CN204392744U - Stack type heat radiation module - Google Patents
Stack type heat radiation module Download PDFInfo
- Publication number
- CN204392744U CN204392744U CN201520032015.6U CN201520032015U CN204392744U CN 204392744 U CN204392744 U CN 204392744U CN 201520032015 U CN201520032015 U CN 201520032015U CN 204392744 U CN204392744 U CN 204392744U
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- China
- Prior art keywords
- heating panel
- perforation
- high power
- power component
- heating
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- Expired - Fee Related
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- 230000005855 radiation Effects 0.000 title description 2
- 238000010438 heat treatment Methods 0.000 claims abstract description 120
- 230000005669 field effect Effects 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 210000001364 upper extremity Anatomy 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011469 building brick Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000001149 thermolysis Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Central Heating Systems (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a stack formula heat dissipation module, including first heating panel, a plurality of second heating panels, third heating panel, tooth stick and nut, wherein the second heating panel sets up between first heating panel and third heating panel, and first, clip an at least high power subassembly between second and the third heating panel, two sides of every high power subassembly are laminating to first, second or third heating panel to run through first, second and third heating panel according to the preface by the tooth stick, by the nut lock solid in the two ends of tooth stick and integrative heat dissipation module that combines into. The pins of the high-power component can be inserted into corresponding jacks in the circuit board to form electrical connection with circuits on the circuit board. Therefore, the utility model discloses can strengthen the radiating effect of high power component by the storehouse mode, improve the electrical stability of long-time operation.
Description
Technical field
The utility model has about a kind of stack-type thermal module, especially utilizes heating panel storehouse in two sides of high power component, and runs through heating panel by tooth rod and lock into radiating module to strengthen radiating efficiency.
Background technology
Generally speaking, the useful life of electronic building brick can successively decrease with temperature, and task performance and electrical characteristic meeting temperature influence, therefore need suitable cooling mechanism to prevent overheated generation.Traditionally, installing the radiating subassembly with radiating fin additional is very simply and the very general practice, because radiating fin has larger surface area, can area of dissipation be increased and conduct heat in air, being configured with of radiating fin is beneficial to formation cross-ventilation simultaneously, and especially large surface area is also conducive to thermal radiation.
Such as, for the single electronic building brick that power consumption in personal computer is the highest, such as central processing unit (CPU) or image processing chip, often need to have the radiating seat of radiating fin in its surface.But, additionally can increase thermal resistance in order to the thermal grease pasting radiating seat, significantly cannot improve thermal conduction rate.
In addition, in power supply device, process big current, high voltage, high-power power transistor are easy to temperature in operation and rise fast, even more than 100 DEG C, and maintain high temperature exothermic state, therefore except using radiating seat, also need to utilize fan to provide forced convertion, to increase radiating rate, prevent overheated and lost efficacy or burnt.But the electric power that fan consumes is also considerable, the problem of vibrations and noise especially can be produced.
For the application of electric test, normal needs operate electric device or the assembly of multiple highly energy-consuming for a long time simultaneously, it is evident that, the heat dissipation of above-mentioned prior art is also inapplicable, because thermal grease is not easily removed completely, and the volume of fan is quite large, for the test environment that accommodation space is quite limited, not too applicable.
Therefore, be sought after a kind of stack-type thermal module, overall space can be saved, simultaneously can for multiple high power component, mat multiple heating panel storehouse is in two sides of each high power component, and utilize tooth rod run through heating panel and locked by screw integral to strengthen radiating efficiency, and conveniently disassemble and reconfigure, and then solve the problem of above-mentioned prior art.
Utility model content
Main purpose of the present utility model is providing a kind of stack-type thermal module, comprise one first heating panel, multiple second heating panel, one the 3rd heating panel, at least two tooth rod and at least four nuts, wherein said second heating panel is arranged between the first heating panel and the 3rd heating panel, and clamp at least one high power component between the first heating panel, described second heating panel and the 3rd heating panel.Two sides of each high power component conform to the first heating panel, the second heating panel or the 3rd heating panel, and sequentially run through the first heating panel, described second heating panel and the 3rd heating panel by tooth rod, and mat nut lock is fixed in two ends of tooth rod, and then the radiating module be combined into one.
Specifically, high power component can be power transistor, such as high power metal-oxide half field effect transistor.In addition, the pin of high power component can directly insert jack corresponding in circuit board, or mat welding and be connected electrically to the corresponding contact of circuit in circuit board, and then is formed with the circuit of circuit board and be electrically connected.
Therefore, the utility model is that adjacent two heating panels are fitted to two sides of high power component by mat stacked manner, provides the structure of two radiating surface, in order to strengthen the thermolysis of high power component, and improves the electric stability of long-time operation.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of display according to the stack-type thermal module of the utility model embodiment.
Fig. 2 is the schematic diagram of display according to the stack-type thermal module of another embodiment of the utility model.
Wherein, description of reference numerals is as follows:
10 first heating panels
11 first radiating fins
20 second heating panels
21 second radiating fins
30 the 3rd heating panels
40 tooth rods
41 nuts
P pin
Q high power component
Embodiment
Below coordinate accompanying drawing and Reference numeral to do more detailed description to execution mode of the present utility model, make to have the knack of those skilled in the art and can implement according to this after studying this specification carefully.
First, please refer to Fig. 1, the schematic diagram of stack-type thermal module of the present utility model.As shown in Figure 1, stack-type thermal module of the present utility model comprises one first heating panel 10, multiple second heating panel 20, one the 3rd heating panel 30, at least two tooth rod 40 and at least four nuts 41, wherein said second heating panel 20 is sequentially storehouses and be arranged between the first heating panel 10 and the 3rd heating panel 30, and the first heating panel 10, at least one high power component Q is clamped between described second heating panel 20 and the 3rd heating panel 30, therefore, two sides of each high power component Q, left surface in such as figure and right flank, conform to the first heating panel 10, second heating panel 20 or the 3rd heating panel 30.
Such as, first heating panel 10 is positioned at Far Left, 3rd heating panel 30 is positioned at rightmost, and the second heating panel 20 is clipped between the first heating panel 10 and the 3rd heating panel 30, and fitted by the first heating panel 10 and the second heating panel 20 respectively in two sides of leftmost high power component Q, and fitted by the second heating panel 20 and the 3rd heating panel 30 respectively in two sides of rightmost high power component Q, in addition, fit between 2 second adjacent heating panels 20 a high power component Q.
For strengthening radiating efficiency further, at least one side of the first heating panel 10, the right flank of the first heating panel 10 in such as figure, additionally can have multiple radiating fin 11, and at least one side of the second heating panel 20, the right flank of the second heating panel 20 in such as figure, additionally can have multiple radiating fin 21.Especially, radiating fin 11 is the top being configured in the first heating panel 10, and radiating fin 21 is the top being configured in the second heating panel 20.It should be noted that the first heating panel 10 and the second heating panel 20 also can have fin or radiating seat.
Above-mentioned high power component Q can be power transistor, such as metal-oxide half field effect transistor, double carrier transistor or insulation gate double carrier transistor (Insulated Gate Bipolar Transistor, IGBT).
Each first heating panel 10, second heating panel 20, the 3rd heating panel 30 have at least two perforation, with sequentially running through the first heating panel 10, second heating panel 20, the 3rd heating panel 30 for tooth rod 40, and mat nut 41 is locked in two ends of tooth rod 40 and locks, and then be combined into one.Meanwhile, the pin P of each high power component Q is configured to the lower edge at corresponding second heating panel 20.Therefore, the pin P of high power component Q can directly insert circuit board (not shown), or mat welding, and is formed with the circuit (not shown) of circuit board and be electrically connected.
With further reference to Fig. 2, the schematic diagram of the stack-type thermal module of another embodiment of the utility model, be similar to the embodiment of Fig. 1, its main difference point is that the embodiment of Fig. 2 comprises two tooth rod 40 and four nuts 41 in addition, and the first heating panel 10, top and the bottom of described second heating panel 20 and the 3rd heating panel 30 have at least two perforation respectively, run through with for four tooth rods 40, and two ends of the tooth rod 40 that locked by eight nuts 41, thus the first heating panel 10, high power component Q can be sandwiched between the top of described second heating panel 20 and the 3rd heating panel 30 and bottom simultaneously, and the pin P being positioned at the high power component Q of top and bottom is respectively towards upper limb and lower edge.
Therefore, the pin P of the high power component Q that the multiple circuit board (not shown) being positioned at top and bottom can sandwich with top and bottom is connected, and then reaches electrical connection.Its advantage is the number that can increase high power component Q, improves integrated operation efficiency, and saves running cost.
The remaining component of Fig. 2 embodiment is the embodiment being same as Fig. 1, thus repeats no more.
But it should be noted that, embodiment in Fig. 1, Fig. 2 just uses the exemplary embodiment clearly demonstrating the utility model technical characteristic, and be not used to limit scope of the present utility model, that is the assembly with identical or equal function all should belong to scope of the present utility model.
In sum, main feature of the present utility model is that adjacent two heating panels are fitted to two sides of high power component by mat stacked manner, the structure of two radiating surface is provided, in order to strengthen the thermolysis of high power component, and improves the electric stability of long-time operation.Especially, once can test multiple to high power component simultaneously, significantly improve testing efficiency, and reduce test operation cost.
Another feature of the present utility model reconfigures after being disassembled all constituent components, therefore uses upper very convenient, and the number of circuit board can arbitrary disposition, as long as the storehouse size of circuit board is in the length range of tooth rod.
Above said content is only to explain preferred embodiment of the present utility model; not attempt does any pro forma restriction to the utility model according to this; therefore; all to have under identical creation spirit do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.
Claims (4)
1. a stack-type thermal module, is characterized in that, comprising:
One first heating panel, has at least two perforation;
Multiple second heating panel, is configured to the side being sequentially stacked over this first heating panel, and each second heating panel has at least two perforation;
One the 3rd heating panel, has at least two perforation, be configured to described second heating panel be by this first heating panel and the 3rd heating panel teamed;
At least two tooth rods, sequentially run through the described perforation of this first heating panel, described second heating panel and the 3rd heating panel respectively; And
At least four nuts, lock two ends of described tooth rod, and then lock this first heating panel, described second heating panel and the 3rd heating panel,
Wherein sandwich between this first heating panel, described second heating panel and the 3rd heating panel and two sides of at least one high power component of fitting, and the pin of this high power component is configured to the lower edge towards this second heating panel.
2., according to stack-type thermal module according to claim 1, it is characterized in that,
This high power component is a power transistor, comprises metal-oxide half field effect transistor or double carrier transistor.
3. a stack-type thermal module, is characterized in that, comprising:
One first heating panel, has at least four perforation, and wherein two perforation are positioned at the top of this first heating panel, and another two perforation are positioned at the bottom of this first heating panel;
Multiple second heating panel, is configured to the side being sequentially stacked over this first heating panel, and each second heating panel has at least four perforation, and wherein two perforation are positioned at the top of this second heating panel, and another two perforation are positioned at the bottom of this second heating panel;
One the 3rd heating panel, there are at least four perforation, wherein two perforation are positioned at the top of the 3rd heating panel, and another two perforation are positioned at the bottom of the 3rd heating panel, and the 3rd heating panel be configured to described second heating panel be by this first heating panel and the 3rd heating panel teamed;
At least four tooth rods, sequentially run through the described perforation of this first heating panel, described second heating panel and the 3rd heating panel respectively; And
At least eight nuts, two ends of the described tooth rod of indivedual locking, and then lock this first heating panel, described second heating panel and the 3rd heating panel,
Wherein sandwich respectively and two sides of at least one high power component of fitting between the top of this first heating panel, described second heating panel and the 3rd heating panel and bottom, and the pin being positioned at the high power component of bottom is configured to the lower edge towards this second heating panel, and the pin of superposed high power component is configured to the upper limb towards this second heating panel.
4., according to stack-type thermal module according to claim 3, it is characterized in that,
This high power component is a power transistor, comprises metal-oxide half field effect transistor or double carrier transistor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103207091 | 2014-04-23 | ||
| TW103207091U TWM492043U (en) | 2014-04-23 | 2014-04-23 | Stacked type heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204392744U true CN204392744U (en) | 2015-06-10 |
Family
ID=52577021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520032015.6U Expired - Fee Related CN204392744U (en) | 2014-04-23 | 2015-01-16 | Stack type heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204392744U (en) |
| TW (1) | TWM492043U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
-
2014
- 2014-04-23 TW TW103207091U patent/TWM492043U/en not_active IP Right Cessation
-
2015
- 2015-01-16 CN CN201520032015.6U patent/CN204392744U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM492043U (en) | 2014-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150610 Termination date: 20190116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |