CN204348704U - Power electronic element and Intelligent Power Module - Google Patents
Power electronic element and Intelligent Power Module Download PDFInfo
- Publication number
- CN204348704U CN204348704U CN201420546409.9U CN201420546409U CN204348704U CN 204348704 U CN204348704 U CN 204348704U CN 201420546409 U CN201420546409 U CN 201420546409U CN 204348704 U CN204348704 U CN 204348704U
- Authority
- CN
- China
- Prior art keywords
- power module
- intelligent power
- transparency carrier
- electronic component
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of Intelligent Power Module, it comprises transparency carrier.Transparency carrier comprises upper surface and connects the side of upper surface.Intelligent Power Module also comprises the adhesive layer be arranged on upper surface, be formed at the circuit layer on adhesive layer, be arranged on the electronic component on circuit layer, by the wire of routing technology connecting electronic component, to be arranged on circuit layer and the pin extended outside substrate, and to cover upper surface and side and the transparent resin of encapsulated circuit, electronic component, routing.Owing to adopting transparency carrier and transparent resin, directly can observe the inside of Intelligent Power Module after encapsulation, therefore, without the need to can detection be completed by ultrasonic scanning, therefore can reduce costs and raise the efficiency.In addition, carry out failure analysis also without the need to the Intelligent Power Module that breaks a seal, can raise the efficiency equally, and avoid secondary damage.The present invention also discloses a kind of power electronic element.
Description
Technical field
The present invention relates to circuit package technology, especially relate to a kind of power electronic element and Intelligent Power Module.
Background technology
Intelligent Power Module, i.e. IPM (Intelligent Power Module) are a kind of power drive devices power electronics and integrated circuit technique combined.Owing to having the advantage such as high integration, high reliability, Intelligent Power Module wins increasing market, being particularly suitable for the frequency converter of drive motors and various inverter, is frequency control, metallurgical machinery, electric traction, servo-drive, power electronic element that frequency-conversion domestic electric appliances is conventional.
When detecting after existing Intelligent Power Module encapsulation, need by ultrasonic scanning, therefore cost is higher, and consuming time longer, and efficiency is low.
In addition, when carrying out failure analysis to Intelligent Power Module, need to carry out Kaifeng process to Intelligent Power Module to observe invalid position.Kaifeng processing procedure not only increases the operating procedure of failure analysis, reduces the ageing of failure analysis, and can cause secondary damage to Intelligent Power Module, increase new invalid position.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.For this reason, the present invention needs to provide a kind of power electronic element and a kind of Intelligent Power Module.
According to the Intelligent Power Module of first embodiment of the invention, it comprises transparency carrier.Described transparency carrier comprises upper surface and connects the side of described upper surface.Described Intelligent Power Module also comprises the adhesive layer be arranged on described upper surface, be formed at the circuit layer on described adhesive layer, be arranged on the electronic component on described circuit layer, the wire of described electronic component is connected by routing technology, to be arranged on described circuit layer and the pin extended outside described substrate, and to cover described upper surface and described side and encapsulate the transparent resin of described circuit, described electronic component, described routing.
The Intelligent Power Module of first embodiment of the invention is owing to adopting described transparency carrier and described transparent resin, the inside of Intelligent Power Module directly can be observed after encapsulation, therefore, without the need to can detection be completed by ultrasonic scanning, therefore can reduce costs and raise the efficiency.In addition, carry out failure analysis also without the need to the Intelligent Power Module that breaks a seal, can raise the efficiency equally, and avoid secondary damage.
In some embodiments, described transparency carrier also comprises bottom surface that is opposing with described upper surface and that be connected with described side, and described bottom surface is exposed is beneficial to heat radiation.
In some embodiments, described transparency carrier is clear glass or quartz.
In some embodiments, described adhesive layer is the insulating cement of filling silicon dioxide or alundum (Al2O3) particle.
In some embodiments, described adhesive layer is overlapping with the orthographic projection on the upper surface of described circuit layer.
In some embodiments, described wire adopts aluminum steel or gold thread.
In some embodiments, described pin is zinc-plated copper or silver-plated copper.
In some embodiments, described transparent resin is polyurethane PU glue or epoxide resin AB glue.
In some embodiments, described electronic component is driving chip, power device, diode, electric capacity or resistance.
According to the power electronic element of second embodiment of the invention, it comprises transparency carrier.The side that described transparency carrier comprises upper surface and is connected with described upper surface.Described power electronic element also comprises the circuit structure that is formed on described upper surface and covers described upper surface and described side and encapsulate the transparent resin of described circuit structure.
The power electronic element of second embodiment of the invention is owing to adopting described transparency carrier and described transparent resin, the inside of power electronic element directly can be observed after encapsulation, therefore, without the need to can detection be completed by ultrasonic scanning, therefore can reduce costs and raise the efficiency.In addition, carry out failure analysis also without the need to the power electronic element that breaks a seal, can raise the efficiency equally, and avoid secondary damage.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of execution mode, wherein:
Fig. 1 is the schematic diagram of the Intelligent Power Module of first embodiment of the invention.
Fig. 2 is the schematic cross-section of Intelligent Power Module along II-II of Fig. 1.
Fig. 3 is the schematic diagram of the Intelligent Power Module of second embodiment of the invention.
Fig. 4 is the schematic cross-section of Intelligent Power Module along II-II of Fig. 3.
Embodiment
Be described below in detail embodiments of the present invention, the example of described execution mode is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the execution mode be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it is to be appreciated that term " first ", " second " only for describing object, and can not be interpreted as that instruction or hint relative importance or hidden conjunction indicate the quantity of indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or hidden conjunction comprise one or more described features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrically connected or can intercom mutually; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Disclosing hereafter provides many different execution modes or example is used for realizing different structure of the present invention.Of the present invention open in order to simplify, hereinafter the parts of specific examples and setting are described.Certainly, they are only example, and object does not lie in restriction the present invention.In addition, the present invention can in different example repeat reference numerals and/or reference letter, this repetition is to simplify and clearly object, itself does not indicate the relation between discussed various execution mode and/or setting.In addition, the various specific technique that the invention provides and the example of material, but those of ordinary skill in the art can recognize the application of other techniques and/or the use of other materials.
Refer to Fig. 1 and Fig. 2, the power electronic element 10 of better embodiment of the present invention comprises transparency carrier 11, circuit structure 12 and transparent resin 13.The side 112 that transparency carrier 11 comprises upper surface 111 and is connected with upper surface 111.Circuit structure 12 is formed on upper surface 111.Transparent resin 13 covers upper surface 111 and side 112 also encapsulated circuit structure 12.
The power electronic element 10 of better embodiment of the present invention is owing to adopting transparency carrier 11 and transparent resin 13, the inside of power electronic element 10 directly can be observed after encapsulation, therefore, without the need to can detection be completed by ultrasonic scanning, therefore can reduce costs and raise the efficiency.
In addition, carry out failure analysis also without the need to the power electronic element 10 that breaks a seal, can raise the efficiency equally, and avoid secondary damage.
In present embodiment, power electronic element 10 is Intelligent Power Module.Concrete, circuit structure 12 comprises adhesive layer 121, circuit layer 122, electronic component 123, wire 124 and pin 125.Adhesive layer 121 is arranged on upper surface 111.Circuit layer 122 is formed on adhesive layer 121.Electronic component 123 is arranged on circuit layer 122.Wire 124 is by routing technology connecting electronic component 123.Pin 125 to be arranged on circuit layer 122 and to extend outside substrate 11.
In present embodiment, transparency carrier 11 also comprises bottom surface 113 that is opposing with upper surface 111 and that be connected with side 112.The exposed power electronic element 10 that is beneficial in bottom surface 113 dispels the heat.
Transparency carrier 11 is clear glass or quartz.
Adhesive-layer 111 is the insulating cement of filling silicon dioxide or alundum (Al2O3) particle.
Adhesive layer 111 is identical with the shape of circuit layer 112, and in other words adhesive layer 111 is overlapping with the orthographic projection of circuit layer 112 on upper surface 111.Circuit layer 112 generally adopts the preparation of metals such as copper, silver, gold, platinum.
Electronic component 123 is driving chip, power device, diode, electric capacity or resistance.
Wire 124 adopts aluminum steel or gold thread.
Pin 125 is zinc-plated copper or silver-plated copper.
Transparent resin 13 is polyurethane PU glue or epoxide resin AB glue.
Refer to Fig. 3 and Fig. 4, the power electronic element 20 of second embodiment of the invention is substantially identical with power electronic component 10, but transparent resin 13 also covers the bottom surface 113 of transparency carrier 11.So, be convenient to encapsulation, and encapsulation firmly.
In the description of this specification, specific features, structure, material or feature that the description of reference term " execution mode ", " some execution modes ", " exemplary embodiment ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with described execution mode or example are contained at least one execution mode of the present invention or example.In this manual, identical execution mode or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more execution mode or example.
Although illustrate and describe embodiments of the present invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these execution modes when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalents thereof.
Claims (10)
1. an Intelligent Power Module, is characterized in that, comprising:
Transparency carrier, described transparency carrier comprises upper surface and connects the side of described upper surface,
Be arranged at the adhesive layer on described upper surface,
Be formed at the circuit layer on described adhesive layer,
Be arranged on the electronic component on described circuit layer,
The wire of described electronic component is connected by routing technology,
To be arranged on described circuit layer and the pin extended outside described substrate, and
Cover described upper surface and described side and encapsulate the transparent resin of described circuit, described electronic component, described routing.
2. Intelligent Power Module as claimed in claim 1, it is characterized in that, described transparency carrier also comprises bottom surface that is opposing with described upper surface and that be connected with described side, and described bottom surface is exposed is beneficial to heat radiation.
3. Intelligent Power Module as claimed in claim 1, it is characterized in that, described transparency carrier is clear glass or quartz.
4. Intelligent Power Module as claimed in claim 1, is characterized in that, described adhesive layer is the insulating cement of filling silicon dioxide or alundum (Al2O3) particle.
5. Intelligent Power Module as claimed in claim 1, it is characterized in that, described adhesive layer is overlapping with the orthographic projection on the upper surface of described circuit layer.
6. Intelligent Power Module as claimed in claim 1, is characterized in that, described wire adopts aluminum steel or gold thread.
7. Intelligent Power Module as claimed in claim 1, it is characterized in that, described pin is zinc-plated copper or silver-plated copper.
8. Intelligent Power Module as claimed in claim 1, it is characterized in that, described transparent resin is polyurethane PU glue or epoxide resin AB glue.
9. Intelligent Power Module as claimed in claim 1, it is characterized in that, described electronic component is driving chip, power device, diode, electric capacity or resistance.
10. a power electronic element, is characterized in that, comprising:
Transparency carrier, the side that described transparency carrier comprises upper surface and is connected with described upper surface,
Be formed at the circuit structure on described upper surface; And
Cover described upper surface and described side and encapsulate the transparent resin of described circuit structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420546409.9U CN204348704U (en) | 2014-09-22 | 2014-09-22 | Power electronic element and Intelligent Power Module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420546409.9U CN204348704U (en) | 2014-09-22 | 2014-09-22 | Power electronic element and Intelligent Power Module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204348704U true CN204348704U (en) | 2015-05-20 |
Family
ID=53231955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420546409.9U Active CN204348704U (en) | 2014-09-22 | 2014-09-22 | Power electronic element and Intelligent Power Module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204348704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
-
2014
- 2014-09-22 CN CN201420546409.9U patent/CN204348704U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6357394B2 (en) | Semiconductor device | |
| US11107756B2 (en) | Semiconductor device and method for manufacturing the same, and power conversion device | |
| JP2011086889A (en) | Semiconductor device and manufacturing method thereof | |
| WO2018207656A1 (en) | Power module, electric power conversion device, and method for producing power module | |
| WO2016199360A1 (en) | Semiconductor device | |
| CN102760816A (en) | LED (light emitting diode) packaging structure and manufacturing method thereof | |
| US10192806B2 (en) | Semiconductor device | |
| US20170229428A1 (en) | Semiconductor device and electronic apparatus | |
| JP2009278134A5 (en) | ||
| WO2010123647A3 (en) | Substrate based light source package with electrical leads | |
| CN204348704U (en) | Power electronic element and Intelligent Power Module | |
| TW201513288A (en) | Semiconductor device | |
| CN102217059A (en) | Insulating ring, insulating assembly and package for packaging | |
| CN106611758B (en) | Integrated power module packaging structure | |
| CN109560693A (en) | Electric appliance, power device and forming method thereof | |
| CN202977376U (en) | Sensor packaging module | |
| CN103337496B (en) | Based on LED integrated encapsulation structure and the making method of two-sided silicon substrate | |
| US10084123B2 (en) | Portable light-emitting device without pre-stored power sources and LED package structure thereof | |
| CN103779343A (en) | Power semiconductor module | |
| WO2014057765A1 (en) | Semiconductor device and method for manufacturing same | |
| US20120098004A1 (en) | Light emitting diode package | |
| CN109728736A (en) | Electric appliance, power device and forming method thereof | |
| CN103000794B (en) | LED package structure | |
| CN103779341B (en) | A kind of high-power half bridge module | |
| CN203746841U (en) | Power semiconductor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |