CN204516757U - The fingerprint sensor package structure of sapphire fluting - Google Patents
The fingerprint sensor package structure of sapphire fluting Download PDFInfo
- Publication number
- CN204516757U CN204516757U CN201520100883.3U CN201520100883U CN204516757U CN 204516757 U CN204516757 U CN 204516757U CN 201520100883 U CN201520100883 U CN 201520100883U CN 204516757 U CN204516757 U CN 204516757U
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- China
- Prior art keywords
- sapphire
- chip
- substrate
- fluting
- described substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The utility model relates to the fingerprint sensor package structure of a kind of sapphire fluting, it comprises substrate (3), described substrate (3) front is provided with induction chip (5), be connected by bonding wire (10) between described induction chip (5) front with substrate (3) front, described induction chip (5) front is provided with sapphire (8), described sapphire (8) periphery, the back side is provided with groove (9), described substrate (3) back side is provided with chip (14) and element (11), described substrate (3) below is provided with flexible printed wiring board (12), be connected by penetrating molding through hole (2) between described substrate (3) back side with flexible printed wiring board (12).The fingerprint sensor package structure of a kind of sapphire fluting of the utility model, its technique is comparatively simple, avoids losing induction chip, can reduce the distance between chip induction zone and sapphire simultaneously, make the encapsulating structure of fingerprint recognition have high sensitivity.
Description
Technical field
The utility model relates to the fingerprint sensor package structure of a kind of sapphire fluting, belongs to technical field of semiconductor encapsulation.
Background technology
Along with the progress of modern society, the importance of person identification and personal information security progressively receives the concern of people.Because somatic fingerprint has uniqueness and consistency, make fingerprint identification technology have fail safe good, reliability is high, feature easy to use, makes fingerprint identification technology be widely used in protecting the various fields of personal information security.
The encapsulation of existing fingerprint Identification sensor is in order to ensure that fingerprint recognition has enough sensitivity, guarantee to extract user fingerprints accurately, first method is exactly improve the high sensitivity of fingerprint recognition chip, but highly sensitive chip manufacturing difficulty is larger, corresponding manufacturing cost is higher, is unfavorable for application and the popularization of fingerprint recognition chip; Second method is exactly reduce the distance of chip induction zone and skin glass substrate, as shown in Figure 1, the periphery of induction chip has edge groove, reduce routing radian, thus shortening distance of reaction, but this kind of mode induction chip periphery arranges the manufacturing process complexity of groove, easily causes the loss of induction chip.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, the fingerprint sensor package structure that a kind of sapphire is slotted is provided, the technology of digging groove by sapphire replaces the design of existing chip edge groove, technique is comparatively simple, avoid losing induction chip, the distance between chip induction zone and sapphire can be reduced simultaneously, make the encapsulating structure of fingerprint recognition have high sensitivity.
The purpose of this utility model is achieved in that the fingerprint sensor package structure that a kind of sapphire is slotted, it comprises substrate, described substrate front side is provided with induction chip, described induction chip front is connected by bonding wire with between substrate front side, described induction chip front is provided with sapphire, described sapphire backsides periphery is provided with groove, described substrate back is provided with chip and element, flexible printed wiring board is provided with below described substrate, described substrate back is connected by penetrating molding through hole with between flexible printed wiring board, described substrate peripheral is provided with outer becket, described flexible printed wiring board one end is provided with connecting portion, described connecting portion is outside outer becket, described connecting portion is connected with external circuit or device.
Compared with prior art, the utility model has following beneficial effect:
The technology of 1, digging groove by sapphire replaces the design of existing chip edge groove, and technique is comparatively simple, avoids losing induction chip;
2, sapphire groove part just in time can hold the radian of bonding wire, can reduce the distance between chip induction zone and sapphire, makes the encapsulating structure of fingerprint recognition have high sensitivity.
Accompanying drawing explanation
Fig. 1 is the structural representation that existing fingerprint sensor reduces the distance of chip induction zone and skin glass substrate.
Fig. 2 is the schematic diagram of the fingerprint sensor package structure of a kind of sapphire fluting of the utility model.
Wherein:
Outer becket 1
Penetrate molding through hole 2
Substrate 3
Load glue 4
Induction chip 5
Chip induction zone 6
Binding agent 7
Sapphire 8
Groove 9
Bonding wire 10
Element 11
Flexible printed wiring board 12
Connecting portion 13
Chip 14.
Embodiment
See Fig. 2, the fingerprint sensor package structure of a kind of sapphire fluting of the utility model, it comprises substrate 3, described substrate 3 front is provided with induction chip 5 by load glue 4, described induction chip 5 front is connected by bonding wire 10 with between substrate 3 front, described induction chip 5 front is provided with sapphire 8 by binding agent 7, periphery, described sapphire 8 back side is provided with groove 9, described groove 9 radian is higher than bonding wire 10 radian, described substrate 3 back side is provided with chip 14 and element 11, flexible printed wiring board 12 is provided with below described substrate 3, described substrate 3 back side is connected by penetrating molding through hole 2 with between flexible printed wiring board 12, described substrate 3 periphery is provided with outer becket 1, described flexible printed wiring board 12 one end is provided with connecting portion 13, described connecting portion 13 is positioned at outside outer becket 1, described connecting portion 13 is connected with external circuit or device.
Claims (1)
1. the fingerprint sensor package structure of a sapphire fluting, it is characterized in that: it comprises substrate (3), described substrate (3) front is provided with induction chip (5), be connected by bonding wire (10) between described induction chip (5) front with substrate (3) front, described induction chip (5) front is provided with sapphire (8), described sapphire (8) periphery, the back side is provided with groove (9), described substrate (3) back side is provided with chip (14) and element (11), described substrate (3) below is provided with flexible printed wiring board (12), be connected by penetrating molding through hole (2) between described substrate (3) back side with flexible printed wiring board (12), described substrate (3) periphery is provided with outer becket (1), described flexible printed wiring board (12) one end is provided with connecting portion (13), described connecting portion (13) is positioned at outer becket (1) outside, described connecting portion (13) is connected with external circuit or device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520100883.3U CN204516757U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of sapphire fluting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520100883.3U CN204516757U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of sapphire fluting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204516757U true CN204516757U (en) | 2015-07-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520100883.3U Active CN204516757U (en) | 2015-02-12 | 2015-02-12 | The fingerprint sensor package structure of sapphire fluting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204516757U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106505044A (en) * | 2015-09-07 | 2017-03-15 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN107240576A (en) * | 2017-07-12 | 2017-10-10 | 昆山丘钛微电子科技有限公司 | Integral system fingerprint chip-packaging structure and fingerprint module |
| CN107731694A (en) * | 2017-11-07 | 2018-02-23 | 苏州科阳光电科技有限公司 | A kind of assemble method of bio-identification module, bio-identification module and mobile terminal |
| CN114115448A (en) * | 2020-08-26 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
| WO2023010555A1 (en) * | 2021-08-06 | 2023-02-09 | 华为技术有限公司 | Chip package structure and electronic device |
-
2015
- 2015-02-12 CN CN201520100883.3U patent/CN204516757U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106505044A (en) * | 2015-09-07 | 2017-03-15 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN107240576A (en) * | 2017-07-12 | 2017-10-10 | 昆山丘钛微电子科技有限公司 | Integral system fingerprint chip-packaging structure and fingerprint module |
| CN107731694A (en) * | 2017-11-07 | 2018-02-23 | 苏州科阳光电科技有限公司 | A kind of assemble method of bio-identification module, bio-identification module and mobile terminal |
| CN107731694B (en) * | 2017-11-07 | 2023-12-01 | 苏州科阳光电科技有限公司 | Assembly method of biological recognition module, biological recognition module and mobile terminal |
| CN114115448A (en) * | 2020-08-26 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
| WO2023010555A1 (en) * | 2021-08-06 | 2023-02-09 | 华为技术有限公司 | Chip package structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |