CN204333006U - A kind of LED modified node method - Google Patents

A kind of LED modified node method Download PDF

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Publication number
CN204333006U
CN204333006U CN201420819140.7U CN201420819140U CN204333006U CN 204333006 U CN204333006 U CN 204333006U CN 201420819140 U CN201420819140 U CN 201420819140U CN 204333006 U CN204333006 U CN 204333006U
Authority
CN
China
Prior art keywords
shaped frame
led
led wafer
conductive line
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420819140.7U
Other languages
Chinese (zh)
Inventor
郑金山
翁震娣
潘学元
吴有军
张军
黄国仁
朱忠平
施财龙
柳加云
王盼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Sunny Electric Group Co Ltd
Original Assignee
Anhui Sunny Electric Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Sunny Electric Group Co Ltd filed Critical Anhui Sunny Electric Group Co Ltd
Priority to CN201420819140.7U priority Critical patent/CN204333006U/en
Application granted granted Critical
Publication of CN204333006U publication Critical patent/CN204333006U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of LED modified node method, two electrode stems include transparent resin encapsulation, being symmetrical set, two electrode stem upper ends are stretched in transparent resin encapsulation, and be provided with U-shaped frame between two electrode stem upper ends, U-shaped frame two U-shaped arm is vertically provided with LED wafer between top, two electrode stems have rigid conductive line respectively to U-shaped frame level connection joint, both sides rigid conductive line respectively one_to_one corresponding is connected to LED wafer side through U-shaped frame, is positioned at U-shaped frame inner bottom part and is also provided with arc reflection bar.The utility model can make full use of the light-emitting area of LED wafer, improves the illumination effect of LED.

Description

A kind of LED modified node method
Technical field
The utility model relates to LED field, specifically a kind of LED modified node method.
Background technology
lED is also known as light-emitting diode, generally be made up of LED wafer, two stands bar, transparent epoxy resin encapsulation header, one of them cradling piece connects reverberation bowl, LED wafer level is placed on reverberation bowl and LED wafer bottom surface and is electrically connected with this cradling piece, and another cradling piece is electrically connected with LED wafer end face by wire.The LED of prior art is placed in reverberation bowl due to LED wafer, and reverberation bowl can shield portions LED wafer part PN junction, there is the problem not making full use of the light-emitting area of LED wafer.
utility model contentthe purpose of this utility model is to provide a kind of LED modified node method, to solve the problem that prior art LED does not make full use of LED wafer light-emitting area.
In order to achieve the above object, the technical scheme that the utility model adopts is:
A kind of LED modified node method, include transparent resin encapsulation, two electrode stems be symmetrical set, it is characterized in that: two electrode stem upper ends are stretched in transparent resin encapsulation, and be provided with U-shaped frame between two electrode stem upper ends, U-shaped frame two U-shaped arm is vertically provided with LED wafer between top, LED wafer left side is P type semiconductor, LED wafer right-hand part is N type semiconductor, two electrode stems have rigid conductive line respectively to U-shaped frame level connection joint, and both sides rigid conductive line respectively one_to_one corresponding connect one to one left in LED wafer through U-shaped frame two U-shaped arm, right flank, be positioned at U-shaped frame inner bottom part and be also provided with arc port arc reflection bar upward, the reflecting surface of described arc reflection bar is arranged on intrados.
Described a kind of LED modified node method, is characterized in that: bondd by conductive silver glue between both sides rigid conductive line and respective side LED wafer side.
The utility model LED wafer is vertically arranged, and both sides are connected with electrode stem by rigid conductive line, forms the hanging structure of LED wafer, can make full use of the light-emitting area of LED wafer, improve the illumination effect of LED.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Embodiment
Shown in Figure 1, a kind of LED modified node method, include transparent resin encapsulation 1, two electrode stems 2 be symmetrical set, it is characterized in that: two electrode stem 2 upper ends are stretched in transparent resin encapsulation 1, and be provided with U-shaped frame 3 between two electrode stem 2 upper ends, U-shaped frame is vertically provided with LED wafer 4 between 3 liang of U-shaped arm tops, LED wafer 4 left side is P type semiconductor, LED wafer 4 right-hand part is N type semiconductor, two electrode stems 2 have rigid conductive line 5 respectively to U-shaped frame 3 level connection joint, and both sides rigid conductive line 5 respectively one_to_one corresponding connect one to one left in LED wafer 4 through U-shaped frame 3 liang of U-shaped arms, right flank, be positioned at U-shaped frame 3 inner bottom part and be also provided with arc port arc reflection bar 6 upward, the reflecting surface of arc reflection bar 6 is arranged on intrados.Bondd by conductive silver glue between both sides rigid conductive line 5 and respective side LED wafer 4 side.

Claims (2)

1. a LED modified node method, include transparent resin encapsulation, two electrode stems be symmetrical set, it is characterized in that: two electrode stem upper ends are stretched in transparent resin encapsulation, and be provided with U-shaped frame between two electrode stem upper ends, U-shaped frame two U-shaped arm is vertically provided with LED wafer between top, LED wafer left side is P type semiconductor, LED wafer right-hand part is N type semiconductor, two electrode stems have rigid conductive line respectively to U-shaped frame level connection joint, and both sides rigid conductive line respectively one_to_one corresponding connect one to one left in LED wafer through U-shaped frame two U-shaped arm, right flank, be positioned at U-shaped frame inner bottom part and be also provided with arc port arc reflection bar upward, the reflecting surface of described arc reflection bar is arranged on intrados.
2. a kind of LED modified node method according to claim 1, be is characterized in that: bondd by conductive silver glue between both sides rigid conductive line and respective side LED wafer side.
CN201420819140.7U 2014-12-22 2014-12-22 A kind of LED modified node method Expired - Fee Related CN204333006U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420819140.7U CN204333006U (en) 2014-12-22 2014-12-22 A kind of LED modified node method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420819140.7U CN204333006U (en) 2014-12-22 2014-12-22 A kind of LED modified node method

Publications (1)

Publication Number Publication Date
CN204333006U true CN204333006U (en) 2015-05-13

Family

ID=53169329

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420819140.7U Expired - Fee Related CN204333006U (en) 2014-12-22 2014-12-22 A kind of LED modified node method

Country Status (1)

Country Link
CN (1) CN204333006U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150513

Termination date: 20171222