CN204496415U - A kind of novel external mini fan for computer to dissipate heat - Google Patents
A kind of novel external mini fan for computer to dissipate heat Download PDFInfo
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- CN204496415U CN204496415U CN201520203509.6U CN201520203509U CN204496415U CN 204496415 U CN204496415 U CN 204496415U CN 201520203509 U CN201520203509 U CN 201520203509U CN 204496415 U CN204496415 U CN 204496415U
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- mini fan
- fan
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Abstract
The utility model discloses a kind of novel external mini fan for computer to dissipate heat, comprise mini fan bottom support, mini fan fan, radiating fin, conical flow guiding cover, rubber thermal-insulation coat is provided with above described mini fan bottom support, USB is provided with above described rubber thermal-insulation coat, copper shell is provided with above described USB, described mini fan fan is provided with above described copper shell, mini fan top cover is provided with above described mini fan fan, insulating rubber material is provided with below described radiating fin, mini fan main shaft is provided with below described insulating rubber material, the heat absorption end is provided with above described mini fan bottom support, mini fan evaporating dish is provided with above at the bottom of described heat absorption.Beneficial effect is: adopt liquid nitrogen and the air-cooled mode combined to dispel the heat, heat-conducting effect is better, and radiating effect is better, and volume is less, carries convenient, and relative low price.
Description
Technical field
The utility model belongs to computer equipment field, is specifically related to a kind of novel external mini fan for computer to dissipate heat.
Background technology
The working temperature of well-known electron device directly determines its serviceable life and stability, the working temperature of each parts of PC is allowed to remain in rational scope, except ensure PC working environment temperature in the reasonable scope except, also must carry out radiating treatment to it.And along with the enhancing of PC computing power, power consumption and heat dissipation problem become the problem of not allowing to avoid day by day.In general, the thermal source rich and influential family in PC comprises CPU, mainboard (south bridge, north bridge and VRM part), video card and miscellaneous part as hardware, CD-ROM drive etc., and the electric energy consumed during their work has quite a few and is converted into heat.Especially for CPU, if user has carried out overclocking, the thermal value of its inner member can not have been despised especially, ensure that it stably works and more necessaryly effectively to dispel the heat.Heating radiator and CPU are as Tai Ji, and they not only counteract each other but also while a change another also can become, and find in change and balance.Temporal is all like this, promotes the CPU just of heating radiator development itself.Along with the increase of integrated transistor quantity in CPU unit area, the increase of its power consumption and for this reason and the heat produced once gesture as fierce floods and savage beasts, the performance of tradition air-cooled radiator seems awkward because of technique bottleneck, has greatly by water-cooled instead trend.
Utility model content
The purpose of this utility model is just to provide a kind of novel external mini fan for computer to dissipate heat to solve the problem.
The utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of novel external mini fan for computer to dissipate heat, comprise mini fan bottom support, mini fan fan, radiating fin, conical flow guiding cover, rubber thermal-insulation coat is provided with above described mini fan bottom support, USB is provided with above described rubber thermal-insulation coat, copper shell is provided with above described USB, described mini fan fan is provided with above described copper shell, mini fan top cover is provided with above described mini fan fan, thermal conductive silicon lipid layer is provided with above described mini fan top cover, heat radiator is provided with above described thermal conductive silicon lipid layer, described conical flow guiding cover is provided with below described heat radiator, described radiating fin is provided with below described conical flow guiding cover, insulating rubber material is provided with below described radiating fin, mini fan main shaft is provided with below described insulating rubber material, the heat absorption end is provided with above described mini fan bottom support, mini fan evaporating dish is provided with above at the bottom of described heat absorption.
In said structure, computer part work produces heat, described USB connects computer, drive described mini fan main axis, drive described mini fan fan and radiating fin to move, heat is shed by described thermal conductive silicon lipid layer, places liquid nitrogen in described mini fan evaporating dish simultaneously, after being heated, volatilization heat absorption, completes computer heat radiation process.
In order to improve mini fan efficiency further, described mini fan bottom support is connected with described rubber thermal-insulation coat, and described USB is connected with described heat radiator.
In order to improve mini fan efficiency further, described copper shell is connected with described mini fan evaporating dish, and described mini fan top cover is connected with described thermal conductive silicon lipid layer.
In order to improve mini fan efficiency further, described conical flow guiding cover is connected with described radiating fin, and described insulating rubber material is connected with described mini fan main shaft.
In order to improve mini fan efficiency further, be connected at the bottom of described heat absorption with described mini fan bottom support, described mini fan evaporating dish is connected with described radiating fin.
Beneficial effect is: adopt liquid nitrogen and the air-cooled mode combined to dispel the heat, heat-conducting effect is better, and radiating effect is better, and volume is less, carries convenient, and relative low price.
Accompanying drawing explanation
Fig. 1 is the front view of the novel external mini fan for computer to dissipate heat described in the utility model;
Fig. 2 is the vertical view of the novel external mini fan for computer to dissipate heat described in the utility model;
Fig. 3 is the left view of the novel external mini fan for computer to dissipate heat described in the utility model.
1, mini fan bottom support; 2, rubber thermal-insulation coat; 3, USB; 4, copper shell; 5, mini fan fan; 6, mini fan top cover; 7, thermal conductive silicon lipid layer; 8, heat radiator; 9, radiating fin; 10, insulating rubber material; 11, mini fan main shaft; 12, conical flow guiding cover; 13, absorb heat at the end; 14, mini fan evaporating dish.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail:
As shown in Figure 1-Figure 3, a kind of novel external mini fan for computer to dissipate heat, comprise mini fan bottom support 1, mini fan fan 5, radiating fin 9, conical flow guiding cover 12, rubber thermal-insulation coat 2 is provided with above mini fan bottom support 1, in order to prevent people's hand frost bitten when mobile micro blower fan, USB 3 is provided with above rubber thermal-insulation coat 2, in order to connect external computer, copper shell 4 is provided with above USB 3, in order to protect mini fan interior arrangement, mini fan fan 5 is provided with above copper shell 4, in order to rotate heat radiation, mini fan top cover 6 is provided with above mini fan fan 5, in order to protect mini fan fan, thermal conductive silicon lipid layer 7 is provided with above mini fan top cover 6, in order to heat is derived, heat radiator 8 is provided with above thermal conductive silicon lipid layer 7, in order to air exchange heat, shed heat fast, conical flow guiding cover 12 is provided with below heat radiator 8, in order to wind indicator taper in mini fan is shed, strengthen and amass with air contact surfaces, accelerate heat radiation, radiating fin 9 is provided with below conical flow guiding cover 12, heat is taken away in order to rotate formation vortex wind power, insulating rubber material 10 is provided with below radiating fin 9, in order to protect mini fan main shaft, mini fan main shaft 11 is provided with below insulating rubber material 10, in order to drive mini fan fan and radiating fin motion, the heat absorption end 13 is provided with above mini fan bottom support 1, in order to absorb heat to bottom, accelerate heat radiation, mini fan evaporating dish 14 is provided with at heat absorption the end 13, in order to hold liquid nitrogen.
In said structure, computer part work produces heat, USB 3 connects computer, mini fan main shaft 11 is driven to rotate, drive mini fan fan 5 and radiating fin 9 to move, heat is shed by thermal conductive silicon lipid layer 7, places liquid nitrogen in mini fan evaporating dish 14 simultaneously, after being heated, volatilization heat absorption, completes computer heat radiation process.
In order to improve mini fan efficiency further, mini fan bottom support 1 is connected with rubber thermal-insulation coat 2, USB 3 is connected with heat radiator 8, copper shell 4 is connected with mini fan evaporating dish 14, mini fan top cover 6 is connected with thermal conductive silicon lipid layer 7, and conical flow guiding cover 12 is connected with radiating fin 9, and insulating rubber material 10 is connected with mini fan main shaft 11, the heat absorption end 13, is connected with mini fan bottom support 1, and mini fan evaporating dish 14 is connected with radiating fin 9.
More than show and describe ultimate principle of the present utility model, principal character and advantage.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and effect thing thereof.
Claims (5)
1. the novel external mini fan for computer to dissipate heat, it is characterized in that: comprise mini fan bottom support, mini fan fan, radiating fin, conical flow guiding cover, rubber thermal-insulation coat is provided with above described mini fan bottom support, USB is provided with above described rubber thermal-insulation coat, copper shell is provided with above described USB, described mini fan fan is provided with above described copper shell, mini fan top cover is provided with above described mini fan fan, thermal conductive silicon lipid layer is provided with above described mini fan top cover, heat radiator is provided with above described thermal conductive silicon lipid layer, described conical flow guiding cover is provided with below described heat radiator, described radiating fin is provided with below described conical flow guiding cover, insulating rubber material is provided with below described radiating fin, mini fan main shaft is provided with below described insulating rubber material, the heat absorption end is provided with above described mini fan bottom support, mini fan evaporating dish is provided with above at the bottom of described heat absorption.
2. a kind of novel external mini fan for computer to dissipate heat according to claim 1, is characterized in that: described mini fan bottom support is connected with described rubber thermal-insulation coat, and described USB is connected with described heat radiator.
3. a kind of novel external mini fan for computer to dissipate heat according to claim 1, it is characterized in that: described copper shell is connected with described mini fan evaporating dish, described mini fan top cover is connected with described thermal conductive silicon lipid layer.
4. a kind of novel external mini fan for computer to dissipate heat according to claim 1, it is characterized in that: described conical flow guiding cover is connected with described radiating fin, described insulating rubber material is connected with described mini fan main shaft.
5. a kind of novel external mini fan for computer to dissipate heat according to claim 1, it is characterized in that: be connected with described mini fan bottom support at the bottom of described heat absorption, described mini fan evaporating dish is connected with described radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520203509.6U CN204496415U (en) | 2015-04-08 | 2015-04-08 | A kind of novel external mini fan for computer to dissipate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520203509.6U CN204496415U (en) | 2015-04-08 | 2015-04-08 | A kind of novel external mini fan for computer to dissipate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204496415U true CN204496415U (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520203509.6U Expired - Fee Related CN204496415U (en) | 2015-04-08 | 2015-04-08 | A kind of novel external mini fan for computer to dissipate heat |
Country Status (1)
| Country | Link |
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| CN (1) | CN204496415U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107632645A (en) * | 2017-10-26 | 2018-01-26 | 合肥超越电器有限责任公司 | It is a kind of that there is the integrated temperature controller for putting line cooling mechanism |
-
2015
- 2015-04-08 CN CN201520203509.6U patent/CN204496415U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107632645A (en) * | 2017-10-26 | 2018-01-26 | 合肥超越电器有限责任公司 | It is a kind of that there is the integrated temperature controller for putting line cooling mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20160408 |