CN204761709U - Packaging structure of MEMS microphone - Google Patents
Packaging structure of MEMS microphone Download PDFInfo
- Publication number
- CN204761709U CN204761709U CN201520460257.5U CN201520460257U CN204761709U CN 204761709 U CN204761709 U CN 204761709U CN 201520460257 U CN201520460257 U CN 201520460257U CN 204761709 U CN204761709 U CN 204761709U
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- Prior art keywords
- circuit board
- chip
- encapsulating structure
- mems
- utility
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- 238000004806 packaging method and process Methods 0.000 title abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract 2
- 239000003292 glue Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 241000218202 Coptis Species 0.000 description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
The utility model relates to a packaging structure of MEMS microphone, including circuit board, lid to and by the enclosure space that circuit board and lid surrounded, still include MEMS chip, the ASIC chip that sets up on the circuit board, wherein, the MEMS chip is including back of the body chamber, the ASIC chip is arranged in the out -of -the -way chamber of MEMS chip to the tin ball bonding connects or it is attached on the circuit board to pass through the conducting resin through planting, still including the intercommunication the sound hole of enclosure space. The utility model discloses a packaging structure, ASIC chip are arranged in the out -of -the -way chamber of MEMS chip, and its mode welding through planting the tin ball is in the circuit board, and this just makes the space that can sparingly encapsulate for it is littleer that the product can be done, with the miniaturized development of satisfying modern electronic product. Furthermore, the utility model discloses a packaging structure, it produces simple process, and the processing procedure is efficient, low in production cost.
Description
Technical field
The utility model relates to a kind of microphone, belongs to acoustic-electric conversion art, more specifically, relates to a kind of encapsulating structure of MEMS microphone.
Background technology
MEMS (Micro Electro Mechanical System) microphone is the microphone manufactured based on MEMS technology, vibrating diaphragm wherein, back pole plate are the vitals in MEMS microphone, vibrating diaphragm, back pole plate constitute capacitor and on silicon integrated, realize the conversion of acoustic-electric.
In recent years, along with the development of science and technology, the volume of the electronic product such as mobile phone, notebook computer is in continuous reduction, and the performance requirement of people to these portable electronic products is also more and more higher, and this just requires that the volume of electronic component supporting with it also must along with reduction.
Existing MEMS microphone, comprise the encapsulating structure surrounded by circuit board, shell, and be arranged in MEMS chip, the asic chip of this encapsulating structure, wherein, MEMS chip and asic chip are all fixing on circuit boards, be electrically connected by gold thread between MEMS chip and asic chip, be electrically connected by gold thread between asic chip and circuit board.Such connected mode, not only adds production process, nor is beneficial to the miniaturization of MEMS microphone.
Utility model content
An object of the present utility model is to provide a kind of encapsulating structure of MEMS microphone.
According to an aspect of the present utility model, a kind of encapsulating structure of MEMS microphone is provided, comprise circuit board, lid, and the enclosure space to be surrounded by circuit board and lid, also comprise setting MEMS chip on circuit boards, asic chip, wherein, described MEMS chip comprises back of the body chamber, described asic chip is arranged in the back of the body chamber of MEMS chip, and connects by planting tin ball bonding or attach on circuit boards by conducting resinl; Also comprise the acoustic aperture being communicated with described enclosure space.
Preferably, described asic chip upside down welds on circuit boards.
Preferably, described circuit board is provided with groove, described asic chip is welded in the groove of circuit board.
Preferably, described acoustic aperture is arranged on lid.
Preferably, described acoustic aperture is arranged on circuit boards.
Preferably, described MEMS chip is connected by the mode sealed with circuit board.
Preferably, the outer ledge of described MEMS chip and circuit board are sealed.
Preferably, the outer ledge of described MEMS chip is sealed by COB glue and circuit board.
Described conducting resinl is ACF conducting resinl or ACA conducting resinl.
Encapsulating structure of the present utility model, asic chip is arranged in the back of the body chamber of MEMS chip, and it welds in the circuit board by the mode of planting tin ball, and this just makes it possible to the space saving encapsulation, what product can be done is less, to meet the miniaturization of modern electronic product.And encapsulating structure of the present utility model, its production technology is simple, and process efficiency is high, and production cost is low.
By referring to the detailed description of accompanying drawing to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will become clear.
Accompanying drawing explanation
What form a part for specification drawings describes embodiment of the present utility model, and together with the description for explaining principle of the present utility model.
Fig. 1 is the schematic diagram of the utility model encapsulating structure.
Fig. 2 is the schematic diagram of the another kind of execution mode of the utility model encapsulating structure.
Embodiment
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that: unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit scope of the present utility model.
Illustrative to the description only actually of at least one exemplary embodiment below, never as any restriction to the utility model and application or use.
The technology and equipment known for person of ordinary skill in the relevant may not discuss in detail, but in the appropriate case, described technology and equipment should be regarded as a part for specification.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
With reference to figure 1, the utility model provides a kind of encapsulating structure of MEMS microphone, comprises circuit board 1, lid 2, and the enclosure space be surrounded by circuit board 1 and lid 2.Wherein, this lid 2 also can be in tabular, now, also needs to arrange side wall portion and supports on the circuit card 1 by lid 2, the common outer enclosure forming microphone.Described encapsulating structure is also provided with the acoustic aperture 7 be communicated with enclosure space, so that the inflow of sound; Wherein, acoustic aperture 7 can be arranged on lid 2, also can arrange on the circuit card 1.
Encapsulating structure of the present utility model, also comprise the MEMS chip 3 be arranged in enclosure space, asic chip 4, MEMS chip 3 is transducer part voice signal being converted into the signal of telecommunication, and it can utilize MEMS (MEMS (micro electro mechanical system)) technique to make.The signal of telecommunication that asic chip 4 is mainly used to MEMS chip 3 exports amplifies, so that subsequent treatment.
Wherein, MEMS chip 3 comprises back of the body chamber 6, and MEMS chip 3 is fixing on the circuit card 1 by mode well-known to those skilled in the art, and adopts gold thread to realize the electrical connection between MEMS chip 3 and circuit board 1.Wherein, in order to seal the operatic tunes, linked together by the mode sealed with circuit board 1 in described MEMS chip 3, in order to the convenience of technique, outer ledge and the circuit board 1 of MEMS chip 3 are sealed, such as, adopt COB glue to seal, ensure that the hermetic seal of the operatic tunes.Described asic chip 4 is arranged in the back of the body chamber 6 of MEMS chip 3, and welds on the circuit card 1 by planting tin ball 5.Wherein, asic chip 4 of the present utility model and/or MEMS chip 3 can attach on the circuit card 1 by conducting resinl, such as adopt anisotropic conductive adhesive, it is a kind of conductive glue for electronic devices and components encapsulation, there is unidirectional (vertical direction conducting, parallel direction not conducting) conduction and glue together fixing function.Anisotropically conductive glued membrane (AnisotropicConductiveFilm can be adopted in the utility model; Or anisotropic conductive adhesive cream (Anisotropicconductiveadhesive ACF); ACA).
Encapsulating structure of the present utility model, asic chip is arranged in the back of the body chamber of MEMS chip, and it is welded in the circuit board by the mode of planting tin ball, thus can save the space of encapsulation, what product can be done is less, to meet the miniaturization of modern electronic product.And encapsulating structure of the present utility model, its manufacturing process is simple, and process efficiency is high, and production cost is low.
In the execution mode that the utility model one is concrete, described asic chip 4 welds on the circuit card 1, and realizes the electrical connection between asic chip 4 and circuit board 1 by gold thread.Preferably, described asic chip 4 adopts inverted mode to weld on the circuit card 1, the electrode of asic chip 4 is directly electrically connected the contact corresponding to circuit board 1, adopt this structure, the use of gold thread can be avoided, thus reduce further the height of whole encapsulating structure, what encapsulating structure can be done is thinner.
Further preferably, described circuit board 1 is provided with groove 8, with reference to figure 2, described asic chip 4 is welded in this groove 8, reduce further the height of whole encapsulating structure.
Although be described in detail specific embodiments more of the present utility model by example, it should be appreciated by those skilled in the art, above example is only to be described, instead of in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, when not departing from scope and spirit of the present utility model, above embodiment can be modified.Scope of the present utility model is limited by claims.
Claims (9)
1. the encapsulating structure of a MEMS microphone, it is characterized in that: comprise circuit board (1), lid (2), and the enclosure space to be surrounded by circuit board (1) and lid (2), also comprise the MEMS chip (3) be arranged on circuit board (1), asic chip (4), wherein, described MEMS chip (3) comprises back of the body chamber (6), described asic chip (4) is arranged in the back of the body chamber (6) of MEMS chip (3), and by planting tin ball (5) welding or being attached on circuit board (1) by conducting resinl; Also comprise the acoustic aperture (7) being communicated with described enclosure space.
2. encapsulating structure according to claim 1, is characterized in that: described asic chip (4) is upside down welded on circuit board (1).
3. encapsulating structure according to claim 1, is characterized in that: described circuit board (1) is provided with groove (8), and described asic chip (4) is welded in the groove (8) of circuit board (1).
4. encapsulating structure according to claim 1, is characterized in that: described acoustic aperture (7) is arranged on lid (2).
5. encapsulating structure according to claim 1, is characterized in that: described acoustic aperture (7) is arranged on circuit board (1).
6. encapsulating structure according to claim 1, is characterized in that: described MEMS chip (3) is connected by the mode sealed with circuit board (1).
7. encapsulating structure according to claim 6, is characterized in that: outer ledge and the circuit board (1) of described MEMS chip (3) are sealed.
8. encapsulating structure according to claim 7, is characterized in that: the outer ledge of described MEMS chip (3) is sealed by COB glue and circuit board (1).
9. encapsulating structure according to claim 1, is characterized in that: described conducting resinl is ACF conducting resinl or ACA conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520460257.5U CN204761709U (en) | 2015-06-30 | 2015-06-30 | Packaging structure of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520460257.5U CN204761709U (en) | 2015-06-30 | 2015-06-30 | Packaging structure of MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204761709U true CN204761709U (en) | 2015-11-11 |
Family
ID=54476373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520460257.5U Active CN204761709U (en) | 2015-06-30 | 2015-06-30 | Packaging structure of MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204761709U (en) |
-
2015
- 2015-06-30 CN CN201520460257.5U patent/CN204761709U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |