CN204516795U - A kind of rectangle LED silk support - Google Patents
A kind of rectangle LED silk support Download PDFInfo
- Publication number
- CN204516795U CN204516795U CN201520159228.5U CN201520159228U CN204516795U CN 204516795 U CN204516795 U CN 204516795U CN 201520159228 U CN201520159228 U CN 201520159228U CN 204516795 U CN204516795 U CN 204516795U
- Authority
- CN
- China
- Prior art keywords
- rectangle
- copper sheet
- support
- led
- micropore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of rectangle LED silk support, support is made up of copper sheet, and copper sheet surface forms the design of rectangle micropore, and LED luminescent wafer is placed between square hole position or holes; Copper sheet is wrapped up by novel C MC material transparent solid-state epoxy resin cake glue, forms the recessed cyphelia adhesive dispenser of ship type, for depositing required fluorescent powder.Copper thickness 0.1mm, width 0.6mm, length 30MM, rectangle micropore is 0.3MM*0.6MM, and quantity is between 20-30.This programme by its rational radiator structure and optical design, makes the filament light decay that encapsulates good, reaches the effect of two sides uniform in light emission, saved technique and the cost of labor of 25% simultaneously.
Description
Technical field
The utility model relates to lighting field, is specifically related to a kind of rectangle LED silk support.
Background technology
Along with the development of science and technology, LED replaces traditional lighting gradually.Existing LED is provided with light emitting module, comprises square or circular support, is arranged at the LED chip of support side, and be coated on the lens on LED chip surface.Because the insulating material such as existing support generally adopts sapphire, glass are formed, its thermal conductivity is extremely low, affects the life-span of LED.In addition, existing LED silk support adopts planar point glue packaging technology mostly, efficiency and yields low, and production cost is high.
LED silk lamp is a kind of light fixture of imitated incandescent lamp, and it replaces the filament of conventional incandescent with LED silk.This novel LED, just can reach the lighting angle identical with incandescent lamp and illuminating area without the need to installing lens additional, and the power consumption again with LED is low, the effect such as the life-span is high, environmental protection.
Competition, under the pressure of cost pressure, LED enterprise has to find new packing forms, to realize single chips large driven current density from structure, greatly reduce on the consumption of encapsulation glue simultaneously, not only increase on brightness light efficiency, thermal resistance is lower, and saves existing packaging cost.
Utility model content
The utility model, in order to solve problems of the prior art, provides a kind of strip LED filament support, increases heat conductivility and slows down light decay, reduces technique and reduces packaging cost.
In order to solve the problems of the technologies described above, the utility model provides a kind of strip LED filament support, and support adopts the silver-plated material of copper sheet, thickness is set to 0.1mm, width 0.6mm, length 30MM, copper sheet surface forms the rectangle micropore design of 0.3MM*0.6MM.
Further, described strip LED filament support, is characterized in that: LED luminescent wafer can be placed on square hole position, reaches very high back side light-out effect.Also can be placed between holes and reach very high radiating effect.
Described strip LED filament support, it is characterized in that: use novel C MC material transparent solid-state epoxy resin cake glue Jacket thickness to be 0.1mm, width 0.6mm, length 30MM, surface forms the sheffield plate of the rectangle micropore design of 0.3MM*0.6MM, forms the recessed cyphelia adhesive dispenser of ship type.
Further, described strip LED filament support, is characterized in that: CMC material transparent solid-state epoxy resin cake glue parcel copper sheet forms the cup type of 1mm height, for depositing required fluorescent powder.
Further, described strip LED filament support, is characterized in that: CMC material transparent solid-state epoxy resin cake glue heatproof 300 DEG C, light transmittance 90%, fills conduction powder, thermal conductivity 5.6W/MK.
The beneficial effects of the utility model are by its rational radiator structure and optical design, make the filament light decay that encapsulates good, reach the effect of two sides uniform in light emission, saved technique and the cost of labor of 25% simultaneously.
Accompanying drawing explanation
Fig. 1 is the LED chip of the utility model embodiment rectangle LED silk support and a kind of position view of copper sheet square hole.
Fig. 2 is the LED chip of the utility model embodiment rectangle LED silk support and the another location schematic diagram of copper sheet square hole.
Fig. 3 is the CMC package structure schematic diagram of the utility model embodiment rectangle LED silk support.
Embodiment
Below in conjunction with accompanying drawing and example, the utility model is described further.
As shown in Figure 1 to Figure 3, a kind of strip LED filament support 1,11, backing thickness is set to 0.1mm, width 0.6mm, length 30MM.The rectangle micropore 3,13 of 0.3MM*0.6MM is formed on copper sheet 4 surface.LED chip 2,12 is positioned between copper sheet rectangle micropore 3 middle (as Fig. 2) or two rectangle micropores 13 (as Fig. 1).
As shown in Figure 3, CMC material transparent solid-state epoxy resin cake glue 5 wraps up the cup type that copper sheet 4 forms H=0.2mm height.Required fluorescent powder can be filled in the recessed cup of described CMC material transparent solid-state epoxy resin cake glue parcel copper sheet formation.
Described thickness 0.1mm, the rectangle micropore quantity of width 0.6mm, length 30MM copper sheet surface formation 0.3MM*0.6MM can between 20-30.
Described CMC material transparent solid-state epoxy resin cake glue 5 wraps up the total height that copper sheet 4 forms 1mm-2mm.
Above are only preferred embodiment of the present utility model, certainly, explore according to actual needs and further and can also have other execution mode.But, it is clearly understood that, based on similar above-mentioned or other conversion with the execution mode of same idea do not stated out, all should be encompassed within protection range of the present utility model.
Claims (2)
1. a rectangle LED silk support, is characterized in that: support is made up of copper sheet, and copper sheet surface forms the design of rectangle micropore, and LED luminescent wafer is placed between square hole position or holes; Copper sheet is wrapped up by transparent solid-state epoxy resin cake glue, forms the recessed cyphelia adhesive dispenser of ship type, for depositing required fluorescent powder.
2. rectangle LED silk support according to claim 1, it is characterized in that: copper thickness 0.1mm, width 0.6mm, length 30MM, rectangle micropore is 0.3MM*0.6MM, and quantity is between 20-30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520159228.5U CN204516795U (en) | 2015-03-20 | 2015-03-20 | A kind of rectangle LED silk support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520159228.5U CN204516795U (en) | 2015-03-20 | 2015-03-20 | A kind of rectangle LED silk support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204516795U true CN204516795U (en) | 2015-07-29 |
Family
ID=53714740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520159228.5U Expired - Fee Related CN204516795U (en) | 2015-03-20 | 2015-03-20 | A kind of rectangle LED silk support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204516795U (en) |
-
2015
- 2015-03-20 CN CN201520159228.5U patent/CN204516795U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104600181A (en) | LED (Light Emitting Diode) light bar and preparation method thereof | |
| CN101871627A (en) | High-efficiency heat radiating LED (light emitting diode) lamp and manufacture method thereof | |
| CN103325916A (en) | Light emitting diode packaging structure and manufacturing method thereof | |
| CN202712175U (en) | Fluorescent film planar sheet type LED array light source | |
| CN102280563A (en) | High-power LED (Light Emitting Diode) flexible package | |
| CN201887041U (en) | High heat radiation patch type LED module | |
| CN204516795U (en) | A kind of rectangle LED silk support | |
| CN203026552U (en) | LED (lighting emitted diode) component bracket | |
| CN202003993U (en) | Large power LED packaging structure | |
| CN201918423U (en) | LED heat conduction and dissipation mechanism | |
| CN203250779U (en) | Light emitting diode packaging structure | |
| CN201129629Y (en) | High-power LED lamp | |
| CN202721186U (en) | Integrated high-efficiency lighting device provided with multi-layer structure | |
| CN202469577U (en) | Two-surface light emergent thin-sheet type light emitting diode (LED) lamp | |
| CN202469579U (en) | Double-surface light-emitting planar sheet LED lamp | |
| CN102544300A (en) | LED packaging structure | |
| CN206505946U (en) | A kind of LED/light source of specular removal | |
| CN207165565U (en) | A kind of COB light source structure | |
| CN205069686U (en) | LED punctiform formula COB module | |
| CN203215559U (en) | Multiple-lamp-strip light-emitting diode (LED) light source encapsulation structure | |
| CN204785919U (en) | Little heat dissipation capacity LED shot -light | |
| CN204885156U (en) | LED light source module | |
| CN204554420U (en) | A kind of LED bulb | |
| CN202012780U (en) | Light-emitting diode (LED) lamp tube based on ceramic substrate package | |
| CN204905299U (en) | One -way luminous LED light emitting component COB packaging structure , LED light source and LED lamps and lanterns |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20170320 |