CN204441243U - A kind of thin patch element - Google Patents
A kind of thin patch element Download PDFInfo
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- CN204441243U CN204441243U CN201420788040.2U CN201420788040U CN204441243U CN 204441243 U CN204441243 U CN 204441243U CN 201420788040 U CN201420788040 U CN 201420788040U CN 204441243 U CN204441243 U CN 204441243U
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Abstract
The application provides a kind of thin patch element, comprise the first electrode of lamination connection successively from top to bottom, insulation board and the second electrode, the lower surface be connected with described insulation board of the first electrode offers groove, and the position corresponding with groove of insulation board is provided with through hole; Be positioned at the upper surface of the second electrode and the position corresponding with through hole extends to form boss towards through hole, boss is sheathed in through hole and forms the cavity with gap with groove; And, at least one side of the outer rim of the body of the first electrode extends downward the plane at the second electrode place, to form the first pin, the cavity with gap can be formed with the boss of the second electrode by the groove of the first electrode, decrease the thickness of components and parts, when then can be positioned over the back side of printed substrate in small space, the safe distance between the back side of printed substrate and external conductive casing can not be had influence on, and then decrease the volume of equipment, be beneficial to the miniaturization, integrated of electronic product, equipment.
Description
Technical field
The utility model relates to arresting element technical field, is specifically related to a kind of thin patch element.
Background technology
Along with the develop rapidly of surface installation technique and SMD components, kind and the quantity of surface mount elements significantly increase, and become the main product of electronic devices and components.In overvoltage protection field, the requirement of the height to device and the utilance to printed substrate is more and more higher, two current pole discharge tubes add man-hour at high-speed paster, because the height dimension of existing two pole discharge tubes is excessive, meet the safe distance between printed substrate and external conductive casing under prerequisite, be placed with the distance that to increase in the back side of printed substrate between printed substrate to external conductive casing, increase the volume of equipment.Therefore, in order to realize the safe distance between the back side of printed substrate and external conductive casing in small space, can only existing diode be placed with on the front surface relative with the back side of printed substrate.
For realizing the miniaturization of electronic product, equipment, the technological means that element application manufacturer commonly uses is the distance reduced between element or between element and shell, and this technological means inherently affects the safe distance between device.
Utility model content
The utility model provides a kind of thin patch element, solve when existing discharge tube is positioned over backboard in small space due to thickness have impact on greatly the safe distance between the back side of printed substrate and external conductive casing problem.
First aspect, the present embodiment provides a kind of thin patch element, comprise the first electrode of lamination connection successively from top to bottom, insulation board and the second electrode, described first electrode has the notch that card puts described insulation board, described first electrode comprises body and the first pin, wherein, the lower surface be connected with described insulation board of the body of described first electrode offers groove, and the position corresponding with described groove of described insulation board is provided with through hole; Be positioned at the upper surface of described second electrode and the position corresponding with described through hole extends to form boss towards described through hole, described boss is sheathed in described through hole and forms the cavity with gap with described groove; And at least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form described first pin with the second electrode separation.
In conjunction with first aspect, in the implementation that the first is possible, the lower surface of described first pin and the lower surface of described second electrode are at same plane.
In conjunction with the first possible implementation of first aspect, in the implementation that the second is possible, the body of described first electrode, described insulation board and described second electrode by solder sheet from top to bottom successively lamination be connected.
In conjunction with the implementation that the second of first aspect is possible, in the implementation that the third is possible, the upper surface of the body of described first electrode is flat surface.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation, described boss is sheathed in described through hole, is formed have gap and for sealing argon gas, helium, neon, hydrogen, nitrogen, the cavity of at least one inert gas in Krypton with described groove.
In conjunction with the third possible implementation of first aspect, in the 5th kind of possible implementation, in described cavity, be packaged with the electrical combination module be combined to form with at least one components and parts of described first electrode and described second electrode electrical interconnects or at least two component circuit.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 5th kind of possible implementation, in the 6th kind of possible implementation, the body of described first electrode is regular polygon electrode or circular electrode or oval-shaped electrode or the square-shaped electrode with square boss or round boss.
In conjunction with the 6th kind of possible implementation of first aspect, in the 7th kind of possible implementation, described insulation board is regular polygon insulation board or circular insulating board or oval insulation board.
In conjunction with the 7th kind of possible implementation of first aspect, in the 8th kind of possible implementation, described second electrode is regular polygon electrode or circular electrode or oval-shaped electrode.
In conjunction with the 8th kind of possible implementation of first aspect, in the 9th kind of possible implementation, described groove is oval-shaped groove or circular groove or regular polygon connected in star.
In conjunction with the 9th kind of possible implementation of first aspect, in the tenth kind of possible implementation, described through hole is ellipse hole or manhole or regular polygon connected in star.
In conjunction with the tenth kind of possible implementation of first aspect, in the 11 kind of possible implementation, described boss is ellipse around boss or round boss or regular polygon boss or round platform.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 5th kind of possible implementation, in the 12 kind of possible implementation, the body of described first electrode is square-shaped electrode or the electrode with round boss or square boss or rectangle boss, and described insulation board is square insulating plate;
At least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form the first pin, comprising:
The side of the outer rim of the body of described first electrode or relative both sides extend downward the plane at described second electrode place, to form the first pin.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 5th kind of possible implementation, in the 13 kind of possible implementation, described first electrode is circular electrode, and described insulation board is circular insulating board;
At least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form the first pin, comprising:
Any segmental arc of the outer rim of the body of described first electrode or circumferential outer edge extend downward the plane at described second electrode place, to form the first pin.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 5th kind of possible implementation, in the 14 kind of possible implementation, the upper surface of the body of described first electrode is less than or equal to 3mm to the height of the lower surface of described second electrode.
In conjunction with the 14 kind of possible implementation of first aspect, in the 15 kind of possible implementation, described first electrode and described second electrode are metal electrode, and described metal electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode; Or described first electrode and described second electrode are the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold;
And described insulation board is ceramic wafer or glass plate;
And the upper surface of the lower surface of the body of described first electrode or the surface of described groove or described second electrode or the surface-coated of described boss have electronic emission material.
The utility model provides a kind of thin patch element, comprise the first electrode of lamination connection successively from top to bottom, insulation board and the second electrode, described first electrode has the notch that card puts described insulation board, described first electrode comprises body and the first pin, the lower surface be connected with described insulation board of the body of described first electrode offers groove, and the position corresponding with described groove of described insulation board is provided with through hole; Be positioned at the upper surface of described second electrode and the position corresponding with described through hole extends to form boss towards described through hole, described boss is sheathed in described through hole and forms the cavity with gap with described groove; And at least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form the first pin.The cavity with gap can be formed with the boss of the second electrode by the groove of the first electrode in the present embodiment, decrease the thickness (highly) of element, when then can be positioned over the back side of printed substrate in small space, the safe distance between the back side of printed substrate and external conductive casing can not be had influence on, and then decrease the area occupied of printed substrate, be beneficial to the miniaturization, integrated of electronic product, equipment.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structure chart of a kind of thin patch element that Fig. 1 a provides for the embodiment of the present application;
The sectional structure chart of a kind of thin patch element that Fig. 1 b provides for the embodiment of the present application;
A decomposition chart of a kind of thin patch element that Fig. 1 c provides for the embodiment of the present application;
Another decomposition chart of a kind of thin patch element that Fig. 1 d provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 e provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 f provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 g provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 h provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 k provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 1 m provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 2 a provides for the embodiment of the present application;
The sectional structure chart of a kind of thin patch element that Fig. 2 b provides for the embodiment of the present application;
A decomposition chart of a kind of thin patch element that Fig. 2 c provides for the embodiment of the present application;
Another decomposition chart of a kind of thin patch element that Fig. 2 d provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 2 e provides for the embodiment of the present application;
The structure chart of the another kind of thin patch element that Fig. 2 f provides for the embodiment of the present application.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, be clearly and completely described the technical scheme in the embodiment of the present application, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Below by specific embodiment, be described in detail respectively.
The present embodiment provides a kind of thin patch element, comprise the first electrode of lamination connection successively from top to bottom, insulation board and the second electrode, first electrode has the notch that card puts described insulation board, notch comprises body and first pin of the first electrode, wherein, groove is offered at the lower surface be connected with insulation board of the body of the first electrode, at least one side that notch also comprises the outer rim of the body of the first electrode extends downward the plane at the second electrode place, to form the first pin with the second electrode separation, the position corresponding with groove of insulation board is provided with through hole, be positioned at the upper surface of the second electrode and the position corresponding with through hole extends to form boss towards through hole, boss is sheathed in through hole and forms the cavity with gap with groove, and at least one side of the outer rim of the body of the first electrode extends downward the plane at the second electrode place, to form the first pin with the second electrode separation.
As the optional execution mode of one, the lower surface of the first pin and the lower surface of the second electrode are at same plane, then, during element paster, element can parallelly be labelled on printed substrate.
As the optional execution mode of one, the body of the first electrode, insulation board and the second electrode by solder sheet from top to bottom successively lamination be connected.
As the optional execution mode of one, in cavity, be sealed with gas; Gas comprises inert gas, and inert gas is at least one gas in argon gas, helium, neon, hydrogen, nitrogen, Krypton.
Described gas is the mixed type gas of single type inert gas or the mixing of at least two kinds of inert gases, and described single type inert gas is argon gas or helium or neon or hydrogen or nitrogen or Krypton;
Described mixed type gas is argon gas, helium mix gas or argon gas, neon mist or argon gas, hydrogen gas mixture or argon gas, nitrogen mixed gas or argon gas, Krypton mist or helium, neon mist or helium, hydrogen gas mixture or helium, nitrogen mixed gas or helium, Krypton mist or neon, hydrogen gas mixture or neon, nitrogen mixed gas or neon, Krypton mist or hydrogen, nitrogen mixed gas or hydrogen, Krypton mist or argon gas, helium, neon mist or argon gas, helium, hydrogen gas mixture or argon gas, helium, nitrogen mixed gas or argon gas, neon, hydrogen gas mixture or argon gas, neon, nitrogen mixed gas or argon gas, hydrogen, nitrogen mixed gas or helium, neon, hydrogen gas mixture or helium, neon, nitrogen mixed gas or helium, hydrogen, nitrogen mixed gas or neon, hydrogen, nitrogen mixed gas or argon gas, helium, neon, hydrogen gas mixture or argon gas, helium, neon, nitrogen mixed gas or helium, neon, hydrogen, nitrogen mixed gas or argon gas, neon, hydrogen, nitrogen mixed gas or helium, neon, hydrogen, nitrogen mixed gas or argon gas, helium, neon, hydrogen, nitrogen mixed gas.
As the optional execution mode of one, in cavity, be packaged with the electrical combination module be combined to form with at least one components and parts of the first electrode and the second electrode electrical interconnects or at least two component circuit.
As the optional execution mode of one, the body of the first electrode is regular polygon electrode or circular electrode or oval-shaped electrode or the square-shaped electrode with square boss or round boss, and the upper surface of the body of the first electrode is flat surface.
As the optional execution mode of one, insulation board is regular polygon insulation board or circular insulating board or oval insulation board.
As the optional execution mode of one, the second electrode is regular polygon electrode or circular electrode or oval-shaped electrode.
As the optional execution mode of one, the groove that the body lower surface of the first electrode is offered is oval-shaped groove or circular groove or regular polygon connected in star.
As the optional execution mode of one, the through hole of insulation board is ellipse hole or manhole or regular polygon connected in star.
As the optional execution mode of one, the boss of the second electrode is ellipse around boss or round boss or regular polygon boss or round platform.
As the optional execution mode of one, the body of the first electrode is square-shaped electrode or the electrode with round boss or square boss or rectangle boss, and insulation board is square insulating plate;
At least one side of the outer rim of the body of the first electrode extends downward the plane at the second electrode place, to form the first pin, comprising:
The side of the outer rim of the body of the first electrode or relative both sides extend downward the plane at the second electrode place, to form the first pin.
As the optional execution mode of one, the first electrode is circular electrode, and insulation board is circular insulating board;
At least one side of the outer rim of the body of the first electrode extends downward the plane at the second electrode place, to form the first pin, comprising:
Any segmental arc of the outer rim of the body of the first electrode or circumferential outer edge extend downward the plane at the second electrode place, to form the first pin.
As the optional execution mode of one, the first electrode is metal electrode, and metal electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode; Or electrode is the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold.
As the optional execution mode of one, insulation board is ceramic wafer or glass plate.
As the optional execution mode of one, the lower surface of the body of the first electrode or the upper surface of the groove offered or the second electrode or the surface-coated of boss have electronic emission material.
As the optional execution mode of one, the upper surface of the boss of the second electrode is provided with the grid of regular shape, grid is coated with electronic powder emissive material.
As the optional execution mode of one, the sidewall of the through hole of insulation board is provided with carbon line.
As the optional execution mode of one, the height of the lower surface of upper surface to the second electrode of the body of the first electrode is less than or equal to 3mm.
Refer to Fig. 1 a, Fig. 1 b and Fig. 1 c, the structure chart of a kind of thin patch element that Fig. 1 a provides for the embodiment of the present application, the sectional structure chart of a kind of thin patch element that Fig. 1 b provides for the embodiment of the present application, a decomposition chart of a kind of thin patch element that Fig. 1 c provides for the embodiment of the present application, another decomposition chart of a kind of thin patch element that Fig. 1 d provides for the embodiment of the present application, as shown in Figure 1a, the thin patch element that the present embodiment provides comprises from top to bottom the first electrode 110 that lamination successively connects, insulation board 120 and the second electrode 130, first electrode 110 comprises body and the first pin 111, second electrode 130 comprises the second pin 131.As shown in Figure 1 b, the lower surface be connected with insulation board 120 of the body of the first electrode 110 in the thin component that the present embodiment provides offers groove 112, and the position corresponding with groove 112 of insulation board 120 is provided with through hole 121; Be positioned at the upper surface of the second electrode 130 and the position corresponding with through hole 121 extends to form boss 132 towards through hole 121, boss 132 is sheathed in through hole 121 and forms the cavity 133 with gap with groove 112.In the present embodiment, first electrode 110 is square-shaped electrode, insulation board 120 is square insulating plate 120, and the size of insulation board 120 is identical with the first electrode 110 size, the relative both sides of the body of the first electrode 110 extend to the second electrode 130 place plane respectively vertically downward, to form the first pin 111, the i.e. U-shaped notch of band first pin 111 that is formed in one of the first electrode 110, second electrode 130 is positioned at the centre of the first electrode 110 perpendicular to the projection of the first electrode 110 place plane, and the second electrode 130 is square-shaped electrode, in other embodiments, the position of the second electrode 130 is not by the restriction of the present embodiment, namely the second electrode 130 can be positioned at the side of the first electrode 110 perpendicular to the projection of the first electrode 110 place plane, just can as long as separate with the first pin 111 of the first electrode 110.In addition, as shown in Figure 1 b, the lower surface of the body of the first electrode 110 offers groove 112 towards the upper surface of the first electrode 110, as illustrated in figure 1 c, the shape of groove 112 is circular, the position that insulation board 120 is corresponding with groove 112 offers manhole 121, as shown in Figure 1 d, is positioned at the upper surface of the second electrode 130 and the position corresponding with through hole 121 extends to form round boss 132 towards through hole 121.The height of boss 132 is higher than through hole in the present embodiment, also can be shorter than the height of through hole, and specific implementation is not by the restriction of embodiment.
In the present embodiment, the upper surface of the body of the first electrode 110 is flat surface, and the lower surface of the first pin 111 and the lower surface of the second electrode 130 are at same plane.
And in the present embodiment as shown in Fig. 1 c and Fig. 1 d, the body of the first electrode 110, insulation board 120 and the second electrode 130 by solder sheet 140 from top to bottom successively lamination be connected.In other embodiments, the body of the first electrode 110, insulation board 120 and the second electrode 130 can by solder or other sealing-in modes from top to bottom successively lamination be connected, specific implementation is by the restriction of the present embodiment.
As the optional execution mode of one, in cavity 133, be sealed with gas; Gas comprises inert gas, and inert gas is at least one gas in argon gas, helium, neon, hydrogen, nitrogen, Krypton, then now thin patch element is patch-type gas discharge tube.
As the optional execution mode of one, be packaged with the electrical combination module be combined to form with at least one components and parts of the first electrode 110 and the second electrode 130 electrical interconnects or at least two component circuit in cavity 133, then now thin patch element is overvoltage protective device or for the belt electrode of packaging and the package casing device of paster pin.
As the optional execution mode of one, the body of the first electrode 110 is regular polygon electrode or circular electrode or oval-shaped electrode, and the upper surface of the body of the first electrode 110 is flat surface.
As the optional execution mode of one, insulation board 120 is regular polygon insulation board 120 or circular insulating board 120 or oval insulation board 120.
As the optional execution mode of one, refer to Fig. 1 e, the structure chart of the another kind of thin patch element that Fig. 1 e provides for the embodiment of the present application, as shown in fig. le, based on the replacement of the second electrode 130 of the thin patch element shown in Fig. 1 a, the second electrode 130 in Fig. 1 e is circular electrode.As the optional execution mode of one, refer to Fig. 1 f, the structure chart of the another kind of thin patch element that Fig. 1 f provides for the embodiment of the present application, as shown in Figure 1 f, based on the replacement of the second electrode 130 of the thin patch element shown in Fig. 1 a, the second electrode 130 in Fig. 1 f is the square-shaped electrode of band chamfering, in other embodiments, second electrode 130 can be regular polygon electrode or oval-shaped electrode, and the selection of concrete shape realizes not by the restriction of the present embodiment.As the optional execution mode of one, refer to Fig. 1 g, the structure chart of the another kind of thin patch element that Fig. 1 g provides for the embodiment of the present application, as shown in Figure 1 g, based on the replacement of the second electrode 130 of the thin patch element shown in Fig. 1 a, the second electrode 130 in Fig. 1 g is rectangular electrodes, it is positioned at the middle part of the first electrode 110 in the upright projection of the first electrode 110 place plane, it is positioned at the sidepiece that also can be positioned at the first electrode 110 in the upright projection of the first electrode 110 place plane in other embodiments, when the overlapping sideways of the long limit of the second electrode 130 and insulation board 120, the body of the first electrode 110 can have side to extend to form the first pin 111 downwards, specific implementation is not by the restriction of the present embodiment.In the present embodiment, the both sides of the body of the first electrode 110 form the first pin 111 respectively to downward-extension, then when paster without the need to considering the problem in element paster direction, can parallel paster.
As the optional execution mode of one, refer to Fig. 1 h, the structure chart of the another kind of thin patch element that Fig. 1 h provides for the embodiment of the present application, as shown in figure 1h, based on the body of the first electrode 110 of the thin patch element shown in Fig. 1 a and the replacement of the second electrode 130, the body of the first electrode 110 in Fig. 1 h is the electrode of belt length square boss, and the second electrode 130 is rectangular electrodes.As the optional execution mode of one, refer to Fig. 1 k, the structure chart of the another kind of thin patch element that Fig. 1 k provides for the embodiment of the present application, as shown in figure 1k, based on the body of the first electrode 110 of the thin patch element shown in Fig. 1 a and the replacement of the second electrode 130, the body of the first electrode 110 in Fig. 1 k is the electrode of band round boss, and the second electrode 130 is rectangular electrodes.
As the optional execution mode of one, groove 112 is oval-shaped groove or circular groove or regular polygon connected in star.
As the optional execution mode of one, through hole 121 is ellipse hole or manhole or regular polygon connected in star.
As the optional execution mode of one, boss 132 is ellipse around boss or round boss or regular polygon boss or round platform.
As the optional execution mode of one, refer to Fig. 1 m, the structure chart of the another kind of thin patch element that Fig. 1 m provides for the embodiment of the present application, as figure 1 m illustrates, based on the body of the first electrode 110 of the thin patch element shown in Fig. 1 a and the replacement of the second electrode 130, in the present embodiment, the side of the outer rim of the body of the first electrode 110 extends downward the plane at the second electrode 130 place, and to form the first pin 111, and the second electrode 130 is rectangular electrodes.
As the optional execution mode of one, the first electrode and the second electrode 130 are metal electrode, and metal electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode; Or the first electrode and the second electrode 130 are the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold.
As the optional execution mode of one, insulation board 120 is ceramic wafer or glass plate.
As the optional execution mode of one, the lower surface of the body of the first electrode 110 or groove 112 or the upper surface of the second electrode 130 or the surface-coated of boss 132 have electronic emission material.
As the optional execution mode of one, the upper surface of boss 132 is provided with the grid of regular shape, grid is coated with electronic powder emissive material.
As the optional execution mode of one, the sidewall of through hole 121 is provided with carbon line.
Refer to Fig. 2 a, Fig. 2 b, Fig. 2 c and Fig. 2 d, the structure chart of the another kind of thin patch element that Fig. 2 a provides for the embodiment of the present application, the sectional structure chart of a kind of thin patch element that Fig. 2 b provides for the embodiment of the present application, a decomposition chart of a kind of thin patch element that Fig. 2 c provides for the embodiment of the present application, another decomposition chart of a kind of thin patch element that Fig. 2 d provides for the embodiment of the present application, as shown in Figure 2 a, the thin patch element that the present embodiment provides comprises from top to bottom the first electrode 210 that lamination successively connects, insulation board 220 and the second electrode 230, first electrode 210 comprises body and the first pin 211, second electrode 230 comprises the second pin 231.As shown in Figure 2 b, the lower surface be connected with insulation board 220 of the body of the first electrode 210 in the thin component that the present embodiment provides offers groove 212, and the position corresponding with groove 212 of insulation board 220 is provided with through hole 221; Be positioned at the upper surface of the second electrode 230 and the position corresponding with through hole 221 extends to form boss 232 towards through hole 221, boss 232 is sheathed in through hole 221 and forms the cavity 233 with gap with groove 212.In the present embodiment, the body of the first electrode 210 is circular electrode, insulation board 220 is circular insulating board 220, and the size of insulation board 220 is identical with the body size of the first electrode 210, the circumferential outer edge of the body of the first electrode 210 extends to the plane at the second electrode 230 place vertically downward, to form the first pin 211, the i.e. dome-shaped notch of band pin that is formed in one of the first electrode 210, second electrode 230 is positioned at the centre of the first electrode 210 perpendicular to the projection of the first electrode 210 place plane, and the second electrode 230 is circular electrode, in other embodiments, the position of the second electrode 230 is not by the restriction of the present embodiment, namely the second electrode 230 can be positioned at the side of the first electrode 210 perpendicular to the projection of the first electrode 210 place plane, just can as long as separate with the first pin 211 of the first electrode 210.In addition, as shown in Figure 2 b, first electrode 210 the lower surface of body offer groove 212 towards the upper surface of the first electrode 210, as shown in Figure 2 c, the shape of groove 212 is circular, the position that insulation board 220 is corresponding with groove 212 offers manhole 221, as shown in Figure 2 d, is positioned at the upper surface of the second electrode 230 and the position corresponding with through hole 221 extends to form round boss 232 towards through hole 221.
In the present embodiment, the upper surface of the body of the first electrode 210 is flat surface, and the lower surface of the first pin 211 and the lower surface of the second electrode 230 are at same plane.
And in the present embodiment as shown in Fig. 2 c and Fig. 2 d, the body of the first electrode 210, insulation board 220 and the second electrode 230 by solder sheet 240 from top to bottom successively lamination be connected.In other embodiments, the body of the first electrode 210, insulation board 220 and the second electrode 230 can by solder or other sealing-in modes from top to bottom successively lamination be connected, specific implementation is by the restriction of the present embodiment.
As the optional execution mode of one, in cavity 233, be sealed with gas; Gas comprises inert gas, and inert gas is at least one gas in argon gas, helium, neon, hydrogen, nitrogen, Krypton, then now thin patch element is patch-type gas discharge tube.
As the optional execution mode of one, be packaged with the electrical combination module be combined to form with at least one components and parts of the first electrode 210 and the second electrode 230 electrical interconnects or at least two component circuit in cavity 233, then now thin patch element is overvoltage protective device or for the belt electrode of packaging and the package casing device of paster pin.
As the optional execution mode of one, the body of the first electrode 210 is regular polygon electrode or circular electrode or oval-shaped electrode, and the upper surface of the body of the first electrode 210 is flat surface.
As the optional execution mode of one, insulation board 220 is regular polygon insulation board 220 or circular insulating board 220 or oval insulation board 220.
As the optional execution mode of one, refer to Fig. 2 e, the structure chart of the another kind of thin patch element that Fig. 2 e provides for the embodiment of the present application, as shown in Figure 2 e, based on the replacement of the second electrode 230 of the thin patch element shown in Fig. 2 a, the second electrode 230 in Fig. 2 e is square-shaped electrode, refer to Fig. 2 f, the structure chart of the another kind of thin patch element that Fig. 2 f provides for the embodiment of the present application, as shown in figure 2f, based on the change of the shape of the first pin 211 of the thin patch element shown in Fig. 2 a, the first pin 211 in Fig. 2 f is the plane formation that two segmental arcs of the Relative distribution of the outer rim of the body of the first electrode 210 extend downward the second electrode 230 place.In other embodiments, second electrode 230 can be regular polygon electrode or oval-shaped electrode, and first pin 211 can be that at least one segmental arc any of the outer rim of the body of the first electrode 210 extends downward the second electrode 230 place plane and formed, the selection of the shape of concrete first pin 211 and the shape of the second electrode 230 realizes by the restriction of the present embodiment.
As the optional execution mode of one, groove 212 is oval-shaped groove or circular groove or regular polygon connected in star.
As the optional execution mode of one, through hole 221 is ellipse hole or manhole or regular polygon connected in star.
As the optional execution mode of one, boss 232 is ellipse around boss or round boss or regular polygon boss or round platform.
As the optional execution mode of one, the side of the outer rim of the body of the first electrode 210 extends downward the plane at the second electrode 230 place, to form the first pin 211.
As the optional execution mode of one, the first electrode is metal electrode, and metal electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode; Or electrode is the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold.
As the optional execution mode of one, insulation board 220 is ceramic wafer or glass plate.
As the optional execution mode of one, the lower surface of the body of the first electrode 210 or groove 212 or the upper surface of the second electrode 230 or the surface-coated of boss 232 have electronic emission material.
As the optional execution mode of one, the upper surface of boss 232 is provided with the grid of regular shape, grid is coated with electronic powder emissive material.
As the optional execution mode of one, the sidewall of through hole 221 is provided with carbon line.
To sum up describe, the utility model provides a kind of thin patch element, comprise the first electrode of lamination connection successively from top to bottom, insulation board 220 and the second electrode 230, the lower surface be connected with described insulation board 220 of the body of described first electrode offers groove 212, and the position corresponding with described groove 212 of described insulation board 220 is provided with through hole 221; Be positioned at the upper surface of described second electrode 230 and the position corresponding with described through hole 221 extends to form boss 232 towards described through hole 221, described boss 232 is sheathed in described through hole 221 and forms the cavity 233 with gap with described groove 212; And at least one side of the outer rim of described first electrode extends downward the plane at described second electrode 230 place, to form the first pin 211.The cavity 233 with gap can be formed with the boss 232 of the second electrode 230 by the groove 212 of the first electrode in the present embodiment, decrease the thickness (highly) of element, when then can be positioned over the back side of printed substrate in small space, the safe distance between the back side of printed substrate and external conductive casing can not be had influence on, and then decrease the area occupied of printed substrate, be beneficial to the miniaturization, integrated of electronic product, equipment.
In multiple embodiments that the application provides; should be understood that; more than describe; be only the embodiment of the application; but the protection range of the application is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the application discloses, amendment or the replacement of various equivalence can be expected easily, these amendments or replace all should be encompassed in the application protection range within.
Claims (16)
1. a thin patch element, it is characterized in that, comprise the first electrode of lamination connection successively from top to bottom, insulation board and the second electrode, described first electrode has the notch that card puts described insulation board, described first electrode comprises body and the first pin, wherein, the lower surface be connected with described insulation board of the body of described first electrode offers groove, and the position corresponding with described groove of described insulation board is provided with through hole; Be positioned at the upper surface of described second electrode and the position corresponding with described through hole extends to form boss towards described through hole, described boss is sheathed in described through hole and forms the cavity with gap with described groove; And at least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form described first pin with the second electrode separation.
2. thin patch element as claimed in claim 1, it is characterized in that, the lower surface of described first pin and the lower surface of described second electrode are at same plane.
3. thin patch element as claimed in claim 2, is characterized in that, the body of described first electrode, described insulation board and described second electrode by solder sheet from top to bottom successively lamination be connected.
4. thin patch element as claimed in claim 3, it is characterized in that, the upper surface of the body of described first electrode is flat surface.
5. thin patch element as claimed in claim 4, it is characterized in that, described boss is sheathed in described through hole, is formed have gap and cavity for sealing at least one inert gas in argon gas, helium, neon, hydrogen, nitrogen, Krypton with described groove.
6. thin patch element as claimed in claim 4, is characterized in that, is packaged with the electrical combination module be combined to form with at least one components and parts of described first electrode and described second electrode electrical interconnects or at least two component circuit in described cavity.
7. as the thin patch element as described in arbitrary in claim 1 to 6, it is characterized in that, the body of described first electrode is regular polygon electrode or circular electrode or oval-shaped electrode or the square-shaped electrode with square boss or round boss.
8. thin patch element as claimed in claim 7, is characterized in that, described insulation board is regular polygon insulation board or circular insulating board or oval insulation board.
9. thin patch element as claimed in claim 8, is characterized in that, described second electrode is regular polygon electrode or circular electrode or oval-shaped electrode.
10. thin patch element as claimed in claim 9, is characterized in that, described groove is oval-shaped groove or circular groove or regular polygon connected in star.
11. thin patch elements as claimed in claim 10, is characterized in that, described through hole is ellipse hole or manhole or regular polygon connected in star.
12. thin patch elements as claimed in claim 11, is characterized in that, described boss is ellipse around boss or round boss or regular polygon boss or round platform.
13., as the thin patch element as described in arbitrary in claim 1 to 6, is characterized in that, the body of described first electrode is square-shaped electrode or the electrode with round boss or square boss or rectangle boss, and described insulation board is square insulating plate;
At least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form the first pin, comprising:
The side of the outer rim of the body of described first electrode or relative both sides extend downward the plane at described second electrode place, to form the first pin.
14. as the thin patch element as described in arbitrary in claim 1 to 6, and it is characterized in that, the body of described first electrode is circular electrode, and described insulation board is circular insulating board;
At least one side of the outer rim of the body of described first electrode extends downward the plane at described second electrode place, to form the first pin, comprising:
Any segmental arc of the outer rim of the body of described first electrode or circumferential outer edge extend downward the plane at described second electrode place, to form the first pin.
15., as the thin patch element as described in arbitrary in claim 1 to 6, is characterized in that,
The upper surface of the body of described first electrode is less than or equal to 3mm to the height of the lower surface of described second electrode.
16. thin patch elements as claimed in claim 15, is characterized in that, described first electrode and described second electrode are metal electrode, and described metal electrode is copper electrode or oxygen-free copper electrode or iron nickel electrode; Or described first electrode and described second electrode are the electrode of any one material in electronickelling on copper electrode or oxygen-free copper electrode or iron nickel electrode, chromium, copper, silver, gold;
And described insulation board is ceramic wafer or glass plate;
And the upper surface of the lower surface of body of described first electrode or the surface of groove or described second electrode or the surface-coated of described boss have electronic emission material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420788040.2U CN204441243U (en) | 2014-12-14 | 2014-12-14 | A kind of thin patch element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420788040.2U CN204441243U (en) | 2014-12-14 | 2014-12-14 | A kind of thin patch element |
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| Publication Number | Publication Date |
|---|---|
| CN204441243U true CN204441243U (en) | 2015-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420788040.2U Active CN204441243U (en) | 2014-12-14 | 2014-12-14 | A kind of thin patch element |
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| CN (1) | CN204441243U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128910A (en) * | 2016-07-13 | 2016-11-16 | 深圳市槟城电子有限公司 | A kind of thin patch gas-discharge tube |
-
2014
- 2014-12-14 CN CN201420788040.2U patent/CN204441243U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128910A (en) * | 2016-07-13 | 2016-11-16 | 深圳市槟城电子有限公司 | A kind of thin patch gas-discharge tube |
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Address after: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee after: Shenzhen Penang Electronics Co.,Ltd. Address before: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee before: Shenzhen Bencent Electronics Co.,Ltd. |
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