CN204332929U - Contactless wafter delivery appts - Google Patents
Contactless wafter delivery appts Download PDFInfo
- Publication number
- CN204332929U CN204332929U CN201420806994.1U CN201420806994U CN204332929U CN 204332929 U CN204332929 U CN 204332929U CN 201420806994 U CN201420806994 U CN 201420806994U CN 204332929 U CN204332929 U CN 204332929U
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- gas
- wafer
- contactless
- handled
- disk body
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Abstract
A kind of contactless wafter delivery appts, wafer to be handled in a card casket is positioned in order to carry one, this device comprises a bearing assembly, one first gas supply unit, one second gas supply unit and a driven unit, this bearing assembly comprises at least one carrying disk body, multiplely provides the first pore of a floating gas and multiple the second pore providing side to float gas, wherein, this first pore is arranged according to an area of this wafer to be handled and this carrying disk body makes this floating gas form one to float uniformly power.This wafer to be handled floats gas by this floating gas and this side and is able to carry out carrying through non-contacting mode and picks and places, and avoids the problem producing wafer bow because exerting a force inequality.
Description
Technical field
The utility model relates to a kind of semiconductor manufacturing equipment, particularly relates to a kind of contactless wafter delivery appts.
Background technology
Semiconductor technology manufactures electronic component, completing of electronic component on Silicon Wafer (silicon wafer), is made up of accurate complicated integrated circuit; Make a Silicon Wafer semiconductor, need grow up through chip oxide layer, micro-shadow technology, etching, cleaning, Impurity Diffusion, the different technique such as implanted ions and thin film deposition can complete, therefore often need through the complicated technique in tens of even hundreds of road, and, considering under manual operation easily produces the situation that error, pollution and speed not easily promotes, automation equipment is used to control manufacture and carry this wafer, to improve yield and to increase production capacity, become the mode of production that each semiconductor dealer is indispensable.
TaiWan, China patent of invention is announced in No. 562772, namely a kind of automatic guided vehicle, AGVS and wafer method for carrying is disclosed, after multiple wafer is accommodated in a buffering clamp casket by a shifting apparatus by it, then carried by an automatic guided vehicle and move towards a point of destination, by this shifting apparatus, this wafer in buffering clamp casket takes out by this again, make this wafer before having dust problems to occur, shift between each station.
Generally speaking, the the picking and placeing of this wafer mainly depends on a robotic arm (shifting apparatus) and picks and places this wafer being accommodated in a card casket (buffering clamp casket), but, this robotic arm, when taking wafer, often only carries the subregion of wafer, as TaiWan, China new patent announces the structure shown in No. M264083, thus cause force uneven, for thinner and large-sized wafer, the problem that often can bend when taking, causes the damage of wafer; And after long-term use, its position picking and placeing this wafer may produce skew, so, when this robotic arm is being placed this wafer or taking out in the process of this wafer, to the surface of this wafer of scratch be easy to, cause the damage of this wafer and scrap, and the necessity be improved.
Utility model content
Main purpose of the present utility model, be to solve in semiconductor technology, when existing robotic arm moves wafer, because the subregion only carrying wafer causes force uneven, the problem easily bent, and when offseting after existing robotic arm Long-Time Service, when causing picking and placeing the wafer being accommodated in card casket, easily there is the problem of this wafer of scratch.
For reaching above-mentioned purpose, the utility model provides a kind of contactless wafter delivery appts, wafer to be handled in a card casket is positioned in order to carry one, this card casket comprises multiple frame member and is multiplely arranged at this frame member and carries the placing member of this wafer to be handled, and this contactless wafter delivery appts comprises:
One in order to carry the bearing assembly of this wafer to be handled, comprise at least one carrying disk body, be multiplely arranged at this carrying disk body and the first pore of a floating gas be provided and be multiplely arranged at this carrying disk body and provide side to float the second pore of gas, this floating gas sprays along a longitudinal direction, this side is floated gas and is sprayed along a pushing direction, this longitudinal direction angle crossing with this pushing direction, wherein, this first pore is arranged according to an area of this wafer to be handled and this carrying disk body makes this floating gas form one to float uniformly power;
One the first gas supply unit be connected with those first pores;
One the second gas supply unit be connected with those second pores; And
One to be connected with this bearing assembly and to drive this carrying disk body close to the driven unit below this wafer to be handled;
Wherein, this bearing assembly utilizes, from this floating gas of this first pore ejection, this wafer to be handled is taken away this placing member, and this side utilizing this second pore to spray is floated gas and taken away outside this card casket by this wafer to be handled.
Above-mentioned contactless wafter delivery appts, wherein this carrying disk body comprises floating region and a rest area on one, and this first pore is arranged at floating region and this rest area on this, and this second pore is arranged at floating region on this.
Above-mentioned contactless wafter delivery appts, wherein more comprises one and is arranged at the block element of this rest area away from one end, floating region on this.
Above-mentioned contactless wafter delivery appts, wherein on this, floating region is a disc-shape.
Above-mentioned contactless wafter delivery appts, wherein this carrying disk body more comprises a placement gas dish and at least one floating gas dish extended from this placement gas rim one transverse direction, this first pore is arranged on this placement gas dish and this floating gas dish, and this second pore is arranged on this floating gas dish.
Above-mentioned contactless wafter delivery appts, wherein more comprises one and is arranged at the block element of this placement gas dish away from this floating gas dish one end.
Above-mentioned contactless wafter delivery appts, wherein this placement gas dish is a disc-shape.
Above-mentioned contactless wafter delivery appts, wherein more comprises one in order to sense the inductive component of this wafer, and this inductive component to be arranged on this at least one carrying disk body and to be mutually electrically connected with this driven unit.
Above-mentioned contactless wafter delivery appts, wherein more comprises a control valve unit, and this control valve unit is connected with this inductive component, this first gas supply unit and this second gas supply unit.
Above-mentioned contactless wafter delivery appts, wherein more comprise the card casket strutting piece that is arranged at this carrying disk body this card casket side contiguous, this card casket strutting piece comprises the hoist trunk that at least one pair of should carry disk body.
From the above, feature of the present utility model is, this wafer to be handled utilizes this floating gas and this side to float gas, and to carry out carrying mobile, it is non-contacting mode of transport, the power that floats uniformly can be provided, avoid the problem producing wafer bow because exerting a force inequality, and put because adopting non-contacting mode of transport, the situation that can reduce by this has scratch to damage because of contact-impact produces.
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model first embodiment;
Fig. 2 A ~ Fig. 2 D is the start schematic flow sheet of the utility model first embodiment;
Fig. 3 A ~ Fig. 3 D is the start schematic flow sheet of the utility model second embodiment;
Fig. 4 is the structural representation of the utility model the 3rd embodiment.
Embodiment
Relevant detailed description of the present utility model and technology contents, the existing accompanying drawing that just coordinates is described as follows:
Refer to shown in Fig. 1 and Fig. 2 A to Fig. 2 D, be respectively the start schematic flow sheet of structural representation of the present utility model and the first embodiment.The utility model is a kind of contactless wafter delivery appts, is positioned over wafer to be handled 1 in a card casket 2 in order to carry one, and this card casket 2 comprises multiple frame member 3 and multiple this frame member 3 that is arranged to carry the placing member 4 of this wafer 1 to be handled.This contactless wafter delivery appts comprises a bearing assembly 10, one first gas supply unit 20, one second gas supply unit 30 and a driven unit 40, this bearing assembly 10 is in order to carry this wafer 1 to be handled and to comprise at least one carrying disk body 11, multiplely be arranged at this carrying disk body 11 and first pore 12 of a floating gas A be provided and be multiplely arranged at this carrying disk body 11 and provide side to float second pore 13 of gas B, this floating gas A sprays along a longitudinal direction Y, this side is floated gas B and is sprayed along a pushing direction S, this longitudinal direction Y and this pushing direction S-phase hand over an angle C.This first gas supply unit 20 is connected with those first pores 12, this second gas supply unit 30 is then connected with those second pores 13, and this driven unit 40 is connected with this bearing assembly 10 and drives this carrying disk body 11 from the below of this card casket 2 close to this wafer 1 to be handled.
In the present embodiment, this first pore 12 and this second pore 13 scattering device are on this carrying disk body 11, this carrying disk body 11 more comprises a floating region 11a and rest area 11b on, this first pore 12 is arranged at floating region 11a and this rest area 11b on this, and this second pore 13 is arranged at floating region 11a on this.During this is novel, the shape of this rest area 11b is preferably to should wafer 1 to be handled and be a disc-shape, and this first pore 12 coordinates an area of this wafer 1 to be handled to be arranged in this carrying disk body 11 makes this floating gas form one to float uniformly power.In addition, this contactless wafter delivery appts more comprises block element 50, inductive component 60 and a control valve unit 70, this block element 50 is arranged at this carrying disk body 11 one end away from this card casket 2, this inductive component 60 is electrically connected mutually with this carrying disk body 11 and this driven unit 40, and this control valve unit 70 is then interconnected with this inductive component 60, this first gas supply unit 20 and this second gas supply unit 30.
Please refer to Fig. 2 A to Fig. 2 D, the start method of the utility model first embodiment is as following steps:
S1: by the start of this driven unit 40, makes this carrying disk body 11 stretch into this card casket 2 from the below of this card casket 2, makes the upper floating region 11a of this carrying disk body 11 be positioned at the below of this wafer 1 to be handled;
S2: this inductive component 60 senses this wafer 1 to be handled, and notify that this control valve unit 70 opens this first gas supply unit 20, this floating gas A is sprayed along this longitudinal direction Y from those first pores 12, makes this wafer 1 to be handled float and leave this placing member 4 by this;
S3: this control valve unit 70 opens this second gas supply unit 30 further, make this side float gas B to spray along this pushing direction S from those second pores 13, and then this wafer 1 to be handled can be moved along this transverse direction X toward this rest area 11b, by this this wafer 1 to be handled is shifted out this card casket 2;
S4: this wafer 1 to be handled of this sensing units sense touches this block element 50, namely completes picking and placeing of this wafer 1 to be handled.
Consult shown in Fig. 3 A, in the utility model second embodiment, this carrying disk body 11 more comprises a placement gas dish 111 and at least one floating gas dish 112 extended along this transverse direction X from this placement gas dish 111, and in the present embodiment, this floating gas dish 112 has two, this first pore 12 is arranged on this placement gas dish 111 and this floating gas dish 112, this second pore 13 is arranged on this floating gas dish 112, and this block element 50 is then arranged at this placement gas dish 111 away from this floating gas dish 112 one end; In addition, the shape of this placement gas dish 111 is to should wafer 1 to be handled and be a disc-shape.
Same, referring to shown in Fig. 3 A to Fig. 3 D, is the start schematic flow sheet of the utility model second embodiment, this contactless wafter delivery appts comprise following steps as flowing mode:
S1: by the start of this driven unit 40, makes the floating gas dish 112 of this carrying disk body 11 stretch into this card casket 2 from the below of this card casket 2, makes this floating gas dish 112 be positioned at the below of this wafer 1 to be handled;
S2: this inductive component 60 senses this wafer 1 to be handled, and notify that this control valve unit 70 opens this first gas supply unit 20, this floating gas A is sprayed along this longitudinal direction Y from those first pores 12, makes this wafer 1 to be handled float and leave this placing member 4 by this;
S3: this control valve unit 70 opens this second gas supply unit 30 further, make this side float gas B to spray along this pushing direction S from those second pores 13, and then this wafer 1 to be handled can be moved along this transverse direction X toward this placement gas dish 111, by this this wafer 1 to be handled is shifted out this card casket 2;
S4: this wafer 1 to be handled of this sensing units sense touches this block element 50 be arranged on this placement gas dish 111, namely completes picking and placeing of this wafer 1 to be handled.
In addition, the utility model more comprises the card casket strutting piece (not shown) that is arranged at this at least one carrying disk body 11 this card casket 2 side contiguous, and this card casket strutting piece comprises at least one pair of should the hoist trunk of at least one carrying disk body 11.
Please arrange in pairs or groups shown in Fig. 4, one and interconnective 3rd gas supply unit 80 of this control valve unit 70 is more comprised in the 3rd embodiment of the present utility model, this block element 50 more comprises multiple buffering venthole 51,3rd gas supply unit 80 is connected with this buffering venthole 51, and provide a buffer gas from this buffering venthole 51, slow down speed too fast when this wafer 1 to be handled floats gas B force by this side moves towards the left side by this, avoid this wafer 1 to be handled to cause damage because of collision further.
Except above-mentioned points, contactless wafter delivery appts more can comprise an impeller (not shown), this impeller is arranged at this carrying disk body 11 one end away from this block element 50, the direction of this wafer 1 to be handled toward this block element 50 promotes from one end of this carrying disk body 11 by this impeller, replacement is floated gas B with this side and is promoted this wafer 1 to be handled, avoids this floating gas A and this side to float gas B and mutually disturbs and impact.
In sum, the utility model has features:
One, this wafer to be handled utilize this floating gas and this side to float gas to carry out carrying mobile, it is a non-contacting mode of transport, the power that floats uniformly can be provided, avoid the problem producing wafer bow because exerting a force inequality, and put because adopting non-contacting mode of transport, the situation that can reduce by this has scratch to damage because of contact-impact produces.
Two, by the setting of this inductive component and this control valve unit, allow to control the supply that gas is floated in this floating gas and this side, and then avoid this wafer to be handled when picking and placeing because gas flow controls not good and produce damaged in collision.
Three, by the setting of this block element, the position of this wafer to be handled can be limited further, avoid this wafer to be handled to drop the situation of damage.
Certainly; the utility model also can have other various embodiments; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the utility model.
Claims (10)
1. a contactless wafter delivery appts, wafer to be handled in a card casket is positioned in order to carry one, this card casket comprises multiple frame member and is multiplely arranged at this frame member and carries the placing member of this wafer to be handled, and it is characterized in that, this contactless wafter delivery appts comprises:
One in order to carry the bearing assembly of this wafer to be handled, comprise at least one carrying disk body, be multiplely arranged at this carrying disk body and the first pore of a floating gas be provided and be multiplely arranged at this carrying disk body and provide side to float the second pore of gas, this floating gas sprays along a longitudinal direction, this side is floated gas and is sprayed along a pushing direction, this longitudinal direction angle crossing with this pushing direction, wherein, this first pore is arranged according to an area of this wafer to be handled and this carrying disk body makes this floating gas form one to float uniformly power;
One the first gas supply unit be connected with those first pores;
One the second gas supply unit be connected with those second pores; And
One to be connected with this bearing assembly and to drive this carrying disk body close to the driven unit below this wafer to be handled;
Wherein, this bearing assembly utilizes, from this floating gas of this first pore ejection, this wafer to be handled is taken away this placing member, and this side utilizing this second pore to spray is floated gas and taken away outside this card casket by this wafer to be handled.
2. contactless wafter delivery appts according to claim 1, is characterized in that, this carrying disk body comprises floating region and a rest area on one, and this first pore is arranged at floating region and this rest area on this, and this second pore is arranged at floating region on this.
3. contactless wafter delivery appts according to claim 2, is characterized in that, more comprises one and is arranged at the block element of this rest area away from one end, floating region on this.
4. contactless wafter delivery appts according to claim 2, is characterized in that, on this, floating region is a disc-shape.
5. contactless wafter delivery appts according to claim 1, it is characterized in that, this carrying disk body more comprises a placement gas dish and at least one floating gas dish extended from this placement gas rim one transverse direction, this first pore is arranged on this placement gas dish and this floating gas dish, and this second pore is arranged on this floating gas dish.
6. contactless wafter delivery appts according to claim 5, is characterized in that, more comprises one and is arranged at the block element of this placement gas dish away from this floating gas dish one end.
7. contactless wafter delivery appts according to claim 5, is characterized in that, this placement gas dish is a disc-shape.
8. contactless wafter delivery appts according to claim 1, is characterized in that, more comprises one in order to sense the inductive component of this wafer, and this inductive component to be arranged on this at least one carrying disk body and to be mutually electrically connected with this driven unit.
9. contactless wafter delivery appts according to claim 8, is characterized in that, more comprises a control valve unit, and this control valve unit is connected with this inductive component, this first gas supply unit and this second gas supply unit.
10. contactless wafter delivery appts according to claim 1, is characterized in that, more comprise the card casket strutting piece that is arranged at this carrying disk body this card casket side contiguous, this card casket strutting piece comprises the hoist trunk that at least one pair of should carry disk body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420806994.1U CN204332929U (en) | 2014-12-17 | 2014-12-17 | Contactless wafter delivery appts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420806994.1U CN204332929U (en) | 2014-12-17 | 2014-12-17 | Contactless wafter delivery appts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204332929U true CN204332929U (en) | 2015-05-13 |
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ID=53169254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420806994.1U Expired - Fee Related CN204332929U (en) | 2014-12-17 | 2014-12-17 | Contactless wafter delivery appts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204332929U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817561A (en) * | 2017-11-22 | 2019-05-28 | 北京北方华创微电子装备有限公司 | Mechanical finger, chip transmission method and manipulator |
| CN113921441A (en) * | 2021-11-18 | 2022-01-11 | 苏州尊恒半导体科技有限公司 | Suspension type wafer positioning device |
| CN116238849A (en) * | 2023-03-17 | 2023-06-09 | 江苏奥斯力特电子科技有限公司 | Non-contact wafer arranging machine |
-
2014
- 2014-12-17 CN CN201420806994.1U patent/CN204332929U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817561A (en) * | 2017-11-22 | 2019-05-28 | 北京北方华创微电子装备有限公司 | Mechanical finger, chip transmission method and manipulator |
| CN113921441A (en) * | 2021-11-18 | 2022-01-11 | 苏州尊恒半导体科技有限公司 | Suspension type wafer positioning device |
| CN116238849A (en) * | 2023-03-17 | 2023-06-09 | 江苏奥斯力特电子科技有限公司 | Non-contact wafer arranging machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150513 Termination date: 20181217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |