CN204362480U - A kind of radiator structure - Google Patents
A kind of radiator structure Download PDFInfo
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- CN204362480U CN204362480U CN201420666658.1U CN201420666658U CN204362480U CN 204362480 U CN204362480 U CN 204362480U CN 201420666658 U CN201420666658 U CN 201420666658U CN 204362480 U CN204362480 U CN 204362480U
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- strutting piece
- generating member
- heat generating
- heat
- radiator structure
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Abstract
The utility model relates to a kind of radiator structure, and it comprises: install heat generating member on circuit boards, and the radiating subassembly fixed with described heat generating member.Described radiator structure has radiating efficiency high and reduce the advantage of production cost.
Description
Technical field
The utility model relates to electronic circuit technology field, particularly relates to a kind of radiator structure.
Background technology
Radiator structure of the prior art is many to be dispelled the heat to the metal-oxide-semiconductor (mos field effect transistor) on the circuit board in this radiator structure by its inner radiator arranged.
Radiator structure of the prior art comprises circuit board, radiator, the aluminium alloy base plate being fixed on radiator structure inside and insulation and is fixed on multiple semiconductor device on described aluminium alloy base plate.Because the radiator being arranged in this radiator structure does not contact with the metal shell of this radiator structure, thus, the heat that metal-oxide-semiconductor in radiator structure self produces directly can not pass to the metal shell of radiator structure, can only first be delivered in the inner air of radiator structure, transferred heat to the metal shell of radiator structure again by air, finally by this metal shell, heat is delivered in extraneous air.Because the conductive coefficient of air is little, thermal resistance is very large, the heat that metal-oxide-semiconductor self is produced by transfer of air to the process of the metal shell of radiator structure in conduction efficiency very low, radiating effect is poor.
There is the low problem of radiating efficiency in radiator structure of the prior art.
Utility model content
For the problems referred to above, according to the utility model proposes a kind of radiator structure, it comprises: install heat generating member on circuit boards, and the radiating subassembly fixed with described heat generating member.Heat generating component in the application is that heat-conducting manufacture forms, and therefore, the heat that heat generating member produces in the course of the work can be directly passed to radiating subassembly without the need to transferring heat to air in advance, then by transfer of air to radiating subassembly.Like this, avoid the conductive coefficient due to air little, and the aerial conductivity of the heat that heat generating member self is produced is lower, and the radiating efficiency of heat generating member is reduced.Radiator structure in the application avoids the process passed by the heat of heat generating member by air effectively, but directly the heat of heat generating member is passed to radiating subassembly, finally passed by the heat of radiating subassembly by heat generating member, greatly increase radiating efficiency, ensure that the normal work of heat generating member.
Preferably, described radiating subassembly comprises strutting piece.This strutting piece is used for fixing and mounting circuit boards, because this strutting piece is that heat-conducting manufacture forms, and this heat-conducting has the large characteristic of conductive coefficient, therefore, in time the heat of the heat generating member received can be passed, play the effect of heat transfer rapidly and quickening heat radiation.
Preferably, described heat generating member is arranged between described circuit board and described strutting piece, and the height of the distance between described circuit board with described strutting piece and described heat generating member is identical.Namely by the position of Circuit tuning plate in bolt, realizing circuit plate is identical with the height of the distance between strutting piece and heat generating member, then by tighting a bolt, making this heat generating member that any loosening can not occur between circuit board and strutting piece, realizing the object be fixed.
Preferably, described radiating subassembly also comprises the casing that inside is provided with described circuit board, described heat generating member and described strutting piece.This box house has container cavity, and this casing also comprises diapire and is symmetricly set on the first side wall and second sidewall of these diapire both sides.Wherein, this first side wall and the second sidewall, in order to install and securing supports, make this strutting piece can be positioned in this casing.
Preferably, described casing comprises diapire and is symmetricly set on the first side wall and second sidewall of described diapire both sides, the inner surface of described the first side wall is provided with and supports floor towards first of described second projected side wall, and the inner surface of described second sidewall is provided with and supports floor towards second of described the first side wall projection.This first support floor and the second support floor are heat-conducting manufacture and form.In addition, this heat-conducting has the large characteristic of conductive coefficient concurrently, be conducive to like this being delivered to the outside of this casing by being arranged in the electric components of casing and heat generating member because of the heat that produces after work a period of time with speed faster, thus play the effect of the internal temperature of heat and the reduction casing reducing electric components and heat generating member self.Efficiently avoid electric components and heat generating member because of self temperature too high and cannot normally work, even there is the phenomenon of scaling loss.In addition, when not affecting other electric components in casing and installing, by increasing the plane of flattening of this first support floor towards the second sidewall direction, simultaneously, increase this second support floor towards the plane of flattening in the first side wall direction and the surface roughness reducing the first support floor and the second support floor, make this first surface supporting floor and the second support floor meet smooth, smooth requirement.Thus the heat received by this strutting piece is conducted with larger area of dissipation.
Preferably, the first end of described strutting piece and described first supports floor and fixes, and the second end of described strutting piece and described second supports floor and fixes.
Preferably, it is that bolt is connected that the first end and described first of described strutting piece supports floor, and it is that bolt is connected that second end and described second of described strutting piece supports floor.
Preferably, between described circuit board with described strutting piece for bolt is connected.
Preferably, the installed surface of described heat generating member and the bottom face of described circuit board fit, and the radiating surface of described heat generating member and the upper surface of described strutting piece fit.The heat so just making this heat generating member produce because of work passes to strutting piece in time, expeditiously, avoid depositing between the installed surface in heat generating member and the bottom face of circuit board and between the radiating surface of heat generating member and the upper surface of strutting piece to have air because forming gap, and then, avoid the efficiency reducing heat radiation.
According to the utility model, it is high and reduce the advantage of production cost that described radiator structure has radiating efficiency.
Accompanying drawing explanation
Also will be described in more detail the utility model with reference to accompanying drawing based on embodiment hereinafter.In the drawings:
Fig. 1 is the overall structure schematic diagram of radiator structure of the present utility model.
In the accompanying drawings, identical parts use identical Reference numeral.Accompanying drawing is not according to the scaling of reality.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Refer to Fig. 1, it is the overall structure schematic diagram of radiator structure of the present utility model.As shown in the figure, described radiator structure comprises circuit board 1, heat generating member 2 and radiating subassembly 3.Wherein, heat generating member 2 is installed on the circuit card 1, and fixes with this radiating subassembly 3.
In a preferred embodiment, radiating subassembly 3 comprises strutting piece 31 and casing 32.The inside of this casing 32 has container cavity 321.Circuit board 1, heat generating member 2 and strutting piece 31 are installed in this container cavity 321, and, be laminated to each other between circuit board 1, heat generating member 2 and strutting piece 31 and be arranged in the container cavity 321 of casing 32.Wherein, this casing 32 also comprises diapire 322 and is symmetricly set on the first side wall 323 and second sidewall 324 of these diapire 322 both sides.In the embodiment of the application, casing 32 is also formed by heat-conducting manufacture, and the conductive coefficient of this material is large, is conducive to heat radiation.
In a preferred embodiment, the inner surface of this first side wall 323 is provided with and supports floor 3231 towards first of the second sidewall 324 projection.The inner surface of this second sidewall 324 is provided with and supports floor 3241 towards second of the first side wall 323 projection.Wherein, this first supports floor 3231 and second and supports floor 3241 and be heat-conducting manufacture and form.In addition, this heat-conducting has the large characteristic of conductive coefficient concurrently, is conducive to like this being delivered to the outside of this casing 32 by being arranged in the electric components of casing 32 and heat generating member 2 because of the heat that produces after work a period of time with speed faster.Thus, play the effect of the heat reducing electric components and heat generating member 2 self, and play the effect of the internal temperature reducing casing 32.Efficiently avoid electric components and heat generating member 2 because of self temperature too high and cannot normally work, even there is the phenomenon of scaling loss.In the embodiment of the application, this heat-conducting can be aluminium alloy.And, this the first support floor 3231 and second supports floor 3241 when not affecting other electric components in casing 32 and installing, the distance between this first support floor 3231 and second support floor 3241 should be reduced as much as possible, namely the plane of flattening of this first support floor 3231 towards the second sidewall 324 direction is increased, meanwhile, the plane of flattening of this second support floor 3241 towards the first side wall 323 direction is increased.In addition, also should reduce the surface roughness of this first support floor 3231 and the second support floor 3241, make this first surface supporting floor 3231 and the second support floor 3241 meet smooth, smooth requirement.
In a preferred embodiment, this strutting piece 31 forms for heat-conducting manufacture, and the conductive coefficient of this heat-conducting is comparatively large, thus the heat be conducive to heat generating member 2 self produces conducts timely.The sectional dimension of this strutting piece 31 is identical with the sectional dimension of the diapire 322 of casing 32.The two ends of this strutting piece 31 are separately fixed at the first support floor 3231 and second and support on floor 3241, fit by the bottom face of the first end 311 of this strutting piece 31 and this first upper surface supporting floor 3231, then be fixed by screw or bolt, simultaneously, the bottom face of the second end 322 of this strutting piece 31 and this second upper surface supporting floor 3241 are fitted, to be fixed by screw or bolt then equally.Thus, complete the installation of this strutting piece 31 in casing 32.Due to aforementioned first support floor 3231 and second is supported the comparatively large of the plane of flattening design of floor 3241 relative direction, this first support floor 3231 and the contact area between the second support floor 3241 and strutting piece 31 effectively can be increased like this.Thus the heat making this strutting piece 31 receive heat generating member 2 transmission conducts with larger area of dissipation.
In addition, because the surface roughness of aforesaid first support floor 3231 and the second support floor 3241 is lower, i.e. smooth surface, thus can fit closely in the upper surface that the upper surface making the bottom face of the first end 311 of strutting piece 31 and first support floor 3231 can fit and make the bottom face and second of the second end 312 of strutting piece 31 to support floor 3241 closely.Like this, can not there be gap at the position contacted with the second upper surface supporting floor 3241 at the bottom face of the position that the bottom face of first end 311 contacts with the first upper surface supporting floor 3231 and the second end 312, and then can not have air.At increase strutting piece 31 respectively and first support while floor 3231 and second supports the contact area between floor 3241, reduce first and support the surface roughness that floor 3231 and second supports floor 3241, effectively can reduce strutting piece 31 respectively and first support floor 3231 and second and support contact heat resistance between floor 3241.Like this, when thermal resistance is less, the heat that strutting piece 31 can be conducive to receive passes to the first support floor 3231 and second timely and supports floor 3241.Then, the heat received is passed to the first side wall 323 by this first support floor 3231, the heat received is passed to the second sidewall 324 by this second support floor 3241, finally, conducted heat to the outside of casing 32 by the first side wall 323 and the second sidewall 324, reach the object reducing casing 32 internal temperature.
If the surface roughness of the first support floor 3231 and the second support floor 3241 is higher, then can forms gap at the position contacted with strutting piece 31, in gap, can air be had.When strutting piece 31 transfers heat to the first support floor 3231 and the second support floor 3241, this heat can not be directly passed to the first side wall 323 and the second sidewall 324, but will air first in aforementioned gap, then transfer heat to the first side wall 323 and the second sidewall 324 by air.Because the conductive coefficient of air is very little, thus the aerial conduction efficiency of heat is reduced, cause the problem that there is radiating effect difference.Therefore it is low that this first support floor 3231 and the second support floor 3241 should be made to meet surface roughness, make the ganoid requirement of the first support floor 3231 and the second support floor 3241.
In a preferred embodiment, the mode that circuit board 1 is bolted is fixed on strutting piece 31.By adjusting this position of circuit board 1 in bolt, the adjustment of the spacing of this circuit board 1 relative support 31 can be realized.
In a preferred embodiment, be provided with heat generating member 2 between circuit board 1 and strutting piece 31, wherein, the installed surface 21 in this heat generating member 2 is fixed on the bottom face of circuit board 1 by the mode of welding.The height of this heat generating member 2 is identical with the distance between circuit board 1 and strutting piece 31, namely by the position of Circuit tuning plate 1 in bolt, the height of the distance between realizing circuit plate 1 with strutting piece 31 and heat generating member 2 is identical, then by tighting a bolt, the radiating surface 22 of this heat generating member 2 is fitted tightly with the upper surface of strutting piece 31, and then make heat generating member 2 that any loosening can not occur between circuit board 1 and strutting piece 31, achieve the object that this heat generating member 2 is fixed.
In a preferred embodiment, the installed surface 21 of heat generating member 2 fits with the bottom face of circuit board 1, and the radiating surface 22 of this heat generating member 2 fits with the upper surface of strutting piece 31.Like this, the heat just making this heat generating member 2 produce in the course of the work can pass to strutting piece 31 in time, expeditiously, avoid there is air because forming gap between the installed surface 21 in heat generating member 2 and the bottom face of circuit board 1 and between the radiating surface 22 of heat generating member 2 and the upper surface of strutting piece 31, and then, avoid the efficiency reducing heat radiation.In the embodiment of the application, heat generating member 2 can be metal-oxide-semiconductor (mos field effect transistor).
In the embodiment of the application, the heat that heat generating member 2 in casing 32 and electric components produce in the course of the work can pass to strutting piece 31 in time, the heat received is passed to the first support floor 3231 and second and supports floor 3241 by this strutting piece 31, first supported floor 3231 and second by this and support floor 3241 heat is passed to the first side wall 323 and the second sidewall 324 accordingly again, finally by this first side wall 323 and the second sidewall 324, heat is delivered to the outside of casing 32.Wherein, form because strutting piece 31, the first side wall 323, second sidewall 324, first support floor 3231 and the second support floor 3241 are heat-conducting manufacture.In addition, by utilizing the advantage that the area of dissipation of this first side wall 323 and the second sidewall 324 is larger, reach the object reducing heat generating member 2 and electric components heat, and reach the object reducing casing 32 internal temperature, ensure that the normal work of the electric components in casing 32.In addition, whole radiation processes, without the need to the transmission through air, greatly increases radiating efficiency.Simultaneously, because this heat generating member 2 is without the need to relating to special radiator, only need by this heat generating member 2 be arranged between circuit board 1 and strutting piece 31, and the installed surface 21 of this heat generating member 2 is fitted with the bottom face of circuit board 1, the radiating surface 22 of this heat generating member 2 and the upper surface of strutting piece 31 fit and make the bottom face at the two ends of strutting piece 31 support floor 3231 with first respectively and the second upper surface supporting floor 3241 fits, realize the transmission of heat, heat is delivered to the outside of casing 32 the most at last.As can be seen here, to have radiating efficiency high and reduce the advantage of production cost for described radiator structure.
Although be described the utility model with reference to preferred embodiment, when not departing from scope of the present utility model, various improvement can be carried out to it and parts wherein can be replaced with equivalent.Especially, only otherwise there is structural hazard, the every technical characteristic mentioned in each embodiment all can combine in any way.The utility model is not limited to specific embodiment disclosed in literary composition, but comprises all technical schemes fallen in the scope of claim.
Claims (7)
1. a radiator structure, is characterized in that, it comprises:
Heat generating member is on circuit boards installed, and
The radiating subassembly fixed with described heat generating member, described radiating subassembly comprises strutting piece, and described heat generating member is arranged between described circuit board and described strutting piece, and the height of the distance between described circuit board with described strutting piece and described heat generating member is identical.
2. radiator structure according to claim 1, is characterized in that, described radiating subassembly also comprises the casing that inside is provided with described circuit board, described heat generating member and described strutting piece.
3. radiator structure according to claim 2, it is characterized in that, described casing comprises diapire and is symmetricly set on the first side wall and second sidewall of described diapire both sides, the inner surface of described the first side wall is provided with and supports floor towards first of described second projected side wall, and the inner surface of described second sidewall is provided with and supports floor towards second of described the first side wall projection.
4. radiator structure according to claim 3, is characterized in that, the first end of described strutting piece and described first supports floor and fixes, and the second end of described strutting piece and described second supports floor and fixes.
5. radiator structure according to claim 4, is characterized in that, it is that bolt is connected that the first end and described first of described strutting piece supports floor, and it is that bolt is connected that second end and described second of described strutting piece supports floor.
6. radiator structure according to any one of claim 1 to 5, is characterized in that, for bolt is connected between described circuit board with described strutting piece.
7. radiator structure according to claim 6, is characterized in that, the installed surface of described heat generating member and the bottom face of described circuit board fit, and the radiating surface of described heat generating member and the upper surface of described strutting piece fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420666658.1U CN204362480U (en) | 2014-11-10 | 2014-11-10 | A kind of radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420666658.1U CN204362480U (en) | 2014-11-10 | 2014-11-10 | A kind of radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204362480U true CN204362480U (en) | 2015-05-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420666658.1U Active CN204362480U (en) | 2014-11-10 | 2014-11-10 | A kind of radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204362480U (en) |
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2014
- 2014-11-10 CN CN201420666658.1U patent/CN204362480U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Fifty-seven, Zhuzhou Province, China National hi tech Development Zone, Hunan, Li Yu Industrial Park, district 412007 Patentee after: Zhongche Times Electric Vehicle Co.,Ltd. Address before: Fifty-seven, Zhuzhou Province, China National hi tech Development Zone, Hunan, Li Yu Industrial Park, district 412007 Patentee before: HUNAN CRRC TIMES ELECTRIC VEHICLE Co.,Ltd. Address after: Fifty-seven, Zhuzhou Province, China National hi tech Development Zone, Hunan, Li Yu Industrial Park, district 412007 Patentee after: HUNAN CRRC TIMES ELECTRIC VEHICLE Co.,Ltd. Address before: Fifty-seven, Zhuzhou Province, China National hi tech Development Zone, Hunan, Li Yu Industrial Park, district 412007 Patentee before: HUNAN CSR TIMES ELECTRIC VEHICLE Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |