CN204696157U - 一种增加安全线的led灯 - Google Patents

一种增加安全线的led灯 Download PDF

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Publication number
CN204696157U
CN204696157U CN201520360666.8U CN201520360666U CN204696157U CN 204696157 U CN204696157 U CN 204696157U CN 201520360666 U CN201520360666 U CN 201520360666U CN 204696157 U CN204696157 U CN 204696157U
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CN
China
Prior art keywords
led
safety
support
bonding
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520360666.8U
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English (en)
Inventor
严冰波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Saintly Lighting Co ltd
Original Assignee
Zhongshan Emperor Lighting Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Zhongshan Emperor Lighting Technology Co Ltd filed Critical Zhongshan Emperor Lighting Technology Co Ltd
Priority to CN201520360666.8U priority Critical patent/CN204696157U/zh
Application granted granted Critical
Publication of CN204696157U publication Critical patent/CN204696157U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种增加安全线的LED灯，其涉及LED封装领域，包括LED晶片、键合线、LED固晶胶、LED支架、安全键合线；所述LED晶片通过LED固晶胶固定在LED支架上，所述键合线连接LED晶片电极与LED支架，所述安全键合线一端焊接在键合线与LED支架的焊接点金球上，一端焊接在LED支架上。本实用新型通过增加安全键合线，提升了LED灯安全可靠度，方便又实用。

Description

一种增加安全线的LED灯
技术领域
本实用新型为LED封装领域，具体涉及一种LED灯。
背景技术
目前市面上现有的LED灯，由于键合线与支架的材质不同，两者间的焊接点金球在使用久后会容易松脱，电路断开，导致失效。
发明内容
针对现有产品上存在的不足，本实用新型目的在于提供一种LED灯，其内键合一条安全键合线，提升使用可靠度。
为了实现上述目的，本实用新型是通过以下技术方案来实现：一种增加安全线的LED灯，其特征在于，包括LED晶片、键合线、LED固晶胶、LED支架、安全键合线；所述LED晶片通过LED固晶胶固定在LED支架上，所述键合线连接LED晶片电极与LED支架，所述安全键合线一端焊接在键合线与LED支架的焊接点金球上，一端焊接在LED支架上。
    作为优选，所述安全键合线与焊接处金球材质比较接近，比LED支架更利于焊接，不易松脱。
本实用新型通过增加安全线键合方式，提升了LED灯在使用过程中的安全可靠度，方便又实用。
附图说明
下面结合附图和具体实施方式来详细说明本实用新型。
图1为本实用新型的结构示意图。
具体实施方式
为使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体实施方式，进一步阐述本实用新型。
参照图1，本具体实施方式采用以下技术方案：一种增加安全线的LED灯，其特征在于，包括LED晶片1、键合线2、LED固晶胶3、LED支架4、安全键合线5；所述LED晶片1通过LED固晶胶3焊接在LED支架4上，所述键合线2连接LED晶片1电极与LED支架4，所述安全键合线5一端焊接在键合线2与LED支架4的焊接点金球上，一端焊接在LED支架4上。
此外，所述安全键合线5与焊接处金球材质比较接近，比LED支架4更利于焊接，不易松脱。
本具体实施通过在键合线与支架的焊接点金球键合一条安全线，即使金球发生松脱，LED灯也还可以工作，提升了LED灯安全可靠度，方便又实用。
以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解，本实用新型不受上述实施例的限制，上述实施例和说明书中描述的只是说明本实用新型的原理，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。

Claims (2)

1.一种增加安全线的LED灯，其特征在于，包括LED晶片（1）、键合线（2）、LED固晶胶（3）、LED支架（4）、安全键合线（5）；所述LED晶片（1）通过LED固晶胶（3）固定在LED支架（4）上，所述键合线（2）连接LED晶片（1）电极与LED支架（4），所述安全键合线（5）一端焊接在键合线（2）与LED支架（4）的焊接点金球上，一端焊接在LED支架（4）上。
2.根据权利要求1所述的一种增加安全线的LED灯，其特征在于，所述安全键合线（5）与焊接点金球的材质比较接近，比LED支架（4）更利于焊接，不易松脱。
CN201520360666.8U 2015-05-30 2015-05-30 一种增加安全线的led灯 Expired - Fee Related CN204696157U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520360666.8U CN204696157U (zh) 2015-05-30 2015-05-30 一种增加安全线的led灯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520360666.8U CN204696157U (zh) 2015-05-30 2015-05-30 一种增加安全线的led灯

Publications (1)

Publication Number Publication Date
CN204696157U true CN204696157U (zh) 2015-10-07

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Country Status (1)

Country Link
CN (1) CN204696157U (zh)

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GR01 Patent grant
CP02 Change in the address of a patent holder

Address after: 528415 first, five building, 4 building, 93 Yongning Industrial Road, Xiaolan Town, Zhongshan, Guangdong.

Patentee after: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd.

Address before: 528415 Zhongshan first, Xiaolan Town, Zhongshan, Guangdong, first 1, 129

Patentee before: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd.

CP02 Change in the address of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20190828

Address after: 528400, No. 93, Yongning Industrial Road, Xiaolan Town, Guangdong, Zhongshan two

Patentee after: ZHONGSHAN SAINTLY LIGHTING Co.,Ltd.

Address before: 528415 No. 1 card, 4th building, 5th floor, 93 Yongning Industrial Avenue, Xiaolan Town, Zhongshan City, Guangdong Province

Patentee before: ZHONGSHAN SHENGSHANG PHOTOELECTRIC TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151007

CF01 Termination of patent right due to non-payment of annual fee