CN204596841U - Application Ultrathin side penetrates the transmitting tube that efficient SMD PCB class LED manufactures - Google Patents
Application Ultrathin side penetrates the transmitting tube that efficient SMD PCB class LED manufactures Download PDFInfo
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- CN204596841U CN204596841U CN201520203355.0U CN201520203355U CN204596841U CN 204596841 U CN204596841 U CN 204596841U CN 201520203355 U CN201520203355 U CN 201520203355U CN 204596841 U CN204596841 U CN 204596841U
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- led
- transmitting tube
- pcb board
- luminescence chip
- chip
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Abstract
The utility model discloses a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, this transmitting tube comprises bottom heat radiation substrate and LED is launched on top, described transmitting LED comprises luminescence chip and pcb board, described luminescence chip is fixedly connected with described pcb board, and the polarity of described luminescence chip is connected on described pcb board by gold thread.Luminescence chip selects IR chip or PD/PT chip.Single led package assembling apparent size is: 3.0mm*1.2mm*2.65m, and single led package assembling luminous zone area is: 0.78mm*1.2mm*1.55mm.Ultra-thin LED of the present utility model penetrates the few 0.4mm of thickness than the side of main flow on the market, only has the thickness of 1.2mm; Light efficiency can reach Max.17mW/Sr@20mA, 20 ° ~ 30 °, with general assembly luminance raising more than 20%; And make simple, easy to use.
Description
Technical field
The utility model belongs to semiconductor device production field, be specifically related to a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube.
Background technology
Infrared Light-Emitting Diode (IRLED), Photo Diode/Photo Transistor/PDIC has become many 3C Products (Computer: computer, Communication: communication device, Consumer electronics: the photoelectric subassembly needed for consumption electronic product), and wherein in the application of Touch Screen, major demands concentrates on the markets such as mobile phone/E-Book/ computer, because market end considers the cost of Touch Screen, therefore start to be changed into optical profile type to reduce costs by condenser type, because the volume of electronic product is more and more little, reducing assembly volume and maintain high brightness (affecting transmission range) will be institute's major demands direction, market, because not yet having the side of infrared light high brightness to penetrate ultra-thin SMD class LED product in the market, therefore the emphasis of this patent photoelectric subassembly research and development is the ultra-thin 1.2mm Side-View SMD PCB Type product of exploitation, promote luminous intensity 20% (Max.17mW/Sr@20mA than 1.6mm thickness is thin on the market 0.4mm, 20 ° ~ 30 °).
Utility model content
Utility model object: the purpose of this utility model is to solve deficiency of the prior art, provides a kind of and applies the transmitting tube that Ultrathin side penetrates efficient SMD PCB class LED manufacture.
Technical scheme: described in the utility model a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, described transmitting tube comprises the heat-radiating substrate of bottom and the transmitting LED on top, described transmitting LED comprises luminescence chip and pcb board, described luminescence chip is fixedly connected with described pcb board, described luminescence chip polarity be connected on described pcb board by gold thread.
As optimization, described luminescence chip selects the IR chip of 8mil ~ 20mil or the PD/PT chip of 14mil ~ 30mil.
As optimization, single described LED assembly apparent size is: 3.0mm*1.2mm*2.65mm, and single described LED assembly luminous zone area is: 0.78mm*1.2mm*1.55mm.
As optimization, described luminescence chip is fixedly connected with by conducting resinl with described pcb board.
As optimization, the diameter of described gold thread is 1.25mil.
As optimization, described pcb board is of a size of 12.9*55.7mm, and pcb board body is evenly equipped with via, and the diameter of via is 0.3mm, is provided with LED between via, and the spacing between each LED is 0.08mm.
Beneficial effect: transmitting tube of the present utility model adopts Ultrathin side to penetrate efficient SMD PCB class LED/PD/PT package assembling, and this assembly tool has the following advantages:
(1) ultra-thin: to penetrate the few 0.4mm of thickness than the side of main flow on the market, only have the thickness of 1.2mm;
(2) efficient: light efficiency can reach Max.17mW/Sr@20mA, 20 ° ~ 30 °, with general assembly luminance raising more than 20%;
(3) make simply: this production technical maturity, without great quality hidden danger;
(4) easy to use: electrode position is positioned at product two ends can complete welding smoothly.
Accompanying drawing explanation
Fig. 1 is the single led encapsulating structure figure of the utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the upward view of Fig. 1.
Fig. 4 is pcb board structure chart of the present utility model.
Fig. 5 is the structure figure of Fig. 4.
Fig. 6 is the A district amplification assumption diagram of Fig. 4.
Fig. 7 is the B district amplification assumption diagram of Fig. 5.
Embodiment
A kind of Ultrathin side for the application of this transmitting tube as shown in Fig. 1 to Fig. 7 penetrates efficient SMD PCB class LED structure schematic diagram, this transmitting tube comprises bottom heat radiation substrate (not shown) and LED is launched on top, described transmitting LED comprises luminescence chip 1 and pcb board 2, described luminescence chip 1 is fixedly connected with described pcb board 2, described luminescence chip 1 polarity be connected on described pcb board 2 by gold thread.
As the further optimization of technique scheme, luminescence chip 1 selects the IR chip of 8mil ~ 20mil or the PD/PT chip of 14mil ~ 30mil.Single described LED assembly apparent size is: 3.0mm*1.2mm*2.65mm.Single described LED assembly luminous zone area is: 0.78mm*1.2mm*1.55mm.Described luminescence chip is fixedly connected with by conducting resinl with described pcb board.The diameter of described gold thread is 1.25mil.Described pcb board 2 is of a size of 12.9*55.7mm, and pcb board body is evenly equipped with via, and the diameter of via is 0.3mm, is provided with LED between via, and the spacing between each LED is 0.08mm.
Above-mentioned Ultrathin side penetrates the preparation technology of efficient SMD PCB class LED, comprises the steps:
(1) die bond: be fixed on pcb board material by conducting resinl by IR/PD/PT chip, completes 150 DEG C, and 2H is short roasting, guarantees that product is stabilized on pcb board;
(2) bonding wire: first utilize electricity slurry cleaning machine to remove scaling powder residual in wire bonding process, then use 1.25mil gold thread, chip polarity is introduced on pcb board;
(3) pressing mold: height refraction 1.45 ~ 1.55 colloids are encapsulated in product surface, guarantee that interiors of products does not damage by outside, mould also adopts the shaping Lens mould designed, and guarantees product lighting angle and luminous intensity;
(4) cut: assembly justifying design being cut into single 3.0mm*1.2mm*2.65mm, ensures well-tended appearance;
(5) & packaging is tested: use 20mA test, guarantee the consistency of voltage, wavelength, brightness, every 2K ~ 4K packs rolling provides client to use.
As optimization, step (1) described conducting resinl adopts Tanaka containing the high connductivity glue of high heat conduction.Step (3) described colloid chooses 11000,75000 type colloids.
Transmitting tube of the present utility model adopts Ultrathin side to penetrate efficient SMD PCB class LED/PD/PT package assembling, and this assembly tool has the following advantages:
(1) ultra-thin: to penetrate the few 0.4mm of thickness than the side of main flow on the market, only have the thickness of 1.2mm;
(2) efficient: light efficiency can reach Max.17mW/Sr@20mA, 20 ° ~ 30 °, with general assembly luminance raising more than 20%;
(3) make simply: this production technical maturity, without great quality hidden danger;
(4) easy to use: electrode position is positioned at product two ends can complete welding smoothly.
Current touch-control market Touch Panel is just at the early-stage, if by current computer/e-book/mobile phone in the occupancy volume of Chinese market and popularity rate, about have and at least using correlation type product more than 100,000,000 populations, and replace the situation of condenser type product gradually along with optical profile type, optical profile type application will become main flow Touch Panel using assembly gradually, and this super-thin high efficient SMD PCB class LED/PD/PT encapsulates the demand that also can meet client luminous intensity and sensor light electric current while that unit reducing about more than 30% on thickness.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to any simple modification that technical spirit of the present utility model is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (6)
1. apply the transmitting tube that Ultrathin side penetrates efficient SMD PCB class LED manufacture for one kind, it is characterized in that: described transmitting tube comprises the heat-radiating substrate of bottom and the transmitting LED on top, described transmitting LED comprises luminescence chip (1) and pcb board (2), described luminescence chip (1) is fixedly connected with described pcb board (2), described luminescence chip (1) polarity be connected on described pcb board (2) by gold thread.
2. according to claim 1 a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, it is characterized in that: described luminescence chip (1) selects the IR chip of 8mil ~ 20mil or the PD/PT chip of 14mil ~ 30mil.
3. according to claim 1 a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, it is characterized in that: single described LED assembly apparent size is: 3.0mm*1.2mm*2.65mm, single described LED assembly luminous zone area is: 0.78mm*1.2mm*1.55mm.
4. according to claim 1 a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, it is characterized in that: described luminescence chip (1) is fixedly connected with by conducting resinl with described pcb board (2).
5. according to claim 1 a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, it is characterized in that: the diameter of described gold thread is 1.25mil.
6. according to claim 1 a kind of apply Ultrathin side penetrate efficient SMD PCB class LED manufacture transmitting tube, it is characterized in that: described pcb board (2) is of a size of 12.9*55.7mm, pcb board body is evenly equipped with via, the diameter of via is 0.3mm, be provided with LED between via, the spacing between each LED is 0.08mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520203355.0U CN204596841U (en) | 2015-04-07 | 2015-04-07 | Application Ultrathin side penetrates the transmitting tube that efficient SMD PCB class LED manufactures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520203355.0U CN204596841U (en) | 2015-04-07 | 2015-04-07 | Application Ultrathin side penetrates the transmitting tube that efficient SMD PCB class LED manufactures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204596841U true CN204596841U (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520203355.0U Expired - Fee Related CN204596841U (en) | 2015-04-07 | 2015-04-07 | Application Ultrathin side penetrates the transmitting tube that efficient SMD PCB class LED manufactures |
Country Status (1)
| Country | Link |
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| CN (1) | CN204596841U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105720172A (en) * | 2016-04-20 | 2016-06-29 | 江苏瑞博光电科技有限公司 | Production process of SMD PCB type LED (Light Emitting Diode) with super-wide transmitting/receiving angle and obtained LED lamp |
| CN106601894A (en) * | 2016-10-25 | 2017-04-26 | 江苏瑞博光电科技有限公司 | Ultra-thin different-angle transmitting and receiving SMD mounting PCB type LED manufacturing process and manufactured LED lamp |
-
2015
- 2015-04-07 CN CN201520203355.0U patent/CN204596841U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105720172A (en) * | 2016-04-20 | 2016-06-29 | 江苏瑞博光电科技有限公司 | Production process of SMD PCB type LED (Light Emitting Diode) with super-wide transmitting/receiving angle and obtained LED lamp |
| CN106601894A (en) * | 2016-10-25 | 2017-04-26 | 江苏瑞博光电科技有限公司 | Ultra-thin different-angle transmitting and receiving SMD mounting PCB type LED manufacturing process and manufactured LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20180407 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |