CN110333755A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN110333755A CN110333755A CN201910517267.0A CN201910517267A CN110333755A CN 110333755 A CN110333755 A CN 110333755A CN 201910517267 A CN201910517267 A CN 201910517267A CN 110333755 A CN110333755 A CN 110333755A
- Authority
- CN
- China
- Prior art keywords
- side wall
- electronic equipment
- glue
- groove
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000839 emulsion Substances 0.000 claims description 15
- 230000003666 anti-fingerprint Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 46
- 238000010586 diagram Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000003292 glue Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920001621 AMOLED Polymers 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 230000000007 visual effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Polymers C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- -1 amino modified acrylic acid Chemical class 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Polymers COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the present application provides a kind of electronic equipment, is related to electronic technology field, screen accounting can be improved, which includes: display module, and display module includes display panel and cover board, and cover board is located on display panel；Center, center have groove, and groove includes bottom surface and side wall, and the side wall of groove includes two the first side walls on electronic equipment length direction and two second sidewalls in electronic equipment width direction；The first side wall is planar structure；Display panel is placed in the groove of center；The side wall of cover board is adhered to the side wall of groove by the first glue-line.
Description
Technical field
This application involves electronic technology fields, in particular to a kind of electronic equipment.
Background technique
Currently, the design in electronic equipments such as mobile phone, tablet computers develops towards the direction of high screen accounting, screen accounting is used
In the relative ratio for indicating plate suqare before screen and electronic equipment, therefore, how to improve screen accounting becomes those skilled in the art
Member's problem to be solved.
Summary of the invention
Technical scheme provides a kind of electronic equipment, and screen accounting can be improved.
Technical scheme provides a kind of electronic equipment, comprising: display module, the display module include display surface
Plate and cover board, the cover board are located on the display panel；Center, the center have groove, the groove include bottom surface and
Side wall, the side wall of the groove include two the first side walls on the electronic equipment length direction and along the electronic equipment
Two second sidewalls in width direction；The first side wall is planar structure；The display panel is placed in the center
In groove；The side wall of the cover board is adhered to the first side wall and the second sidewall by the first glue-line.
As can be seen that planar structure is set by two the first side walls of center further groove, it can be to avoid step structure pair
The blocking of display panel improves the visual of display panel so that the display panel in groove can have bigger area
Region area.Further, the side wall of cover board is adhered to the side wall of groove by the first glue-line, improves center and display with this
Adhesive strength between mould group.
In a kind of possible design, the display panel passes through the second glue close to a side surface of the bottom surface of the groove
Layer is adhered to the bottom surface of the groove.The adhesive strength between display module and center can be improved.
In a kind of possible design, there is gap between each the first side wall and the side wall of the display panel, it can be with
Reduction display panel risk of cracking damage due to shock.
In a kind of possible design, the cover board is pasted with anti-fingerprint protection far from a side surface of the display panel
Film, the not set anti-fingerprint protective film of the side wall of the cover board.The side wall of the cover board can be contacted directly with first glue-line,
The cohesive force between the first glue-line and the side wall of cover board can be improved.
In a kind of possible design, there is step surface at the second sidewall；The cover board is close to the bottom of the groove
The side part of the surface in face is adhered to the step surface by third glue-line, and the bonding between display module and center can be improved
Power and stability.
In a kind of possible design, it is provided with cohesive force enhancement layer between the third glue-line and the step surface, is glued
Knot power enhancement layer is ink.In a kind of possible design, the ink is urethane resin material.
In a kind of possible design, the third glue-line is two component material.
In a kind of possible design, first glue-line is arranged to the side of the side wall of the cover board and the groove
Gap filling between wall is full.
In a kind of possible design, on from the bottom surface of groove to the direction of cover board, the display panel successively includes showing
Show functional layer, encapsulated layer and polaroid；The 4th glue-line, institute are provided between the side wall of the display panel and each the first side wall
State the side wall that the 4th glue-line is adhered to the display function layer, the encapsulated layer and the polaroid.Pass through the 4th glue-line
The further protection to display panel is formed in side, so that the side of display panel has better seal effect and buffering effect
Fruit.
In a kind of possible design, the display panel includes the buffer layer that distance is nearest between the bottom surface of groove.
In a kind of possible design, first glue-line is light-sensitive emulsion.
In a kind of possible design, second glue-line is delay light-sensitive emulsion.
In a kind of possible design, the electronic equipment is mobile phone, tablet computer or wearable device.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the application specific embodiment or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the application, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of a kind of electronic equipment；
In Fig. 2 in Fig. 1 electronic equipment AA ' to a kind of the schematic diagram of the section structure；
Fig. 3 is the structural schematic diagram in the embodiment of the present application under the positive visual angle of a kind of electronic equipment；
Fig. 4 is the schematic perspective view of the display module of a kind of electronic equipment in the embodiment of the present application；
Fig. 5 is the schematic perspective view of the center of a kind of electronic equipment in the embodiment of the present application；
Fig. 6 is the decomposition texture schematic diagram of a kind of electronic equipment in the embodiment of the present application；
Fig. 7 be Fig. 3 in electronic equipment BB ' to a kind of the schematic diagram of the section structure；
Fig. 8 be Fig. 3 in electronic equipment CC ' to a kind of the schematic diagram of the section structure；
Fig. 9 be Fig. 3 in electronic equipment DD ' to a kind of the schematic diagram of the section structure.
Appended drawing reference:
1 '-display module；
11 '-display panels；
12 '-cover boards；
2 '-centers；
20 '-step surfaces；
3 '-glue-lines；
1- display module；
11- display panel；
101- display function layer；
102- encapsulated layer；
103- polaroid；
104- buffer layer；
12- cover board；
120- side wall；
2- center；
21- groove；
The bottom surface 211-；
212- side wall；
201- the first side wall；
202- second sidewall；
200- step surface；
The first glue-line of 31-；
The second glue-line of 32-；
33- third glue-line；
The 4th glue-line of 34-；
The gap 4-.
Specific embodiment
It is explicitly described below in conjunction with technical solution of the attached drawing to the application, it is clear that described embodiment is
Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
The term used in the embodiment of the present application is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The application.
It should be appreciated that term "and/or" used herein is only a kind of incidence relation for describing affiliated partner, indicate
There may be three kinds of relationships, for example, A and/or B, can indicate: individualism A, exist simultaneously A and B, individualism B these three
Situation.
It should be noted that the nouns of locality such as "upper", "lower" described in the embodiment of the present application, "left", "right" are with attached drawing
Shown in angle come what is be described, should not be construed as the restriction to the embodiment of the present application.In addition, within a context, it is also necessary to
Understand, connects another element when mentioning an element, another element can not only be connected directly between, can also be led to
It crosses intermediary element and is indirectly coupled to another element.
It is introduced in conjunction with structure of the attached drawing to electronic equipment, Fig. 1 is the structural schematic diagram of a kind of electronic equipment, in Fig. 2
In Fig. 1 electronic equipment AA ' to a kind of the schematic diagram of the section structure, as depicted in figs. 1 and 2, display module 1 ' is fixed on center
On 2 '.Display module 1 ' includes display panel 11 ' and cover board 12 '.The display panel 11 ' and cover board 12 ' of display module 1 ' are bonded
Together, it is placed in the groove of center 2 ', the groove of center 2 ' is provided with step surface 20 ' in the edge of surrounding.In Fig. 2
The lower surface of cover board 12 ' is adhered to step surface 20 ' by glue-line 3 ', so that display module 1 ' is fixed on center 2 ', due to
Display module 1 ' needs to realize fixation the surrounding of center 2 ' is bonding with step surface 20 ' by cover board 12 ', and display panel
11 ' are arranged in the lower surface of cover board 12 '.The surrounding of center 2 ' is provided with step structure, and display panel 11 ' is arranged in center 2 '
Between the step structure of surrounding, display panel 11 ' is used to show the display function of picture, and cover board 12 ' is used for display panel 11 '
Light emission side protected.As can be seen that the setting of step surface 20 ' has compressed the space of display panel 11 ' in center 2 '.
With reference to the accompanying drawing to the invention relates to technical solution be illustrated, Fig. 3 be the embodiment of the present application in
Structural schematic diagram under the positive visual angle of a kind of electronic equipment, Fig. 4 are the display module of a kind of electronic equipment in the embodiment of the present application
Schematic perspective view, Fig. 5 are the schematic perspective view of the center of a kind of electronic equipment in the embodiment of the present application, and Fig. 6 is this
Apply embodiment in a kind of electronic equipment decomposition texture schematic diagram, Fig. 7 be Fig. 3 in electronic equipment BB ' to a kind of section
Structural schematic diagram, Fig. 8 be Fig. 3 in electronic equipment CC ' to a kind of the schematic diagram of the section structure.As shown in Figures 3 to 8, this Shen
Please embodiment a kind of electronic equipment is provided, comprising: display module 1, display module 1 include along the z-axis direction on be stacked it is aobvious
Show panel 11 and cover board 12, z-axis direction is the thickness direction of electronic equipment.Cover board 12 is located on display panel 11, display panel
11 and cover board 12 can be bonded to each other；Center 2, center 2 have groove 21, and groove 21 includes bottom surface 211 and side wall 212, groove
21 side wall 212 includes two the first side walls 201 on electronic equipment length direction and in electronic equipment width direction
Two second sidewalls 202.Wherein, the length direction of the first side wall 201 can be identical with electronic equipment length direction, such as Fig. 3 institute
Show, electronic equipment length direction is y-axis direction.The length direction of second sidewall 202 can be identical with electronic equipment width direction,
As shown in figure 3, electronic equipment width direction is x-axis direction.It is arbitrarily mutually perpendicular between the two in x-axis, y-axis and z-axis.Each
The first side wall 201 is planar structure, and 201 position of the first side wall does not have step structure；Display panel 11 is placed in the recessed of center 2
In slot 21, cover board 12 is located at the side of bottom surface 211 of the display panel 11 far from groove 21；The side wall 120 of cover board 12 passes through first
Glue-line 31 is adhered to the first side wall 201 and second sidewall 202.
Wherein, visual angle when positive visual angle, that is, user watches electronic equipment in the z-axis direction, under the visual angle, electronics in Fig. 3
Picture display width of the equipment between the left and right sides is easier to be experienced by user, i.e. picture between two the first side walls 201
Face display width is the bigger the better, and display panel 11 is for realizing menu display function, the side of the bottom surface 211 of groove 21
Light side.As display panel 11 in Fig. 7 and Fig. 8 top be display panel 11 light emission side, for example, display panel 11 can be
(Active-matrix organic light-emitting diode, AMOLED) active matrix organic light-emitting diode is shown
Panel or (Liquid Crystal Display, LCD) liquid crystal display panel, cover board 12 can be made of clear material, example
Such as the glass cover-plate made of glass, for realizing the protection to display module 1, cover board 12 and display panel 11 can pass through
(Optical Clear Resin, OCR) optical clear resin (not shown) bonds together.Wherein, center 2 can be
Aluminium alloy, for realizing the fixation and protection to display module 1.Center 2 or other metal materials are made, center 2
It can be made of graphite.Two the first side walls 201 of center 2 are planar structure, compared to Figure 1, eliminate step structure, this
Sample, the blocking of the not no step structure of display panel 11 between two the first side walls 201, can have (the display of bigger area
Panel 11 is formed by the area in plane in x-axis and y-axis), the visible area area of display panel 11 can be improved.In addition,
It is bonding with 12 bottom surface of cover board due to that can not be realized by step surface for two the first side walls 201, in order to improve display mould
Adhesive strength between group 1 and center 2 makes the side wall 120 of cover board 12 be adhered to the side wall of groove 21 by the first glue-line 31
212.The bottom surface of cover board 12 is surface of the cover board 12 close to 211 side of the bottom surface of groove 21.Step surface in second sidewall 202
200 is Nian Jie by glue-line close to 211 1 side surface of the bottom surface of groove 21 with cover board 12.
It should be noted that the electronic equipment in the embodiment of the present application is gone back other than including display module 1 and center 2
It may include other structures, such as be additionally provided with the structures such as circuit board and battery far from the side of display module 1 in center 2, with
Realize the function of electronic equipment.The side of center 2 is equipped with display module, and the other side is equipped with mainboard and battery.Center 2 is located at display
Between mould group and circuit board.
Electronic equipment in the embodiment of the present application, on the one hand, set plane for two the first side walls of center further groove
Structure, can blocking to avoid step structure to display panel so that the display panel in groove can have bigger area,
Improve the visible area area of display panel.On the other hand, the side wall of cover board is made to be adhered to groove by the first glue-line
Side wall improves the adhesive strength between center and display module with this.The above both sides cooperation, can improve display module
With the fixed form of center, the screen accounting of electronic equipment is improved.
In one possible implementation, display panel 11 passes through the close to a side surface of the bottom surface of groove 21 211
Two glue-lines 32 are adhered to the bottom surface 211 of groove 21, as the lower surface of display panel 11 in Fig. 7 and Fig. 8 is viscous by the second glue-line 32
It is connected to the bottom surface 211 of groove 21, by increasing by the second glue between the bottom surface of display panel 11 211 and the bottom surface of groove 21 211
The mode of layer 32, can be further improved the adhesive strength between display module 1 and center 2.
The area that the embodiment of the present application increases display panel 11 by the way that setting the first side wall 201 is planar structure, if
Based on considering for screen accounting is improved, the side wall and the distance between the first side wall 201 of display panel 11 are the smaller the better, however, logical
Actual drop test is crossed, if the side wall of display panel 11 directly contacts the first side wall 201 of groove 21 or passes through glue-line
Or the first side wall 201 of other structures mediate contact groove 21, it may result in display panel cracking risk with higher.Cause
This has gap 4 in one possible implementation between each the first side wall 201 and the side wall of display panel 11.Such as
Structure in Fig. 8, has gap 4 between 11 leftmost side edge of the first side wall 201 and display panel, and the first glue-line 31 is located at cover board
Between 12 side wall 120 and the side wall 212 of groove, gap 4 is between the first glue-line 31 and the bottom surface 211 of groove 21.In electricity
In the manufacture craft of sub- equipment, display module 1 is placed on the groove 21 of center 2, by the second glue-line 32 by display panel 11
Lower surface and groove 21 bottom surface 211 be bonded, then, carried out between the side wall 120 of cover board 12 and the side wall 212 of groove 21
Dispensing makes the first glue-line 31 be placed in the gap between cover board 12 and center 2, during the dispensing of the first glue-line 31, adhesive
It may flow downward, by the flow of adhesive when control dispensing, so that adhesive, which will not flow downward to, fills up display surface
Between the side wall and the first side wall 201 of plate 11, guarantee at least partly area between the side wall and the first side wall 201 of display panel 11
Domain maintains the air gap 4.Display panel 11, such as AMOLED display panel are easy cracking after being hit, so as to cause aobvious
Show exception, by actual drop test, if having gap 4 between the first side wall 201 and the side wall of display panel 11, shows
Panel 11 is due to shock and the risk of cracking damage can reduce, to improve the reliability of display panel 11.
As shown in Figure 7 and Figure 8, cover board 12 is located at the outermost of electronic equipment far from a side surface of display panel 11, holds
Easily user touch when, leave fingerprint on surface, especially for touch-control display module, user need by the touching of finger come
Realize the control to electronic equipment, therefore, it is easier to fingerprint is left on the surface of cover board 12, to cause to display effect bad
It influences, therefore, anti-fingerprint protective film (not shown) can be pasted with far from a side surface of display panel 11 in cover board 12.
The not set anti-fingerprint protective film of the side wall 120 of cover board 12, the side wall 120 of cover board 12 are directly contacted with the first glue-line 31.Due to
The reason of technique, is easy to remain anti-fingerprint guarantor on the side wall 120 of cover board 12 when 12 surface of cover board makes anti-fingerprint protective film
Cuticula, for example, forming oleophobic layer on 12 surface of cover board by spraying process, as anti-fingerprint protective film, oleophobic layer may be residual
It stays on the side wall 120 of cover board 12, the binding force between adhesive and anti-fingerprint protective film is poor, can reduce the side wall of cover board 12
120 and the first cohesive force between glue-line 31 therefore can remove the side wall 120 of cover board 12 by way of plasma treatment
Upper remaining anti-fingerprint protective film, to improve the cohesive force between the first glue-line 31 and the side wall 120 of cover board 12.
Optionally, Fig. 9 be Fig. 3 in electronic equipment DD ' to a kind of the schematic diagram of the section structure, as shown in figs. 3 to 9,
There is step surface 200, each step surface 200 can be perpendicular to z-axis at second sidewall 202.Step is provided at second sidewall 202
Structure, side part of the surface of the cover board 12 close to the bottom surface of groove 21 211 are adhered to step surface 200 by third glue-line 33.Such as
Shown in Fig. 9, cover board 12 is adhered to step surface 200 by third glue-line 33 close to the both ends of the side of the bottom surface of groove 21 211.Its
In, cohesive force enhancement layer (not shown) can be set between third glue-line 33 and each step surface 200.Cohesive force enhancing
Layer with the binding force with higher of third glue-line 33, while with the binding force with higher of step surface 200 on center 2, thus
For improving the cohesive force between third glue-line 33 and step surface 200, further increase viscous between display module 1 and center 2
Tie power and stability.For example, the step surface width in Fig. 3 at the second sidewall 202 of top can be 0.7 ㎜, lower section second sidewall
Step surface width at 202 can be 0.5mm.Wherein, step surface width can be the size of step surface in the y-axis direction.
As shown in figure 9, cover board 12 be transparent material, and the step surface 200 on center 2 may generate it is reflective, therefore, on
Stating cohesive force enhancement layer can be ink, for example, by black ink, realize the effect of extinction and shading, avoid ambient quilt
Step surface 200 reflects and brings bad experience to the viewing of user.
Optionally, above-mentioned ink is urethane resin material, to improve the by the stronger High-performance ink material of cohesive force
Cohesive force between three glue-lines 33 and step surface 200.
It should be noted that in order to further increase the cohesive force between cover board 12 and step surface 200,33 He of third glue-line
Cohesive force enhancement layer equally can be set between cover board 12.
Optionally, third glue-line 33 can be two component material.In the adhesive using two kinds of different components of preceding mixing
Production forms third glue-line 33 after material mixing, and compared with single-component glue, cohesive force may be stronger.
Optionally, the main component after above-mentioned two component materials synthesis is methacrylic acid, and Young's modulus is in 1.0GPa
Between~1.1Gpa.
As shown in figs. 3 to 9, the first glue-line 31 be arranged to by the side wall 212 of the side wall 120 of cover board 12 and groove 21 it
Between gap filling it is full.In the manufacturing process of electronic equipment, display module 1 is placed on center 2 and by the second glue-line 32
After being bonded with third glue-line 33, in the surrounding of cover board 12, there will necessarily be the gap between the side wall 212 of center 2,
Therefore, the gap can be filled up by the first glue-line 31.On the one hand, the side wall 120 of cover board 12 can be improved in position
Cohesive force and stability between the side wall 212 of center 2, on the other hand, can also realize the function of sealing, prevent dust into
Enter electronic equipment internal.For example, as shown in figure 9, by the first glue-line between the side wall 120 of cover board 12 and the side wall 212 of groove 21
31 gap widths filled can be 0.06mm.
In one possible implementation, display panel 11 be AMOLED display panel, from the bottom surface of groove 21 211 to
On the direction of cover board 12, i.e., on the direction in Fig. 7, Fig. 8 and Fig. 9 from bottom to up, display panel 11 successively includes display function layer
101, encapsulated layer 102 and polaroid 103, wherein on from the bottom surface of groove 21 211 to the direction of cover board 12, display function layer
101 may include rigid substrate (such as glass substrate), circuit film layer and luminescent device film layer, include in luminescent device film layer according to
The secondary anode layer being stacked, organic luminous layer and cathode layer, when applying voltage respectively on anode layer and cathode layer, electronics and
Hole is injected separately into organic luminous layer, compound in organic luminous layer and release energy, and realizes and shines, and then realizes display function
Can, it is provided in circuit film layer for driving the circuit structure that luminescent device is luminous in luminescent device film layer.Encapsulated layer 102 is used for
Realize the encapsulation of display function layer 101, the display function layer 101 and encapsulated layer 102 being packaged together are the structure of hardness, therefore
When colliding stress, it is easy cracking and damages.Therefore, the structure in the embodiment of the present application is conducive to AMOLED display panel
Protection, in addition, polaroid 103 is adhered to encapsulated layer 102 by glue-line (not shown)；The side wall of display panel 11 and first
The 4th glue-line 34 can be set between side wall 201, the 4th glue-line 34 is adhered to display function layer 101, encapsulated layer 102 and polarisation
The side wall of piece 103.On the one hand, the further protection to display panel 11 is formed in side by the 4th glue-line 34, so that display
The side of panel 11 has better seal effect and buffering effect.On the other hand, it is further increased by the 4th glue-line 34 aobvious
Show the cohesive force and stability between functional layer 101, encapsulated layer 102 and polaroid 103.4th glue-line 34 is specifically as follows dual
The main component of solidification glue, dual cure glue can be amino modified acrylic acid, and Young's modulus is between 400Mpa~500Mpa.
In one possible implementation, as shown in figure 8, gap 4 is between the first side wall 201 and the 4th glue-line 34.In addition, the
It can be spaced setting between four glue-lines 34 and the bottom surface 211 of groove 21, to prevent the display of 211 pairs of 21 bottom surface of collision process further groove
The effect of 11 side wall of panel, reduction display panel 11 risk of cracking damage due to shock.For example, as shown in figure 8, display surface
The distance between the side of plate 11 and the first side wall 201 can be 0.41mm.It should be noted that in one embodiment,
First glue-line, the second glue-line, third glue-line and the 4th glue-line can be the glue-line of identical material, or the glue of different materials
Layer, the embodiment of the present application have illustration for the specific implementation of each glue-line.
In one implementation, display panel 11 further includes buffer layer 104.Buffer layer 104 can be with the bottom of groove 21
Distance is nearest between face 211.Buffer layer 104 can specifically include the material layers such as foam.When electronic equipment collides, it can make to show
There is stress buffering, to reduce display between the bottom surface 211 of 2 further groove 21 of display function layer 101 in panel 11 and center
The risk that panel 11 is damaged due to collision.
In one implementation, the first glue-line 31 is light-sensitive emulsion, such as ultraviolet curing glue, is that one kind passes through ultraviolet light
Light irradiates and the adhesive that is cured.In the bonding process of display module 1 and center 2, display module 1 is placed in center 2
Groove 21 on, then between the side wall 120 of cover board 12 and the side wall 212 of groove 21 by gluing process be arranged light-sensitive emulsion,
Then make the ultraviolet light irradiation light-sensitive emulsion.Since cover board 12 is transparent material, ultraviolet can pass through cover board 12 and shine
It is incident upon light-sensitive emulsion, the bonding between the side wall 120 of cover board 12 and the side wall 212 of groove 21 is realized in photosensitive adhesive curing.First glue-line
31 main component can be amino modified acrylic acid, and Young's modulus is between 40Mpa~60Mpa.
In one implementation, the second glue-line 32 is delay light-sensitive emulsion, and delay light-sensitive emulsion has the characteristic of retardation of curing,
When ultraviolet light irradiation for a period of time after can just solidify, since 11 overall structure of display panel is opaque.Therefore, it is arranged
Second glue-line 32 is delay light-sensitive emulsion, in the bonding process of display module 1 and center 2, first in display panel 11 far from lid
The side surface setting delay light-sensitive emulsion of plate 12, then makes ultraviolet illumination be incident upon the light-sensitive emulsion, is later placed in display module 1
On the groove 21 of center 2, a side surface of the display panel 11 far from cover board 12 contacts the bottom surface of groove 21 by delay light-sensitive emulsion
211, at this point, the delay light-sensitive emulsion starts to free solidification, thus realize a side surface by display panel 11 far from cover board 12 and
Bonding between the bottom surface 211 of groove 21.The main component of second glue-line 32 can be polyurethane-modified acrylic acid, Young's modulus
Between 5Mpa~10Mpa.
Optionally, above-mentioned electronic equipment can be mobile phone, tablet computer or wearable device etc..
The above is only preferred embodiment of the present application, are not intended to limit this application, for those skilled in the art
For member, various changes and changes are possible in this application.Within the spirit and principles of this application, it is made it is any modification,
Equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (12)
1. a kind of electronic equipment characterized by comprising
Display module, the display module include display panel and cover board, and the cover board is located on the display panel；
Center, the center have groove, and the groove includes bottom surface and side wall, and the side wall of the groove includes along the electronics
Two the first side walls on device length direction and two second sidewalls in the electronic equipment width direction；
The first side wall is planar structure；
The display panel is placed in the groove of the center；
The side wall of the cover board is adhered to the first side wall and the second sidewall by the first glue-line.
2. electronic equipment according to claim 1, which is characterized in that
The display panel is adhered to by the second glue-line the bottom surface of the groove close to a side surface of the bottom surface of the groove.
3. electronic equipment according to claim 1 to 2, which is characterized in that
There is gap between the first side wall and the side wall of the display panel.
4. electronic equipment according to claim 1 to 3, which is characterized in that
The cover board is pasted with anti-fingerprint protective film far from a side surface of the display panel, and the side wall of the cover board is not set
The anti-fingerprint protective film.
5. electronic equipment according to claim 1 to 4, which is characterized in that
There is step surface at the second sidewall；
Side part of the surface of the cover board close to the bottom surface of the groove is adhered to the step surface by third glue-line.
6. electronic equipment according to claim 5, which is characterized in that
Cohesive force enhancement layer is provided between the third glue-line and the step surface；
The cohesive force enhancement layer is ink.
7. -6 any electronic equipment according to claim 1, which is characterized in that
First glue-line is arranged to expire the gap filling between the side wall of the cover board and the side wall of the groove.
8. -7 any electronic equipment according to claim 1, which is characterized in that
On from the bottom surface of the groove to the direction of the cover board, the display panel successively includes display function layer, encapsulated layer
And polaroid；
The 4th glue-line is provided between the side wall of the display panel and each the first side wall, the 4th glue-line is adhered to
The side wall of the display function layer, the encapsulated layer and the polaroid.
9. -8 any electronic equipment according to claim 1, which is characterized in that
The display panel includes the buffer layer that distance is nearest between the bottom surface of the groove.
10. -9 any electronic equipment according to claim 1, which is characterized in that
First glue-line is light-sensitive emulsion.
11. electronic equipment according to claim 2, which is characterized in that
Second glue-line is delay light-sensitive emulsion.
12. -11 any electronic equipment according to claim 1, which is characterized in that the electronic equipment is mobile phone, plate
Computer or wearable device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910517267.0A CN110333755B (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
| CN202310826869.0A CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910517267.0A CN110333755B (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310826869.0A Division CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110333755A true CN110333755A (en) | 2019-10-15 |
| CN110333755B CN110333755B (en) | 2023-07-11 |
Family
ID=68140977
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910517267.0A Active CN110333755B (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
| CN202310826869.0A Pending CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310826869.0A Pending CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110333755B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111147633A (en) * | 2019-12-24 | 2020-05-12 | 华为技术有限公司 | Mobile terminal |
| CN113382569A (en) * | 2021-06-04 | 2021-09-10 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN114125103A (en) * | 2021-11-18 | 2022-03-01 | Oppo广东移动通信有限公司 | Connecting ring, middle frame, electronic equipment, display module and assembling method of display module |
| CN115097904A (en) * | 2022-07-25 | 2022-09-23 | 荣耀终端有限公司 | Electronic equipment |
| WO2022213722A1 (en) * | 2021-04-07 | 2022-10-13 | Oppo广东移动通信有限公司 | Electronic device and assembly method therefor |
| CN115249434A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Display device |
| CN116017898A (en) * | 2023-03-24 | 2023-04-25 | 荣耀终端有限公司 | Electronic device and method for assembling electronic device |
| CN114449791B (en) * | 2020-10-30 | 2024-01-23 | 北京小米移动软件有限公司 | Electronic equipment |
| CN117437848A (en) * | 2022-07-13 | 2024-01-23 | 荣耀终端有限公司 | Display equipment and assembly process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108008780A (en) * | 2018-01-22 | 2018-05-08 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN108227269A (en) * | 2018-02-01 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of middle shell, electronic equipment and its assemble method |
| CN207833400U (en) * | 2018-01-18 | 2018-09-07 | 广东欧珀移动通信有限公司 | Electronic equipment |
| WO2019006783A1 (en) * | 2017-07-03 | 2019-01-10 | 上海传英信息技术有限公司 | Screen structure, and display apparatus using the screen structure |
-
2019
- 2019-06-14 CN CN201910517267.0A patent/CN110333755B/en active Active
- 2019-06-14 CN CN202310826869.0A patent/CN116915883A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019006783A1 (en) * | 2017-07-03 | 2019-01-10 | 上海传英信息技术有限公司 | Screen structure, and display apparatus using the screen structure |
| CN207833400U (en) * | 2018-01-18 | 2018-09-07 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN108008780A (en) * | 2018-01-22 | 2018-05-08 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN108227269A (en) * | 2018-02-01 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of middle shell, electronic equipment and its assemble method |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111147633A (en) * | 2019-12-24 | 2020-05-12 | 华为技术有限公司 | Mobile terminal |
| CN111147633B (en) * | 2019-12-24 | 2021-07-02 | 荣耀终端有限公司 | Mobile terminal |
| CN114449791B (en) * | 2020-10-30 | 2024-01-23 | 北京小米移动软件有限公司 | Electronic equipment |
| WO2022213722A1 (en) * | 2021-04-07 | 2022-10-13 | Oppo广东移动通信有限公司 | Electronic device and assembly method therefor |
| CN115249434A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Display device |
| CN113382569A (en) * | 2021-06-04 | 2021-09-10 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN114125103A (en) * | 2021-11-18 | 2022-03-01 | Oppo广东移动通信有限公司 | Connecting ring, middle frame, electronic equipment, display module and assembling method of display module |
| CN117437848A (en) * | 2022-07-13 | 2024-01-23 | 荣耀终端有限公司 | Display equipment and assembly process thereof |
| CN115097904A (en) * | 2022-07-25 | 2022-09-23 | 荣耀终端有限公司 | Electronic equipment |
| CN116017898A (en) * | 2023-03-24 | 2023-04-25 | 荣耀终端有限公司 | Electronic device and method for assembling electronic device |
| CN116017898B (en) * | 2023-03-24 | 2023-09-05 | 荣耀终端有限公司 | Electronic device and method for assembling electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110333755B (en) | 2023-07-11 |
| CN116915883A (en) | 2023-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110333755A (en) | Electronic equipment | |
| CN111128011B (en) | Flexible display device and electronic apparatus including the same | |
| CN107102762B (en) | Touch screen panel and mobile terminal including the same | |
| US11129281B2 (en) | Flexible circuit film and electronic device comprising the same | |
| KR102420438B1 (en) | Display apparatus and portable terminal | |
| US10823996B2 (en) | Display panel and method of manufacturing the same, display device | |
| US20160118370A1 (en) | Display device | |
| KR101963125B1 (en) | Display module | |
| US7920224B2 (en) | Display device | |
| US11342539B2 (en) | Display panel aligned with window and display device having the same | |
| US9910520B2 (en) | Electronic device | |
| CN102376748A (en) | On-cell tps active matrix organic light emitting diode structure | |
| TWM474189U (en) | Touch display apparatus | |
| CN102346322B (en) | Touch control display device | |
| JP5664144B2 (en) | Information display terminal | |
| KR102535167B1 (en) | Display device | |
| CN111987239A (en) | Flexible display panel and display device | |
| KR102177962B1 (en) | Display module and display device having the same | |
| KR101797001B1 (en) | Acf, fabricating method of display panel using the same, fpd module inculding the display panel | |
| JP2011191444A (en) | Liquid crystal display module | |
| TWI457645B (en) | Touch display device | |
| CN113644102B (en) | Display module, preparation method thereof and display device | |
| CN111882989B (en) | Display panel and display device | |
| CN110738136B (en) | Display module and electronic equipment | |
| CN112310303A (en) | Display device and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |