CN204788897U - Use total mark ball to survey semiconductor laser tube core device - Google Patents
Use total mark ball to survey semiconductor laser tube core device Download PDFInfo
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- CN204788897U CN204788897U CN201520535791.8U CN201520535791U CN204788897U CN 204788897 U CN204788897 U CN 204788897U CN 201520535791 U CN201520535791 U CN 201520535791U CN 204788897 U CN204788897 U CN 204788897U
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- China
- Prior art keywords
- tube core
- circuit board
- briquetting
- base
- semiconductor laser
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000012360 testing method Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000002788 crimping Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
Use total mark ball to survey semiconductor laser tube core device, it relates to semiconductor laser and makes technical field, and it contains backup pad, water -cooling platform, base, the wrong screw of hand, spacing collar, briquetting, kingpin, circuit board, tube core, total mark ball, through -hole, little magnet, and the light accuracy is received to total mark ball cooperation photodiode PD survey tube core power, measures rapidly, tube core centre gripping base and water -cooling platform are connected to little magnet, and it is comparatively convenient that the tube core is dismantled in the installation, modified circular arc design crimping device guarantees that the contact connection is stable, choose for use copper sheet gilding material to guarantee high on state current, measuring voltage's the degree of accuracy is guaranteed to the circuit board that the four -wire set up, and this testing arrangement has longer life, higher testing accuracy.
Description
Technical field
The utility model relates to semiconductor laser manufacturing technology field, is specifically related to use integrating sphere to survey semiconductor laser tube core device.
Background technology
Middle power (1W-50W) semiconductor laser, is widely used in fields such as scientific research, medical treatment, materials processings.The performance of the critical components in semiconductor laser---tube core (Chip) is larger on the impact of completed semiconductor laser instrument.In order to the qualification rate of quick test tube core in batch production, improve the end product quality of semiconductor laser, usually need to measure its performance parameter before Chip uses comprehensively.
In the characteristic detecting device of existing tube core, be usually only concerned about how fast clamp tube core, namely fix die site by stop means, adopt pressure transducer prevent tube core impaired, powered to tube core by probe or metallic membrane.
Summary of the invention
The purpose of this utility model is defect for prior art and deficiency, and the use integrating sphere providing a kind of structure simple, reasonable in design, easy to operate surveys semiconductor laser tube core device.
For achieving the above object, the technical solution adopted in the utility model is: it comprises back up pad, water-cooled platform, base, hand tighten screw, spacing collar, briquetting, needle roller, circuit board, tube core, integrating sphere, through hole, small magnet; Orthogonal three perforates on described integrating sphere, the side of one side perforate is wherein provided with back up pad, water-cooled platform is connected with back up pad by securing member, the top of water-cooled platform is provided with base, the top of base is provided with circuit board, and the side of circuit board is connected with tube core, and tube core is placed in the spacing draw-in groove of base, the top of circuit board is provided with briquetting, is also provided with needle roller between circuit board and briquetting; The edge of described briquetting is arc-shaped, the edge of briquetting and tube core, circuit board contacts, and briquetting, circuit board, base are tightened by hand tighten screw, are provided with spacing collar between the upper surface of briquetting and hand tighten screw; Described water-cooled platform is provided with through hole; Small magnet is provided with between described water-cooled platform and base.
As preferably, described circuit board posts gold plated copper sheets.
As preferably, described circuit board is provided with four conductive poles.
As preferably, described water-cooled platform, base adopt red copper material to make.
As preferably, described briquetting adopts PVC material to make.
During the utility model operation, integrating sphere is in orthogonal three perforates, back up pad is fixed on the plane that perforate is Φ 25, hexagon socket head cap screw is used to be fixed on integrating sphere, water-cooled platform is fixing on the supporting plate, debugging is needed after first installation, hit exactly with tube core center and integrating sphere perforate and be as the criterion at same plane, the two is non-dismountable after installing, screw thread fixing glue is used to ensure its steadiness, the via design that water-cooled platform adopts is in order to adaptive water-cooling circulating system, usual controlled circulation water temperature is at 25 DEG C, junction uses fast slotting water nozzle, facilitate in different occasion fast by this device connecting system.
Take off base, after being rotated counterclockwise hand tighten screw replacing tube core, again hand tighten screw is tightened, the edge designed arc-shaped appearance buffering of briquetting is stressed, when hand twist dynamics excessive time, the briquetting generation deformation buffering tube core of PVC plastic is stressed, needle roller is as spacing, the displacement of restriction briquetting, each replacing tube core, must ensure that the circular arc portion of briquetting drops on the both sides of tube core, circuit board is divided into four layers, the Material selec-tion FR-4 sheet material directly contacted with base, thickness is 0.3mm, two-layer FPC substrate film, the conductive copper sheet 0.5mm that one deck is gold-plated, they put in order from down to up successively: FR-4 sheet material, FPC substrate film, gold plated copper sheets, FPC substrate film, they are fixed together by solid, here copper thickness design can support the work of 20A big current, choosing of insulating material can ensure good electrical contact, keep isolating with peripheral metal simultaneously, avoid interference, circuit board adopts four conductive poles to connect, two groups of wires are used for On current, other two groups then for measuring voltage, they all adopt in gold-plated material grafting, take into account conduction good, it is convenient to change.
In measuring process, only base need be taken off, unscrew briquetting, tube core is placed in the spacing draw-in groove of base, tightened by hand tighten screw, now tube core is by briquetting and circuit board compacting, so just achieves the firm clamping of laser tube core, start semiconductor laser tester and apply sweep current, can test be completed.
After adopting said structure, the beneficial effect that the utility model produces is: use integrating sphere described in the utility model surveys semiconductor laser tube core device, and integrating sphere coordinates photodiode PD to measure die power, receives light accurate, measures rapidly; Small magnet connects tube core Holding seat and water-cooled platform, and installing/dismounting tube core more for convenience; The designed arc-shaped appearance compression bonding apparatus improved ensures contact stable connection; Select the gold-plated material of copper sheet to ensure high On current, the circuit board that four lines are arranged ensures the accuracy of measuring voltage, and this proving installation has longer serviceable life, higher test accuracy.The utility model have structure simple, arrange rationally, the advantage such as cost of manufacture is low.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Fig. 2 is the enlarged drawing in I portion in Fig. 1.
Fig. 3 is the vertical view of Fig. 1.
Description of reference numerals:
1, back up pad; 2, water-cooled platform; 3, base; 4, hand tighten screw; 5, spacing collar; 6, briquetting; 7, needle roller; 8, circuit board; 9, tube core; 10, integrating sphere; 11, through hole; 12, small magnet.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
Referring to such as Fig. 1---shown in Fig. 3, this embodiment adopts following technical scheme: it comprises back up pad 1, water-cooled platform 2, base 3, hand tighten screw 4, spacing collar 5, briquetting 6, needle roller 7, circuit board 8, tube core 9, integrating sphere 10, through hole 11, small magnet 12; Orthogonal three perforates on described integrating sphere 10, the side of one side perforate is wherein provided with back up pad 1, water-cooled platform 2 is connected with back up pad 1 by securing member, the top of water-cooled platform 2 is provided with base 3, the top of base 3 is provided with circuit board 8, and the side of circuit board 8 is connected with tube core 9, and tube core 9 is placed in the spacing draw-in groove of base 3, the top of circuit board 8 is provided with briquetting 6, is also provided with needle roller 7 between circuit board 8 and briquetting 6; The edge of described briquetting 6 is arc-shaped, and the edge of briquetting 6 contacts with tube core 9, circuit board 8, and briquetting 6, circuit board 8, base 3 are tightened by hand tighten screw 4, is provided with spacing collar 5 between the upper surface of briquetting 6 and hand tighten screw 4; Described water-cooled platform 2 is provided with through hole 11; Small magnet 12 is provided with between described water-cooled platform 2 and base 3.
As preferably, described circuit board 8 posts gold plated copper sheets.
As preferably, described circuit board 8 is provided with four conductive poles.
As preferably, described water-cooled platform 2, base 3 adopt red copper material to make.
As preferably, described briquetting 6 adopts PVC material to make.
During the operation of this embodiment, integrating sphere 10 is in orthogonal three perforates, back up pad 1 is fixed on the plane that perforate is Φ 25, hexagon socket head cap screw is used to be fixed on integrating sphere 10, water-cooled platform 2 is fixed in back up pad 1, debugging is needed after first installation, hit exactly with tube core 9 center and integrating sphere 10 perforate and be as the criterion at same plane, the two is non-dismountable after installing, screw thread fixing glue is used to ensure its steadiness, through hole 11 design that water-cooled platform 2 adopts is in order to adaptive water-cooling circulating system, generally speaking, controlled circulation water temperature is at 25 DEG C, junction uses fast slotting water nozzle, facilitate in different occasion fast by this frock connecting system.
Take off base 3, be rotated counterclockwise after hand tighten screw 4 changes tube core 9, again hand tighten screw 4 is tightened, the edge designed arc-shaped appearance buffering of briquetting 6 is stressed, when hand twist dynamics excessive time, it is stressed that the briquetting 6 of PVC plastic produces deformation buffering tube core 9, needle roller 7 is as spacing, the displacement of restriction briquetting 6, each replacing tube core 9, must ensure that the circular arc portion of briquetting 6 drops on the both sides of tube core 9, circuit board 8 is divided into four layers, the Material selec-tion FR-4 sheet material directly contacted with base 3, thickness is 0.3mm, two-layer FPC substrate film, the conductive copper sheet 0.5mm that one deck is gold-plated, they put in order from down to up successively: FR-4 sheet material, FPC substrate film, gold plated copper sheets, FPC substrate film, they are fixed together by solid, here copper thickness design can support the work of 20A big current, choosing of insulating material can ensure good electrical contact, keep isolating with peripheral metal simultaneously, avoid interference, circuit board 8 adopts four conductive poles to connect, 2 groups of wires are used for On current, other two groups then for measuring voltage, they all adopt in gold-plated material grafting, take into account conduction good, it is convenient to change.
In measuring process, only need take off base 3, unscrew briquetting 6, tube core 9 is placed in the spacing draw-in groove of base 3, tightened by hand tighten screw 4, now tube core 9 is by briquetting 6 and circuit board 8 compacting, so just achieves the firm clamping of laser tube core, start semiconductor laser tester and apply sweep current, can test be completed.
Adopt after said structure, the beneficial effect that this embodiment produces for: the use integrating sphere described in this embodiment surveys semiconductor laser tube core device, and integrating sphere coordinates photodiode PD to measure die power, receives light accurate, measures rapidly; Small magnet connects tube core Holding seat and water-cooled platform, and installing/dismounting tube core more for convenience; The designed arc-shaped appearance compression bonding apparatus improved ensures contact stable connection; Select the gold-plated material of copper sheet to ensure high On current, the circuit board that four lines are arranged ensures the accuracy of measuring voltage, and this proving installation has longer serviceable life, higher test accuracy.This embodiment have structure simple, arrange rationally, the advantage such as cost of manufacture is low.
Claims (5)
1. use integrating sphere to survey semiconductor laser tube core device, it is characterized in that: it comprises back up pad, water-cooled platform, base, hand tighten screw, spacing collar, briquetting, needle roller, circuit board, tube core, integrating sphere, through hole, small magnet; Orthogonal three perforates on described integrating sphere, the side of one side perforate is wherein provided with back up pad, water-cooled platform is connected with back up pad by securing member, the top of water-cooled platform is provided with base, the top of base is provided with circuit board, and the side of circuit board is connected with tube core, and tube core is placed in the spacing draw-in groove of base, the top of circuit board is provided with briquetting, is also provided with needle roller between circuit board and briquetting; The edge of described briquetting is arc-shaped, the edge of briquetting and tube core, circuit board contacts, and briquetting, circuit board, base are tightened by hand tighten screw, are provided with spacing collar between the upper surface of briquetting and hand tighten screw; Described water-cooled platform is provided with through hole; Small magnet is provided with between described water-cooled platform and base.
2. use integrating sphere according to claim 1 surveys semiconductor laser tube core device, it is characterized in that: described circuit board posts gold plated copper sheets.
3. use integrating sphere according to claim 1 surveys semiconductor laser tube core device, it is characterized in that: described circuit board is provided with four conductive poles.
4. use integrating sphere according to claim 1 surveys semiconductor laser tube core device, it is characterized in that: described water-cooled platform, base adopt red copper material to make.
5. use integrating sphere according to claim 1 surveys semiconductor laser tube core device, it is characterized in that: described briquetting adopts PVC material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520535791.8U CN204788897U (en) | 2015-07-21 | 2015-07-21 | Use total mark ball to survey semiconductor laser tube core device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520535791.8U CN204788897U (en) | 2015-07-21 | 2015-07-21 | Use total mark ball to survey semiconductor laser tube core device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204788897U true CN204788897U (en) | 2015-11-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520535791.8U Active CN204788897U (en) | 2015-07-21 | 2015-07-21 | Use total mark ball to survey semiconductor laser tube core device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204788897U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110160426A (en) * | 2018-01-08 | 2019-08-23 | 深圳市技拓光电有限公司 | A kind of semiconductor laser tube core detection device |
-
2015
- 2015-07-21 CN CN201520535791.8U patent/CN204788897U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110160426A (en) * | 2018-01-08 | 2019-08-23 | 深圳市技拓光电有限公司 | A kind of semiconductor laser tube core detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220525 Address after: 710065 4th floor, E3 building, No. 103, Xi'an Semiconductor Industrial Park, No. 125, Jinye Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Xinchuang Yimei technology partnership (L.P.) Address before: 100070 115, 1 floor, 1 building, 10 Spark Road, Fengtai District Science City, Beijing. Patentee before: BEIJING REALLIGHT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231023 Address after: Room 301, 3rd Floor, Building 7, Kunpeng Zhizaoyuan, Dongjiangdu Village, Diaotai Street, Fengxi New City, Xi'an City, Shaanxi Province, 712000 Patentee after: Lingsu Medical Technology (Shaanxi) Co.,Ltd. Address before: 710065 4th floor, E3 building, No. 103, Xi'an Semiconductor Industrial Park, No. 125, Jinye Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an Xinchuang Yimei technology partnership (L.P.) |