CN204518218U - FPC surface protection structure - Google Patents
FPC surface protection structure Download PDFInfo
- Publication number
- CN204518218U CN204518218U CN201520236690.0U CN201520236690U CN204518218U CN 204518218 U CN204518218 U CN 204518218U CN 201520236690 U CN201520236690 U CN 201520236690U CN 204518218 U CN204518218 U CN 204518218U
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- CN
- China
- Prior art keywords
- ink
- oil layer
- hot curing
- fluid oil
- curing fluid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to a kind of FPC surface protection structure, comprises substrate, and described substrate front side is provided with hot curing fluid oil layer of ink; The area of described hot curing fluid oil layer of ink is not less than the area of Copper Foil on substrate; The thickness of described hot curing fluid oil layer of ink is 0.3 ~ 0.8 millimeter; Described hot curing fluid oil layer of ink is combined with substrates into intimate.Hot curing fluid oil layer of ink is formed one deck and has extraordinary Solder resistance and flexible protective layer by the utility model after high-temperature baking solidification, thus serve the effect of the protection base material copper face the same with common coverlay, and decrease process flow, shorten the production time, also save manpower simultaneously, reduce material waste; In quality control, it avoid the quality problem such as the bubble, the folding line that produce in common coverlay manufacturing process be bad, substantially increase the qualification rate of product.
Description
Technical field
The utility model relates to flexible circuit board field, especially a kind of FPC surface protection structure.
Background technology
FPC (flexible print circuit board) generally adopts FCCL (Flexible Copper Clad Laminate: flexibility coat copper plate) to manufacture for substrate, after the copper foil layer of FCCL forms circuit, be exposed to except in air except in order to processing further or the position such as: pad and plug finger (line scan pickup coil side) that use, overwhelming majority circuit then needs with air exclusion in case oxidized or corrode, to increase the useful life of metallic copper, also need to prevent and the electrical connection of other electronic devices and components and cause the reasons such as short circuit simultaneously, need on FPC, to cover layer protecting film to realize the protection of copper face, present most flexible print circuit board (FPC) product, comprise substrate and substrate counterdie, solid-state PI (full name: Polyimide all can be selected when covering metal face, polyimides) coverlay, at this moment the boring first carrying out coverlay is needed, blinking scrap, the process such as cleaning, adhering agent layer is applied again on FPC substrate, then coverlay is fitted on substrate, wherein need through multistep operation, combining closely of coverlay and FPC could be realized., often can there is folding line, bubble etc. abnormal, cause scrapping of product in another exterior quality management and control aspect, must improve like this for multiple operation, many costs, many abnormal technique in the processing procedure such as stamping-out, pressing.
Utility model content
The technical problems to be solved in the utility model is: provide the FPC surface protection structure that a kind of operation is simple, Production Time is short, cost is low, conforming product rate is high.
The utility model solves the technical scheme that its technical problem adopts: a kind of FPC surface protection structure, comprises substrate, and described substrate front side is provided with hot curing fluid oil layer of ink; The area of described hot curing fluid oil layer of ink is not less than the area of Copper Foil on substrate; The thickness of described hot curing fluid oil layer of ink is 0.3 ~ 0.8 millimeter; Described hot curing fluid oil layer of ink is combined with substrates into intimate.
Further, hot curing fluid oil layer of ink described in the utility model and substrates into intimate in conjunction with time be solid protective layer.
The beneficial effects of the utility model are, solve the defect existed in background technology, hot curing fluid oil layer of ink is formed one deck after high-temperature baking solidification there is extraordinary Solder resistance and flexible protective layer, thus serve the effect of the protection base material copper face the same with common coverlay, and decrease process flow, shorten the production time, also save manpower simultaneously, reduce material waste; In quality control, it avoid the quality problem such as the bubble, the folding line that produce in common coverlay manufacturing process be bad, substantially increase the qualification rate of product.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structural representation of preferred embodiment of the present utility model;
In figure: 1, substrate; 2, hot curing fluid oil layer of ink.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
A kind of FPC surface protection structure as shown in Figure 1, comprise substrate 1, described substrate front side is provided with hot curing fluid oil layer of ink 2; The area of described hot curing fluid oil layer of ink is not less than the area of Copper Foil on substrate; The thickness of described hot curing fluid oil layer of ink is 0.3 ~ 0.8 millimeter; Described hot curing fluid oil layer of ink is combined with substrates into intimate.
Hot curing fluid oil layer of ink and substrates into intimate in conjunction with time be solid protective layer.
Compare the structure with the FPC of prior art, it reaches the effect of the copper face of the protective substrate the same with common coverlay, and eliminates adhering agent layer, decreases raw-material use, has saved production cost.
The just embodiment of the present utility model described in above specification, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (2)
1. a FPC surface protection structure, comprises substrate, it is characterized in that: described substrate front side is provided with hot curing fluid oil layer of ink; The area of described hot curing fluid oil layer of ink is not less than the area of Copper Foil on substrate; The thickness of described hot curing fluid oil layer of ink is 0.3 ~ 0.8 millimeter; Described hot curing fluid oil layer of ink is combined with substrates into intimate.
2. FPC surface protection structure as claimed in claim 1, is characterized in that: described hot curing fluid oil layer of ink and substrates into intimate in conjunction with time be solid protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520236690.0U CN204518218U (en) | 2015-04-17 | 2015-04-17 | FPC surface protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520236690.0U CN204518218U (en) | 2015-04-17 | 2015-04-17 | FPC surface protection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204518218U true CN204518218U (en) | 2015-07-29 |
Family
ID=53716143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520236690.0U Expired - Fee Related CN204518218U (en) | 2015-04-17 | 2015-04-17 | FPC surface protection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204518218U (en) |
-
2015
- 2015-04-17 CN CN201520236690.0U patent/CN204518218U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Henglin Town, Wujin District of Jiangsu province Changzhou 213000 Tong Tau Street, No. 4 Patentee after: Jiangsu Xiehe electronic Limited by Share Ltd Address before: Henglin town Wujin District Cui Bridge Street 213103 Jiangsu province Changzhou City Patentee before: Changzhou Xiehe Circuit Board Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20210417 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |