CN203941941U - Led mounting structure - Google Patents
Led mounting structure Download PDFInfo
- Publication number
- CN203941941U CN203941941U CN201420035557.4U CN201420035557U CN203941941U CN 203941941 U CN203941941 U CN 203941941U CN 201420035557 U CN201420035557 U CN 201420035557U CN 203941941 U CN203941941 U CN 203941941U
- Authority
- CN
- China
- Prior art keywords
- led
- mounting structure
- rod
- reflector
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the technical field of LED, relates in particular to a kind of LED mounting structure.This LED mounting structure comprises translucent cover, spun gold lead-in wire, LED chip, reflector, support, cathode rod and anode rod, described cathode rod and anode rod are fixed on wedge type support, the upper end of support is provided with reflector, described reflector is by the spun gold connection bracket that goes between, and LED chip is gone between and connected cathode rod and anode rod by spun gold.This LED mounting structure is simple, has played protective effect for chip, can produce in enormous quantities, and the job stability of LED is higher simultaneously.
Description
Technical field
The utility model relates to a kind of LED, relates in particular to a kind of LED mounting structure.
Background technology
The use of LED is more and more extensive in the prior art, LED mounting structure complexity of the prior art, because LED chip is a very little solid, its two electrodes will just can be seen under the microscope, after adding electric current, he just can be luminous, in the course of processing, easily occur welding error, a wire bad connection will cause the inefficacy of whole LED tandem, thereby causes luminous unstable.
Summary of the invention
The technical problems to be solved in the utility model is: in the course of processing, easily occur welding error, a wire bad connection will cause the inefficacy of whole LED tandem, thereby causes luminous unstablely, and a kind of LED mounting structure is provided.
In order to overcome the defect existing in background technology, the utility model solves the technical scheme that its technical problem adopts: this LED mounting structure comprises translucent cover, spun gold lead-in wire, LED chip, reflector, support, cathode rod and anode rod, described cathode rod and anode rod are fixed on wedge type support, the upper end of support is provided with reflector, described reflector is by the spun gold connection bracket that goes between, and LED chip is gone between and connected cathode rod and anode rod by spun gold.
The beneficial effects of the utility model are: this LED mounting structure is simple, has played protective effect for chip, can produce in enormous quantities, and the job stability of LED is higher simultaneously.
Brief description of the drawings
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model;
Wherein: 1, translucent cover, 2, spun gold lead-in wire, 3, LED chip, 4, reflector, 5, support, 6, cathode rod, 7, anode rod.
Embodiment
Fig. 1 is structural representation of the present utility model, figure comprises translucent cover 1, spun gold lead-in wire 2, LED chip 3, reflector 4, support 5, cathode rod 6 and anode rod 7, described cathode rod 6 and anode rod 7 are fixed on wedge type support 5, the upper end of support 5 is provided with reflector 4, described reflector 4 is by spun gold 2 connection brackets 5 that go between, and LED chip 3 is gone between and 2 connected cathode rod 6 and anode rods 7 by spun gold.
Cathode rod 6 and anode rod 7 are bonded on support 5, and the positive pole of chip 3 is connected on support 5 with metal lead wire, and the negative pole of chip 3 is bonded in reflector 4 with silver slurry.
This LED mounting structure is simple, has played protective effect for chip, can produce in enormous quantities, and the job stability of LED is higher simultaneously.
Claims (1)
1. a LED mounting structure, comprise translucent cover (1), spun gold lead-in wire (2), LED chip (3), reflector (4), support (5), cathode rod (6) and anode rod (7), it is characterized in that: described cathode rod (6) and anode rod (7) are fixed on wedge type support (5), the upper end of support (5) is provided with reflector (4), described reflector (4) is by spun gold (2) connection bracket (5) that goes between, LED chip (3) by spun gold go between (2) connect cathode rod (6) and anode rod (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420035557.4U CN203941941U (en) | 2014-01-21 | 2014-01-21 | Led mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420035557.4U CN203941941U (en) | 2014-01-21 | 2014-01-21 | Led mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203941941U true CN203941941U (en) | 2014-11-12 |
Family
ID=51861235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420035557.4U Expired - Fee Related CN203941941U (en) | 2014-01-21 | 2014-01-21 | Led mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203941941U (en) |
-
2014
- 2014-01-21 CN CN201420035557.4U patent/CN203941941U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141112 Termination date: 20160121 |
|
| EXPY | Termination of patent right or utility model |