CN204719771U - A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals - Google Patents
A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals Download PDFInfo
- Publication number
- CN204719771U CN204719771U CN201520233512.2U CN201520233512U CN204719771U CN 204719771 U CN204719771 U CN 204719771U CN 201520233512 U CN201520233512 U CN 201520233512U CN 204719771 U CN204719771 U CN 204719771U
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- circuit substrate
- induction chip
- cover
- metal support
- glue
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Abstract
The utility model discloses a kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals, comprise circuit substrate successively, induction chip, cover plate and metal support, described induction chip is fixedly pasted onto on described circuit substrate by glue, described cover plate is fixedly pasted onto on described induction chip by glue, described circuit substrate and induction chip are equipped with pad point, pad point mutually corresponding on described circuit substrate and induction chip is welded by gold thread, the junction of described induction chip and described metal support is provided with sealant, described lid surface is provided with color layers and protective seam successively, described metal support inside surface is coated with insulation course, M type breach is provided with bottom described metal support, described circuit substrate is also provided with metal pad, described M type breach is connected by conductive silver glue with described metal pad, described metal support is fixedly connected with by glue with the junction of described circuit substrate.The utility model structure is simple, packaging technology is easy.
Description
Technical field
The utility model relates to a kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals.
Background technology
What the identification of current most mobile terminal device adopted is user ID+user cipher, this mode operate loaded down with trivial details, password easily passes into silence, particularly password be easily cracked, safety coefficient is very low.The popularization degree applied along with all kinds of mobile terminal device is more and more higher, must have higher requirement to security of system aspect, and the appearance of especially mobile payment must push safety requirements to summit.Fingerprint characteristic due to people has uniqueness and unchangeable property, is apply ideal template as bio-identification, so just arises at the historic moment and promoted the appearance of fingerprint recognition assembly.
Utility model content
Utility model object: technical problem to be solved in the utility model is to provide a kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals, this modular construction is simple, packaging technology difficulty is low.
Utility model content: for solving the problems of the technologies described above, the technological means that the utility model adopts is:
A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals, comprise circuit substrate successively, induction chip, cover plate and metal support, described induction chip is fixedly pasted onto on described circuit substrate by glue, described cover plate is fixedly pasted onto on described induction chip by glue, described circuit substrate and induction chip are equipped with pad point, pad point mutually corresponding on described circuit substrate and induction chip is welded by gold thread, the junction of described induction chip and described metal support is provided with sealant, described lid surface is provided with color layers and protective seam successively, described metal support inside surface is coated with insulation course, M type breach is provided with bottom described metal support, described circuit substrate is also provided with metal pad, described M type breach is connected by conductive silver glue with described metal pad, described metal support is fixedly connected with by glue with the junction of described circuit substrate.
Wherein, described cover plate is ceramic cover plate or sapphire cover plate.
Wherein, between described cover plate and described induction chip, the thickness of glue layer is 5um, can be good at like this ensureing induction sensitivity.
Wherein, the gross thickness of described color layers and protective seam is 5 ~ 10um; this thickness can ensure the induction sensitivity of fingerprint identification module to finger biological characteristic; the hardness of protective seam is 8H ~ 9H simultaneously; thus guarantee that fingerprint identification module surface is not easily scraped off, extend its serviceable life and service property (quality).
Wherein, described sealant is glue layer, carries out sealing and solidifying with the position that induction chip contacts with metal support by transparent glue, thus avoids the foreign matter in environment to enter in product.
Wherein, described insulation course is ink layer, after metal support needs first to carry out surfaces externally and internally process, again it is combined with circuit substrate and induction chip, anodized or the process of spraying plating ink are carried out to metal support inside surface, after process, metal support inside surface generates a layer insulating, ensures the insulativity on its surface, can effectively prevent the metal support when assembling from contacting and the phenomenon that is short-circuited with gold thread.
Beneficial effect: compared to prior art, the utility model cover-plate type fingerprint recognition modular construction is simple, packaging technology is easy, and can be applicable to the multiple mobile terminal devices such as smart mobile phone, panel computer, production cost is low, and induction sensitivity is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model cover-plate type fingerprint recognition assembly;
Fig. 2 is the exploded perspective view of each parts of the utility model cover-plate type fingerprint recognition assembly;
Wherein, a is cover plate; B is metal support; C is gold thread; D is induction chip; E is circuit substrate;
Fig. 3 is the structural representation after the utility model cover-plate type fingerprint recognition assembling components.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model content is described further.
As shown in Figures 1 to 3, cover-plate type fingerprint recognition assembly of the present utility model, comprise circuit substrate 1 successively, induction chip 2, cover plate 5 and metal support 4, induction chip 2 is fixedly pasted onto on circuit substrate 1 by glue, cover plate 5 is fixedly pasted onto on induction chip 2 by glue, circuit substrate 1 and induction chip 2 are equipped with pad point 8, pad point 8 mutually corresponding on circuit substrate 1 and induction chip 2 is welded by gold thread 3, the pad point 8 induction chip 2 and circuit substrate 1 belonging to same electrical specification is welded connection by gold thread 3, thus ensure effective connection of electric function, induction chip 2 is provided with sealant with the junction of metal support 4, cover plate 5 surface is provided with color layers and protective seam 6 successively, metal support 4 inside surface is coated with insulation course 7, M type breach 9 is provided with bottom metal support 4, circuit substrate 1 is also provided with metal pad 10, M type breach 9 is connected by conductive silver glue with metal pad 10, metal support 4 is fixedly connected with by heat curing-type glue with the junction of circuit substrate 1.
The packaging technology of the utility model cover-plate type fingerprint recognition assembly is: on circuit substrate 1, need the position of pasting induction chip 2 to coat liquid glue, be attached to by induction chip 2 on the relevant position of circuit substrate 1; Toast after attaching, make both combine firmly; Be welded on the pad point 8 of induction chip 2 with gold thread 3 one end, the other end of gold thread 3 is welded on the pad point 8 of circuit substrate 1, realize electrically conducting between the pad making induction chip 2 and circuit substrate 1 have same electrical specification, the parts assembled are cleaned and dried; Heat curing-type glue is coated in the region contacted with metal support 4 in circuit substrate 1 surrounding, metal pad 10 is avoided in gluing process, metal support 4 is assembled on circuit substrate 1, re-use tool to carry out pressing and fix and solidify, the upper conductive silver glue of the metal pad that on metal support 4, M type breach 9 is corresponding with on circuit substrate 1 10 carries out sealing and curing, guarantees between the two electrically conducting completely, and object forms loop to collection finger biometric characteristic signal; Then transparent glue is used to be carried out sealing and solidifying in the contact site of induction chip 2 and metal support 4, thus avoid the foreign matter in environment to enter in product, again the parts assembled are cleaned and dried, guarantee that induction chip 2 upper surface is without any foreign matter; Then required high-k glue (specific inductive capacity of glue is 15) is coated on induction chip 2 surface, the ceramic cover plate cleaned up or sapphire cover plate 5 are placed on specific inductive capacity glue through metal support 4, tool is used evenly to apply the downforce of about 4kg at ceramic cover plate or sapphire cover plate 5 upper surface, guarantee that high-k glue uniformly dispersing is opened, form the glue layer 11 that thickness is about 5um, can be good at like this ensureing the induction sensitivity to finger biological characteristic, then baking-curing process is carried out to high-k glue layer 11; Again color layers spraying plating process is carried out and baking-curing to ceramic cover plate or sapphire cover plate 5 upper surface; again at color layers surface spraying plating hardness protective seam baking-curing; the gross thickness of ceramic cover plate or sapphire cover plate 5 upper surface color layers and hardness protective seam 6 is 5 ~ 10um; to guarantee the induction sensitivity of fingerprint identification module to finger biological characteristic; the hardness of protective seam must ensure at 8H ~ 9H simultaneously; thus guarantee that fingerprint identification module surface is not easily scraped off, extend its serviceable life and service property (quality).
In addition, after needing that first surfaces externally and internally process is carried out to metal support 4, again it is combined with circuit substrate 1 and induction chip 2, anodized or the process of spraying plating ink are carried out to metal support 4 inside surface, after process, metal support 4 inside surface generates a layer insulating, ensure the insulativity on its surface, effectively can preventing the metal support 4 when assembling from contacting with gold thread 3 and the phenomenon and cause product bad of being short-circuited, metal support 4 outside surface being carried out to the spraying plating of required color.
Color layers spraying plating process is carried out and baking-curing to ceramic cover plate or sapphire cover plate 5 upper surface; again at color layers surface spraying plating hardness protective seam baking-curing; the gross thickness of ceramic cover plate or sapphire cover plate 5 upper surface color layers and hardness protective seam 6 is 5 ~ 10um; to guarantee the induction sensitivity of fingerprint identification module to finger biological characteristic; the hardness of protective seam must ensure at 8H ~ 9H simultaneously; thus guarantee that fingerprint identification module surface is not easily scraped off, extend its serviceable life and service property (quality).
Cover-plate type fingerprint recognition modular construction of the present utility model is simple, packaging technology is easy, and can be applicable to the multiple mobile terminal devices such as smart mobile phone, panel computer, production cost is low, and induction sensitivity is high.
Claims (6)
1. one kind is applied to the cover-plate type fingerprint recognition assembly of field of mobile terminals, it is characterized in that: comprise circuit substrate successively, induction chip, cover plate and metal support, described induction chip is fixedly pasted onto on described circuit substrate by glue, described cover plate is fixedly pasted onto on described induction chip by glue, described circuit substrate and induction chip are equipped with pad point, pad point mutually corresponding on described circuit substrate and induction chip is welded by gold thread, the junction of described induction chip and described metal support is provided with sealant, described lid surface is provided with color layers and protective seam successively, described metal support inside surface is coated with insulation course, M type breach is provided with bottom described metal support, described circuit substrate is also provided with metal pad, described M type breach is connected by conductive silver glue with described metal pad, described metal support is fixedly connected with by glue with the junction of described circuit substrate.
2. the cover-plate type fingerprint recognition assembly being applied to field of mobile terminals according to claim 1, is characterized in that: described cover plate is ceramic cover plate or sapphire cover plate.
3. the cover-plate type fingerprint recognition assembly being applied to field of mobile terminals according to claim 1, is characterized in that: between described cover plate and described induction chip, the thickness of glue layer is 5um.
4. the cover-plate type fingerprint recognition assembly being applied to field of mobile terminals according to claim 1, is characterized in that: the gross thickness of described color layers and protective seam is 5 ~ 10um, wherein, the hardness of described protective seam is 8H ~ 9H.
5. the cover-plate type fingerprint recognition assembly being applied to field of mobile terminals according to claim 1, is characterized in that: described sealant is glue layer.
6. the cover-plate type fingerprint recognition assembly being applied to field of mobile terminals according to claim 1, is characterized in that: described insulation course is ink layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520233512.2U CN204719771U (en) | 2015-04-17 | 2015-04-17 | A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520233512.2U CN204719771U (en) | 2015-04-17 | 2015-04-17 | A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204719771U true CN204719771U (en) | 2015-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520233512.2U Expired - Fee Related CN204719771U (en) | 2015-04-17 | 2015-04-17 | A kind of cover-plate type fingerprint recognition assembly being applied to field of mobile terminals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204719771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017173580A1 (en) * | 2016-04-05 | 2017-10-12 | 华为技术有限公司 | Terminal, and method for assembling acquisition module of terminal |
-
2015
- 2015-04-17 CN CN201520233512.2U patent/CN204719771U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017173580A1 (en) * | 2016-04-05 | 2017-10-12 | 华为技术有限公司 | Terminal, and method for assembling acquisition module of terminal |
| US10757825B2 (en) | 2016-04-05 | 2020-08-25 | Huawei Technologies Co., Ltd. | Terminal and method for assembling collection module of terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20190417 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |