assembly also comprises the printed layers covering described upper strata.
The smart card that the third aspect of the application provides, is made up of described smart card fabrication assembly.
The technical scheme that the application provides can comprise following beneficial effect:
The smart card that the application provides arranges the thicker bearing course of a circle by the periphery of the flexible circuit board substrate at circuit board, can play and support stressed effect preferably, effectively prevent hot pressing chips because of stressed damage, the yield rate of smart card is improved.
Should be understood that, it is only exemplary that above general description and details hereinafter describe, and can not limit the application.
Accompanying drawing explanation
The decomposing schematic representation of the smart card fabrication assembly that Fig. 1 introduces for the application's background technology;
The decomposing schematic representation of the smart card fabrication assembly that Fig. 2 provides for application embodiment;
The structural representation of the circuit board that Fig. 3 provides for the embodiment of the present application;
The structural representation on the upper strata that Fig. 4 provides for the embodiment of the present application;
The structural representation of the lower floor that Fig. 5 provides for the embodiment of the present application.
Accompanying drawing illustrates: 2-circuit board; 20-chip; 22-flexible circuit board substrate; 24-bearing course; 26-pilot hole; 4-upper strata; 40-upper strata basic unit; 42-through hole; 44-locates counterbore; 6-lower floor; Basic unit of 60-lower floor; 62-edge protuberance; 64-reference column; 8-printed layers.
Accompanying drawing to be herein merged in instructions and to form the part of this instructions, shows the embodiment meeting the application, and is used from instructions one principle explaining the application.
Embodiment
Also by reference to the accompanying drawings the application is described in further detail below by specific embodiment."front", "rear" described in literary composition, "left", "right", " on ", D score all with the accompanying drawing of this circuit board, smart card fabrication assembly and smart card for reference, wherein " front " refers to perpendicular to paper upwards, and " afterwards " refers to perpendicular to paper downward.
The embodiment of the present application provides the display of a kind of band display screen, band button operation, the functional smart cards such as band bluetooth, this smart card is made up of smart card fabrication assembly, and as shown in Figure 2, this smart card fabrication assembly comprises circuit board 2, upper strata 4, lower floor 6 and printed layers 8.Wherein, upper strata 4 is for the upper surface of covering board 2, and lower floor 6 is for the lower surface of covering board 2.Circuit board 2 can be encapsulated with lower floor 6 by upper strata 4.Printed layers 8 is arranged on the upper surface on upper strata 8.
As shown in Figure 3, circuit board 2 comprises chip 20, flexible circuit board substrate 22 and bearing course 24.Chip 20 is arranged on the upper surface of flexible circuit board substrate 22.Bearing course 24 arranges a circle around the periphery of flexible circuit board substrate 22, also will ensure that the upper surface of bearing course 24 is higher than the upper surface of chip 20 (if there is multiple chip, being higher than the highest chip 20) simultaneously.For said structure, this application provides two kinds of embodiments.The first adopts packing ring to serve as bearing course 24, is arranged on by packing ring on flexible circuit board substrate 22, and ensures that the thickness of packing ring is greater than the thickness of chip 20.The second adopts hard circuit board as bearing course 24, hard circuit board is arranged on the periphery of flexible circuit board substrate 22, and ensureing that the lower surface of hard circuit board flushes with the lower surface of flexible circuit board substrate 22, the thickness of hard circuit board is greater than the thickness of chip 20 and the thickness sum of flexible circuit board substrate 22.For these two kinds of modes, bearing course 24 can in advance and flexible circuit board substrate 22 form integral structure, what can also keep the two is separated from each other state, is structure as a whole in hot pressing by hot-forming together for each layer comprising flexible circuit board substrate 22 and bearing course 24 again.
Because the upper surface of bearing course 24 is higher than the upper surface of chip 20, therefore, in hot pressing, bearing course 24 can share the pressure of the overwhelming majority; And the resistance to elevated temperatures of bearing course 24 is better, can not melt, therefore can also play padded effect in hot pressing.Can stablize to make bearing course 24, effectively playing pressure-bearing effect, the width of bearing course 24 had better not be less than 1 millimeter, in order to avoid its scope supported is too small or self-strength is too low and the protected effect that reduces chip 20.
In order to further protect IC 20, the structure of the application one embodiment to upper strata 4 is improved.As shown in Figure 4, upper strata 4 comprises upper strata basic unit 40 and is arranged on the through hole 42 in upper strata basic unit 40.When carrying out hot pressing, through hole 42 needs the chip 20 on alignment circuit plate 2, to make chip 20 can be in hot pressing in through hole 42, can not extrude by upper strata basic unit 40.The quantity of through hole 42 can be determined according to the quantity of the chip 20 on circuit board 2.The large I of each through hole 42 is determined according to the size with the chip 20 corresponding to it, and principle is that after lamination, chip 20 peripheral layer binder is not intermittently advisable.The thickness of upper strata basic unit 40 can be greater than the thickness (if there is multiple chip 20, being greater than the thickness of the thickest chip 20) of chip 20.Can prevent hot press in hot pressing from directly extruding the chip 20 be in through hole 42, further protect IC 20 like this, improve yield rate.
In order to further protect IC 20, the structure of the application one embodiment to lower floor 6 is also improved.As shown in Figure 5, lower floor 6 comprise basic unit of lower floor 60 and around the periphery of basic unit of lower floor 60 arrange one circle edge protuberance 62.The lower surface of edge protuberance 62 flushes with the lower surface of basic unit of lower floor 60, and the two together constitutes a groove for containment circuit board 2.In one embodiment, the size of this groove can be arranged to make circuit board 2 just embed this inside grooves and be advisable.The thickness of edge protuberance 62 needs the maximum gauge (thickness of flexible circuit board substrate 22 adds the thickness of the thickest chip 20) being greater than circuit board 2.
Edge protuberance 62 role and bearing course 24 similar, can be used for pressure when sharing hot pressing, prevent chip 20 fail in compression.Further, edge protuberance 62 and bearing course 24, due to highly different, therefore can also form the bearing area of different gradient, better can disperse pressure during hot pressing.In order to ensure the pressure-bearing effect of edge protuberance 62, the width of edge protuberance 62 had better not be less than 1 millimeter.
In the manufacturing process of smart card, not only will by bottom 6, circuit board 2 and upper strata 4 laminated multi-layer together, also to control a few person projection in the horizontal plane simultaneously and be in respective ad-hoc location, therefore, for the ease of location, as shown in Figure 5, the lower floor 6 in the present embodiment is also provided with reference column 64 at the upper surface of basic unit of lower floor 60.Accordingly, on the flexible circuit board substrate 22 of circuit board 2, corresponding reference column 64 is provided with pilot hole 26 (see Fig. 3), and in the upper strata basic unit 40 on upper strata 4, corresponding reference column 64 is provided with location counterbore 44 (see Fig. 4).
When stacking, lower floor 6, circuit board 2 and upper strata 4 realize location by the cooperation between reference column 64 and pilot hole 26, location counterbore 44, simplify technique, reduce production cost.Meanwhile, printed layers 8 is also bound according to the pilot hole 26 on upper strata 4, eventually carries out lamination and forms smart card.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for a person skilled in the art, the application can have various modifications and variations.Within all spirit in the application and principle, any amendment done, equivalent replacement, improvement etc., within the protection domain that all should be included in the application.
Claims (10)
1. a circuit board, is characterized in that, comprise chip, for arrange described chip flexible circuit board substrate and around the periphery of described flexible circuit board substrate arrange one circle bearing course;
The upper surface of described bearing course is higher than the upper surface of described chip.
2. circuit board according to claim 1, is characterized in that, described bearing course is packing ring, and the lower surface of described packing ring and the upper surface of described flexible circuit board substrate are fitted, and the thickness of described packing ring is greater than the thickness of described chip.
3. circuit board according to claim 1, it is characterized in that, described bearing course is hard circuit board, the lower surface of described hard circuit board flushes with the lower surface of described flexible circuit board substrate, and the thickness of described hard circuit board is greater than the thickness of described chip and the thickness sum of described flexible circuit board substrate.
4., containing a fabrication assembly for circuit board, it is characterized in that, comprise the circuit board according to any one of claims 1 to 3, upper strata and lower floor; Described upper strata is for covering the upper surface of described circuit board; Described lower floor is for covering the lower surface of described circuit board.
5. the fabrication assembly containing circuit board according to claim 4, it is characterized in that, described upper strata comprises upper strata basic unit and is arranged on through hole in described upper strata basic unit and corresponding with described chip, and the thickness of described upper strata basic unit is greater than the thickness of described chip.
6. the fabrication assembly containing circuit board according to claim 4, is characterized in that, the circle edge protuberance that described lower floor comprises basic unit of lower floor and arranges around the periphery of basic unit of described lower floor; The lower surface of described edge protuberance flushes with the lower surface of basic unit of described lower floor and is jointly configured for holding the groove of described circuit board; The thickness of described edge protuberance is greater than the thickness sum of the thickness of described flexible circuit board substrate, the thickness of described chip and basic unit of described lower floor.
7. the fabrication assembly containing circuit board according to claim 6, it is characterized in that, described circuit board embeds described groove.
8. the fabrication assembly containing circuit board according to claim 4, it is characterized in that, the upper surface of described lower floor is provided with reference column; On described circuit board, corresponding described reference column is provided with the pilot hole passed for described reference column; On described upper strata, corresponding described reference column is provided with the location counterbore passed for described reference column.
9. the fabrication assembly containing circuit board according to claim 4, is characterized in that, also comprise the printed layers covering described upper strata.
10. a smart card, is characterized in that, is made up of the fabrication assembly containing circuit board described in any one of claim 4 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420858267.XU CN204360404U (en) | 2014-12-30 | 2014-12-30 | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420858267.XU CN204360404U (en) | 2014-12-30 | 2014-12-30 | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204360404U true CN204360404U (en) | 2015-05-27 |
Family
ID=53261860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420858267.XU Expired - Fee Related CN204360404U (en) | 2014-12-30 | 2014-12-30 | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204360404U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023037A (en) * | 2015-07-29 | 2015-11-04 | 飞天诚信科技股份有限公司 | Intelligent card, manufacturing method of intelligent card and manufacturing tool of intelligent card |
| CN105760926A (en) * | 2016-02-01 | 2016-07-13 | 上海哲山电子科技有限公司 | Active smart card manufacturing method and active smart card |
| CN106845995A (en) * | 2017-01-19 | 2017-06-13 | 飞天诚信科技股份有限公司 | A kind of method of Bluetooth intelligent card and its control transaction risk |
| CN107145930A (en) * | 2015-05-28 | 2017-09-08 | 苏州海博智能系统有限公司 | Card manufacturing method |
| CN107944536A (en) * | 2017-11-29 | 2018-04-20 | 永道无线射频标签(扬州)有限公司 | It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material |
| CN113286443A (en) * | 2021-05-13 | 2021-08-20 | 深圳市联合智能卡有限公司 | Cold pressing process of PCBA smart card |
-
2014
- 2014-12-30 CN CN201420858267.XU patent/CN204360404U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107145930A (en) * | 2015-05-28 | 2017-09-08 | 苏州海博智能系统有限公司 | Card manufacturing method |
| CN105023037A (en) * | 2015-07-29 | 2015-11-04 | 飞天诚信科技股份有限公司 | Intelligent card, manufacturing method of intelligent card and manufacturing tool of intelligent card |
| CN105023037B (en) * | 2015-07-29 | 2018-08-28 | 飞天诚信科技股份有限公司 | A kind of smart card and its manufacturing method and manufacture tool |
| CN105760926A (en) * | 2016-02-01 | 2016-07-13 | 上海哲山电子科技有限公司 | Active smart card manufacturing method and active smart card |
| CN106845995A (en) * | 2017-01-19 | 2017-06-13 | 飞天诚信科技股份有限公司 | A kind of method of Bluetooth intelligent card and its control transaction risk |
| CN106845995B (en) * | 2017-01-19 | 2018-05-04 | 飞天诚信科技股份有限公司 | A kind of Bluetooth intelligent card and its method for controlling transaction risk |
| CN107944536A (en) * | 2017-11-29 | 2018-04-20 | 永道无线射频标签(扬州)有限公司 | It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material |
| CN113286443A (en) * | 2021-05-13 | 2021-08-20 | 深圳市联合智能卡有限公司 | Cold pressing process of PCBA smart card |
| CN113286443B (en) * | 2021-05-13 | 2022-01-14 | 深圳市联合智能卡有限公司 | Cold pressing process of PCBA smart card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204360404U (en) | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board | |
| CN100576244C (en) | Smart card and manufacture method thereof | |
| CN104303195B (en) | Turn frequency layer and its manufacturing method | |
| WO2014167344A3 (en) | Improvements relating to business cards | |
| CN104527202A (en) | Making method of interlayer of card | |
| CN101513782A (en) | Electromagnetic wave shielding material | |
| CN204360406U (en) | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board | |
| CN103218650B (en) | Contact Type Ic Card with display module and preparation method thereof | |
| CN103231554A (en) | Laminated type high heat conduction graphite film structure | |
| CN201945982U (en) | Structure of compatible touch control sensor | |
| CN203311442U (en) | Usage card with precious metal inlaid therein | |
| CN204356591U (en) | A kind of extraordinary lines paper | |
| CN201867862U (en) | Laminated ultra-thin RFID (Radio Frequency Identification Devices) electronic tag card | |
| CN105653807A (en) | Automatic alignment method based on Cadence Via | |
| CN203559006U (en) | Card protecting film | |
| KR20130122108A (en) | High glossy smart painting frame | |
| CN205750847U (en) | A kind of transactional cards with wood grain stereoeffect | |
| CN205589781U (en) | Disclose needle packing | |
| CN203164994U (en) | Diamante intelligent card | |
| CN202873194U (en) | Air conduction backing plate | |
| CN203164998U (en) | Contact type IC card with display module | |
| CN201106141Y (en) | Cloth-based wallpaper | |
| CN201808256U (en) | Polyester printed cloth | |
| CN204763921U (en) | Electronic equipment's protective sheath | |
| CN204659123U (en) | An a kind of glue jelly protector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 |