CN204387765U - 三维立体发光led灯泡 - Google Patents
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Abstract
本实用新型涉及一种三维立体发光LED灯泡，包括灯罩、三维立体发光的LED灯丝、芯柱、导电引出线、灯头绝缘部件、驱动电源和灯头导电部件，所述灯罩的灯罩口与所述芯柱上端口形成密封的灯体；所述芯柱内设有导气管，所述芯柱伸入所述灯罩内，其上端固定一卡槽，卡槽内卡住所述三维立体发光的LED灯丝。本实用新型灯丝的封装无需包覆荧光粉，简化了工艺过程。仅需一灯丝设置在芯柱上端的卡槽上，然后通过灯体和灯头的封装，实现LED灯泡的三维立体发光，该封装具有焊点少、结构简单、封装时间短、成本低等优点。
Description
技术领域
本实用新型涉及一种LED照明灯泡，尤其涉及一种三维立体发光的透明LED灯丝。
背景技术
发光二极管（Light Emitting Diode, LED）因其具有发光效率高、耗电量少、寿命长、可靠性强、环保等优点，正在逐步地取代白炽灯，其应用领域愈来愈广，已被广泛应用在指示灯、信号灯、显示屏、景观照明等领域，在人们的日常生活中处处可见，如电脑显示屏、手机显示屏、台灯、汽车防雾灯、交通信号灯等。
使用LED芯片作为发光光源的灯泡，传统的封装是将一个或多个蓝光芯片固定在一个封装基板上，通过金线焊接串联各个蓝光芯片，且在蓝光芯片上包覆荧光粉，蓝光芯片所发光线激发荧光粉产生黄色光，发射出的部分蓝色光加上荧光粉所发出的黄色光，即形成两者合成后的白光。由于LED芯片为平面发光光源，铜、铝等导电金属材料组成的传统基板不具有透光性，这导致所发出光线仅仅朝LED芯片前方照射，不能到达芯片底部，芯片底部的光线全部浪费，侧面光线也有部分损失，整体的发光角度小于180度。
随着LED照明技术的发展，大角度立体发光的LED照明灯具已有发明。实现大角度立体照明的技术关键在于灯丝的设计，目前立体发光灯丝主要有两种，一种灯丝的基板采用铜、铝材料制成，分别在基板的两个侧面上设置蓝光芯片及红光芯片组合构成的发光单元，全方位激发荧光粉，实现LED灯丝的三维立体发光；另一种灯丝基板是透明的，由玻璃或者陶瓷制成，只需在基板的一个侧面上设置芯片，便可实现LED三维立体发光的目的。
目前的LED灯泡通常采用至少二根灯丝，生产的各灯丝是相互独立的，封装时需经导线焊接后串联在一起，这样的焊点较多，导致了封装时间长，工艺复杂等技术问题。
发明内容
针对现有技术中存在的缺陷和不足，本实用新型的目的是，提供一种结构更为简单合理、封装时间较短、显色性高以及成本更低的三维立体发光LED灯泡。
为实现上述目的，本实用新型的技术方案如下：
一种三维立体发光LED灯泡，包括灯罩、三维立体发光的LED灯丝、芯柱、导电引出线、灯头绝缘部件、驱动电源和灯头导电部件，所述灯罩的灯罩口与所述芯柱上端口形成密封的灯体；所述芯柱内设有导气管，所述芯柱伸入所述灯罩内，其上端固定一卡槽，卡槽内卡住所述三维立体发光的LED灯丝。
所述三维立体发光的LED灯丝由透明基板、芯片和荧光透明陶瓷盖组成，所述透明基板呈面状结构，由荧光透明陶瓷材料制成，其厚度小于0.5mm，所述芯片直接封装于所述透明基板的一个侧面上，其包括至少两列有规律排布的蓝光芯片和红光芯片，每隔三个蓝光芯片设置一个红光芯片，蓝光芯片和红光芯片通过金属导线连接，所述荧光透明陶瓷盖直接覆盖在所述芯片的外围，并通过胶体固定在所述透明基板上。
所述卡槽由玻璃或改性塑料或陶瓷或金属类中的任何一种材料制成，其两条导电引出线贯穿所述芯柱内，与所述驱动电源的正、负电极连接。
所述三维立体发光的LED灯丝伸入所述灯罩内，其正、负电极设置于所述灯丝的下端。
本实用新型的有益效果是：
将基板的材料和芯片的包覆层使用荧光透明陶瓷，保证了荧光粉在透明陶瓷基体中的均匀性，避免了使用荧光粉与树脂混合后沉降导致的不均匀性。
荧光透明陶瓷的使用，避免了芯片和基板周围包覆荧光粉的工艺过程，简化了工艺流程，缩短了封装时间。
LED灯泡仅需一灯丝安装在芯柱上端的卡槽内，无需现有大多发明所提的两条以上灯丝，减少了焊线、焊点和连接片等。
在基板的一个侧面直接封装多个蓝光芯片和红光芯片，有效地提高了LED灯丝及灯泡的显色性。
因此本实用新型依托成熟的生产工序便可制造的三维立体发光LED灯泡，具有较简单的结构，较短的封装时间，较低的生产成本和较高的显色性等优点。
附图说明
图1是本实用新型的三维立体发光LED灯泡的结构立体示意图；
图2是三维立体发光灯丝结构之一示意图；
图3是三维立体发光灯丝结构之二示意图。
具体实施方式
下面将结合具体实施例及附图对本实用新型的结构原理作进一步的详细说明。
本实用新型提出了一种三维立体发光LED灯泡，灯泡结构示意图如图1所示，主要包括灯罩1、三维立体发光的LED灯丝2、芯柱3、导电引出线5、灯头绝缘部件6、驱动电源7和灯头导电部件8。所述灯罩1的灯罩口与所述芯柱3上端口形成密封的灯体；所述芯柱3内设有导气管4，利用其向灯体内通入散热保护气体10；所述芯柱3伸入所述灯罩1内；所述芯柱3上端固定一卡槽9，其用于设置所述三维立体发光的LED灯丝2。
所述三维立体发光LED灯丝2，主要由透明基板11、芯片12和荧光透明陶瓷盖16组成,如图2-3所示。
所述透明基板11设置呈面状结构，采用荧光透明陶瓷材料制成，其厚度为小于0.5mm。
所述芯片12直接封装于所述透明基板11的一个侧面上；其包括至少两列有规律排布的蓝光芯片13和红光芯片14，蓝光芯片13和红光芯片14通过金属导线15连接，连接方式有顺次串联和串、并混合，如图2所示的顺次串联，如图3所示的6个蓝光芯片13和一个红光芯片14为一串联发光组，两个同样的发光组再并联。
所述荧光透明陶瓷盖16直接覆盖所述芯片12的外围，与透明基板接触处采用胶体固定来保障其气密性。
所述透明基板11和所述荧光透明陶瓷盖16所采用的荧光透明陶瓷由荧光粉与MgAl2O4粉体混合制成，保证了荧光粉在透明陶瓷基体中的均匀性，避免了现有荧光粉与树脂混合后沉降导致的不均匀，无需在基板和芯片的周围包覆荧光粉，使得LED灯丝的封装工艺更加简单，封装时间缩短。
荧光透明陶瓷中的荧光粉起到了荧光转换的作用，将蓝光芯片13发出的部分蓝光转换为黄光，剩余的蓝光和转换后的黄光混合成为所需的白光，再通过红光芯片14进行补偿，便可获得低色温和高显色性白光。由于不同的应用领域所需LED灯泡的光效高低不一样，可以通过适当的排列方式解决，一般情况下，设置红光芯片14的数量远少于蓝光芯片13的数量，在本实施例中，每间隔3个蓝光芯片13设置一个红光芯片14。
所述芯片12周围均为荧光透明陶瓷，以使所述芯片12发出的光可透过所述透明基板11和所述荧光透明陶瓷盖16向所有方向发光，即实现所述三维立体发光的LED灯丝2。
所述三维立体发光的灯丝2伸入所述灯罩1内，其正、负电极设置于所述灯丝的下端，以方便直接安装在所述卡槽9上，分别与所述卡槽的正、负电极连接。此安装只需一灯丝，避免了多个焊点，具有较简单的结构，封装时间较短的优点。
所述卡槽9由玻璃、改性塑料、陶瓷、金属类等任何一种材料制成，其两条导电引出线5贯穿所述芯柱3内，与所述驱动电源7的正、负电极连接。
所述芯柱3用于支撑所述三维立体发光的LED灯丝2，通常为陶瓷材料，方便所述卡槽9与其固定连接。所述芯柱3的上端设有一个通孔，其内部的所述导气管4的上端与此通孔相通，利用所述导气管4向密封灯体内充入所述散热保护气体10，同时将其内部空气挤出，使密封灯体内部充满一定气压的所述散热保护气体10，接着封闭所述导气管4的下端口。
所述导气管4由玻璃构成。
所述散热保护气体10为氢气和惰性气体氦气的混合物，能起到最佳导热效果，通过所述灯罩1便可达到较好的散热效果，可避免所述三维立体发光的LED灯丝2与空气反应发生氧化，提高所述三维立体发光的LED灯丝2的使用寿命。
所述灯罩1可选用的材料为玻璃、透明PC+棱筋、透明PC+磨砂粉等任何一种方案制成，其形状可以设计为任意形状，如火苗式、半球形和蜡烛形等。
将所述灯罩1的灯罩口和所述芯柱3上端口密封的灯体与所述灯头绝缘部件6上端熔接，所述灯头绝缘部件6为塑料构成的绝缘环，所述芯柱3下端紧贴所述灯头绝缘部件6的内壁。
所述驱动电源7通过胶体固定于所述灯头绝缘部件6的内部，其电极与所述灯头导电部件8相连接。所述灯头绝缘部件6下端内部为螺纹结构，将具有螺接头的所述灯头导电部件8螺锁于其内部，起到了对所述灯头导电部件8的绝缘效果，以防触电造成伤害。所述灯头导电部件8与一个外接电源连接，便可实现LED灯泡的三维立体发光。
作为示例性的说明，本实用新型实施例的三维立体发光LED灯泡主要通过三大步制造：（1）三维立体发光LED灯丝的封装，（2）灯体封装，（3）灯头封装，详细封装过程如下：
（1）将蓝光芯片和红光芯片按照光效的要求固定在透明基板上，使用金属导线串联或串、并联这些芯片，然后用荧光透明陶瓷盖覆盖所有芯片，使用胶体密封荧光透明陶瓷盖和透明基片，制造过程中需在透明基板的下端预设正、负电极，以形成了三维立体发光的LED灯丝。
（2）将卡槽焊装在芯柱上，导气管固定于芯柱内部，其上端口恰好与芯柱内上端口的通孔重合，接着将一灯丝安装在卡槽上，使两者电极相接，然后将固定好的灯丝、卡槽和芯柱伸入灯罩内部，熔封灯罩口和芯柱的上端口边缘形成密封灯体，气体仅通过导气管和密封的灯体相通，然后通过导气管向灯体内充入散热保护气体，逼出空气。
（3）将灯头绝缘部件与灯体熔封，芯柱下端缘密接灯头绝缘部件，接着将卡槽和芯柱的导电引出线与驱动电源电极相接，将驱动电源用胶体灌封在灯头绝缘部件内部，然后将灯头导电部件螺接在灯头绝缘部件内部下端，且其电极与驱动电源相通。至此完成了三维立体发光LED灯泡制造。
Claims (4)
1.一种三维立体发光LED灯泡，包括灯罩(1)、三维立体发光的LED灯丝(2)、芯柱(3)、导电引出线(5)、灯头绝缘部件(6)、驱动电源(7)和灯头导电部件(8)，其特征在于：所述灯罩(1)的灯罩口与所述芯柱(3)上端口形成密封的灯体；所述芯柱(3)内设有导气管(4)，所述芯柱(3)伸入所述灯罩(1)内，其上端固定一卡槽(9)，卡槽(9)内卡住所述三维立体发光的LED灯丝(2)。
2. 根据权利要求1所述的三维立体发光的LED灯泡，其特征在于：所述三维立体发光的LED灯丝(2)由透明基板(11)、芯片(12)和荧光透明陶瓷盖(16)组成，所述透明基板(11)呈面状结构，由荧光透明陶瓷材料制成，其厚度小于0.5mm，所述芯片(12)直接封装于所述透明基板(11)的一个侧面上，其包括至少两列有规律排布的蓝光芯片(13)和红光芯片(14)，每隔三个蓝光芯片(13)设置一个红光芯片(14)，蓝光芯片(13)和红光芯片(14)通过金属导线(15)连接，所述荧光透明陶瓷盖(16)直接覆盖在所述芯片(12)的外围，并通过胶体固定在所述透明基板(11)上。
3.根据权利要求1所述的三维立体发光的LED灯泡，其特征在于：所述卡槽(9)由玻璃或改性塑料或陶瓷或金属类中的任何一种材料制成，其两条导电引出线(5)贯穿所述芯柱(3)内，与所述驱动电源(7)的正、负电极连接。
4.根据权利要求1或2或3所述的三维立体发光的LED灯泡，其特征在于：所述三维立体发光的LED灯丝(2)伸入所述灯罩(1)内，其正、负电极设置于所述灯丝(2)的下端。
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