CN107944536A - It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material - Google Patents
It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material Download PDFInfo
- Publication number
- CN107944536A CN107944536A CN201711222277.9A CN201711222277A CN107944536A CN 107944536 A CN107944536 A CN 107944536A CN 201711222277 A CN201711222277 A CN 201711222277A CN 107944536 A CN107944536 A CN 107944536A
- Authority
- CN
- China
- Prior art keywords
- base material
- cog regions
- cog
- material base
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
Abstract
Quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material the present invention relates to a kind of, comprise the following steps：Step 1）, Mark1a cog regions identical with die size, Mark1b cog regions are reserved on the antenna substrate outside antenna traces；Step 2）, on middle material base material with printing Mark2a cog regions, Mark2b cog regions at the position of respective antenna base material；Step 3）, first by middle material base material contain Mark2a cog regions, Mark2b cog regions 1/2 at fit on electronic tag so that middle material base material is accurately fitted on electronic tag；Step 4）, by middle material base material complete fit on electronic tag, chip is placed in the Mark perforates of middle material base material.Pass through the present invention, Mark1a cog regions, the mutual alignment of Mark2a cog regions, Mark1b cog regions, the mutual alignment of Mark2b cog regions, then complete the position outside aerial coil and form the new asymmetric positioning easily identified, facilitates Field Force quickly, accurately to judge.
Description
Technical field
Quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material the present invention relates to a kind of, belong to electronics
Label design field.
Background technology
During existing major part ticket card production, required middle material protection chip, and middle material be with after perforate by chip
Realized as the mode in hole to chip protection.In order to effectively protect chip, it is desirable to which chip must be and real completely in hole
In the production of border, since the factors such as board tension force, hole location precision influence, shape of the chip not in hole more or less occurs
Condition.But disturbed be subject to patterns such as antenna traces, chip in time, is accurately judged whether in hole, operation degree of difficulty is high,
So as to result in the undesirable generation of batch.
The content of the invention
The purpose of the present invention is aiming at above-mentioned drawback existing in the prior art, there is provided one kind quick and precisely ensures that chip is put
In the method on middle material base material in Mark perforates.
The object of the present invention is achieved like this, and one kind quick and precisely ensures that chip is placed on middle material base material in Mark perforates
Method, including middle material base material, middle material base material be equipped with Mark perforates, and middle material base material is covered on electronic tag, the electronics
Label includes antenna substrate, antenna traces, chip, and antenna traces are placed on antenna substrate, and chip is placed in antenna traces, it is special
Sign is to comprise the following steps：
Step 1）, reserve on the antenna substrate outside antenna traces Mark1a cog regions identical with die size,
Mark1b cog regions；
Step 2）, middle material base material print fitting Mark perforates when, when middle material base material opens Mark perforates, while in middle material base material
Printing is known with Mark1a cog regions, Mark1b at the position of Mark1a cog regions, Mark1b cog regions on upper respective antenna base material
The identical Mark2a cog regions of other area hole size, Mark2b cog regions；
Step 3）, middle material base material is bonded after on electronic tag when, middle material base material is first contained into Mark2a cog regions, Mark2b knows
Fitted at the 1/2 of other area on electronic tag, outside the Mark2a cog regions in middle material base material and antenna traces on antenna substrate
Mark1a cog region alignments, the Mark2b cog regions in middle material base material know with the Mark1b on antenna substrate outside antenna traces
Other area alignment so that middle material base material is accurately fitted on electronic tag；
Step 4）, by middle material base material complete fit on electronic tag, chip is placed in the Mark perforates of middle material base material.
The antenna traces are made of aerial coil.
The position of the Mark1a cog regions is asymmetric with the position of Mark1b cog regions, neither central symmetry nor mirror image
Symmetrically.
The position of the Mark2a cog regions is asymmetric with the position of Mark2b cog regions, neither central symmetry nor mirror image
Symmetrically.
The present invention is rational in infrastructure, it is easy, easy to use to manufacture, bad in order to avoid there is batch by the present invention,
Need it is live in time, accurately determine whether exception of the chip not in cavity occur, there is provided one kind can simply, it is timely, accurately
Decision making, quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material.In realizing that chip is completely disposed at
Expect in the Mark perforates of base material, realize the purpose of protection chip, therefore consider the extra increase identification Mark outside aerial coil,
That is, Mark1a cog regions identical with die size, Mark1b identifications are reserved on the antenna substrate outside antenna traces
Area；Middle material base material print fitting Mark perforates when, while on middle material base material with the position of respective antenna circuit printing with
The identical Mark2a cog regions of Mark1a cog regions, Mark1b cog region hole sizes, Mark2b cog regions；Middle material base material is pasted
When after conjunction on electronic tag, first by middle material base material contain Mark2a cog regions, Mark2b cog regions 1/2 at fit in electronics
On label, the Mark2a cog regions in middle material base material and the Mark1a cog region alignments on antenna substrate outside antenna traces, in
Expect the Mark2b cog regions in base material and the Mark1b cog region alignments on antenna substrate outside antenna traces so that middle material base material
Accurately fit on electronic tag；Finally middle material base material is completed to fit on electronic tag, chip is placed in middle material base material
In Mark perforates.
By the present invention, after the fitting of base material alignment is expected in 1/2, Mark1a cog regions, Mark2a cog regions mutually cover
Standard, Mark1b cog regions, the mutual alignment of Mark2b cog regions, then complete the position outside aerial coil form it is new
The asymmetric positioning Mark a (Mark1a cog regions, Mark2a) easily identified and Mark b（Mark1b cog regions,
Mark2b）, facilitate Field Force quickly, accurately to judge.So design can prevent chip and Mark perforate sets on middle material base material
It is punctual crooked.
Simultaneously because the position of the position of Mark1a cog regions and Mark1b cog regions is asymmetric, neither central symmetry nor
Mirror symmetry, the position of Mark2a cog regions is asymmetric with the position of Mark2b cog regions, neither central symmetry nor mirror image pair
Claim.It can effectively prevent chip and during Mark perforate alignments, fitting direction is anti-on middle material base material.
The method is suitable for the production technology that any type needs to judge relative position.Using in script material foundation
On, under conditions of not increasing technique, hardly increase material, make fixation and recognition Mark（Mark1a cog regions, Mark2a,
Mark1b cog regions, Mark2b）, conveniently in production, whether timely, quick, accurate judgement relative position meets specification, so that
Reach raising product yield, reduce the purpose of production consume.
Brief description of the drawings
Fig. 1 is that existing middle material base material fits in structure diagram on electronic tag.
Fig. 2 is that existing middle material base material fits in structure diagram on electronic tag.
Fig. 3 is to reserve Mark1a identical with die size on the antenna substrate in the present invention outside antenna traces to know
Other area, Mark1b cog region structure diagrams.
Fig. 4 is the structure diagram of middle material base material part in the present invention.
Fig. 5 is the overall structure diagram of the present invention.
In figure, base is expected in 1 antenna traces, 2 antenna substrates, 3 chips, 4Mark1a cog regions, 5 Mark1b cog regions, 6
Material, 7Mark perforates, 9Mark2a cog regions, 10 Mark2b cog regions, 11 adhesive stickers.
Embodiment
Below in conjunction with attached drawing and brief description of the drawings, the present invention is further illustrated.
It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material, including middle material base material 6, in
Mark perforates 7 are provided with material base material 6, middle material base material 6 is covered on electronic tag, and electronic tag includes antenna substrate 2, antenna line
Road 1, chip 3, antenna traces 1 are placed on antenna substrate 2, and chip 3 is placed in antenna traces 1, it is characterized in that, including following step
Suddenly：
Step 1）, reserve and the identical Mark1a cog regions of 3 size of chip on the antenna substrate 2 outside antenna traces 1
4th, Mark1b cog regions 5；
Step 2）, when middle material base material 6 opens Mark perforates 7, while on middle material base material 6 with the position of respective antenna circuit 1 print
The brush Mark2a cog region 9 identical with Mark1a cog regions 4,5 hole size of Mark1b cog regions, Mark2b cog regions 10；That is,
When middle material base material 6 opens Mark perforates 7, while Mark1a cog regions 4, Mark1b on respective antenna base material 2 on middle material base material 6
Printed at the position of cog region 5 the Mark2a cog region 9 identical with Mark1a cog regions 4,5 size of Mark1b cog regions,
Mark2b cog regions 10；
Step 3）, middle material base material 6 is bonded after on electronic tag when, first by middle material base material 6 containing Mark2a cog regions 9,
Fitted at the 1/2 of Mark2b cog regions 10 on electronic tag, the Mark2a cog regions 9 in middle material base material 6 and antenna traces 1
Outside 4 alignment of Mark1a cog regions on antenna substrate 2, Mark2b cog regions 10 in middle material base material 6 with outside antenna traces 1
5 alignment of Mark1b cog regions on antenna substrate 2 so that middle material base material 6 is accurately fitted on electronic tag；
Step 4）, by middle material base material 6 complete fit on electronic tag, chip 3 is placed in the Mark perforates 7 of middle material base material 6.
In the present embodiment, the antenna traces 1 are made of aerial coil.Know with Mark1b the position of Mark1a cog regions 4
The position in other area 5 is asymmetric, neither central symmetry nor mirror symmetry.The position of Mark2a cog regions 9 and Mark2b cog regions
10 position is asymmetric, neither central symmetry nor mirror symmetry.
Claims (4)
1. a kind of quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material, including middle material base material（6）, middle material
Base material（6）It is equipped with Mark perforates（7）, middle material base material（6）It is covered on electronic tag, the electronic tag includes antenna substrate
（2）, antenna traces（1）, chip（3）, antenna traces（1）It is placed in antenna substrate（2）On, chip（3）It is placed in antenna traces（1）
On；It is characterized in that comprise the following steps：
Step 1）, in antenna traces（1）Outside antenna substrate（2）On reserve and chip（3）The identical Mark1a of size
Cog region（4）, Mark1b cog regions（5）；
Step 2）, in middle material base material（6）Open Mark perforates（7）When, while in middle material base material（6）Upper respective antenna base material（2）On
Mark1a cog regions（4）, Mark1b cog regions（5）Position at printing with Mark1a cog regions（4）, Mark1b cog regions（5）
The identical Mark2a cog regions of size（9）, Mark2b cog regions（10）；
Step 3）, by middle material base material（6）When being bonded on electronic tag, first by middle material base material（6）Contain Mark2a cog regions（9）、
Mark2b cog regions（10）1/2 at fit on electronic tag, middle material base material（6）In Mark2a cog regions（9）With antenna
Circuit（1）Outside antenna substrate（2）On Mark1a cog regions（4）Alignment, middle material base material（6）In Mark2b cog regions（10）
With antenna traces（1）Outside antenna substrate（2）On Mark1b cog regions（5）Alignment so that middle material base material（6）Accurately fit in
On electronic tag；
Step 4）, by middle material base material（6）Completion is fitted on electronic tag, chip（3）It is placed in middle material base material（6）Mark perforates
（7）It is interior.
2. it is according to claim 1 it is a kind of quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material,
It is characterized in that：The antenna traces（1）It is made of aerial coil.
3. it is according to claim 1 it is a kind of quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material,
It is characterized in that：The Mark1a cog regions（4）Position and Mark1b cog regions（5）Position it is asymmetric, neither central symmetry
Also not mirror symmetry.
4. it is according to claim 1 it is a kind of quick and precisely ensure that chip is placed in the method in Mark perforates on middle material base material,
It is characterized in that：The Mark2a cog regions（9）Position and Mark2b cog regions（10）Position it is asymmetric, neither central symmetry
Also not mirror symmetry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711222277.9A CN107944536A (en) | 2017-11-29 | 2017-11-29 | It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711222277.9A CN107944536A (en) | 2017-11-29 | 2017-11-29 | It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107944536A true CN107944536A (en) | 2018-04-20 |
Family
ID=61949441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711222277.9A Pending CN107944536A (en) | 2017-11-29 | 2017-11-29 | It is a kind of quick and precisely to ensure that chip is placed in the method in Mark perforates on middle material base material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107944536A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101601055A (en) * | 2007-04-26 | 2009-12-09 | 株式会社村田制作所 | Wireless IC device |
| CN102622639A (en) * | 2011-01-28 | 2012-08-01 | 北京中安特科技有限公司 | Production process of electronic passport element layer |
| CN203084766U (en) * | 2013-03-20 | 2013-07-24 | 宁波立芯射频股份有限公司 | Electronic tag |
| CN204360404U (en) * | 2014-12-30 | 2015-05-27 | 北京握奇智能科技有限公司 | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board |
| KR101551607B1 (en) * | 2015-05-20 | 2015-09-08 | 주식회사 엘아이엠 | Method for tag using radio communication |
| CN204631919U (en) * | 2015-05-11 | 2015-09-09 | 昆山铨丰印刷科技有限公司 | Electronic tag |
-
2017
- 2017-11-29 CN CN201711222277.9A patent/CN107944536A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101601055A (en) * | 2007-04-26 | 2009-12-09 | 株式会社村田制作所 | Wireless IC device |
| CN102622639A (en) * | 2011-01-28 | 2012-08-01 | 北京中安特科技有限公司 | Production process of electronic passport element layer |
| CN203084766U (en) * | 2013-03-20 | 2013-07-24 | 宁波立芯射频股份有限公司 | Electronic tag |
| CN204360404U (en) * | 2014-12-30 | 2015-05-27 | 北京握奇智能科技有限公司 | Circuit board, the smart card made containing fabrication assembly and the fabrication assembly of circuit board |
| CN204631919U (en) * | 2015-05-11 | 2015-09-09 | 昆山铨丰印刷科技有限公司 | Electronic tag |
| KR101551607B1 (en) * | 2015-05-20 | 2015-09-08 | 주식회사 엘아이엠 | Method for tag using radio communication |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180420 |