CN204407309U - Solar silicon wafers bogey - Google Patents
Solar silicon wafers bogey Download PDFInfo
- Publication number
- CN204407309U CN204407309U CN201520159073.5U CN201520159073U CN204407309U CN 204407309 U CN204407309 U CN 204407309U CN 201520159073 U CN201520159073 U CN 201520159073U CN 204407309 U CN204407309 U CN 204407309U
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- support
- poling
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- bogey
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a kind of manufacture of solar cells equipment, is specially a kind of solar silicon wafers bogey.Solve the system existed in silicon chip processing and tie uneven problem, comprise underframe plate, underframe plate is provided with silicon wafer support, silicon wafer support comprises the support of both sides, level frame on two is provided with between both sides, two lower level frames, draw-in groove is provided with inside described two upper level frames, draw-in groove is provided with on the upside of two lower level frames, the support of both sides is provided with poling, and the front end of poling is inclined plane shape, in poling, be equipped with transportation rod, the underframe plate in the outside of support is provided with even flow plate, and even flow plate is provided with uniform flow hole.Use even flow plate, gas can be made to be evenly distributed in boiler tube, make silicon chip surface junction depth more even, have outstanding advantage to the stability of subsequent technique.
Description
Technical field
The utility model relates to a kind of manufacture of solar cells equipment, is specially a kind of solar silicon wafers bogey.
Background technology
The technological process of production of solar battery sheet is divided into silicon chip to detect, surface wool manufacturing and pickling, diffusion, dephosphorization silex glass, plasma etching and pickling, coated with antireflection film, silk screen printing, the links such as Fast Sintering.
Wherein the concrete steps of diffusion link are, solar cell needs a large-area PN junction to realize the conversion of luminous energy to electric energy, and diffusion furnace is the special equipment manufacturing solar cell PN junction.Tubular diffusion furnace is primarily of four major part composition such as the upper download part of quartz boat, exhaust air chamber, oven body part and gas holder part.The general phosphorus oxychloride liquid source of using of diffusion is as diffuse source.P-type silicon sheet is placed in the quartz container of tubular diffusion furnace, under 850---900 celsius temperature, uses nitrogen to bring phosphorus oxychloride into quartz container, reacted by phosphorus oxychloride and silicon chip, obtain phosphorus atoms.Through certain hour, phosphorus atoms enters the superficial layer of silicon chip from surrounding, and by the space between silicon atom to the diffusion of silicon chip internal penetration, defines the interface of N type semiconductor and P type semiconductor, namely PN junction.
In production process, need that silicon chip is put into high temperature furnace and process, in high temperature process, need a resistant to elevated temperatures bogey, this device is not only high temperature resistant, must be corrosion-resistant, and can protect silicon chip, improves silicon chip rate of finished products.There is design defect in traditional bogey, easily makes silicon chip surface system tie uneven.
Summary of the invention
The utility model ties uneven problem to solve the system existed in silicon chip processing, provides a kind of solar silicon wafers bogey.
The technical solution of the utility model is, a kind of solar silicon wafers bogey, comprise underframe plate, underframe plate is provided with silicon wafer support, silicon wafer support comprises the support of both sides, level frame on two is provided with between both sides, two lower level frames, be provided with draw-in groove inside described two upper level frames, be provided with draw-in groove on the upside of two lower level frames, the support of both sides is provided with poling, the front end of poling is inclined plane shape, in poling, be equipped with transportation rod, the underframe plate in the outside of support is provided with even flow plate, and even flow plate is provided with uniform flow hole.
During use, silicon chip assigns in the space of the formation between level frame and lower level frame, and is sent in sintering furnace, and in sintering process, uniform stream can be delivered to the surrounding of silicon chip by even flow plate, and the system knot of guarantee evenly.Described silicon wafer support definitely directly can not contact hand, therefore needs to insert in poling with conveying lever, and end gets up to transport, and the mouth of pipe of inclined-plane dress, can make transportation rod quick and precisely insert, raise labour efficiency.
In a word, the advantage of solar silicon wafers bogey described in the utility model is, uses even flow plate, gas can be made to be evenly distributed in boiler tube, makes silicon chip surface junction depth more even, has outstanding advantage to the stability of subsequent technique.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
Fig. 2 is the vertical view of silicon wafer support
Fig. 3 is the end view of silicon wafer support
Fig. 4 is the end view of even flow plate
In figure: level frame, 2-underframe plate, 3-support, 4-even flow plate, 5-poling, the upper level frame of 6-, 7-transportation rod under 1-.
Embodiment
As schematically shown in Figure 1, a kind of solar silicon wafers bogey, comprise underframe plate 2, underframe plate 2 is provided with silicon wafer support, silicon wafer support comprises the support 3 of both sides, level frame 6 on two is provided with between the support 3 of both sides, two lower level frames 1, as schematically shown in Figure 2, draw-in groove is provided with inside described two upper level frames 6, draw-in groove is provided with on the upside of two lower level frames 1, the support 3 of both sides is provided with poling 5, as schematically shown in Figure 3, the front end of poling 5 is inclined plane shape, transportation rod 7 is equipped with in poling 5, even flow plate 4 is provided with at the underframe plate 2 in the outside of support 3, as schematically shown in Figure 4, even flow plate 4 is provided with uniform flow hole.
Claims (1)
1. a solar silicon wafers bogey, it is characterized in that: comprise underframe plate (2), underframe plate (2) is provided with silicon wafer support, silicon wafer support comprises the support (3) of both sides, two upper level frames (6) are provided with between the support (3) of both sides, two lower level frames (1), described two upper level frame (6) inner sides are provided with draw-in groove, two lower level frame (1) upsides are provided with draw-in groove, the support (3) of both sides is provided with poling (5), the front end of poling (5) is inclined plane shape, transportation rod (7) is equipped with in poling (5), even flow plate (4) is provided with at the underframe plate (2) in the outside of support (3), even flow plate (4) is provided with uniform flow hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520159073.5U CN204407309U (en) | 2015-03-20 | 2015-03-20 | Solar silicon wafers bogey |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520159073.5U CN204407309U (en) | 2015-03-20 | 2015-03-20 | Solar silicon wafers bogey |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204407309U true CN204407309U (en) | 2015-06-17 |
Family
ID=53431146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520159073.5U Expired - Fee Related CN204407309U (en) | 2015-03-20 | 2015-03-20 | Solar silicon wafers bogey |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204407309U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116516317A (en) * | 2023-04-12 | 2023-08-01 | 江苏微导纳米科技股份有限公司 | Carrier boat, treatment equipment and method for controlling pressure drop in carrier boat |
-
2015
- 2015-03-20 CN CN201520159073.5U patent/CN204407309U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116516317A (en) * | 2023-04-12 | 2023-08-01 | 江苏微导纳米科技股份有限公司 | Carrier boat, treatment equipment and method for controlling pressure drop in carrier boat |
| CN116516317B (en) * | 2023-04-12 | 2023-12-15 | 江苏微导纳米科技股份有限公司 | Carrier boat, treatment equipment and method for controlling pressure drop in carrier boat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20210320 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |