CN204464274U - A kind of POP Stacked die package structure - Google Patents

A kind of POP Stacked die package structure Download PDF

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Publication number
CN204464274U
CN204464274U CN201520238392.5U CN201520238392U CN204464274U CN 204464274 U CN204464274 U CN 204464274U CN 201520238392 U CN201520238392 U CN 201520238392U CN 204464274 U CN204464274 U CN 204464274U
Authority
CN
China
Prior art keywords
weld pad
top layer
packaging
base plate
potted element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520238392.5U
Other languages
Chinese (zh)
Inventor
张珈铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Meng Bao Industrial Co Ltd
Original Assignee
Sichuan Meng Bao Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Meng Bao Industrial Co Ltd filed Critical Sichuan Meng Bao Industrial Co Ltd
Priority to CN201520238392.5U priority Critical patent/CN204464274U/en
Application granted granted Critical
Publication of CN204464274U publication Critical patent/CN204464274U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of POP Stacked die package structure, it comprises top layer potted element (1) and bottom potted element (2), and top layer potted element (1) comprises the upper weld pad (7) being arranged on top layer base plate for packaging (4) upper surface, the lower weld pad (8) being arranged on top layer base plate for packaging (4) lower surface and via (9); Bottom potted element (2) also comprises the upper weld pad (7) being arranged on bottom seal (12) upper surface, the lower weld pad (8) being arranged on bottom base plate for packaging (13) lower surface and via (9); The upper weld pad (7) be connected, lower weld pad (8) and via (9) composition I-shaped structure, the lower weld pad (8) of top layer base plate for packaging (4) is connected with the upper weld pad (7) of bottom potted element (2) by soldered ball (11), and via (9) is in trapezium structure.The utility model has that structural strength is large, load performance good, radiating efficiency high.

Description

A kind of POP Stacked die package structure
Technical field
The utility model relates to field of semiconductor package, particularly relates to a kind of POP Stacked die package structure.
Background technology
Boundary line between the appearance of PoP (Package on Package) stacking mounting technology is fuzzyyer level package and secondary assemble, while greatly improving logical operation function and memory space, also for terminal use provides the possibility of unrestricted choice combination of devices, production cost is also able to more effective control.A considerable preferred version is undoubtedly for 3G mobile PoP.Not mediocre put no, along with the appearance of small-sized high density encapsulation, at a high speed and the high accuracy requirement of assembling become more crucial.Relevant mounting equipment and technique also have more advance and high flexibility.The stacking assembling of components and parts (Package on Package) technology must stand this new challenge.
Current POP laminated packaging structure, usually can run into the problems such as packaging body warpage, load performance is poor, radiating efficiency is low.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of POP Stacked die package structure, has that structural strength is large, load performance good, radiating efficiency high.
The purpose of this utility model is achieved through the following technical solutions: a kind of POP Stacked die package structure, it comprises top layer potted element and bottom potted element, comprise top layer seal, one or more top layer packaged chip, encapsulation pad, top layer base plate for packaging and soldered ball in top layer potted element from top to bottom successively, in bottom potted element, comprise bottom seal, bottom packaged chip, bottom base plate for packaging and soldered ball from top to bottom successively.
Top layer potted element also comprises the upper weld pad being arranged on top layer base plate for packaging upper surface, the lower weld pad being arranged on top layer base plate for packaging lower surface and the via for being connected upper weld pad and lower weld pad.
Bottom potted element also comprises the upper weld pad being arranged on bottom seal upper surface, the lower weld pad being arranged on bottom base plate for packaging lower surface and the via for being connected upper weld pad and lower weld pad.
The upper weld pad be connected, lower weld pad and via composition I-shaped structure, the lower weld pad of top layer base plate for packaging is connected with the upper weld pad of bottom potted element by soldered ball, and via is trapezium structure.
Described top layer packaged chip is fixed on encapsulation pad, and is connected by the upper weld pad of connecting line with top layer base plate for packaging upper surface, and bottom packaged chip is fixed on bottom base plate for packaging by the mode of upside-down mounting.
Described bottom packaged chip is arranged in the trapezoidal tapers bench-type groove of bottom seal.
The beneficial effects of the utility model are:
1) the utility model adopts the upper weld pad of composition I-shaped structure, lower weld pad and via, wherein, via is also set to trapezium structure, the load performance of effective lifting stacked package body, thinner substrate also can not be affected, the pressure-bearing property problem of Multi-Stack Die, the utility model structural strength is larger.
2) in the utility model, bottom seal is provided with trapezoidal tapers bench-type groove, has both ensured that bottom potted element had stronger structural, and has expanded again the heat-dissipating space of bottom packaged chip, can solve the heat dissipation problem of stacked package chip better.
Accompanying drawing explanation
Fig. 1 is the structure chart of the utility model POP Stacked die package structure;
In figure, 1-top layer potted element, 2-bottom potted element, 3-top layer seal, 4-top layer base plate for packaging, 5-top layer packaged chip, 6-encapsulates pad, the upper weld pad of 7-, weld pad under 8-, 9-via, 10-bonding wire, 11-soldered ball, 12-bottom seal, 13-bottom base plate for packaging, 14-bottom packaged chip.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, a kind of POP Stacked die package structure, it comprises top layer potted element 1 and bottom potted element 2, comprise top layer seal 3, one or more top layer packaged chip 5, encapsulation pad 6, top layer base plate for packaging 4 and soldered ball 11 in top layer potted element 1 from top to bottom successively, in bottom potted element 2, comprise bottom seal 12, bottom packaged chip 14, bottom base plate for packaging 13 and soldered ball 11 from top to bottom successively.
Top layer potted element 1 also comprises the upper weld pad 7 being arranged on top layer base plate for packaging 4 upper surface, the lower weld pad 8 being arranged on top layer base plate for packaging 4 lower surface and the via 9 for being connected upper weld pad 7 and lower weld pad 8.
Bottom potted element 2 also comprises the upper weld pad 7 being arranged on bottom seal 12 upper surface, the lower weld pad 8 being arranged on bottom base plate for packaging 13 lower surface and the via 9 for being connected upper weld pad 7 and lower weld pad 8.Be copper post in via 9, the height of the via 9 of top layer potted element 1 is identical with the thickness of top layer base plate for packaging 4, and the height of the via 9 of bottom potted element 2 and bottom seal 12 are identical with after the thickness of bottom base plate for packaging 13.
The upper weld pad 7 be connected, lower weld pad 8 and via 9 form I-shaped structure, and the lower weld pad 8 of top layer base plate for packaging 4 is connected with the upper weld pad 7 of bottom potted element 2 by soldered ball 11, and via 9 is in trapezium structure.The load performance of effective lifting stacked package body, makes thinner substrate also can not affect, and the pressure-bearing property problem of Multi-Stack Die, the utility model structural strength is larger.
The thick scaling powder of 0.175mm is also provided with between top layer potted element 1 and bottom potted element 2.The thickness of bottom potted element 2 is 0.3mm.
Described top layer packaged chip 5 is fixed on encapsulation pad 6, and is connected by the upper weld pad 7 of connecting line 10 with top layer base plate for packaging 4 upper surface, and multiple top layer packaged chip 5 is all fixed on top layer base plate for packaging 4 by the mode of formal dress.Bottom packaged chip 14 is fixed on bottom base plate for packaging 13 by the mode of upside-down mounting.
Described bottom packaged chip 14 is arranged in the trapezoidal tapers bench-type groove of bottom seal 12.Both ensured that bottom potted element had stronger structural, and expanded again the heat-dissipating space of bottom packaged chip, the heat dissipation problem of stacked package chip can be solved better.

Claims (3)

1. a POP Stacked die package structure, it is characterized in that: it comprises top layer potted element (1) and bottom potted element (2), comprise top layer seal (3), one or more top layer packaged chip (5), encapsulation pad (6), top layer base plate for packaging (4) and soldered ball (11) in top layer potted element (1) from top to bottom successively, in bottom potted element (2), comprise bottom seal (12), bottom packaged chip (14), bottom base plate for packaging (13) and soldered ball (11) from top to bottom successively;
Top layer potted element (1) also comprises the upper weld pad (7) being arranged on top layer base plate for packaging (4) upper surface, the lower weld pad (8) being arranged on top layer base plate for packaging (4) lower surface and the via (9) for being connected upper weld pad (7) and lower weld pad (8);
Bottom potted element (2) also comprises the upper weld pad (7) being arranged on bottom seal (12) upper surface, the lower weld pad (8) being arranged on bottom base plate for packaging (13) lower surface and the via (9) for being connected upper weld pad (7) and lower weld pad (8);
The upper weld pad (7) be connected, lower weld pad (8) and via (9) composition I-shaped structure, the lower weld pad (8) of top layer base plate for packaging (4) is connected with the upper weld pad (7) of bottom potted element (2) by soldered ball (11), and via (9) is in trapezium structure.
2. a kind of POP Stacked die package structure according to claim 1, it is characterized in that: described top layer packaged chip (5) is fixed in encapsulation pad (6), and be connected with the upper weld pad (7) of top layer base plate for packaging (4) upper surface by connecting line (10), bottom packaged chip (14) is fixed on bottom base plate for packaging (13) by the mode of upside-down mounting.
3. a kind of POP Stacked die package structure according to claim 1, is characterized in that: described bottom packaged chip (14) is arranged in the trapezoidal tapers bench-type groove of bottom seal (12).
CN201520238392.5U 2015-04-20 2015-04-20 A kind of POP Stacked die package structure Expired - Fee Related CN204464274U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520238392.5U CN204464274U (en) 2015-04-20 2015-04-20 A kind of POP Stacked die package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520238392.5U CN204464274U (en) 2015-04-20 2015-04-20 A kind of POP Stacked die package structure

Publications (1)

Publication Number Publication Date
CN204464274U true CN204464274U (en) 2015-07-08

Family

ID=53671122

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520238392.5U Expired - Fee Related CN204464274U (en) 2015-04-20 2015-04-20 A kind of POP Stacked die package structure

Country Status (1)

Country Link
CN (1) CN204464274U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150708

Termination date: 20170420