CN204596752U - Solder ball attach device and the apparatus for supplying ball for this device - Google Patents
Solder ball attach device and the apparatus for supplying ball for this device Download PDFInfo
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- CN204596752U CN204596752U CN201520095247.6U CN201520095247U CN204596752U CN 204596752 U CN204596752 U CN 204596752U CN 201520095247 U CN201520095247 U CN 201520095247U CN 204596752 U CN204596752 U CN 204596752U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to solder ball attach device and the apparatus for supplying ball for this device, soldered ball settled by material, multiple soldered ball is made to be placed in the pattern of assigned address along direction is adjacent in length and breadth, and then be arranged in the multiple patterns forming multiple columns and rows, solder ball attach device comprises: apparatus for supplying ball, supply soldered ball, its be included in downside be formed opening with the ball resettlement section of accommodate soldered ball with there is circumferencial direction structure and spray inside ball resettlement section air make soldered ball with while cyclone type movement by the first air jet that opening is discharged; Bracket assembled body, it comprise be formed with inlet hole with pattern and receive under the state applying suction pressure from apparatus for supplying ball to inlet hole soldered ball the first support and during being attached soldered ball from apparatus for supplying ball to inlet hole to inlet hole apply suction pressure and from the first support to material transferring soldered ball during stop applying the suction pressure applying unit of suction pressure; Material transferred unit, makes material be positioned on the downside of bracket assembled body, makes to be inhaled into the soldered ball being fixed on the first support and is needed on material.
Description
Technical field
The utility model relates to solder ball attach device and the apparatus for supplying ball for this device, in more detail, relate to can in a non contact fashion with no damage by solder ball attach at substrate, energy minimization is by the quantity of soldered ball required when the material for solder ball attach again, and without the need to the recovery process of other soldered ball, untapped soldered ball can be directly reused in lower operation together, and the solder ball attach device of compact conformation and the apparatus for supplying ball for this device.
Background technology
Recently, along with miniaturization and the high performance of electronic equipment, the semiconductor elements such as semiconductor chip are also in more integrated trend.Therefore, the spacing of the relief pattern of semiconductor element is compared with the past, formed more tight, thus, propose inject a certain amount of fusion welding in the substrate being formed with the accepting groove be consistent with the pattern of semiconductor element after, make injected fusion welding be formed as the method for hemisphere to spherical projection by the reflow process of carrying out this heating.
Usually, while semiconductor packages is laminated in wafer by semiconductor chip along above-below direction, the mode along direction arranged adjacent is in length and breadth manufactured.In the case, semiconductor chip is formed with projection at edge, makes to realize electrical connection between the stacked semiconductor chip of above-below direction, and manufactures the high semiconductor packages of integrated level.
The integrated level of semiconductor element is higher, and the size of projection is less, as the size that can keep projection with little form, can keep again the scheme of its size consistently, generally be suitable for and utilize soldered ball to form the mode of projection.For this reason and in the material used, the pattern corresponding with semiconductor chip is adjacent to arrange along direction in length and breadth, and after the preposition of each pattern carries out the operation of attachment soldered ball, forms projection by reflow process.
Recently, the integrated level along with semiconductor element becomes very high, is just attempting to utilize diameter to be that the tiny soldered balls of 50 μm to 300 μm is to form projection.But due to compared to deadweight, the electrostatic force of tiny soldered balls is large, therefore, there is the problem be difficult to attaching to material by contacting the mode of carrying out being attached one by one.
In order to address this is that, apply for the applicant and disclose following structure in " the forming the method for projection and the soldered ball transfer device for the method at substrate with preassigned pattern " of No. 10-1139375th, the Korean granted patent publication of the patent of obtaining the authorization: namely, support make soldered ball move in the mode of rebounding, thus after soldered ball being placed in the inlet hole of support, make support-moving on material, thus transfer printing is placed in the soldered ball of support in the material, perform attachment operation thus.
The prior art tool formed in the manner has the following advantages: rebound in a non contact fashion owing to making soldered ball and move, while be placed in the inlet hole of support, thus the damage of soldered ball can not only be prevented, and the soldered ball not being placed in support of process can be reclaimed again, and then for operation afterwards.
But above-mentioned prior art because of soldered ball with the mobile route of the mode movement of rebounding only through an inlet hole, thus in order to all soldered balls being filled to the inlet hole of support, need a lot of soldered balls of more than three times, and in order to reuse, use and used the once soldered ball be recovered, along with needing the problem of soldered ball being carried out to strict control.Further, also existing to be needed on material after assigned address soldered ball being placed in support, in the process of transporting supports, causing operation to be postponed, and need the problem of the device of more volume.
Utility model content
In order to solve problem as above, the purpose of this utility model is, solder ball attach device and method is provided, soldered ball small for the size of less than 300 μm can attach on the pattern of material with undamaged cordless by above-mentioned solder ball attach device like clockwork, and above-mentioned pattern is along direction is adjacent in length and breadth.
Meanwhile, the purpose of this utility model is, guides the mobile route of soldered ball, makes the inlet hole of soldered ball Multiple through then out support, thus the quantity of soldered ball required when the material for solder ball attach can be minimized, and then by the use minimizing possibility of impaired soldered ball.
Further, the purpose of this utility model is, without the need to carrying out the recovery process of soldered ball in addition, directly can reuse untapped soldered ball in next process again, thus by the use minimizing possibility of impaired soldered ball.
Moreover, the purpose of this utility model is, provides the solder ball attach device of the compact conformation that can be arranged in narrower space.
To achieve these goals, the utility model provides solder ball attach device, soldered ball settled by predetermined material, multiple soldered ball is made to be placed in the pattern of assigned address along direction is adjacent in length and breadth, and then be arranged in the multiple pattern forming multiple columns and rows, the feature of above-mentioned solder ball attach device is, comprise: apparatus for supplying ball, above-mentioned apparatus for supplying ball supply soldered ball, it comprises ball resettlement section and the first air jet, above-mentioned ball resettlement section is formed with opening in downside, and for accommodating soldered ball, above-mentioned first air jet has circumferencial direction structure, and spray air to the inner side being intended for above-mentioned ball resettlement section, the soldered ball of the inside of above-mentioned ball resettlement section is moved with the type of flow of cyclone type, and then discharge bracket assembled body by above-mentioned opening while making the soldered ball being supplied in above-mentioned ball resettlement section carry out movement with cyclone type, above-mentioned bracket assembled body comprises the first support and suction pressure applying unit, above-mentioned first support is formed with inlet hole with above-mentioned pattern, under from above-mentioned apparatus for supplying ball to the state of above-mentioned inlet hole applying suction pressure, receive soldered ball, above-mentioned suction pressure applying unit is during the attachment soldered ball from above-mentioned apparatus for supplying ball to above-mentioned inlet hole, suction pressure is applied to above-mentioned inlet hole, during from above-mentioned first support to above-mentioned material transferring soldered ball, stop applying suction pressure to above-mentioned inlet hole, material transferred unit, for mobile material, makes above-mentioned material be positioned at the downside of above-mentioned bracket assembled body, and then makes to be inhaled into the soldered ball being fixed on above-mentioned first support and be needed on above-mentioned material.
This is to spray from the form of the formation of the first air jet towards circumferencial direction of apparatus for supplying ball and the formation towards radial direction towards ball resettlement section to have simultaneously along with air, soldered ball in guidance spheres resettlement section moves along the flowing of sprayed air with whirlwind form, thus make the inlet hole of soldered ball repeatedly through support in the mobile route of soldered ball fifty-fifty, even if supply a small amount of soldered ball, the inlet hole of support also can be placed within the shorter time.
Thus, the quantity of soldered ball required when the material for solder ball attach can be minimized, thus along with the soldered ball devoting attachment operation is reused, can by the use minimizing possibility of impaired soldered ball, and, due in the mobile route of soldered ball repeatedly through inlet hole, thus can obtain and can shorten the effect that soldered ball is placed in the time of the inlet hole of support.
In the case, above-mentioned bracket assembled body also has the second support, above-mentioned second support can to arrange with the above-mentioned first support mode rotating spacing of being separated by, thus after soldered ball is placed in the first support, during the soldered ball being placed in the first support is needed on material, receives the soldered ball that supplied by apparatus for supplying ball and soldered ball be placed in the inlet hole of the second support.Thus, in the first support and the second support, settle operation alternately to realize soldered ball without the mode of interrupting, thus more soldered ball can be placed in support (" support " be recorded in claims of this specification and utility model is the general designation of " the first support ", " the second support ") within the time of specifying.
Inlet hole can be distributed in above-mentioned first support and above-mentioned second support with identical pattern, but also by formed distinct patterns inlet hole come from a solder ball attach device, with distinct patterns by solder ball attach in material.
The more important thing is, above-mentioned first support and the second support with above-mentioned pivot for benchmark 180 degree of modes rotating spacing of being separated by configure, thus be used in receive soldered ball and the operation of carrying out settling by making the first support and the second support revolve turnback to make a support from apparatus for supplying ball, and another support is used in the operation soldered ball carrying out settling with the state of turning over turnback being needed on material, thus soldered ball arrangement operation and the operation being needed on material can be performed simultaneously, and it is space-minimized to make shared by bracket assembled body, thus compact structure can be embodied.
On the other hand, the utility model comprises moving part, above-mentioned moving part make in above-mentioned apparatus for supplying ball and above-mentioned first support at least one move, make the opening of above-mentioned apparatus for supplying ball via above-mentioned inlet hole.That is, moving part can only mobile apparatus for supplying ball, makes the opening of apparatus for supplying ball via the inlet hole of the first support, also can only mobile first support, and can move apparatus for supplying ball and the first support simultaneously.
The more important thing is, above-mentioned apparatus for supplying ball also comprises the second air jet, by being formed as the jet of ring-type in the position surrounding above-mentioned first air jet, thus injection air, and be blown into the air of whirlwind form to the soldered ball flowed downward along open outer side by the first air jet in order to settle soldered ball at the inlet hole of the first support, thus make path movement from soldered ball to whirlwind form while, by means of the air that the second air jet sprays, form air curtain, thus prevent above-mentioned soldered ball from departing to the outside of above-mentioned second air jet.
Thus, soldered ball can move with the type of flow of whirlwind form, can prevent again the outside to apparatus for supplying ball from leaking, soldered ball only be flowed with whirlwind form in the downside of apparatus for supplying ball, thus the quantity of the soldered ball needed for inlet hole soldered ball being placed in support can be greatly reduced.Therefore, it is possible to certain preventing with the pollution of reclaiming the soldered ball produced when the soldered ball failing to be placed in the inlet hole of support re-starts use, damaged problem in the past.
Moreover, above-mentioned apparatus for supplying ball can also comprise air suction inlet, is formed as the above-mentioned air suction inlet of ring-type, sucks air by suction passage in the position surrounding above-mentioned first air jet.Thus, soldered ball is placed in the inlet hole being configured in a support, and sucks by the inside applying negative pressure dealing suction passage to air suction inlet the soldered ball residuing in the downside of apparatus for supplying ball and apparatus for supplying ball.
Thus, the soldered ball residuing in ball resettlement section and downside thereof is inhaled into passage and sucks, even if thus apparatus for supplying ball also can be made lightheartedly to move with the state of the open lower side not blocking apparatus for supplying ball.Therefore, due to can when not blocking the open lower side of apparatus for supplying ball, also lightheartedly can move, thus can obtain, after an arrangement operation support being terminated to soldered ball, getting rid of the advantageous effects of the setting of the mask of the downside for blocking apparatus for supplying ball.
In the case, spherical cap is formed at the above-mentioned suction passage separated from above-mentioned air suction inlet, above-mentioned spherical cap suppresses above-mentioned soldered ball to pass through, and allow air to pass through, ball keeping chamber is formed between above-mentioned air suction inlet and above-mentioned spherical cap, and then can by interim keeping more stable for soldered ball in this ball keeping chamber.
Carry out the soldered ball of keeping in ball keeping chamber by air suction inlet except the suction pressure (negative pressure) of whereabouts suction passage applying, or to be discharged to the outside of air suction inlet by applying malleation.And, to the soldered ball that the outside of ball suction inlet is discharged, be pushed out by the malleation applied to air suction inlet, and release to inner sides of radius direction, thus soldered ball can be made to move to the downside of ball resettlement section, and be positioned at the inner sides of radius of the second air jet due to air suction inlet, the soldered ball of discharging from air suction inlet is moved by the downside of the air inwardly sprayed from the second air jet to ball resettlement section.
On the other hand, the utility model can also comprise mask, form cut, the size of above-mentioned cut is arranged to the above-mentioned inlet hole arranged with above-mentioned pattern that can expose above-mentioned support, thus during the above-mentioned inlet hole supply soldered ball from above-mentioned apparatus for supplying ball to above-mentioned first support, aforementioned mask is between above-mentioned first support and above-mentioned apparatus for supplying ball.Thus, apparatus for supplying ball is positioned at the upside of mask, and apparatus for supplying ball moves in the upside of the cut of mask, while soldered ball is placed in the inlet hole of support.That is, because apparatus for supplying ball can be positioned at the upside of mask, even if thus the chamber do not formed in addition for keeping soldered ball in apparatus for supplying ball is also harmless.
Wherein, fixing hole is formed on above-mentioned first support, above-mentioned fixing hole is to surrounding's applying suction pressure of above-mentioned cut, during the above-mentioned inlet hole supply soldered ball from above-mentioned apparatus for supplying ball to above-mentioned first support, apply suction pressure in above-mentioned fixing hole, the plate face of aforementioned mask is close to above above-mentioned first support.Thus, the plate face of mask can not tilt from the surface of support, thus the space that soldered ball can be made to flow into can be eliminated, therefore, even if there is the deviation to the outside movement of cut in a part for apparatus for supplying ball, also because soldered ball prevents soldered ball to be clipped between mask plate face and support in the downside of ball resettlement section all the time, thus, soldered ball can be prevented impaired, and energy minimization tilts and the phenomenon of eddy generation the air of the whirlwind form of discharging from the first air jet from the surface of support because of mask plate face again.
On the other hand, the utility model provides apparatus for supplying ball, for supplying soldered ball to multiple inlet hole, above-mentioned multiple inlet hole forms multiple patterns adjacent with transverse direction along the longitudinal, above-mentioned apparatus for supplying ball comprises: ball resettlement section, is formed with opening in the downside of above-mentioned ball resettlement section, and for accommodating soldered ball; And first air jet, there is circumferencial direction form, and spray air to the inner side being intended for above-mentioned ball resettlement section, the soldered ball of the inside of above-mentioned ball resettlement section is moved with the type of flow of cyclone type, above-mentioned opening is via while above-mentioned inlet hole, and the soldered ball of inside, above-mentioned ball resettlement section is supplied in above-mentioned inlet hole.
Further, above-mentioned apparatus for supplying ball also comprises the second air jet, by being formed as the jet of ring-type in the position surrounding above-mentioned first air jet, sprays air; Thus prevent above-mentioned soldered ball from departing to the outside of above-mentioned second air jet.
Further, above-mentioned apparatus for supplying ball can also comprise air suction inlet, is formed as suction inlet, sucks air by suction passage in the position surrounding above-mentioned first air jet.
And, preferably, spherical cap can be formed with at the above-mentioned suction passage separated from above-mentioned air suction inlet, above-mentioned spherical cap not only suppressed above-mentioned soldered ball by but also allow air to pass through, and then soldered ball is taken care of temporarily the ball keeping chamber between above-mentioned air suction inlet and above-mentioned spherical cap.
In the case, malleation can be applied to above-mentioned air suction inlet, discharge the soldered ball being positioned at above-mentioned suction passage by force.
Further, the above-mentioned suction passage adjacent with above-mentioned air suction inlet to be formed with above-mentioned ball resettlement section mode in opposite directions, thus can make the soldered ball being positioned at ball keeping chamber be moved by the downside of air suction inlet to ball resettlement section by applying malleation.
For this reason, optionally or additionally, the second air jet is formed outside the radius of above-mentioned air suction inlet, air is inwardly sprayed along radial direction in the position that above-mentioned second air jet is surrounding above-mentioned air suction inlet, can, by the air sprayed from the second air jet, the soldered ball of being discharged by air suction inlet from ball keeping chamber be moved to the downside of ball resettlement section thus.
On the other hand, according to another field of utility model, the utility model provides solder ball attach method, soldered ball settled by predetermined material, make multiple soldered ball be placed in the pattern of assigned address along direction is adjacent in length and breadth, and then be arranged in the multiple pattern forming multiple columns and rows, the feature of above-mentioned solder ball attach method is, comprise: suction pressure applies step, the above-mentioned suction inlet to above-mentioned first support applies suction pressure; Feeder moves step, formed to having radius by the first air jet being configured at the surrounding of the opening of above-mentioned apparatus for supplying ball, and while together there is the direction injection air formed towards the direction at the center of above-mentioned ball resettlement section, above-mentioned opening is moved via the upside of above-mentioned suction inlet, thus while making soldered ball flow together movement along whirlwind direction in above-mentioned opening, be placed in above-mentioned inlet hole; Material positioning step, makes material be placed in the downside of above-mentioned first support; And ball attach step, overturn above-mentioned first support, remove the suction pressure applied to above-mentioned inlet hole, thus attach to above-mentioned first support.
During performing above-mentioned ball attach step for above-mentioned first support, for to perform above-mentioned suction pressure apply step and above-mentioned feeder moves step be separated by 180 degree the second support that the mode that rotates spacing configures of above-mentioned first support, thus process efficiency can be improved.
That is, for above-mentioned first support and above-mentioned second support, alternately perform above-mentioned suction pressure and apply step and above-mentioned feeder and move step.
And, in during the above-mentioned feeder of execution moves step, come to spray air to the position of encirclement first air jet by the second air jet being formed as the jet of ring-type, thus prevent above-mentioned soldered ball from departing to the outside of above-mentioned second air jet.
On the other hand, the utility model also comprises mask alignment step, in aforementioned mask positioning step, mask is made to be positioned at above above-mentioned first support, aforementioned mask is formed with cut, and the size of above-mentioned cut is arranged to the above-mentioned inlet hole arranged with above-mentioned pattern that can expose above-mentioned support; Before above-mentioned feeder moves step, above-mentioned apparatus for supplying ball can be positioned at the outside of the cut of aforementioned mask.
And, the utility model can also comprise mask and be close to step, is close in step in aforementioned mask, if perform aforementioned mask positioning step, then can apply suction pressure to the fixing hole being formed at above-mentioned first support, thus make the outer panel face of the cut of aforementioned mask be close to above-mentioned first support.
The utility model formed in the manner can in a non contact fashion, attaches to material, be firmly established at this with the tiny soldered balls that diameter is 10 μm to 300 μm by pattern.
Usually, " arrangement " and " attachment " is for having the term of similar meaning, but the term " arrangement " used in authorized claims of this specification and utility model is used for censuring the inlet hole that soldered ball is positioned at support, term " attachment " is used for censuring soldered ball and is needed on material from support.
As mentioned above, the utility model has following beneficial effect: under the state of the ball resettlement section of apparatus for supplying ball collecting soldered ball, at air to have the whirlwind form from the formation of the first air jet towards circumferencial direction of apparatus for supplying ball and the formation towards inner sides of radius direction simultaneously, carry out the state of spraying towards ball resettlement section under, by make apparatus for supplying ball to pattern arrangement inlet hole support on move, the soldered ball come in guidance spheres resettlement section moves with whirlwind form according to the flowing of sprayed air, thus by repeatedly through the mobile route of the soldered ball of the inlet hole of support, even if with the soldered ball of less amount, also can whole inlet holes of successful installation support in the short period of time, more can improve the efficiency of solder ball attach operation thus.
And, the utility model can obtain following advantage: owing to the quantity of the soldered ball devoting solder ball attach operation can be minimized, thus along with reusing the soldered ball dropped into attachment operation, by the use minimizing possibility of impaired soldered ball, thus there is the advantage of the bad possibility more reducing projection.
Moreover, the utility model can obtain following beneficial effect: by configuring the support of plural disposable arrangement soldered ball, soldered ball arrangement operation can be performed in a support during, be configured to, by another support, soldered ball is needed on material, thus can ceaselessly perform solder ball attach operation, making to have can by the advantageous effects of solder ball attach in material within the shorter time.
The more important thing is, the utility model is formed bracket assembled body in the mode of the support of arrangement soldered ball being revolved turnback in apparatus for supplying ball, and configure material transferred unit in the mode that mobile material on the downside of it makes soldered ball be needed on material from support, thus, the displacement that the soldered ball being placed in support is needed on material is minimized, thus the time more shortened needed for operation, and the compact structure making the space shared by solder ball attach device become less can be embodied.
And, the utility model can obtain following beneficial effect: the second air jet forming ring-type outside the radius by the first air jet of the air in injection whirlwind form, form air curtain, thus while together move with the air of whirlwind form, while the soldered ball preventing from being placed in support departs to the outside of apparatus for supplying ball, the quantity of the soldered ball of the inlet hole for soldered ball being placed in support can be greatly reduced, the pollution of the soldered ball occurred in the process more positively preventing the soldered ball not being placed in the inlet hole of support before reclaiming from reusing can be obtained thus, the effect of damaged problem.
The more important thing is, the utility model can obtain following beneficial effect: around the first air jet of air spraying whirlwind form, be formed with ring-type or sucked the air suction inlet of air in multiple separation place by suction passage, thus in end from apparatus for supplying ball to after the operation of a Stent Implantation soldered ball, air suction inlet applying negative pressure to apparatus for supplying ball sucks and residues in ball resettlement section or the soldered ball on the downside of it, these soldered balls are made to be contained in suction passage, thus, even if do not block the open lower side of apparatus for supplying ball, also the state be welded in apparatus for supplying ball can be kept, and apparatus for supplying ball can be made lightheartedly to move along above-below direction, thus there is the advantageous effects of the setting of the mask of the downside can removed for blocking apparatus for supplying ball.
Accompanying drawing explanation
Fig. 1 is the skeleton diagram of the material that attachment soldered ball is shown.
Fig. 2 is the enlarged drawing of " A " part of Fig. 1.
Fig. 3 is the front view of the structure of the solder ball attach device that the first embodiment of the present utility model is shown.
Fig. 4 is the stereogram of the structure of the inlet hole arrangement soldered ball illustrated from apparatus for supplying ball to support.
Fig. 5 a is the phantom of the structure of the apparatus for supplying ball that an example of the present utility model is shown.
Fig. 5 b is the upward view of the apparatus for supplying ball of Fig. 5 a.
Fig. 6 is the stereogram of the inner part of the first air jet of the apparatus for supplying ball that Fig. 4 is shown.
Fig. 7 is the phantom of the structure of the apparatus for supplying ball that another example of the present utility model is shown.
Fig. 8 a is the approximate three-dimensional map of the structure of the support that the solder ball attach device being used in Fig. 3 is shown.
Fig. 8 b is the enlarged drawing of " B " part of Fig. 8 a.
Fig. 8 c is the approximate three-dimensional map of the structure of the support that the solder ball attach device being used in the second embodiment of the present utility model is shown.
Fig. 9 a to Fig. 9 i is the structural representation of the solder ball attach method that the solder ball attach device utilizing the first embodiment of the present utility model is shown successively.
Figure 10 a to Figure 10 f is the structural representation of the solder ball attach method that the solder ball attach device utilizing the second embodiment of the present utility model is shown successively.
The explanation of Reference numeral
100: solder ball attach device 110,110 ': apparatus for supplying ball
111a: the first air jet 111x: the air of whirlwind form
112a: air suction inlet 112x: negative pressure
112c: ball keeping chamber 113a: the second air jet
113x: air curtain 115: spherical cap
120: mask 125: cut
130: bracket assembled body 140: material transferred unit
M: material H1: the first support
H2: the second support G: inlet hole
F: fixing hole P: patterns of material
P ': scaffold pattern
Embodiment
Below, be described in detail with reference to the solder ball attach device 100 of accompanying drawing to an embodiment of the present utility model.In the process of solder ball attach device 100 that an embodiment of the present utility model is described, in order to main idea clearly of the present utility model, will omit with the structure of known solder ball attach device and act on similar structure and the explanation of effect.
As shown in drawings, the solder ball attach device 100 of the first embodiment of the present utility model comprises: apparatus for supplying ball 110, moves along direction up and down, and to downside supply soldered ball; Mask 120, keeps the state being close with the downside of apparatus for supplying ball 110 or being close to, while be formed with cut 125 in the mode of the inlet hole G exposing support H1, H2, H, and moves up and down; Bracket assembled body 130, with can mode fixed support H1, H2 of movement, above-mentioned support H1, H2 make soldered ball S arrange by pattern; And material transferred unit 140, material M is moved to the downside of bracket assembled body 130, thus the soldered ball and material M that are placed in the inlet hole G of support H1, H2 are formed is attached.
As shown in Figures 1 and 2, multiple pattern P is arranged on above-mentioned material M in the mode adjacent along direction in length and breadth, and soldered ball S is attached at the assigned address E configured with the mode of each pattern P intervening gaps d.Each pattern P of material M is made into a semiconductor element.
As shown in Figure 5, the ball resettlement section 119 for accommodating soldered ball S is formed at the central portion of above-mentioned apparatus for supplying ball 110, supplies soldered ball S, thus supplement from soldered ball supply unit SS in ball resettlement section 119.Ball resettlement section 119 is formed by the hollow bulb of inner part 111, is formed with opening 119a in the downside of ball resettlement section 119, thus makes the soldered ball S in ball resettlement section 119 become the state that can flow down towards the below of ball resettlement section 119.
Wherein, the first intermediate member 112 combines with outside the radius of inner part 111 in the mode of intervening gaps, is provided with the first positive pressure passageway be connected with air pump P1 between inner part 111 and the first intermediate member 112.The lower end of the first positive pressure passageway is formed as the first air jet 111a for spraying air.In the case, as shown in Figure 5 b, be formed with the guide protrusion 111p of the movement for guiding air at the outer peripheral face of inner part 111, thus guide the air in the first positive pressure passageway to move along the bearing of trend of guide protrusion 111p.Extend in the guide protrusion 111p in the region adjacent with the first air jet 111a, make it have circumferencial direction to form, thus by the air 111x that the first air jet 111a discharges, together there is the whirlwind form that circumferencial direction is formed and inner sides of radius direction is formed, cause and move from ball resettlement section 119 to lower side to the soldered ball S flowed down along the path 88x of whirlwind form.
Although accompanying drawing is formed at the outer peripheral face of inner part 111 structure with guide protrusion 111p illustrates, guide protrusion 111p also can be formed at the inner peripheral surface of the first intermediate member 112.And, in order to guide the flowing of whirlwind form, in order to the means of adding circumferencial direction formation to the flowing of the air applied from air pump P1, be not formed as projection form, but more than one that can be formed at flute profile state in inner part 111 or the first intermediate member 112, and the form inserting the other frame formed for additional circumferencial direction to the inside between parts 111 and the first intermediate member 112 can be formed as.
With its similarly, be combined with the second intermediate member 113 at the outer peripheral face of the first intermediate member 112, between the first intermediate member 112 and the second intermediate member 113, be provided with the suction passage for being connected with suction pump P2.The lower end of suction passage is formed as the air suction inlet 112a for sucking air.Although accompanying drawing is formed as the structure of ring-type exemplified with air suction inlet 112, air suction inlet 112a can circumferentially be formed multiple.In the case, the first intermediate member 112 and the second intermediate member 113 can be formed as a body, and air suction inlet 112a can be formed in the lower end in the multiple holes be connected with suction pump P2.
Be formed with spherical cap 115 at the suction passage upwards extended from air suction inlet 112, above-mentioned spherical cap 115 suppresses soldered ball pass through and allow air to pass through.Such as, spherical cap 115 can be formed with porousness block or cloth etc.Thus, if apply negative pressure to suction passage, thus there is the flowing 112x being sucked ambient air by air suction inlet 112a, space then between air suction inlet 112a and spherical cap 115 is formed as ball keeping chamber 112c, thus soldered ball can be made to suck in ball keeping chamber 112c, and the state that holding position is fixed.
As required, suction passage is formed as to apply malleation by air pump (not shown), thus can discharge the soldered ball S being contained in ball keeping chamber 112c by force.
Outside parts 114 combine with outside the radius of the second intermediate member 113 in the mode of intervening gaps, thus side component 114 and the second intermediate member 113 are provided with the second positive pressure passageway be connected with air pump P3 outside.The second air jet 113a for spraying air to be formed in the lower end of the second positive pressure passageway with ring-type.The air 113x sprayed by the second air jet 113a is formed with air curtain between the object (such as: support or mask) that the bottom surface of apparatus for supplying ball 110 is adjacent, thus prevents soldered ball from moving outside the radius of the second air jet 113a.
As shown in the figure, the second positive pressure passageway adjacent to the second air jet 113a inwardly forms bending towards ball resettlement section 119, and can be formed along the direction towards ball resettlement section 119 by the air curtain that the air of discharging from the second air jet 113a is formed.Thus, if the negative pressure applied to ball keeping chamber 112c is removed, thus keeping flows down in the soldered ball S of ball keeping chamber 112c to the outside of air suction inlet 112a, can soldered ball S be made naturally to move to the space surrounded by the first air jet 111a by the air 113x sprayed from the second air jet 113a.Although air curtain also can be formed obliquely towards ball resettlement section 119, according to another execution mode of the present utility model, the air curtain sprayed from the second air jet 113a can vertically be formed.
Apparatus for supplying ball 110 can with connect or guide means along the path of specifying, by moving part M1 come vertically 110u and all around direction 110d move.
On the other hand, as shown in Figure 7, in the apparatus for supplying ball 100 ' of another example of the present utility model, only can form the first air jet 111a and the second air jet 113a, and not form air suction inlet.That is, the first intermediate member 112 and the second intermediate member 113 are formed as an intermediate member 113 '.In this case, due to by soldered ball keeping in suction passage, thus after inlet hole G soldered ball S being placed in a support H, in order to prevent soldered ball from departing from from ball resettlement section 119 to downside, the opening 119a of ball resettlement section 119 cannot need be blocked.According to an example of the present utility model, after end is placed in the operation of support H, the opening 119a of ball resettlement section 119 can keep blocked state by the plate face of mask 120.
Soldered ball S is placed in support H for utilizing the apparatus for supplying ball 110 of the form shown in Fig. 7 by aforementioned mask 120.Mask 120 forms cut 125 in the plate face 122 that the thickness extended from edge is thin, thus under the state being made the inlet hole G of support H expose by cut 125, soldered ball S is made to be placed in the inlet hole G of support H from apparatus for supplying ball 110, and, if the arrangement operation of soldered ball S terminates, then by the opening 119a of airtight ball resettlement section 119, mask plate face 122, thus soldered ball S is kept to depart from from apparatus for supplying ball 110 and to stay in ball resettlement section 119.For this reason, mask 120 can by moving part M2 come with apparatus for supplying ball 110 together vertically 120u move.
If the fixing support H being formed with multiple inlet hole G with the pattern of material of above-mentioned bracket assembled body 130, if make soldered ball S be placed in the inlet hole G of support H, then by making support H rotate, transfer printing is carried out to material M.Therefore, the inlet hole G of support H is with pattern P ' arrangement, wherein above-mentioned pattern P ' with will to be attached soldered ball identical in the pattern P of material M.
For this reason, bracket assembled body 130 is by being fixed on bracket fixture portions 131,132 by the first support H1 and the second support H2 respectively with the rotation spacing of 180 degree, and utilize rotation motor M3 to rotate the mode of the rotating shaft 133 of the pivot 138 being positioned at bracket fixture portions 131,132, make the first support H1 and the second support H2 alternately perform soldered ball and settle operation and soldered ball transfer printing process.So, if with the state plural support H1, H2 being fixed on bracket assembled body 130, come 180 degree and rotate the posture that soldered ball S is placed in support H, then can be needed on due to the soldered ball S being placed in support H material M makes overall structure become compact while, minimize the displacement of support H, make it possible to terminate solder ball attach operation within the shorter time, thus the effect of the process efficiency that is improved.
Further, in order to apply suction pressure to the inlet hole G of each support H1, H2 of being fixed on bracket assembled body 130, each support H1, H2 are all connected with vacuum pump V1, V2, thus apply suction pressure to the inlet hole G of support H1, H2 independently.
At this, although the first support H1 being individually fixed in the bracket fixture portions 131,132 of bracket assembled body 130 can with identical arranged in patterns inlet hole G with the second support H2, but when soldered ball S is alternately attached to material M with different pattern, inlet hole G can be arranged in the first support H1 and the second support H2 with distinct patterns.
On the other hand, when utilizing mask 120 soldered ball S to be placed in the inlet hole G of support H, as shown in Figure 8 a, be formed with the pattern P of inlet hole in arrangement ' region around be formed with fixing hole F for importing suction pressure, and fixing hole F is formed at support H.Thus, if the plate face 122 of mask 120 is positioned at above support H, then can apply suction pressure to fixing hole F, make to be close to mutually above the region 122z of the cut 125 of surrounding mask 120 and support H, thus prevent between mask plate face 122 and support H, tilt in cut 125.Thus, by soldered ball S from apparatus for supplying ball 110 to the inlet hole G of support H settle during in, prevent the soldered ball S flowed with whirlwind form in the downside of the ball resettlement section 119 of apparatus for supplying ball 110 from flowing into the gap between mask plate face 122 and support H, or prevent the flowing of whirlwind form from forming eddy current because of the mask plate face 122 of protruding above support H at the borderline region of cut 125.In the case, can realize by different suction pumps or can realize importing suction pressure to fixing hole F and importing suction pressure to inlet hole G by a suction pump simultaneously.
On the contrary, when not utilizing mask 120 soldered ball S to be placed in the inlet hole G of support H, do not formed for mask plate face 122 being sucked the fixing hole F being fixed on the surface of support H, but be formed with region 210x, and this region 210x is to the pattern P being formed with inlet hole G ' supply soldered ball S before, apparatus for supplying ball 110 can be made to be positioned on support H.At this, because apparatus for supplying ball 110 also can in pattern P ' on come into effect soldered ball and settle operation, thus this region 210x is not necessary.
Above-mentioned material transferred unit 140 with the material M performing solder ball attach operation is sucked the state be fixed on above above-mentioned material transferred unit 140, along all around and above-below direction 140u move.Such as, material transferred unit 140 can have the known means such as the syndeton comprising linear motor to form.Only, material transferred unit 140 is formed as to move along above-below direction 140u, and with optionally close with the bracket assembled body 130 for making support H rotate, thus by the soldered ball S being placed in support H being needed on the mode of material H to perform solder ball attach operation.
Below, to utilizing the solder ball attach device 100,100 ' formed in the manner to be described the solder ball attach method that material M performs solder ball attach operation.
step 1: first, as illustrated in fig. 9, before the first support H1 soldered ball S being placed in bracket assembled body 130, mask 120 rises 120u1 to the position upwards separated from the first support H1, and apparatus for supplying ball 110 ' is also with the state of rising 110u1 location, makes the bottom surface of apparatus for supplying ball 110 ' be in the state be close to mutually with the plate face 122 of mask 120.Like this, the state that the downside of apparatus for supplying ball 110 ' keeps masked plate face 122 to block, thus prevent soldered ball to be scattered from the ball resettlement section 119 of apparatus for supplying ball 110 ' downwards.
Further, if the soldered ball S quantity of ball resettlement section 119 is less than the pattern P be placed in the first support H1 ' component of the inlet hole G of morphologic arrangement, then supplement from ball supply unit SS in the mode of filling up specified amount.
step 2: and, the rotating shaft 133 of runing rest assembly 130 is carried out by rotation motor M3, make the first support H1 of bracket assembled body 130 form the state being positioned at upside, as shown in figure 9b, make apparatus for supplying ball 110 ' and mask 120 move 110u2,120u2 in side downwards by moving part M1, M2.In the case, to determine the position of mask 120 by the cut 125 of mask 120, the inlet hole G of the first support H1 is all exposed.
Thus, the plate face 122 of mask 120 becomes the state contacted with the first support H1, and in this state, as is shown in fig. 9 c, and the state that the downside of apparatus for supplying ball 110 ' still keeps masked plate face 122 to block.
Further, apply suction pressure pz ' from suction pump V1 to the fixing hole F of the first support H1, make to be close to mutually above the periphery of the cut 125 of mask 120 and the first support H1.Meanwhile, also apply suction pressure pz from suction pump V1 to the inlet hole G of the first support H1, thus build the environment that the soldered ball S guided in the upside of the first support H1 can be placed in inlet hole G.
step 3: then, malleation is applied from air pump P1, P2 of apparatus for supplying ball 110 ', thus spray the air 111x in whirlwind direction from the first air jet 111a while, and, form the air curtain 113x from the second air jet 113a towards inner side, make the bottom surface of apparatus for supplying ball 110 ' and mask plate face 122 be separated by small slit-shaped at interval.
Therefore, soldered ball S is while be scattered downwards from ball resettlement section 119 by opening 119a, while carry out the flowing of whirlwind form coming by the air 111x in whirlwind direction sprayed from the first air jet 111a, prevent from departing to the outside of apparatus for supplying ball 110 ' by the air curtain 113x sprayed from the second air jet 113a simultaneously.
step 4: while keeping step 3, as shown in figure 9d, apparatus for supplying ball 110 ' is from the mobile 110d in upside of the upper side direction first support H1 in mask plate face 122, thus make apparatus for supplying ball 110 ' by moving part M1 while the mobile 110d in upside of the inlet hole G of the first support H1, as shown in figure 9e, make soldered ball S be placed in inlet hole G that suction pressure pz plays the first support H1 of effect.In the accompanying drawings, although illustrate the structure that apparatus for supplying ball 110 ' undertakies by moving part M1 moving horizontally, also mask 120 and bracket assembled body 130 can be moved by moving part M2 etc., and they 110 ', 120,130 also can together move.
In the case, the air 111x of the lower side inflow whirlwind form from the first air jet 111a to apparatus for supplying ball 110 ', soldered ball S is moved along the path 88x of whirlwind form in the downside of ball resettlement section 119, therefore, fifty-fifty, the mobile route of soldered ball S can repeatedly via the inlet hole G of the first support H1, even if thus the soldered ball S of supply minority, within the shorter time, also all can be placed in the inlet hole G of the first support H1.Thus, the quantity of the soldered ball S supplied in order to soldered ball S is attached to material M can be minimized, make it possible in the past owing to being reused in operation afterwards to the soldered ball that dropped into once of attachment operation, thus impaired soldered ball S forms attachment, and then form the aspect of projection, greatly reduce the possibility causing mistake.
Although not shown, but as required, on the first support H1, apply the suction pressure lower than suction pressure pz from upside, thus the soldered ball outside the inlet hole G residuing in the first support H1 can be reclaimed in addition.But soldered ball is remained be positioned at the state of the downside of apparatus for supplying ball 110 ' due to the air curtain 113x sprayed from the second air jet 113a, thus can omit the operation reclaiming soldered ball in addition.
step 5: according to step 4, if soldered ball S is all placed in the inlet hole G of the first support H1, then as shown in figure 9f, apparatus for supplying ball 110 ' and mask 120 move to upside 110u1,120u1 by moving part M1, M2.That is, apparatus for supplying ball 110 ' becomes identical state with the state of step 1.
Further, if the soldered ball S quantity of ball resettlement section 119 be less than after for settling the component of the inlet hole G of the second support H2 of soldered ball, then supplement from ball supply unit SS, make it fill up specified amount (step S1).
In this state, in the inlet hole G of the first support H1, the state applying 130p suction pressure pz from vacuum pump V1 is kept.
step 6: then, as shown in figure 9g, at applying suction pressure pz under the state of the inlet hole G of the first support H1, bracket assembled body 130 with pivot 138 for benchmark, the first support H1 is made to revolve turnback, to make the soldered ball being placed in the first support H1 change posture, it is made more to be positioned at downside than the first support H1.
Thus, the second support H2 configured in the mode of rotation spacing of being separated by 180 degree with the first support H1 will carry out in rotary moving to the position residing for the first support H1.
step 7: then, as shown in Fig. 9 h, suck the material transferred unit 140 being fixed with material M and move to upside 140u1 by moving part M4, thus make that material M's is close with the first support H1 above.Further, the suction pressure pz applying 130p from vacuum pump V1 is removed.Thus, with pattern P ' morphologic arrangement the soldered ball S being placed in the first support H1 be all to transfer printing above material M.
Like this, form bracket assembled body 130, the support of arrangement soldered ball S is made to revolve turnback from apparatus for supplying ball 110 ', and to transferring material M to configure material transferred unit 140 on the downside of it, make from the first support H1 to material transferring soldered ball S, thus, the displacement that the soldered ball S being placed in support H1 is needed on material M is minimized, thus more can shorten activity time, and the compact structure making the space shared by solder ball attach device 100 less can be embodied.
On the other hand, according to another example of the present utility model, vibrating motor (not shown) is set at the bracket fixture portions 131 being fixed with the first support H1, produces microvibration by vibrating motor, thus the soldered ball S being placed in the first support H1 can be assisted to be needed on material M.
step 8: then, as illustrated in fig. 9i, the material M receiving soldered ball S transfer printing by the pattern P form of specifying by material transferred unit 140 to after downside 140u2 transfers, to next process transfer (step 140d).According to circumstances, can also add and carry out carrying out with the distributional pattern that the mode of sense of vision takes the soldered ball attaching to material M the operation that detects.
step 9: different from step 7 and step 8, for the second support H2 of upwards sideway swivel movement, perform with the step 2 performed the first support H1 to the identical operation of step 4, thus during settled soldered ball S is attached to the operation of material M in, the second support H2 is performed soldered ball S is placed in pattern P ' operation of the inlet hole G of fractions distribution.
Like this, support H1, H2 of disposable arrangement soldered ball S are configured two or more, thus during any one second support H2 performs soldered ball arrangement operation, soldered ball S is needed on material by another first support H1, make ceaselessly to realize solder ball attach operation, thus can obtain within the shorter time, in more material, be attached the beneficial effect in the operation of soldered ball.
On the other hand, although to utilizing the apparatus for supplying ball 110 ' without ball keeping chamber 112c the structure that soldered ball attaches to material M by the pattern P of specifying to be illustrated with mask 120 in above-mentioned, but the apparatus for supplying ball 110 utilizing and be provided with ball keeping chamber 112c of also withdrawing deposit, and be suitable for the solder ball attach method of mask 120.
The solder ball attach method of the embodiment of the present utility model formed in the manner is formed with the second air jet 113a with ring-type outside the radius of the first air jet 111a of the air of injection whirlwind form, form air curtain 113x, thus together move with the air of the whirlwind form 111x that flows, and the soldered ball preventing from being placed in support departs to the outside of apparatus for supplying ball, thus the quantity of the soldered ball used when greatly reducing the inlet hole for soldered ball being placed in support, thus, have and can prevent from more definitely failing to be placed in the soldered ball of the inlet hole of support and the pollution of the soldered ball reused and occur because reclaiming in the past, damaged beneficial effect.
Below, to utilizing the apparatus for supplying ball 110 comprising ball keeping chamber 112c, and the solder ball attach method of another embodiment of the present utility model of mask 120 is not used to describe in detail.Only, for same as the previously described embodiments or similar structure and effect, the explanation of omitting this in order to the main idea of clear and definite the present embodiment.
step 1: first, as shown in Figure 10 a, before the first support H1 soldered ball S being placed in bracket assembled body 130, apparatus for supplying ball 110 moves 110u1 in the mode separated from the first support H1 and locates.
In the case, because the soldered ball S in apparatus for supplying ball 110 is positioned at the ball keeping chamber 112c applying negative pressure from suction pump P2, even if thus the bottom surface of apparatus for supplying ball 110 tilts, soldered ball S also can not be made downwards to be scattered in ball keeping chamber 112c and to remain in apparatus for supplying ball 110.
step S2: and, by rotation motor M3, the rotating shaft 133 of bracket assembled body 130 is rotated, first support H1 of bracket assembled body 130 is become be positioned at the state of upside, and, as shown in fig. lob, make apparatus for supplying ball 110 move 110u2 in side downwards by moving part M1, make apparatus for supplying ball 110 be positioned at the appointed area 210x of the first support H1.
In the case, if the soldered ball S quantity of ball resettlement section 119 be less than be placed in the first support H1 with pattern P ' component of the inlet hole G of morphologic arrangement, then supplement from ball supply unit SS, make it fill up specified amount (step S1).
Further, also apply suction pressure pz to the inlet hole G of the first support H1 from suction pump V1, thus build the environment that the soldered ball S guided in the upside of the first support H1 can be placed in inlet hole G.
step 3: afterwards, apply malleation from air pump P1, P2, make the air 111x spraying whirlwind direction from the first air jet 111a, be formed with the air curtain 113x from the second air jet 113a towards inner side simultaneously.Then, the bottom surface of apparatus for supplying ball 110 is moved, to cause after slightly separating above the first support H1, and the negative pressure 112x applied except the suction pump P2 of whereabouts apparatus for supplying ball 110, thus to discharge the soldered ball in ball keeping chamber 112c to downside by air suction inlet 112a.
Therefore, from ball keeping chamber 112c, the soldered ball S that discharges promotes from the second air jet 113a in the outside being positioned at suction passage towards the center of ball resettlement section 119, and soldered ball S to flow 88x (Fig. 5 and Figure 10 c) along with the flowing of the whirlwind form from the first air jet 111a injection.Meanwhile, by the air curtain 113x sprayed from the second air jet 113a, prevent soldered ball S from departing to the outside of apparatus for supplying ball 110.
step 4: keep step 3, on one side as shown in fig. lob, apparatus for supplying ball 110 by moving part M1 while the mobile 110d in upside of the inlet hole G of the first support H1, as shown in figure l oc, soldered ball S is placed in inlet hole G that suction pressure pz plays the first support H1 of effect.
In the case, because the air 111x of whirlwind form is from the first air jet 111a to the lower side inflow of apparatus for supplying ball 110, soldered ball S is flowed with the path 88x of whirlwind form in the downside of ball resettlement section 119, therefore, fifty-fifty, the mobile route of soldered ball S repeatedly via the inlet hole G of the first support H1, even if make the soldered ball S supplying minority, also can all can be placed in the inlet hole G of the first support H1 within the shorter time.
step 5: according to step 4, if soldered ball S is all placed in the inlet hole G of the first support H1, then as shown in fig. 10d, apparatus for supplying ball 110 moves to the appointed area 210x of the first support H1 by moving part M.
Further, can interrupt from the injection of the air 111x of the whirlwind form of the first air jet 111a injection, and by reducing from air pump P3 applied pressure, regulate the intensity of the air curtain 113x ' sprayed from the second air jet 113a, make it lower.Then, come to apply suction pressure 112x to air suction inlet 112a by suction pump P2, thus suck to the inside of suction passage the soldered ball S being positioned at the downside of ball resettlement section 119.In the case, according to arranging the spherical cap 115 allowing air to pass through for suppressing soldered ball S to pass through at suction passage, ball keeping chamber 112c is formed between spherical cap 115 and air suction inlet 112a, therefore, stably can be remained in ball keeping chamber 112c by negative pressure by the soldered ball S that air suction inlet 112a sucks.
Although accompanying drawing is not shown, as required, on the first support H1, apply the suction pressure lower than suction pressure pz from upside, thus the soldered ball outside the inlet hole G residuing in the first support H1 can be reclaimed in addition.But due to the air curtain 113x sprayed from the second air jet 113a, soldered ball remains the state of the downside being positioned at apparatus for supplying ball 110, the operation reclaiming soldered ball in addition thus can be omitted.
step 6: by step 5, if soldered ball is all inhaled in ball keeping chamber 112c, then as illustrated in figure 10e, apparatus for supplying ball 110 carries out position to the outside of the first support H1 and moves 110u1.That is, apparatus for supplying ball 110 becomes the state identical with the state of step 1.
In this state, the inlet hole G of the first support H1 keeps the state applying 130p suction pressure pz from vacuum pump V1.
step 7: then, the same to step 10 with the step 6 of above-described embodiment, under the state applying suction pressure pz to the inlet hole G of the first support H1, bracket assembled body 130 with pivot 138 for benchmark, the first support H1 is made to revolve turnback, to make the soldered ball being placed in the first support H1, it is made more to be positioned at downside than the first support H1.Afterwards, with the state making by material moving part 140 material M and the first support H1 be close, the soldered ball of the first support H1 is needed on material M, thus performs solder ball attach operation.
Meanwhile, for the second support H2 of upwards sideway swivel movement, perform with the step 2 performed the first support H1 to the identical operation of step 5, thus soldered ball S be placed in pattern P by the second support H2 execution ' operation of the inlet hole G of fractions distribution.
The solder ball attach method of another embodiment of the present utility model formed in the manner is formed from ring-type or from multiple air suction inlet 112a being sucked air by the place of separating by suction passage around the first air jet 111a of air 111x spraying whirlwind form, thus after terminating to settle from apparatus for supplying ball 110 to support H1 the operation of soldered ball, air suction inlet 112a to apparatus for supplying ball 110 applies negative pressure 112x, suck the soldered ball S residuing in ball resettlement section 119 and downside thereof, and be contained in the ball keeping chamber 112c of suction passage, thus, even if do not block the open lower side of apparatus for supplying ball 110, also soldered ball S can be made to keep being contained in the state of apparatus for supplying ball 110, thus not by the restriction of other structural elements, lightheartedly can move 110u along above-below direction, 110d apparatus for supplying ball 110, the setting of the mask of the downside for blocking apparatus for supplying ball can be removed thus, the beneficial effect that operation can simplify by acquisition more.
Above, describe preferred embodiment of the present utility model in exemplary mode, but scope of the present utility model is not limited to this specific embodiment, suitable change can be carried out in the category described in utility model right claim.In embodiment of the present utility model, although be that example is illustrated by the solder ball attach instrument of the structure being formed with two collecting faces, the utility model is not limited thereto, and comprises the structure in the collecting face being formed with more than three.
Claims (19)
1. a solder ball attach device, soldered ball settled by predetermined material, makes multiple soldered ball be placed in the pattern of assigned address along direction is adjacent in length and breadth, and then be arranged in the multiple pattern forming multiple columns and rows, above-mentioned solder ball attach device, is characterized in that, comprising:
Apparatus for supplying ball, for supplying soldered ball, it comprises ball resettlement section and the first air jet, above-mentioned ball resettlement section is formed with opening in downside, and for accommodating soldered ball, above-mentioned first air jet has circumferencial direction structure, and spray air to the inner side being intended for above-mentioned ball resettlement section, the soldered ball making to be supplied in inside, above-mentioned ball resettlement section moves with the type of flow of cyclone type, and then is discharged by above-mentioned opening while making the soldered ball being supplied in above-mentioned ball resettlement section carry out movement with cyclone type;
Bracket assembled body, above-mentioned bracket assembled body comprises the first support and suction pressure applying unit, above-mentioned first support is formed with inlet hole with above-mentioned pattern, under from above-mentioned apparatus for supplying ball to the state of above-mentioned inlet hole applying suction pressure, receive soldered ball, above-mentioned suction pressure applying unit, during the attachment soldered ball from above-mentioned apparatus for supplying ball to above-mentioned inlet hole, applies suction pressure to above-mentioned inlet hole, during from above-mentioned first support to above-mentioned material transferring soldered ball, stop applying suction pressure to above-mentioned inlet hole;
Material transferred unit, for mobile material, makes above-mentioned material be positioned at the downside of above-mentioned bracket assembled body, and then makes to be inhaled into the soldered ball being fixed on above-mentioned first support and be needed on above-mentioned material.
2. solder ball attach device according to claim 1, it is characterized in that, above-mentioned bracket assembled body comprises rotary driving part, above-mentioned rotary driving part is used for above-mentioned first support is rotated, above-mentioned bracket assembled body also comprises the second support, and above-mentioned second support is to arrange with the above-mentioned first support mode rotating spacing of being separated by.
3. solder ball attach device according to claim 2, is characterized in that, is formed with the inlet hole of distinct patterns at above-mentioned first support and above-mentioned second support.
4. solder ball attach device according to claim 2, is characterized in that, above-mentioned first support and above-mentioned second support with above-mentioned pivot for benchmark 180 degree of modes rotating spacing of being separated by configure.
5. solder ball attach device according to claim 1, is characterized in that, also comprise moving part, above-mentioned moving part make in above-mentioned apparatus for supplying ball and above-mentioned first support at least one move, make the opening of above-mentioned apparatus for supplying ball via above-mentioned inlet hole.
6. solder ball attach device according to claim 1, is characterized in that,
Above-mentioned apparatus for supplying ball also comprises the second air jet, sprays air by the jet being formed as ring-type in the position surrounding above-mentioned first air jet;
Thus prevent above-mentioned soldered ball from departing to the outside of above-mentioned second air jet.
7. solder ball attach device according to claim 6, is characterized in that, above-mentioned second air jet inwardly sprays air.
8. solder ball attach device according to any one of claim 1 to 7, it is characterized in that, above-mentioned apparatus for supplying ball also comprises air suction inlet, is formed as the above-mentioned air suction inlet of ring-type, sucks air by suction passage in the position surrounding above-mentioned first air jet.
9. solder ball attach device according to claim 8, it is characterized in that, spherical cap is formed at the above-mentioned suction passage separated from above-mentioned air suction inlet, above-mentioned spherical cap suppresses above-mentioned soldered ball to pass through, and allow air to pass through, and then soldered ball is taken care of temporarily the ball keeping chamber between above-mentioned air suction inlet and above-mentioned spherical cap.
10. solder ball attach device according to claim 9, it is characterized in that, outside the radius of above-mentioned air suction inlet, be formed with the second air jet, air is inwardly sprayed along inner sides of radius direction in the position that above-mentioned second air jet is surrounding above-mentioned air suction inlet.
11. solder ball attach devices according to any one of claim 1 to 7, it is characterized in that, also comprise mask, be formed with cut, the size of above-mentioned cut is arranged to the above-mentioned inlet hole arranged with above-mentioned pattern that can expose above-mentioned support, thus during the above-mentioned inlet hole supply soldered ball from above-mentioned apparatus for supplying ball to above-mentioned first support, aforementioned mask is between above-mentioned first support and above-mentioned apparatus for supplying ball.
12. solder ball attach devices according to claim 11, it is characterized in that, the surrounding be formed on above-mentioned first support to above-mentioned cut applies the fixing hole of suction pressure, during the above-mentioned inlet hole supply soldered ball from above-mentioned apparatus for supplying ball to above-mentioned first support, apply suction pressure in above-mentioned fixing hole, the plate face of aforementioned mask is close to above above-mentioned first support.
13. 1 kinds of apparatus for supplying ball, for supplying soldered ball to multiple inlet hole, above-mentioned multiple inlet hole forms multiple patterns adjacent with transverse direction along the longitudinal, and above-mentioned apparatus for supplying ball, is characterized in that, comprising:
Ball resettlement section, is formed with opening in the downside of above-mentioned ball resettlement section, and for accommodating soldered ball; And
First air jet, has circumferencial direction structure, and sprays air to the inner side being intended for above-mentioned ball resettlement section, and the soldered ball of inside, above-mentioned ball resettlement section is moved with the type of flow of cyclone type,
The soldered ball of inside, above-mentioned ball resettlement section, via while above-mentioned inlet hole, is supplied in above-mentioned inlet hole by above-mentioned opening.
14. apparatus for supplying ball according to claim 13, is characterized in that,
Above-mentioned apparatus for supplying ball also comprises the second air jet, sprays air by the jet being formed as ring-type in the position surrounding above-mentioned first air jet;
Thus prevent above-mentioned soldered ball from departing to the outside of above-mentioned second air jet.
15. apparatus for supplying ball according to claim 13 or 14, it is characterized in that, above-mentioned apparatus for supplying ball also comprises air suction inlet, is formed as suction inlet, sucks air by suction passage in the position surrounding above-mentioned first air jet.
16. apparatus for supplying ball according to claim 15, it is characterized in that, spherical cap is formed at the above-mentioned suction passage separated from above-mentioned air suction inlet, above-mentioned spherical cap suppresses above-mentioned soldered ball to pass through, and allow air to pass through, and then by the ball keeping chamber of soldered ball keeping between above-mentioned air suction inlet and above-mentioned spherical cap.
17. apparatus for supplying ball according to claim 15, is characterized in that, apply malleation to above-mentioned air suction inlet, thus discharge the soldered ball being positioned at above-mentioned suction passage by force.
18. apparatus for supplying ball according to claim 17, is characterized in that, the above-mentioned suction passage adjacent with above-mentioned air suction inlet is formed as being intended for above-mentioned ball resettlement section.
19. apparatus for supplying ball according to claim 15, it is characterized in that, outside the radius of above-mentioned air suction inlet, be formed with the second air jet, air is inwardly sprayed along inner sides of radius direction in the position that above-mentioned second air jet is surrounding above-mentioned air suction inlet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0021775 | 2014-02-25 | ||
| KR1020140021775A KR101416650B1 (en) | 2014-02-25 | 2014-02-25 | Solderball attach apparatus and solderball supplying device used therein |
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| Publication Number | Publication Date |
|---|---|
| CN204596752U true CN204596752U (en) | 2015-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520095247.6U Active CN204596752U (en) | 2014-02-25 | 2015-02-10 | Solder ball attach device and the apparatus for supplying ball for this device |
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| Country | Link |
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| KR (1) | KR101416650B1 (en) |
| CN (1) | CN204596752U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259478A (en) * | 2020-10-23 | 2021-01-22 | 技感半导体设备(南通)有限公司 | Ball scraping and spreading device and method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101668960B1 (en) * | 2015-08-12 | 2016-11-10 | 주식회사 프로텍 | Apparatus for mounting conductive ball and method for controling the same |
| KR102528016B1 (en) * | 2018-10-05 | 2023-05-02 | 삼성전자주식회사 | Solder member mounting method and system |
| KR20210101357A (en) | 2020-02-07 | 2021-08-19 | 삼성전자주식회사 | Ball disposition system and method for ball disposition on substrate |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060133282A (en) * | 2005-06-20 | 2006-12-26 | 삼성테크윈 주식회사 | Method of forming solder ball bump using gas flow and apparatus using the said method |
| KR101141921B1 (en) | 2011-09-09 | 2012-05-07 | 주식회사 고려반도체시스템 | Method of positioning solder balls at patterned plural grooves and apparatus used therein |
| KR101139375B1 (en) | 2011-09-09 | 2012-04-27 | 주식회사 고려반도체시스템 | Method of forming patterned bumps on subtrate and apparatus of transferring solder balls from a substrate to the other substrate used therein |
| KR101332609B1 (en) | 2012-01-13 | 2013-11-25 | 주식회사 고려반도체시스템 | Solderball positioning method and apparatus using same |
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2014
- 2014-02-25 KR KR1020140021775A patent/KR101416650B1/en active IP Right Review Request
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112259478A (en) * | 2020-10-23 | 2021-01-22 | 技感半导体设备(南通)有限公司 | Ball scraping and spreading device and method |
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| Publication number | Publication date |
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| KR101416650B1 (en) | 2014-07-09 |
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