CN116915883A - Electronic equipment - Google Patents
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- CN116915883A CN116915883A CN202310826869.0A CN202310826869A CN116915883A CN 116915883 A CN116915883 A CN 116915883A CN 202310826869 A CN202310826869 A CN 202310826869A CN 116915883 A CN116915883 A CN 116915883A
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- Prior art keywords
- display panel
- layer
- electronic device
- groove
- cover plate
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 63
- 239000010410 layer Substances 0.000 claims description 67
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 10
- 230000003111 delayed effect Effects 0.000 claims description 8
- 230000002708 enhancing effect Effects 0.000 claims description 8
- 239000002346 layers by function Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- -1 amino modified acrylic acid Chemical class 0.000 claims description 2
- 125000005395 methacrylic acid group Chemical group 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 230000003666 anti-fingerprint Effects 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 7
- 229920001621 AMOLED Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012205 single-component adhesive Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the application provides electronic equipment, which relates to the technical field of electronics and can improve the screen occupation ratio, and comprises: the display module comprises a display panel and a cover plate, and the cover plate is positioned on the display panel; the middle frame is provided with a groove, the groove comprises a bottom surface and side walls, and the side walls of the groove comprise two first side walls along the length direction of the electronic equipment and two second side walls along the width direction of the electronic equipment; the first side walls are all planar structures; the display panel is arranged in the groove of the middle frame; the side wall of the cover plate is adhered to the side wall of the groove through the first adhesive layer.
Description
The application relates to a divisional application of a Chinese patent application named as electronic equipment, wherein the application number is 201910517267.0, the application date is 2019, 6, 14.
Technical Field
The application relates to the technical field of electronics, in particular to electronic equipment.
Background
At present, in the design of electronic devices such as mobile phones and tablet computers, the design is developed towards a high screen ratio, and the screen ratio is used for representing the relative ratio of the screen area to the front panel area of the electronic device, so how to improve the screen ratio is a problem to be solved by those skilled in the art.
Disclosure of Invention
The technical scheme of the application provides electronic equipment, which can improve the screen occupation ratio.
The technical scheme of the application provides electronic equipment, which comprises: the display module comprises a display panel and a cover plate, and the cover plate is positioned on the display panel; a middle frame, wherein the middle frame is provided with a groove, the groove comprises a bottom surface and side walls, and the side walls of the groove comprise two first side walls along the length direction of the electronic equipment and two second side walls along the width direction of the electronic equipment; the first side walls are all planar structures; the display panel is arranged in the groove of the middle frame; the side wall of the cover plate is adhered to the first side wall and the second side wall through a first adhesive layer.
It can be seen that the two first side walls of the groove in the middle frame are arranged to be of a plane structure, so that the blocking of the step structure to the display panel can be avoided, the display panel in the groove can have a larger area, and the visible area of the display panel is increased. Furthermore, the side wall of the cover plate is adhered to the side wall of the groove through the first adhesive layer, so that the adhesive strength between the middle frame and the display module is improved.
In one possible design, a surface of the display panel, which is close to the bottom surface of the groove, is adhered to the bottom surface of the groove through a second adhesive layer. The bonding strength between the display module and the middle frame can be improved.
In one possible design, having a gap between each first sidewall and the sidewall of the display panel may reduce the risk of cracking damage to the display panel due to impact.
In one possible design, an anti-fingerprint protection film is attached to a surface of a side of the cover plate away from the display panel, and the anti-fingerprint protection film is not disposed on a side wall of the cover plate. The side wall of the cover plate can be in direct contact with the first adhesive layer, and the adhesive force between the first adhesive layer and the side wall of the cover plate can be improved.
In one possible design, the second sidewall has a stepped surface at the second sidewall; the surface of one side part of the cover plate, which is close to the bottom surface of the groove, is adhered to the step surface through a third adhesive layer, so that the adhesive force and stability between the display module and the middle frame can be improved.
In one possible design, an adhesion enhancing layer is provided between the third glue layer and the step surface, the adhesion enhancing layer being ink. In one possible design, the ink is a urethane resin material.
In one possible design, the third glue layer is a two-component glue material.
In one possible design, the first glue layer is arranged to fill the gap between the side walls of the cover plate and the side walls of the recess.
In one possible design, the display panel sequentially comprises a display functional layer, a packaging layer and a polaroid from the bottom surface of the groove to the cover plate; a fourth adhesive layer is arranged between the side wall of the display panel and each first side wall, and the fourth adhesive layer is adhered to the side walls of the display functional layer, the packaging layer and the polaroid. The fourth adhesive layer is used for further protecting the display panel at the side edge, so that the side edge of the display panel has better sealing effect and buffering effect.
In one possible design, the display panel includes a buffer layer closest to the bottom surface of the recess.
In one possible design, the first glue layer is a photosensitive glue.
In one possible design, the second glue layer is a delayed photosensitive glue.
In one possible design, the electronic device is a cell phone, tablet computer, or wearable device.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an electronic device;
FIG. 2 is a schematic cross-sectional view of the electronic device of FIG. 1 in the AA' direction;
fig. 3 is a schematic structural diagram of an electronic device under a front view angle in an embodiment of the application;
fig. 4 is a schematic perspective view of a display module of an electronic device according to an embodiment of the application;
fig. 5 is a schematic perspective view of a middle frame of an electronic device according to an embodiment of the present application;
FIG. 6 is a schematic diagram of an exploded structure of an electronic device according to an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of the electronic device of FIG. 3 in BB';
FIG. 8 is a schematic cross-sectional view of the electronic device of FIG. 3 in the direction CC';
fig. 9 is a schematic cross-sectional view of the electronic device in DD' direction in fig. 3.
Reference numerals:
1' -display module;
11' -display panel;
12' -cover plate;
2' -middle frame;
20' -step surface;
a 3' -glue layer;
1-a display module;
11-a display panel;
101-displaying a functional layer;
102-an encapsulation layer;
103-a polarizer;
104-a buffer layer;
12-cover plate;
120-sidewalls;
2-a middle frame;
21-grooves;
211-bottom surface;
212-sidewalls;
201-a first sidewall;
202-a second sidewall;
200-step surface;
31-a first glue layer;
32-a second glue layer;
33-a third glue layer;
34-a fourth glue layer;
4-gap.
Detailed Description
The technical solutions of the present application will be clearly described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone.
It should be noted that, the terms "upper", "lower", "left", "right", and the like in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. Furthermore, in the context it will also be understood that when an element is referred to as being connected to another element, it can be directly connected to the other element or be indirectly connected to the other element via intervening elements.
Referring to the drawings for describing the structure of the electronic device, fig. 1 is a schematic structural diagram of the electronic device, fig. 2 is a schematic sectional structural diagram of the electronic device in the AA ' direction in fig. 1, and as shown in fig. 1 and fig. 2, a display module 1' is fixed on a middle frame 2'. The display module 1' includes a display panel 11' and a cover plate 12'. The display panel 11 'and the cover plate 12' of the display module 1 'are adhered together and placed in the groove of the middle frame 2', and the edges of the periphery of the groove of the middle frame 2 'are provided with step surfaces 20'. In fig. 2, the lower surface of the cover plate 12' is adhered to the step surface 20' through the adhesive layer 3', so that the display module 1' is fixed on the middle frame 2', and the display panel 11' is disposed on the lower surface of the cover plate 12' because the display module 1' needs to be fixed by adhering the cover plate 12' to the step surface 20' around the middle frame 2'. The step structures are arranged around the middle frame 2', the display panel 11' is arranged between the step structures around the middle frame 2', the display panel 11' is used for displaying the display function of a picture, and the cover plate 12 'is used for protecting the light emergent side of the display panel 11'. It can be seen that the provision of the stepped surface 20' in the middle frame 2' compresses the space of the display panel 11 '.
The following description is made with reference to the accompanying drawings, in which fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application under a front view angle, fig. 4 is a schematic structural diagram of a display module of the electronic device according to an embodiment of the present application, fig. 5 is a schematic structural diagram of a middle frame of the electronic device according to an embodiment of the present application, fig. 6 is a schematic structural diagram of an exploded electronic device according to an embodiment of the present application, fig. 7 is a schematic structural diagram of a cross-section of the electronic device in a BB 'direction, and fig. 8 is a schematic structural diagram of a cross-section of the electronic device in a CC' direction. As shown in fig. 3 to 8, an embodiment of the present application provides an electronic device, including: the display module 1, the display module 1 includes a display panel 11 and a cover plate 12 stacked in a z-axis direction, which is a thickness direction of the electronic device. The cover plate 12 is positioned on the display panel 11, and the display panel 11 and the cover plate 12 can be mutually attached; the middle frame 2, the middle frame 2 has a groove 21, the groove 21 includes a bottom surface 211 and side walls 212, and the side walls 212 of the groove 21 include two first side walls 201 along the length direction of the electronic device and two second side walls 202 along the width direction of the electronic device. The length direction of the first sidewall 201 may be the same as the length direction of the electronic device, and as shown in fig. 3, the length direction of the electronic device is the y-axis direction. The length direction of the second sidewall 202 may be the same as the electronic device width direction, which is the x-axis direction as shown in fig. 3. Any two of the x-axis, y-axis and z-axis are perpendicular to each other. Each first side wall 201 is of a planar structure, and the position of the first side wall 201 is not provided with a step structure; the display panel 11 is arranged in the groove 21 of the middle frame 2, and the cover plate 12 is positioned on one side of the display panel 11 away from the bottom surface 211 of the groove 21; the sidewall 120 of the cover plate 12 is adhered to the first sidewall 201 and the second sidewall 202 by the first adhesive layer 31.
The front view angle, that is, the view angle when the user views the electronic device in the z-axis direction, is more easily perceived by the user in fig. 3, that is, the larger the screen display width between the two first sidewalls 201, the better the display panel 11 is for implementing the screen display function, and one side of the bottom 211 of the groove 21 is the light emitting side. As shown in fig. 7 and 8, on the top of the display panel 11, the light emitting side of the display panel 11 is, for example, an Active-matrix organic light-emitting diode (AMOLED) Active matrix organic light emitting diode display panel or a (Liquid Crystal Display, LCD) liquid crystal display panel, the cover plate 12 may be made of a transparent material, such as a glass cover plate made of glass, for protecting the display module 1, and the cover plate 12 and the display panel 11 may be bonded together by an (Optical Clear Resin, OCR) optically transparent resin (not shown in the figure). The middle frame 2 may be an aluminum alloy, and is used for fixing and protecting the display module 1. The middle frame 2 can also be made of other metal materials, and the middle frame 2 can also be made of graphite. The two first side walls 201 of the middle frame 2 are both planar structures, and compared with fig. 1, the step structure is removed, so that the display panel 11 between the two first side walls 201 has no barrier of the step structure, can have a larger area (the area of the display panel 11 in the plane formed by the x axis and the y axis), and can increase the visible area of the display panel 11. In addition, since the adhesion between the two first side walls 201 and the bottom surface of the cover plate 12 cannot be achieved by the step surface, the side walls 120 of the cover plate 12 are adhered to the side walls 212 of the recess 21 by the first adhesive layer 31 in order to improve the adhesion strength between the display module 1 and the middle frame 2. The bottom surface of the cover plate 12 is the surface of the cover plate 12 on the side close to the bottom surface 211 of the recess 21. The step surface 200 on the second side wall 202 is adhered to the surface of the cover plate 12, which is close to the bottom surface 211 of the groove 21, through an adhesive layer.
It should be noted that, in addition to the display module 1 and the middle frame 2, the electronic device in the embodiment of the present application may further include other structures, for example, a circuit board, a battery, and other structures are further disposed on a side of the middle frame 2 away from the display module 1, so as to implement functions of the electronic device. One side of the middle frame 2 is provided with a display module, and the other side is provided with a main board and a battery. The middle frame 2 is positioned between the display module and the circuit board.
According to the electronic equipment provided by the embodiment of the application, on one hand, the two first side walls of the groove in the middle frame are arranged to be of the plane structure, so that the barrier of the step structure to the display panel can be avoided, the display panel in the groove can have a larger area, and the visible area of the display panel is increased. On the other hand, the side wall of the cover plate is adhered to the side wall of the groove through the first adhesive layer, so that the adhesive strength between the middle frame and the display module is improved. The combination of the two aspects can improve the fixing mode of the display module and the middle frame, and improves the screen occupation ratio of the electronic equipment.
In one possible implementation manner, a surface of the display panel 11 near the bottom surface 211 of the recess 21 is adhered to the bottom surface 211 of the recess 21 through the second adhesive layer 32, as in fig. 7 and 8, the lower surface of the display panel 11 is adhered to the bottom surface 211 of the recess 21 through the second adhesive layer 32, and by adding the second adhesive layer 32 between the bottom surface 211 of the display panel 11 and the bottom surface 211 of the recess 21, the adhesion strength between the display module 1 and the middle frame 2 can be further improved.
The embodiment of the present application increases the area of the display panel 11 by setting the first sidewall 201 to a planar structure, if the distance between the sidewall of the display panel 11 and the first sidewall 201 is smaller based on the consideration of improving the screen ratio, however, through the practical drop test, if the sidewall of the display panel 11 directly contacts the first sidewall 201 of the groove 21 or indirectly contacts the first sidewall 201 of the groove 21 through a glue layer or other structures, the display panel may have a higher risk of cracking. Thus, in one possible implementation, there is a gap 4 between each first sidewall 201 and the sidewall of the display panel 11. For example, in the structure of fig. 8, a gap 4 is provided between the first sidewall 201 and the leftmost edge of the display panel 11, the first adhesive layer 31 is located between the sidewall 120 of the cover plate 12 and the sidewall 212 of the recess, and the gap 4 is located between the first adhesive layer 31 and the bottom 211 of the recess 21. In the manufacturing process of the electronic device, the display module 1 is placed on the groove 21 of the middle frame 2, the lower surface of the display panel 11 is adhered to the bottom surface 211 of the groove 21 through the second adhesive layer 32, then, dispensing is performed between the side wall 120 of the cover plate 12 and the side wall 212 of the groove 21, the first adhesive layer 31 is placed in the gap between the cover plate 12 and the middle frame 2, in the dispensing process of the first adhesive layer 31, the adhesive may flow downwards, and the flow rate of the adhesive is controlled during dispensing, so that the adhesive does not flow downwards to between the side wall of the display panel 11 and the first side wall 201, and the air gap 4 is ensured to be maintained in at least part of the area between the side wall of the display panel 11 and the first side wall 201. The display panel 11, for example, an AMOLED display panel, is easily cracked after being impacted, thereby causing abnormal display, and if the gap 4 is formed between the first sidewall 201 and the sidewall of the display panel 11 through an actual drop test, the risk of cracking and damaging the display panel 11 due to the impact is reduced, thereby improving the reliability of the display panel 11.
As shown in fig. 7 and 8, a surface of the cover 12 on a side far from the display panel 11 is located at the outermost side of the electronic device, so that when a user touches the electronic device, a fingerprint is easily left on the surface, and particularly, for a touch display module, the user needs to control the electronic device by touching with a finger, so that the fingerprint is more easily left on the surface of the cover 12, thereby adversely affecting the display effect, and therefore, an anti-fingerprint protection film (not shown in the figure) may be attached to a surface of the cover 12 on a side far from the display panel 11. The side wall 120 of the cover plate 12 is not provided with the anti-fingerprint protective film, and the side wall 120 of the cover plate 12 is in direct contact with the first adhesive layer 31. For process reasons, when the anti-fingerprint protection film is manufactured on the surface of the cover plate 12, the anti-fingerprint protection film is easy to remain on the side wall 120 of the cover plate 12, for example, an oleophobic layer is formed on the surface of the cover plate 12 through a spraying process, the oleophobic layer may remain on the side wall 120 of the cover plate 12 as the anti-fingerprint protection film, the bonding force between the adhesive and the anti-fingerprint protection film is poor, the bonding force between the side wall 120 of the cover plate 12 and the first adhesive layer 31 can be reduced, and therefore, the residual anti-fingerprint protection film on the side wall 120 of the cover plate 12 can be removed through a plasma treatment mode, so that the bonding force between the first adhesive layer 31 and the side wall 120 of the cover plate 12 is improved.
Alternatively, fig. 9 is a schematic cross-sectional structure of the electronic device in DD' direction in fig. 3, where the second sidewall 202 has step surfaces 200, as shown in fig. 3 to 9, and each step surface 200 may be perpendicular to the z-axis. The second side wall 202 is provided with a step structure, and a part of the surface of one side of the cover plate 12, which is close to the bottom surface 211 of the groove 21, is adhered to the step surface 200 through the third adhesive layer 33. As shown in fig. 9, both ends of one side of the cover plate 12 near the bottom surface 211 of the groove 21 are bonded to the step surface 200 by the third adhesive layer 33. Wherein an adhesion enhancing layer (not shown) may be provided between the third adhesive layer 33 and each of the step surfaces 200. The adhesion enhancing layer has higher adhesion with the third adhesive layer 33 and also has higher adhesion with the step surface 200 on the middle frame 2, so as to be used for improving the adhesion between the third adhesive layer 33 and the step surface 200 and further improving the adhesion and stability between the display module 1 and the middle frame 2. For example, the step face width at the upper second side wall 202 may be 0.7 mm and the step face width at the lower second side wall 202 may be 0.5mm in fig. 3. The step surface width may be a dimension of the step surface in the y-axis direction.
As shown in fig. 9, the cover 12 is made of transparent material, and the step surface 200 on the middle frame 2 may reflect light, so the adhesion enhancing layer may be ink, and the effects of light absorption and light shielding are achieved by, for example, black ink, so as to avoid adverse experience to the user due to reflection of external light by the step surface 200.
Alternatively, the ink is a urethane resin material to improve the adhesion between the third adhesive layer 33 and the step surface 200 by a high-performance ink material having a strong adhesion.
In order to further improve the adhesion between the cover plate 12 and the step surface 200, an adhesion enhancing layer may be provided between the third adhesive layer 33 and the cover plate 12.
Alternatively, the third adhesive layer 33 may be a two-component adhesive material. The adhesive materials of two different components are mixed before use to form the third adhesive layer 33, and the adhesive force may be stronger than that of a single-component adhesive.
Optionally, the main component of the synthesized double-component adhesive material is methacrylic acid, and the Young modulus is between 1.0GPa and 1.1 GPa.
As shown in fig. 3 to 9, the first adhesive layer 31 is provided to fill up the gap between the sidewall 120 of the cover plate 12 and the sidewall 212 of the groove 21. In the manufacturing process of the electronic device, after the display module 1 is placed on the middle frame 2 and is adhered by the second adhesive layer 32 and the third adhesive layer 33, gaps between the display module and the side wall 212 of the middle frame 2 are necessarily formed around the cover plate 12, so that the gaps can be filled by the first adhesive layer 31. On the one hand, the adhesion and stability between the side wall 120 of the cover plate 12 and the side wall 212 of the middle frame 2 at each position can be improved, and on the other hand, the sealing function can be realized to prevent dust from entering the inside of the electronic equipment. For example, as shown in fig. 9, the gap width between the sidewall 120 of the cover plate 12 and the sidewall 212 of the groove 21 filled with the first adhesive layer 31 may be 0.06mm.
In one possible implementation manner, the display panel 11 is an AMOLED display panel, and in a direction from the bottom surface 211 of the groove 21 to the cover plate 12, that is, in a direction from bottom to top in fig. 7, 8 and 9, the display panel 11 sequentially includes a display functional layer 101, an encapsulation layer 102 and a polarizer 103, wherein in a direction from the bottom surface 211 of the groove 21 to the cover plate 12, the display functional layer 101 may include a rigid substrate (e.g., a glass substrate), a circuit film layer and a light emitting device film layer, the light emitting device film layer includes an anode layer, an organic light emitting layer and a cathode layer sequentially stacked, and when voltages are respectively applied to the anode layer and the cathode layer, electrons and holes are respectively injected into the organic light emitting layer, and are recombined in the organic light emitting layer to release energy, thereby realizing light emission, and further realizing a display function, and in the circuit film layer, a circuit structure for driving the light emitting device in the light emitting device film layer is disposed. The encapsulation layer 102 is used for encapsulating the display function layer 101, and the display function layer 101 and the encapsulation layer 102 which are encapsulated together have a rigid structure, so that the display function layer is easy to crack and damage when collision is stressed. Therefore, the structure in the embodiment of the present application is beneficial to protect the AMOLED display panel, and in addition, the polarizer 103 is adhered to the encapsulation layer 102 through a glue layer (not shown in the figure); a fourth adhesive layer 34 may be disposed between the sidewalls of the display panel 11 and the first sidewall 201, and the fourth adhesive layer 34 is adhered to the sidewalls of the display function layer 101, the encapsulation layer 102, and the polarizer 103. On the one hand, the fourth adhesive layer 34 is used to form a further protection for the display panel 11 on the side, so that the side of the display panel 11 has better sealing effect and buffering effect. On the other hand, the adhesion and stability between the display function layer 101, the encapsulation layer 102, and the polarizer 103 are further improved by the fourth adhesive layer 34. The fourth adhesive layer 34 may be specifically a dual-cure adhesive, and the main component of the dual-cure adhesive may be amino-modified acrylic acid, and the Young's modulus of the dual-cure adhesive is between 400Mpa and 500 Mpa. In one possible implementation, as shown in fig. 8, the gap 4 is located between the first sidewall 201 and the fourth glue layer 34. In addition, the fourth adhesive layer 34 and the bottom surface 211 of the groove 21 may be disposed at intervals, so as to prevent the bottom surface 211 of the groove 21 from acting on the side wall of the display panel 11 during the collision, and reduce the risk of cracking and damaging the display panel 11 due to the collision. For example, as shown in fig. 8, the distance between the side edge of the display panel 11 and the first side wall 201 may be 0.41mm. It should be noted that, in an embodiment, the first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer may be adhesive layers made of the same material, or adhesive layers made of different materials.
In one implementation, the display panel 11 further includes a buffer layer 104. The buffer layer 104 may be closest to the bottom surface 211 of the recess 21. The buffer layer 104 may specifically include a foam layer or the like. In the event of an electronic device collision, a stress buffer can be provided between the display function layer 101 in the display panel 11 and the bottom surface 211 of the groove 21 in the middle frame 2, so that the risk of damage to the display panel 11 due to the collision is reduced.
In one implementation, the first adhesive layer 31 is a photosensitive adhesive, such as an ultraviolet curing adhesive, and is an adhesive that is cured by irradiation of ultraviolet light. In the bonding process of the display module 1 and the middle frame 2, the display module 1 is placed on the groove 21 of the middle frame 2, then a photosensitive adhesive is arranged between the side wall 120 of the cover plate 12 and the side wall 212 of the groove 21 through a dispensing process, and then ultraviolet light irradiates the photosensitive adhesive. Since the cover plate 12 is made of transparent material, ultraviolet light can be irradiated to the photosensitive paste through the cover plate 12, and the photosensitive paste is cured to achieve adhesion between the side wall 120 of the cover plate 12 and the side wall 212 of the groove 21. The main component of the first adhesive layer 31 may be amino modified acrylic acid, and the Young's modulus is between 40Mpa and 60 Mpa.
In one implementation, the second glue layer 32 is a delayed photo glue, which has the property of delayed curing, and curing only after a period of uv light irradiation, since the entire structure of the display panel 11 is opaque. Therefore, the second adhesive layer 32 is set as a delayed photosensitive adhesive, and in the bonding process of the display module 1 and the middle frame 2, the delayed photosensitive adhesive is firstly set on the surface of the side, away from the cover plate 12, of the display panel 11, then ultraviolet light is irradiated to the photosensitive adhesive, and then the display module 1 is placed on the groove 21 of the middle frame 2, and the surface of the side, away from the cover plate 12, of the display panel 11 is bonded to the bottom surface 211 of the groove 21 through the delayed photosensitive adhesive, at this time, the delayed photosensitive adhesive starts to be cured, so that the bonding between the surface of the side, away from the cover plate 12, of the display panel 11 and the bottom surface 211 of the groove 21 is realized. The main component of the second adhesive layer 32 may be polyurethane modified acrylic acid, and the Young's modulus is between 5Mpa and 10 Mpa.
Optionally, the electronic device may be a mobile phone, a tablet computer, a wearable device, or the like.
The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (12)
1. An electronic device, comprising:
the display module comprises a display panel and a cover plate, and the cover plate is positioned on the display panel;
a middle frame, wherein the middle frame is provided with a groove, the groove comprises a bottom surface and side walls, and the side walls of the groove comprise two first side walls along the length direction of the electronic equipment and two second side walls along the width direction of the electronic equipment;
the first side walls are all planar structures;
the display panel is arranged in the groove of the middle frame;
the side wall of the cover plate is adhered to the first side wall through a first adhesive layer;
at least one of the two second side walls is provided with a step surface;
the surface of one side part of the cover plate, which is close to the bottom surface of the groove, is adhered to the step surface through a third adhesive layer.
2. The electronic device of claim 1, wherein the first glue layer and the third glue layer are of different materials.
3. The electronic device of claim 1 or 2, wherein the main component of the first glue layer is amino modified acrylic acid.
4. The electronic device of claim 1 or 2, wherein the main component of the third glue layer is methacrylic acid.
5. The electronic device of any of claims 1-4, wherein,
and one side surface of the display panel, which is close to the bottom surface of the groove, is adhered to the bottom surface of the groove through a second adhesive layer.
6. The electronic device of any one of claims 1-5, wherein,
a gap is formed between the first side wall and the side wall of the display panel.
7. The electronic device of any one of claims 1-6, wherein a fourth glue layer is disposed on two sidewalls of the display panel facing the first sidewall, and a gap is provided between the fourth glue layer and the first sidewall.
8. The electronic device of claim 7, wherein the electronic device comprises a memory device,
the display panel sequentially comprises a display function layer, a packaging layer and a polaroid from the bottom surface of the groove to the direction of the cover plate;
and the fourth adhesive layer is adhered to the display functional layer, the packaging layer and the side wall of the polaroid.
9. The electronic device of any one of claims 1-8, wherein,
an adhesion enhancing layer is arranged between the third adhesive layer and the step surface;
the adhesion enhancing layer is ink.
10. The electronic device according to any one of claims 1-9, wherein,
the first adhesive layer is arranged to fill a gap between the side wall of the cover plate and the side wall of the groove.
11. The electronic device according to any one of claims 1-10, wherein,
the first adhesive layer is photosensitive adhesive.
12. An electronic device according to claim 5-11, characterized in that,
the second glue layer is a delayed photosensitive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310826869.0A CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910517267.0A CN110333755B (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
| CN202310826869.0A CN116915883A (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
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| CN201910517267.0A Division CN110333755B (en) | 2019-06-14 | 2019-06-14 | Electronic equipment |
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| CN111147633B (en) * | 2019-12-24 | 2021-07-02 | 荣耀终端有限公司 | Mobile terminal |
| CN114449791B (en) * | 2020-10-30 | 2024-01-23 | 北京小米移动软件有限公司 | Electronic equipment |
| WO2022213722A1 (en) * | 2021-04-07 | 2022-10-13 | Oppo广东移动通信有限公司 | Electronic device and assembly method therefor |
| CN115249434A (en) * | 2021-04-28 | 2022-10-28 | Oppo广东移动通信有限公司 | Display device |
| CN113382569A (en) * | 2021-06-04 | 2021-09-10 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN114125103A (en) * | 2021-11-18 | 2022-03-01 | Oppo广东移动通信有限公司 | Connecting ring, middle frame, electronic equipment, display module and assembling method of display module |
| CN117437848A (en) * | 2022-07-13 | 2024-01-23 | 荣耀终端有限公司 | Display equipment and assembly process thereof |
| CN115097904A (en) * | 2022-07-25 | 2022-09-23 | 荣耀终端有限公司 | Electronic equipment |
| CN116017898B (en) * | 2023-03-24 | 2023-09-05 | 荣耀终端有限公司 | Electronic device and method for assembling electronic device |
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| CN107167947B (en) * | 2017-07-03 | 2023-08-29 | 上海传英信息技术有限公司 | Screen structure and display device adopting same |
| CN207833400U (en) * | 2018-01-18 | 2018-09-07 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN108008780A (en) * | 2018-01-22 | 2018-05-08 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN108227269A (en) * | 2018-02-01 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of middle shell, electronic equipment and its assemble method |
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| CN110333755A (en) | 2019-10-15 |
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