CN107240576A - Integral system fingerprint chip-packaging structure and fingerprint module - Google Patents
Integral system fingerprint chip-packaging structure and fingerprint module Download PDFInfo
- Publication number
- CN107240576A CN107240576A CN201710566504.3A CN201710566504A CN107240576A CN 107240576 A CN107240576 A CN 107240576A CN 201710566504 A CN201710566504 A CN 201710566504A CN 107240576 A CN107240576 A CN 107240576A
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- Prior art keywords
- fingerprint
- fingerprint chip
- plastic
- integral system
- packaging structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of integral system fingerprint chip-packaging structure and fingerprint module, encapsulation and the processing procedure of fingerprint module from fingerprint chip are thinned the encapsulation of fingerprint chip, reduce fingerprint module group procedure structure, systematization encapsulates dactylotype.Wherein, the induction region of fingerprint is combined with fingerprint substrate circuit, control and processing apparatus are inverted in the lower section of substrate, base plate line and control and processing apparatus are connected by copper post mode, connection line is pulled to the windowing pad that fingerprint beneath chips are spilt by reverse encapsulation EMC materials by RDL modes simultaneously, and cell phone mainboard can be connected with directly by shell fragment mode with fingerprint chip.This integral system fingerprint chip-packaging structure not only causes fingerprint module ultrathin, simplification, and with more preferable reliability and usability.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, a kind of integral system fingerprint chip-packaging structure is specifically related to
And integral system fingerprint module.
Background technology
The demand driving in market the change and development of technology, and these are changed meets consumer couple with developing very big aspect
The new demand of this consumer electronicses of mobile phone, new experience.Wherein, fingerprint identification technology improves consumer in the application of mobile phone terminal
Convenient experience and safety to mobile phone are experienced.Therefore, fingerprint identification technology rapidly becomes the standard configuration of mobile phone.
As high performance mobile phone is continued to develop, the space of compression fingerprint module is inevitable development trend.Under current trend,
Partial fingerprints position transfer is to back coating (coating) and sideways, and side fingerprint has problems, one side picture element matrix
(pixel array induction zones) collection area is small, is on the other hand unfavorable for smart mobile phone to fingerprint module thickness requirement height more next
Thinner development trend.Rearmounted fingerprint changes manufacturer's design style and design concept to a certain extent, and user traditionally also needs
Will some regulations.Front fingerprint selects integrative packaging structure by as a kind of new selection.Conventional fingerprint module, such as Fig. 1 institutes
Show, packaged fingerprint chip-packaging structure 100 is connected by SMT welding manners with FPC200, capacitance resistance ware 300 and connection
Device 400 is also connected with FPC, and fingerprint chip-packaging structure signal is connected after capacitance resistance ware with connector, in order to improve intensity,
Reinforcement tablet is generally additionally provided with, reinforcement steel disc is attached at FPC bottoms, a complete fingerprint module is processed into by assembling.Refer to
The connector of line module is interlocked turning circuit by the connector with cell phone mainboard (Board), is attached on mobile phone.But, this
The fingerprint chip-packaging structure and fingerprint module of kind of structure, have that fingerprint chip package is thicker, and fingerprint module space-consuming is larger,
The technical problems such as fingerprint module group procedure complexity.
The content of the invention
In order to solve the above-mentioned technical problem, the present invention proposes a kind of integral system fingerprint chip-packaging structure and fingerprint mould
Group, is thinned the encapsulating structure of fingerprint chip, reduces the process structure of fingerprint module, and effectively pressure has subtracted accounting for for fingerprint module
With space, improve the reliability of encapsulation itself and improve user experience.
The technical proposal of the invention is realized in this way：
A kind of integral system fingerprint chip-packaging structure, including substrate, fingerprint chip, plastic-sealed body and processing and controller
Part, the fingerprint chip is located at the upper surface of base plate, and the fingerprint chip is electrically connected with the circuit of the substrate, the plastic packaging
The processing and control device are completely encapsulated in inside it in the base lower surface, make the processing and control by body plastic packaging
Device is located at below the substrate, and the processing and control device are electrically connected with the circuit of the substrate by copper post mode,
The plastic-sealed body of the processing and control device side is recessed ledge structure, and the plastic-sealed body surface of female parts is welded provided with windowing
Disk, the base plate line for connecting the fingerprint chip leads to the windowing pad on the plastic-sealed body surface, institute by RDL gage systems
The pin for stating processing and control device leads to the windowing pad on the plastic-sealed body surface by RDL gage systems.
Further, the processing and control device include power module, analog-digital converter, digital analog converter
And/or processor.
Further, the substrate is to include the pcb boards of 4 layer line line structures, the pin of the processing and control device with
3rd sandwich circuit of the pcb board and the connection of the 4th sandwich circuit.
Further, the plastic-sealed body material is EMC materials.
Further, the fingerprint chip is embedded in the default groove of the upper surface of base plate, on the fingerprint chip
Surface is concordant with the upper surface of base plate or close to concordantly.
A kind of integral system fingerprint module, including described integral system fingerprint chip-packaging structure and mainboard, institute
State the lower section that mainboard is located at the plastic-sealed body of the integral system fingerprint chip-packaging structure, and the mainboard and integral system
Electrically connected between the windowing pad of fingerprint chip-packaging structure by metal clips.
Further, in addition to：
Becket, the becket is assembled in outside the substrate of the integrated pressure sensitivity fingerprint encapsulating structure；
Coating or cover plate, the coating or cover plate are assembled in the fingerprint chip surface.
The beneficial effects of the invention are as follows：The present invention proposes a kind of integral system fingerprint chip-packaging structure and fingerprint mould
Group, encapsulation and the processing procedure of fingerprint module from fingerprint chip, chip and module are integrated together and are encapsulated as an entirety
Ultra-thin fingerprint chip-packaging structure, so as to be thinned the encapsulation of fingerprint chip, reduce the process structure of fingerprint module, system
Change encapsulates dactylotype.Wherein, the induction zone of fingerprint chip is combined with substrate circuit, by power module (PMC), simulation number
The controls such as word converter (ADC), digital analog converter (DAC), processor (Processor) and processing apparatus are inverted in substrate
The reverse plastic packaging in lower section plastic-sealed body in, base plate line and control and processing apparatus are electrically connected with by copper post mode, reversely
Plastic-sealed body (EMC materials) by RDL modes by connection line while be pulled to the lower section default windowing pad of plastic-sealed body female parts
(solder pad), so, cell phone mainboard can be connected with the windowing pad directly by shell fragment mode and fingerprint chip-packaging structure
Connect.This integral system fingerprint chip-packaging structure and fingerprint module not only cause fingerprint module ultrathin, simplification, and
With more preferable reliability and usability.
Brief description of the drawings
Fig. 1 is fingerprint modular structure schematic diagram in the prior art；
Fig. 2 is integral system fingerprint chip-packaging structure schematic diagram of the present invention；
Fig. 3 is mplifying structure schematic diagram at A in Fig. 2；
Fig. 4 is integral system fingerprint module schematic diagram of the present invention；
With reference to accompanying drawing, make the following instructions：
1- substrates, 2- fingerprint chips, 3- plastic-sealed bodies, 4- processing and control device, 5- copper posts, 6- ledge structures, 7- windowings
Pad, 8-RDL, 9- mainboards, 10- metal clips；100- fingerprint chip-packaging structures, 200-FPC, 300- capacitance resistance wares, 400-
Connector 400.
Embodiment
In order to be more clearly understood that the technology contents of the present invention, described in detail especially exemplified by following examples, its purpose is only
It is to be best understood from the protection domain that present disclosure is not intended to limit the present invention.
As shown in Figures 2 and 3, a kind of integral system fingerprint chip-packaging structure, including substrate 1, fingerprint chip 2, modeling
Body 3 and processing and control device 4 are sealed, wherein, fingerprint chip 2 is located at the upper surface of substrate 1, the circuit of fingerprint chip 2 and substrate 1
Electrical connection, the plastic packaging of plastic-sealed body 3 substrate 1 lower surface, will processing and control device 4 be completely encapsulated in inside it, make processing and
Control device 4 is located at the lower section of substrate 1, and processing and control device 4 are electrically connected with the circuit of substrate 1 by way of copper post 5,
The plastic-sealed body 3 of processing and the side of control device 4 is recessed ledge structure 6, and the surface of plastic-sealed body 3 of female parts is welded provided with windowing
Disk (solder pad) 7, the base plate line of connection fingerprint chip 2 passes through RDL (Redistribution layer) 8 gage systems
The windowing pad 7 on the surface of plastic-sealed body 3 is led to, handles and the pin of control device 4 leads to plastic-sealed body by RDL gage systems
The windowing pad 7 on 3 surfaces, Fig. 3 is illustrated in detail for the design structure connected mode of RDL leads.Wherein, the RDL leads
For in the copper lead integral system fingerprint chip-packaging structure, processing and the knot by way of the plastic packaging of plastic-sealed body 3 of control device 4
The electric connection with the circuit of substrate is realized together in the lower surface of substrate 1, and by way of copper post 5, so, from fingerprint core
The encapsulation of piece 2 and the processing procedure of fingerprint module are set out, and chip and module are integrated together into encapsulation, form the ultra-thin of entirety
Fingerprint chip-packaging structure, and RDL copper gage systems are used, by the pin and connection fingerprint chip 2 of control and processing apparatus 4
Base plate line is drawn out to the windowing pad 7 of plastic-sealed body bottom.Here, the bottom design of plastic-sealed body 3 has ledge structure, and will have windowing
The part of pad 7 is recessed concave station, the protrusion of part plastic-sealed body 3 of correspondence control and processing apparatus is formed into boss, so that shape
Into ledge structure 6, when ledge structure 6 is that cell phone mainboard is connected by metal clips herein, metal clips portion can be preferably absorbed
Divide flexible difference in height, after pressing metal clips, shell ensures the flatness on fingerprint module surface.Integral system of the present invention refers to
When line chip-packaging structure (FPS) is applied, FPC FPCs and the reinforcement steel disc part of fingerprint module can be cancelled, it is only necessary to
Packaged FPS is carried out to coating (Coating) or cover plate (Glass) and becket (Ring) assembling on demand, you can complete
Fingerprint module (FPM), therefore, is thinned the encapsulation of fingerprint chip and fingerprint module, reduces fingerprint module group procedure structure, system
Change encapsulates dactylotype, not only causes fingerprint module ultrathin, simplifies, and with more preferable reliability and usability.
Processing and control device 4 are used to the information that fingerprint chip 2 is gathered is handled and controlled.Here, handle and control
Device 4 processed includes power module (PMC), analog-digital converter (ADC), digital analog converter (DAC) and processor
(Processor) it is one or more.Specifically, processing in the present embodiment and control device 4 include power module (PMC), mould
Intend digital quantizer (ADC), digital analog converter (DAC) and processor (Processor).By power module (PMC), simulation
The controls such as digital quantizer (ADC), digital analog converter (DAC), processor (Processor) and processing apparatus 4 are inverted in
In the plastic-sealed body 3 of the reverse plastic packaging in lower section of substrate 1, base plate line is electrically connected with above-mentioned processing apparatus 4 by way of copper post 5
Connect, connection line is pulled to the default windowing weldering of lower section plastic-sealed body female parts by reverse plastic-sealed body 3 by way of RDL8 simultaneously
Disk 7.
It is preferred that, substrate 1 is to include the pcb boards of 4 layer line line structures, the of the pin and pcb board of processing and control device 4
3 sandwich circuits and the connection of the 4th sandwich circuit.This is preferred embodiment, but not limited to this, can also use the pcb board of other forms.
The substrate of 4 layer line line structures includes pixel region and signal lead hop, and processing and control device 4 are positioned over substrate 1
Lower position, processing and control device 4 are wrapped up using EMC encapsulating materials, and processing and control device 4 pass through copper post 5 with substrate 1
Mode connects conducting.
It is preferred that, the material of plastic-sealed body 3 is EMC materials.
It is preferred that, fingerprint chip 2 is embedded in the default groove in the upper surface of substrate 1, the upper surface of fingerprint chip 1 and base
The upper surface of plate 1 is concordant or close to concordantly.This is preferred embodiment, but not limited to this, however not excluded that fingerprint chip is using patch
Form loaded on substrate surface.
On the other hand, the present invention provides a kind of integral system fingerprint module, including integral system fingerprint chip package
Structure and mainboard 9, mainboard is the mainboard of mobile terminal here, such as cell phone mainboard, and the mainboard 9 is located at integral system fingerprint
The lower section of the plastic-sealed body 3 of chip-packaging structure, and mainboard 9 and integral system fingerprint chip-packaging structure windowing pad 7 it
Between electrically connected by metal clips 10,.As shown in figure 4, it is the attachment structure of fingerprint module and cell phone mainboard, in cell phone mainboard
Be provided with metal clips 10, the windowing pad 7 of the bottom female parts of plastic-sealed body 3 of integral system fingerprint chip-packaging structure with
Cell phone mainboard be can be achieved to be electrically connected with by metal clips 10, and conduction, metal are connected with windowing pad 7 by metal clips 10
During shell fragment 10 is contacted with windowing pad 7, retractable shell fragment can be extruded, female parts (concave station) can absorb part and stretch
The difference in height of contracting, after pushing shrapnel, it is ensured that FPM surface smoothness.Therefore, integral system fingerprint module of the present invention reaches
FPM FPC parts and FPC steel disc reinforcement part is eliminated, while decreasing FPM whole height.
It is preferred that, a kind of integral system fingerprint module also includes becket and coating or cover plate, and becket is assembled in
Outside the substrate of integrated pressure sensitivity fingerprint encapsulating structure, coating or cover plate are assembled in the surface of fingerprint chip 2.
To sum up, the present invention provides a kind of integral system fingerprint chip-packaging structure and fingerprint module, from fingerprint chip
The processing procedure of encapsulation and fingerprint module sets out, and is thinned the encapsulation of fingerprint chip, reduces fingerprint module group procedure structure, systematization envelope
Dactylotype is filled.Wherein, the induction region of fingerprint is combined with fingerprint substrate circuit, control and processing apparatus is inverted in base
The lower section of plate, is connected base plate line and control and processing apparatus by copper post mode, and reverse encapsulation EMC materials simultaneously will connection
Circuit is pulled to the windowing pad that fingerprint beneath chips are spilt by RDL modes, cell phone mainboard can with directly by shell fragment mode with
Fingerprint chip is connected.This integral system fingerprint chip-packaging structure not only causes fingerprint module ultrathin, simplification, and
With more preferable reliability and usability.
Above example is referring to the drawings, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art
Member by above-described embodiment carry out various forms on modification or change, but without departing substantially from the present invention essence in the case of, all
Fall within the scope and spirit of the invention.
Claims (7)
1. a kind of integral system fingerprint chip-packaging structure, it is characterised in that：Including substrate, fingerprint chip, plastic-sealed body and place
Reason and control device, the fingerprint chip are located at the upper surface of base plate, and the circuit of the fingerprint chip and the substrate is electrically connected
Connect, the processing and control device are completely encapsulated in inside it by the plastic-sealed body plastic packaging in the base lower surface, are made described
Processing and control device are located at below the substrate, and the processing and control device and the circuit of the substrate pass through copper post side
Formula is electrically connected, and the plastic-sealed body of the processing and control device side is recessed ledge structure, the plastic-sealed body surface of female parts
Provided with windowing pad, the base plate line for connecting the fingerprint chip leads to the plastic-sealed body surface by RDL gage systems
Opened a window pad, and the windowing that the pin of the processing and control device leads to the plastic-sealed body surface by RDL gage systems is welded
Disk.
2. integral system fingerprint chip-packaging structure according to claim 1, it is characterised in that：The processing and control
Device includes power module, analog-digital converter, digital analog converter and/or processor.
3. integral system fingerprint chip-packaging structure according to claim 1, it is characterised in that：The substrate be comprising
The pin of the pcb board of 4 layer line line structures, the processing and control device and the 3rd sandwich circuit of the pcb board and the 4th sandwich circuit
Connection.
4. integral system fingerprint chip-packaging structure according to claim 1, it is characterised in that：The plastic-sealed body material
For EMC materials.
5. integral system fingerprint chip-packaging structure according to claim 1, it is characterised in that：The fingerprint chip is embedding
In the default groove of the upper surface of base plate, the fingerprint chip upper surface is concordant with the upper surface of base plate or close flat
Together.
6. a kind of integral system fingerprint module, it is characterised in that：Including the integration system described in any one of claim 1 to 5
System fingerprint chip-packaging structure and mainboard, the mainboard is located at the plastic-sealed body of the integral system fingerprint chip-packaging structure
Electrically connected between lower section, and the mainboard and the windowing pad of integral system fingerprint chip-packaging structure by metal clips.
7. integral system fingerprint module according to claim 6, it is characterised in that：Also include：
Becket, the becket is assembled in outside the substrate of the integrated pressure sensitivity fingerprint encapsulating structure；
Coating or cover plate, the coating or cover plate are assembled in the fingerprint chip surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566504.3A CN107240576A (en) | 2017-07-12 | 2017-07-12 | Integral system fingerprint chip-packaging structure and fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566504.3A CN107240576A (en) | 2017-07-12 | 2017-07-12 | Integral system fingerprint chip-packaging structure and fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107240576A true CN107240576A (en) | 2017-10-10 |
Family
ID=59991008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710566504.3A Withdrawn CN107240576A (en) | 2017-07-12 | 2017-07-12 | Integral system fingerprint chip-packaging structure and fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107240576A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650401A (en) * | 2019-09-30 | 2020-01-03 | 华为技术有限公司 | Wireless earphone |
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060223216A1 (en) * | 2005-03-29 | 2006-10-05 | Chin-Huang Chang | Sensor module structure and method for fabricating the same |
| CN204516757U (en) * | 2015-02-12 | 2015-07-29 | 江苏长电科技股份有限公司 | The fingerprint sensor package structure of sapphire fluting |
| CN106485236A (en) * | 2016-10-31 | 2017-03-08 | 维沃移动通信有限公司 | A kind of manufacture method of fingerprint module, fingerprint module and terminal |
| CN207199597U (en) * | 2017-07-12 | 2018-04-06 | 昆山丘钛微电子科技有限公司 | Integral system fingerprint chip-packaging structure and fingerprint module |
-
2017
- 2017-07-12 CN CN201710566504.3A patent/CN107240576A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060223216A1 (en) * | 2005-03-29 | 2006-10-05 | Chin-Huang Chang | Sensor module structure and method for fabricating the same |
| CN204516757U (en) * | 2015-02-12 | 2015-07-29 | 江苏长电科技股份有限公司 | The fingerprint sensor package structure of sapphire fluting |
| CN106485236A (en) * | 2016-10-31 | 2017-03-08 | 维沃移动通信有限公司 | A kind of manufacture method of fingerprint module, fingerprint module and terminal |
| CN207199597U (en) * | 2017-07-12 | 2018-04-06 | 昆山丘钛微电子科技有限公司 | Integral system fingerprint chip-packaging structure and fingerprint module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650401A (en) * | 2019-09-30 | 2020-01-03 | 华为技术有限公司 | Wireless earphone |
| CN110650401B (en) * | 2019-09-30 | 2024-01-30 | 华为技术有限公司 | Wireless earphone |
| CN112183340A (en) * | 2020-09-28 | 2021-01-05 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
| CN112183340B (en) * | 2020-09-28 | 2024-04-26 | 业泓科技(成都)有限公司 | Optical fingerprint module and mobile terminal |
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Effective date of registration: 20201201 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshanqiu titanium biometric technology Co.,Ltd. Address before: 215300 No. 3, Rainbow Road, Kunshan hi tech Industrial Development Zone, Jiangsu, Suzhou Applicant before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
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