CN201319098Y - LCD module - Google Patents
LCD module Download PDFInfo
- Publication number
- CN201319098Y CN201319098Y CNU2008202123839U CN200820212383U CN201319098Y CN 201319098 Y CN201319098 Y CN 201319098Y CN U2008202123839 U CNU2008202123839 U CN U2008202123839U CN 200820212383 U CN200820212383 U CN 200820212383U CN 201319098 Y CN201319098 Y CN 201319098Y
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- glass substrate
- lcd module
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Abstract
The utility model discloses an LCD module, which comprises a glass substrate. A colored filter is arranged at the upper part of the glass substrate; an anisotropic conductive adhesive for bonding electronic components is adhered to the lower part; two positioning marks are arranged on the glass substrate positioned on the two sides of the anisotropic conductive adhesive; and the shapes of the two positioning marks are different. The utility model provides a novel LCD module, two positioning marks with different shapes are arranged on the glass substrate, and when the glass substrate is overturned, when packaging the equipment, mistakes can be found in time and the chip bonding motion is stopped.
Description
Technical field
The utility model relates to a kind of LCD module, relates in particular to the glass substrate of LCD module.
Background technology
Can be fixed in glass (chip on glass with chip according to the different mining of baseplate material in the processing procedure of existing middle-size and small-size LCD module, COG, be called glass flip chip encapsulation again), chip is fixed in circuit board (chip on board, COB) or chip be fixed in flexible PCB (chip on film, COF) etc. encapsulation technology is bundled in chip or other electron component on all kinds of substrates.As shown in Figure 1, one LCD module comprises a glass substrate 10, on the described glass substrate 10 colored filter 12 is installed, be positioned at described colored filter 12 belows on the described glass substrate 10 and sticked anisotropy conductiving glue (ACF) 14 with binding chip or other electron component, described anisotropy conductiving glue 14 both sides correspondences are provided with a circular telltale mark 16.In the COG process, sealed in unit can be determined the binding position of chip by scanning telltale mark 16, thereby chip is positioned on the described different in nature conducting resinl 14 finishes binding, accurately limit the positions of chips, guarantee that chip binding back is finished with described glass substrate 10 to be electrically connected by telltale mark 16.
But the glass substrate 10 of existing LCD module is transparent, telltale mark 16 shapes on it are identical, therefore in the COG binding procedure, if glass substrate 10 is reversed placement, sealed in unit still can scan telltale mark 16 and chip is placed on glass substrate 10 back sides, causes wastage of material.Therefore, need provide a kind of new LCD module, its glass substrate 10 is reversed when placing, sealed in unit can in time be found mistake and stop chip binding action.
The utility model content
The purpose of this utility model is to provide a kind of LCD module, and its glass substrate is reversed when placing, and sealed in unit can in time be found mistake and stop the chip binding.
The technical solution of the utility model comprises:
A kind of LCD module, comprise a glass substrate, the top of described glass substrate is provided with a colored filter, the bottom sticks the anisotropy conductiving glue that is useful on the binding electronic component, be positioned at described anisotropy conductiving glue both sides on the described glass substrate and be respectively equipped with a location mark, described two specifically labelled shape differences.
Described LCD module, wherein, described two specifically labelled shapes are respectively circular and cross star.
Described LCD module, wherein, described two specifically labelled shapes are respectively triangle and pentalpha.
Described LCD module, wherein, described two specifically labelled shapes are respectively circle and polygon.
Described LCD module, wherein, described two telltale marks are different to the distance of described glass substrate geometric center point.
The utility model provides a kind of new LCD module, and its glass substrate is provided with variform two telltale marks, and when described glass substrate was reversed placement, sealed in unit can in time be found mistake and stop chip binding action.
Description of drawings
Fig. 1 is a kind of synoptic diagram of existing LCD module;
Fig. 2 is the synoptic diagram of the utility model LCD module better embodiment;
Fig. 3 is the synoptic diagram of the utility model LCD module second embodiment.
Embodiment
Below in conjunction with accompanying drawing, will be described in more detail each preferred embodiment of the present utility model.
As shown in Figure 2, a kind of LCD module, comprise a glass substrate 20, the top of described glass substrate 20 is provided with a colored filter 22, the lower central position sticks the anisotropy conductiving glue 24 that is useful on the binding electronic component, is positioned at described anisotropy conductiving glue 24 both sides on the described glass substrate 20 and is respectively equipped with one first telltale mark 261 and one second telltale mark 262.
In better embodiment of the present utility model, described first telltale mark 261 is a cross star, and second telltale mark 262 is circular.
Therefore, when carrying out the COG binding, if glass substrate 20 is reversed placement, sealed in unit sees through first telltale mark 261 that described glass substrate 20 scans and the shape of second telltale mark 262 will not be inconsistent with setting value, can find mistake at once and stop the chip binding.
In addition, as other embodiment, described specifically labelled shape also can be other geometric configuration, for example triangle, pentalpha or polygon etc.
As shown in Figure 3, in another embodiment of the present utility model, the top of described glass substrate 20 ' is provided with a colored filter 22 ', the lower central position sticks the anisotropy conductiving glue 24 ' that is useful on the binding electronic component, be positioned at described anisotropy conductiving glue 24 ' both sides on the described glass substrate 20 ' and be respectively equipped with one first telltale mark 261 ' and one second telltale mark 262 ', described first telltale mark 261 ' is a cross star, second telltale mark 262 ' is a pentalpha, and described first telltale mark 261 ' and second telltale mark 262 ' are different to the distance of described glass substrate 20 ' geometric center point.
Therefore, when carrying out the COG binding, if glass substrate 20 ' is reversed placement, first telltale mark 261 ' that sealed in unit scans and the shape of second telltale mark 262 ' and position will not be inconsistent with setting value, can find mistake at once and stop chip binding action.
Should be understood that above-mentioned description at preferred embodiment of the present invention is comparatively detailed and concrete, can not therefore think the restriction to the utility model scope of patent protection, scope of patent protection of the present invention should be as the criterion with claims.
Claims (5)
1, a kind of LCD module, comprise a glass substrate, the top of described glass substrate is provided with a colored filter, the bottom sticks the anisotropy conductiving glue that is useful on the binding electronic component, be positioned at described anisotropy conductiving glue both sides on the described glass substrate and be respectively equipped with a location mark, it is characterized in that: described two specifically labelled shape differences.
2, LCD module according to claim 1 is characterized in that, described two specifically labelled shapes are respectively circular and cross star.
3, LCD module according to claim 1 is characterized in that, described two specifically labelled shapes are respectively triangle and pentalpha.
4, LCD module according to claim 1 is characterized in that, described two specifically labelled shapes are respectively circle and polygon.
According to each described LCD module in the claim 1 to 4, it is characterized in that 5, described two telltale marks are different to the distance of described glass substrate geometric center point.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202123839U CN201319098Y (en) | 2008-10-14 | 2008-10-14 | LCD module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008202123839U CN201319098Y (en) | 2008-10-14 | 2008-10-14 | LCD module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201319098Y true CN201319098Y (en) | 2009-09-30 |
Family
ID=41197860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008202123839U Expired - Fee Related CN201319098Y (en) | 2008-10-14 | 2008-10-14 | LCD module |
Country Status (1)
Country | Link |
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CN (1) | CN201319098Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103021966A (en) * | 2012-11-07 | 2013-04-03 | 日月光半导体制造股份有限公司 | Substrate with reference marks and chip fixing method using substrate |
CN105005161A (en) * | 2015-08-10 | 2015-10-28 | 深圳晶华显示器材有限公司 | Mistake proofing crimping production method of display panel, structure of display panel, and display panel |
CN108375849A (en) * | 2018-04-27 | 2018-08-07 | 武汉华星光电技术有限公司 | Array substrate and chip bonding method |
-
2008
- 2008-10-14 CN CNU2008202123839U patent/CN201319098Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103021966A (en) * | 2012-11-07 | 2013-04-03 | 日月光半导体制造股份有限公司 | Substrate with reference marks and chip fixing method using substrate |
CN105005161A (en) * | 2015-08-10 | 2015-10-28 | 深圳晶华显示器材有限公司 | Mistake proofing crimping production method of display panel, structure of display panel, and display panel |
CN105005161B (en) * | 2015-08-10 | 2018-05-15 | 深圳晶华显示器材有限公司 | Mistake proofing crimping production method, structure and the display panel of display panel |
CN108375849A (en) * | 2018-04-27 | 2018-08-07 | 武汉华星光电技术有限公司 | Array substrate and chip bonding method |
WO2019205487A1 (en) * | 2018-04-27 | 2019-10-31 | 武汉华星光电技术有限公司 | Array substrate and chip binding method |
US11101230B2 (en) | 2018-04-27 | 2021-08-24 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Array substrate and chip bonding method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: TCL Group Co., Ltd. Document name: Notification to Pay the Fees |
|
DD01 | Delivery of document by public notice |
Addressee: TCL Group Co., Ltd. Document name: Notification of Termination of Patent Right |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090930 Termination date: 20151014 |
|
EXPY | Termination of patent right or utility model |