CN204361083U - 一种针脚直插式产品封装结构 - Google Patents

一种针脚直插式产品封装结构 Download PDF

Info

Publication number
CN204361083U
CN204361083U CN201420807632.4U CN201420807632U CN204361083U CN 204361083 U CN204361083 U CN 204361083U CN 201420807632 U CN201420807632 U CN 201420807632U CN 204361083 U CN204361083 U CN 204361083U
Authority
CN
China
Prior art keywords
stitch
direct insertion
insertion product
groove
encapsulating structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420807632.4U
Other languages
English (en)
Inventor
周容德
张珊
龚臻
刘怡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN201420807632.4U priority Critical patent/CN204361083U/zh
Application granted granted Critical
Publication of CN204361083U publication Critical patent/CN204361083U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

本实用新型涉及一种针脚直插式产品封装结构，属于半导体封装技术领域。它包括引线框（1），所述引线框（1）正面设置有凹槽（2），所述凹槽（2）内插装有针脚直插式产品（4），所述针脚直插式产品（4）通过焊料（3）与凹槽（2）相连接，所述引线框（1）和针脚直插式产品（4）周围包封有塑封料（5）。本实用新型一种针脚直插式产品封装结构，它在引线框表面增加凹槽设计，能够与针脚直插式产品形成良好的物理键合，并可以增加针脚直插式产品与焊料的接触面积，从而可以增加产品的可靠性，同时能够降低封装体的整体高度。

Description

一种针脚直插式产品封装结构
技术领域
本实用新型涉及一种针脚直插式产品封装结构，属于半导体封装技术领域。
背景技术
目前行业内的针脚直插式产品基本为直接安装电路板上，少部分应用在3D封装结构中，通过增加焊接材料和设备改进来使用。
现有针脚直插式产品安装设计结构不能有效增强焊接稳定性和可焊性，无法形成系统级产品，针脚直插式产品与其它元件也无法形成良好的物理键合。
发明内容
本实用新型的目的在于克服上述不足，提供一种针脚直插式产品封装结构，它在引线框表面增加凹槽设计，能够与针脚直插式产品形成良好的物理键合，并可以增加针脚直插式产品与焊料的接触面积，从而可以增加产品的可靠性，同时能够降低封装体的整体高度。
本实用新型的目的是这样实现的：一种针脚直插式产品封装结构，它包括引线框，所述引线框正面设置有凹槽，所述凹槽内插装有针脚直插式产品，所述针脚直插式产品通过焊料与凹槽相连接，所述引线框和针脚直插式产品周围包封有塑封料。
与现有技术相比，本实用新型具有以下有益效果：
本实用新型一种针脚直插式产品封装结构，它在引线框表面增加凹槽设计，能够与针脚直插式产品形成良好的物理键合，并可以增加针脚直插式产品与焊料的接触面积，从而可以增加产品的可靠性，同时能够降低封装体的整体高度。
附图说明
    图1为本实用新型一种针脚直插式产品封装结构的结构示意图。
其中：
引线框1
凹槽2
焊料3
针脚直插式产品4
塑封料5。
具体实施方式
参见图1，本实用新型一种针脚直插式产品封装结构，它包括引线框1，所述引线框1正面设置有凹槽2，所述凹槽2内插装有针脚直插式产品4，所述针脚直插式产品4通过焊料3与凹槽2相连接，所述引线框1和针脚直插式产品4周围包封有塑封料5。

Claims (1)

1.一种针脚直插式产品封装结构，其特征在于：它包括引线框（1），所述引线框（1）正面设置有凹槽（2），所述凹槽（2）内插装有针脚直插式产品（4），所述针脚直插式产品（4）通过焊料（3）与凹槽（2）相连接，所述引线框（1）和针脚直插式产品（4）周围包封有塑封料（5）。
CN201420807632.4U 2014-12-19 2014-12-19 一种针脚直插式产品封装结构 Active CN204361083U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420807632.4U CN204361083U (zh) 2014-12-19 2014-12-19 一种针脚直插式产品封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420807632.4U CN204361083U (zh) 2014-12-19 2014-12-19 一种针脚直插式产品封装结构

Publications (1)

Publication Number Publication Date
CN204361083U true CN204361083U (zh) 2015-05-27

Family

ID=53262536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420807632.4U Active CN204361083U (zh) 2014-12-19 2014-12-19 一种针脚直插式产品封装结构

Country Status (1)

Country Link
CN (1) CN204361083U (zh)

Similar Documents

Publication Publication Date Title
MY196641A (en) Low Profile Leaded Semiconductor Package
WO2011090574A3 (en) Semiconductor package and method
CN204361083U (zh) 一种针脚直插式产品封装结构
CN203967124U (zh) 一种倒装封装多面发光的led灯
CN202712172U (zh) 一种多芯片双基岛的sop封装结构
CN202651105U (zh) 贴片式桥式引线框架
CN201829490U (zh) 芯片区打孔集成电路引线框架
CN204361084U (zh) 一种增强管脚抵抗永久变形和断裂能力的引线框架结构
CN204516746U (zh) 可插拔fpc的指纹传感器封装结构
CN203774321U (zh) 一种用于sot23半导体的双二极管封装结构
CN102332413A (zh) 一种smt锡膏链接工艺
CN202585399U (zh) 引线框架
CN204303801U (zh) 双面bump芯片包封后重布线的封装结构
CN202363190U (zh) 一种焊接型热敏电阻
CN204029816U (zh) 一种贴片式二极管
CN204375731U (zh) 一种cob基板及cob光源
CN104779224A (zh) 一种功率器件的qfn封装结构
EP2741321A3 (en) Semiconductor device and method of manufacturing the same
CN204144251U (zh) 一种多面发光的led灯珠
CN204178646U (zh) 贴片式的led数码显示器
CN102324411A (zh) 新型无基岛预填塑封料引线框结构
CN102315191A (zh) 新型有基岛预填塑封料引线框结构
CN203721704U (zh) 一种8dip半导体pmf与cap的封装结构
CN203746833U (zh) 在功率半导体封装中使用的焊接用信号引线
CN202816922U (zh) 一种sot89-3l封装引线框架

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant