CN116238849A - Non-contact wafer arranging machine - Google Patents

Non-contact wafer arranging machine Download PDF

Info

Publication number
CN116238849A
CN116238849A CN202310262684.1A CN202310262684A CN116238849A CN 116238849 A CN116238849 A CN 116238849A CN 202310262684 A CN202310262684 A CN 202310262684A CN 116238849 A CN116238849 A CN 116238849A
Authority
CN
China
Prior art keywords
rotating bearing
supporting plate
driving gear
fixedly connected
telescopic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310262684.1A
Other languages
Chinese (zh)
Inventor
唐志强
唐志勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Aosilite Electronic Technology Co ltd
Original Assignee
Jiangsu Aosilite Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Aosilite Electronic Technology Co ltd filed Critical Jiangsu Aosilite Electronic Technology Co ltd
Priority to CN202310262684.1A priority Critical patent/CN116238849A/en
Publication of CN116238849A publication Critical patent/CN116238849A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/30—Belts or like endless load-carriers
    • B65G15/32—Belts or like endless load-carriers made of rubber or plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/10—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface
    • B65G15/12—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface with two or more endless belts
    • B65G15/14—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface with two or more endless belts the load being conveyed between the belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
    • B65G65/32—Filling devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G69/00—Auxiliary measures taken, or devices used, in connection with loading or unloading
    • B65G69/16—Preventing pulverisation, deformation, breakage, or other mechanical damage to the goods or materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a non-contact wafer arranging machine, and relates to the technical field of wafer arrangement. The feeding device comprises a supporting plate, a feeding device and an arrangement device, wherein a concave semi-closed structure of the supporting plate is provided with a feeding hopper, a chute is arranged on the supporting plate, one end of a first rotating bearing far away from the supporting plate is connected with a first driving gear in a penetrating manner, one end of the first rotating bearing close to the supporting plate is provided with a motor, the first rotating bearing and a second rotating bearing are connected through a first conveyor belt, the second driving gear is fixedly connected to the second rotating bearing, one end of the second driving gear is fixedly connected with a connecting rod, the right side of the lower end of the connecting rod is provided with a telescopic box, an air duct is connected above the telescopic box in a penetrating manner, and one end of the air duct is connected with the center of a second driven gear in a penetrating manner. Through setting up loading attachment, realize the material loading to the not unidimensional wafer, through setting up arrangement device, realize carrying out non-contact arrangement to the not unidimensional wafer, prevent contact friction between the wafer.

Description

Non-contact wafer arranging machine
Technical Field
The invention relates to the technical field of wafer arrangement, in particular to a non-contact wafer arrangement machine.
Background
The rapid detection of the wafers can be realized by rapidly arranging the wafers, but the current arrangement of the wafers mostly leads to friction collision among the wafers, thereby causing wafer damage, so we propose a non-contact wafer arranging machine.
Disclosure of Invention
In order to solve the technical problems, the invention provides a non-contact wafer arranging machine, which comprises a supporting plate, a feeding device and an arranging device, wherein the supporting plate is of a concave semi-closed structure, a feeding hopper is arranged on the supporting plate, one side of the feeding hopper is fixedly connected inside the supporting plate, the lower end of the feeding hopper extends between a first conveyor belt and a second conveyor belt, a chute is arranged on the supporting plate, and the chute is fixedly connected outside the supporting plate;
the feeding device comprises a first rotating bearing, a first driving gear, a first driven gear, a first conveyor belt, a second conveyor belt and a second rotating bearing, wherein one end, far away from the supporting plate, of the first rotating bearing is connected with the first driving gear in a penetrating manner, one end, close to the supporting plate, of the first rotating bearing is connected with a motor, the first rotating bearing and the second rotating bearing are connected through the belt of the first conveyor belt, and the feeding device is arranged to realize the feeding of wafers with different sizes;
the arrangement device comprises a second driving gear, a second driven gear, a connecting rod, an air duct, a telescopic box and an arrangement assembly, wherein the second driving gear is fixedly connected to a second rotating bearing, one end of the second driving gear, which is far away from the second rotating bearing, is fixedly connected with the connecting rod, the right side of the lower end of the connecting rod is provided with the telescopic box, the air duct is connected above the telescopic box in a penetrating manner, one end of the air duct, which is far away from the telescopic box, is connected with the center of the second driven gear in a penetrating manner, and non-contact arrangement of wafers of different sizes is realized by arranging the arrangement device, so that contact friction between the wafers is prevented.
Further, the inside sliding connection of spout has first rolling bearing and second rolling bearing, the one end of nearly spout of first rolling bearing is through flexible spring and the inside fixed connection of spout, the quantity of flexible spring has two, two flexible spring is fixed connection respectively on first rolling bearing and second rolling bearing, first rolling bearing both ends respectively with inside backup pad and flexible spring lower extreme fixed connection, first rolling bearing middle part is through ball and second conveyer belt rotation connection, second rolling bearing both ends respectively with inside backup pad and flexible spring lower extreme fixed connection, second rolling bearing middle part is through ball and second conveyer belt rotation connection, through setting up flexible spring, makes the second conveyer belt reciprocate in the spout, realizes the change of interval between first conveyer belt and the second conveyer belt to realize the material loading to different size wafers.
Further, the number of the first rotating bearings is two, the number of the second rotating bearings is two, the two first rotating bearings and the two second rotating bearings are respectively connected through a first conveyor belt and a second conveyor belt, a first driving gear and a first driven gear are respectively fixedly connected to the two first rotating bearings, the first driving gear is located below the first driven gear, the first driving gear and the first driven gear are meshed with each other, the first driving gear rotates positively under the driving of a motor, and the first driven gear meshed with the first driving gear rotates reversely to drive the first conveyor belt and the second conveyor belt forward simultaneously.
Further, the second driving gear is fixedly connected to the center of a second rotating bearing connected with the first conveyor belt, the second driven gear is located on the right side of the second driving gear, the second driven gear is meshed with the second driving gear, the second driven gear is fixedly connected with the arrangement assembly, the center of the second driven gear is in the same horizontal line with the center of the arrangement assembly, the first conveyor belt drives the second driving gear to rotate, and accordingly the second driven gear meshed with the second driving gear is driven to rotate, and the arrangement assembly is further driven to access the wafer.
Further, the expansion tank is a closed structure, a reset spring is transversely arranged in the expansion tank, two ends of the reset spring are fixedly connected with the inside of the expansion tank, the connecting rod compresses the expansion tank under the drive of the second driving gear, so that gas is compressed into the gas guide pipe, and the reset spring is arranged, so that after the connecting rod is not compressed any more, the expansion tank is reset, and the gas returns to the expansion tank.
Further, arrange the subassembly and include shell, flexible gasbag and spacing hole, the one end that the shell is close to the backup pad is passed through the bearing and is connected with the inside rotation of backup pad, the inside flexible gasbag that is provided with of shell, be provided with spacing hole on the shell, flexible gasbag passes through glue to be fixed inside shell and spacing hole, the air duct runs through and sets up inside flexible gasbag, the air duct rotates with second driven gear and arranges the subassembly center to be connected, and the wafer passes through loading attachment, gets into spacing hole, and the intraductal gas of air duct gets into flexible gasbag, and flexible gasbag inflation tightly wraps the wafer, and gas regression, arranges subassembly rotatory to the below, and the wafer is placed in collection device or detection device, prevents friction contact between the wafer, causes the damage to realize the non-contact between the wafer and arrange.
The invention has the beneficial effects that:
1. according to the invention, the feeding device is arranged, the first driving gear is driven by the motor to rotate forward, and the first driving gear and the first driven gear meshed with the first driving gear rotate reversely to drive the first conveyor belt and the second conveyor belt to simultaneously drive forward, and meanwhile, the second conveyor belt slides in the chute through the telescopic spring, so that the feeding of wafers with different sizes is realized.
2. According to the invention, the arrangement device is arranged, the second driving gear is driven by the first conveyor belt to rotate to drive the second driven gear to rotate, meanwhile, the radius of the second driving gear is smaller than that of the second driven gear, after the second driving gear rotates for one circle, the second driven gear just drives the arrangement assembly to move for half a circle, and meanwhile, wafers enter the arrangement device from the feeding device and then move from the upper side to the lower side so as to enter the storage device or the detection device.
3. According to the invention, the arrangement assembly is arranged, the connecting rod is driven by the second driving gear to compress the expansion tank, so that gas is compressed into the expansion air bag through the gas guide pipe, the expansion air bag expands to tightly cover the wafers, the reset spring is arranged, so that the connecting rod is reset after no longer being compressed, the gas returns into the expansion tank, the arrangement assembly is rotated to the lower side, the expansion air bag contracts, finally, the wafers are separated from the arrangement assembly and are placed in the collecting device or the detecting device, the wafers are prevented from being damaged due to friction contact, and the non-contact arrangement among the wafers is realized.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the present invention;
FIG. 3 is a schematic diagram of a loading device according to the present invention;
FIG. 4 is a schematic view of the structure of the telescopic case of the present invention;
FIG. 5 is a schematic view of an alignment apparatus according to the present invention;
FIG. 6 is a schematic view of an arrangement assembly according to the present invention;
FIG. 7 is a schematic view of the internal structure of the alignment assembly of the present invention;
in the figure: 1. a support plate; 2. feeding into a hopper; 3. a chute; 5. a telescopic spring; 6. a feeding device; 7. an arrangement device; 8. a first rotating bearing; 9. a first drive gear; 10. a first driven gear; 11. a first conveyor belt; 12. a second conveyor belt; 13. a second rotating bearing; 14. a second drive gear; 15. a second driven gear; 16. a connecting rod; 17. an air duct; 18. a telescopic case; 19. an arrangement assembly; 20. a return spring; 21. a housing; 22. a telescopic air bag; 23. and a limiting hole.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Referring to fig. 1-7, the invention discloses a non-contact wafer arranger, which comprises a supporting plate 1, a feeding device 6 and an arranger 7, wherein the supporting plate 1 is of a concave semi-closed structure, a feeding hopper 2 is arranged on the supporting plate 1, one side of the feeding hopper 2 is fixedly connected inside the supporting plate 1, the lower end of the feeding hopper 2 extends between a first conveyor belt 11 and a second conveyor belt 12, a chute 3 is arranged on the supporting plate 1, and the chute 3 is fixedly connected outside the supporting plate 1;
the feeding device 6 comprises a first rotary bearing 8, a first driving gear 9, a first driven gear 10, a first conveyor belt 11, a second conveyor belt 12 and a second rotary bearing 13, wherein one end, far away from the supporting plate 1, of the first rotary bearing 8 is connected with the first driving gear 9 in a penetrating way, one end, close to the supporting plate 1, of the first rotary bearing 8 is provided with a motor, the first rotary bearing 8 and the second rotary bearing 13 are connected through the first conveyor belt 11 in a belt way, and the feeding device 6 is arranged to realize the feeding of wafers with different sizes;
the arrangement device 7 comprises a second driving gear 14, a second driven gear 15, a connecting rod 16, an air duct 17, a telescopic box 18 and an arrangement assembly 19, wherein the second driving gear 14 is fixedly connected to the second rotating bearing 13, one end, far away from the second rotating bearing 13, of the second driving gear 14 is fixedly connected with the connecting rod 16, the right side of the lower end of the connecting rod 16 is provided with the telescopic box 18, the air duct 17 is connected above the telescopic box 18 in a penetrating manner, one end, far away from the telescopic box 18, of the air duct 17 is connected with the center of the second driven gear 15 in a penetrating manner, and through the arrangement device 7, non-contact arrangement of wafers of different sizes is realized, and contact friction between the wafers is prevented.
The inside sliding connection of spout 3 has first rolling bearing 8 and second rolling bearing 13, the one end that first rolling bearing 8 is close spout 3 is through the inside fixed connection of extension spring 5 and spout 3, the quantity of extension spring 5 has two, two extension springs 5 are fixed connection respectively on first rolling bearing 8 and second rolling bearing 13, first rolling bearing 8 both ends respectively with inside backup pad 1 and extension spring 5 lower extreme fixed connection, first rolling bearing 8 middle part is through ball and second conveyer belt 12 rotation connection, second rolling bearing 13 both ends are respectively with inside backup pad 1 and extension spring 5 lower extreme fixed connection, second rolling bearing 13 middle part is through ball and second conveyer belt 12 rotation connection, through setting up extension spring 5, make second conveyer belt 12, can reciprocate in spout 3, realize the change of interval between first conveyer belt 11 and the second conveyer belt 12, in order to realize the material loading to different sizes wafer.
The number of the first rotating bearings 8 is two, the number of the second rotating bearings 13 is two, the two first rotating bearings 8 and the two second rotating bearings 13 are respectively connected through a first conveyor belt 11 and a second conveyor belt 12, a first driving gear 9 and a first driven gear 10 are fixedly connected to the two first rotating bearings 8 respectively, the first driving gear 9 is located below the first driven gear 10, the first driving gear 9 and the first driven gear 10 are meshed with each other, the first driving gear 9 rotates positively under the driving of a motor, and the first driven gear 10 meshed with the first driving gear 9 rotates reversely to drive the first conveyor belt 11 and the second conveyor belt 12 to simultaneously drive forwards.
The second driving gear 14 is fixedly connected to the center of the second rotating bearing 13 connected with the belt of the first conveying belt 11, the second driven gear 15 is located on the right side of the second driving gear 14, the second driven gear 15 is meshed with the second driving gear 14, the second driven gear 15 is fixedly connected with the arrangement assembly 19, the center of the second driven gear 15 is in the same horizontal line with the center of the arrangement assembly 19, the first conveying belt 11 drives the second driving gear 14 to rotate, and accordingly the second driven gear 15 meshed with the second driving gear 14 is driven to rotate, and the arrangement assembly 19 is further driven to receive wafers.
The expansion tank 18 is of a closed structure, a reset spring 20 is transversely arranged in the expansion tank 18, two ends of the reset spring 20 are fixedly connected with the inside of the expansion tank 18, the connecting rod 16 is driven by the second driving gear 14 to compress the expansion tank 18, so that gas is compressed into the gas guide pipe 17, and the reset spring 20 is arranged, so that the connecting rod 16 is reset after being not compressed, and the gas returns into the expansion tank 18.
The arrangement assembly 19 comprises a shell 21, a telescopic airbag 22 and a limiting hole 23, one end of the shell 21, which is close to the supporting plate 1, is rotationally connected with the inside of the supporting plate 1 through a bearing, the telescopic airbag 22 is arranged in the shell 21, the limiting hole 23 is formed in the shell 21, the telescopic airbag 22 is fixed in the shell 21 and the limiting hole 23 through glue, an air duct 17 penetrates through the telescopic airbag 22, the air duct 17 is rotationally connected with the center of the second driven gear 15 and the arrangement assembly 19, a wafer passes through the feeding device 6 and enters the limiting hole 23, gas in the air duct 17 enters the telescopic airbag 22, the telescopic airbag 22 expands to tightly wrap the wafer, the gas returns, the arrangement assembly 19 rotates to the lower side, and the wafer is placed in the collecting device or the detecting device to prevent the wafer from being damaged due to friction contact, so that the non-contact arrangement between the wafers is realized.
One specific application of this embodiment is:
when the device works, a motor is started, wafers are put into a feeding hopper 2, a first driving gear 9 rotates positively and reversely with a first driven gear 10 meshed with each other under the drive of the motor, so that a first conveyor belt 11 and a second conveyor belt 12 convey the wafers to an arrangement device 7 under the drive of two first rotating bearings 8 and two second rotating bearings 13, and meanwhile, the second conveyor belt 12 slides up and down in a chute 3 under the action of a telescopic spring 5 according to the different sizes of each batch of wafers, and is suitable for feeding the wafers with different sizes, so that the wafers with different sizes are fed;
the wafers fall into the limiting holes 23 on the arrangement assembly 19, the second driving gear 14 rotates under the drive of the first conveyor belt 11 to drive the second driven gear 15 to rotate, meanwhile, the radius of the second driving gear 14 is smaller than that of the second driven gear 15, after the second driving gear 14 rotates for one circle, the second driven gear 15 just drives the arrangement assembly 19 to move for half a circle, and meanwhile, the wafers enter the arrangement device 7 from the feeding device 6 and then move from the upper side to the lower side so as to enter the storage device or the detection device;
simultaneously, the connecting rod 16 compresses the expansion tank 18 under the drive of the second driving gear 14, thereby compressing the gas into the expansion air bag 22 through the gas guide pipe 17, expanding the expansion air bag 22, tightly wrapping the wafer, resetting the expansion tank 18 after the connecting rod 16 is not compressed any more through the arrangement of the reset spring 20, returning the gas into the expansion tank 18, simultaneously rotating the arrangement assembly 19 to the lower part, contracting the expansion air bag 22, finally separating the wafer from the arrangement assembly 19, placing the wafer in a collecting device or a detecting device, and arranging the arrangement assembly 19 to prevent the wafer from being in friction contact with each other to cause damage so as to realize non-contact arrangement between the wafers.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.

Claims (8)

1. A wafer non-contact alignment machine, comprising:
the device comprises a supporting plate (1), wherein the supporting plate (1) is of a concave semi-closed structure, a feeding hopper (2) is arranged on the supporting plate (1), and one side of the feeding hopper (2) is fixedly connected inside the supporting plate (1);
a sliding groove (3) is formed in the supporting plate (1), and the sliding groove (3) is fixedly connected to the outside of the supporting plate (1);
the feeding device (6), wherein the feeding device (6) comprises a first rotating bearing (8), a first driving gear (9), a first driven gear (10), a first conveyor belt (11), a second conveyor belt (12) and a second rotating bearing (13);
one end, far away from the supporting plate (1), of the first rotating bearing (8) is connected with a first driving gear (9) in a penetrating way, and a motor is arranged at one end, close to the supporting plate (1), of the first rotating bearing (8);
the first rotating bearing (8) and the second rotating bearing (13) are connected through a first conveyor belt (11) belt;
an arrangement device (7), wherein the arrangement device (7) comprises a second driving gear (14), a second driven gear (15), a connecting rod (16), an air duct (17), a telescopic box (18) and an arrangement assembly (19);
the second driving gear (14) is fixedly connected to the second rotating bearing (13), one end, far away from the second rotating bearing (13), of the second driving gear (14) is fixedly connected with a connecting rod (16), and the right side of the lower end of the connecting rod (16) is provided with a telescopic box (18);
an air duct (17) is connected above the telescopic box (18) in a penetrating manner, and one end, far away from the telescopic box (18), of the air duct (17) is connected with the center of the second driven gear (15) in a penetrating manner.
2. The wafer non-contact alignment machine according to claim 1, wherein: the inside of the sliding groove (3) is connected with a first rotating bearing (8) and a second rotating bearing (13) in a sliding way, and one end, close to the sliding groove (3), of the first rotating bearing (8) is fixedly connected with the inside of the sliding groove (3) through a telescopic spring (5);
the number of the telescopic springs (5) is two, and the two telescopic springs (5) are respectively and fixedly connected to the first rotating bearing (8) and the second rotating bearing (13);
the two ends of the first rotating bearing (8) are fixedly connected with the inside of the supporting plate (1) and the lower end of the telescopic spring (5) respectively, the middle part of the first rotating bearing (8) is rotationally connected with the second conveying belt (12) through balls, the two ends of the second rotating bearing (13) are fixedly connected with the inside of the supporting plate (1) and the lower end of the telescopic spring (5) respectively, and the middle part of the second rotating bearing (13) is rotationally connected with the second conveying belt (12) through balls.
3. The wafer non-contact alignment machine according to claim 1, wherein: the number of the first rotating bearings (8) is two, the number of the second rotating bearings (13) is two, and the two first rotating bearings (8) and the two second rotating bearings (13) are respectively connected through a first conveyor belt (11) and a second conveyor belt (12) through belts;
the two first rotating bearings (8) are respectively fixedly connected with a first driving gear (9) and a first driven gear (10), the first driving gear (9) is located below the first driven gear (10), and the first driving gear (9) and the first driven gear (10) are meshed with each other.
4. A wafer non-contact aligner according to claim 3, wherein: the lower end of the feeding hopper (2) extends into the space between the first conveyor belt (11) and the second conveyor belt (12).
5. The wafer non-contact alignment machine according to claim 1, wherein: the second driving gear (14) is fixedly connected to the center of a second rotating bearing (13) connected with the first conveyor belt (11) through a belt;
the second driven gear (15) is positioned on the right side of the second driving gear (14), and the second driven gear (15) and the second driving gear (14) are meshed with each other;
the second driven gear (15) is fixedly connected with the arrangement assembly (19), and the center of the second driven gear (15) and the center of the arrangement assembly (19) are positioned on the same horizontal line.
6. The wafer non-contact alignment machine according to claim 1, wherein: the telescopic box (18) is of a closed structure, a reset spring (20) is transversely arranged in the telescopic box (18), and two ends of the reset spring (20) are fixedly connected with the inside of the telescopic box (18).
7. The wafer non-contact alignment machine according to claim 1, wherein: the arrangement assembly (19) comprises a shell (21), a telescopic airbag (22) and a limiting hole (23), wherein one end, close to the supporting plate (1), of the shell (21) is rotationally connected with the inside of the supporting plate (1) through a bearing, the telescopic airbag (22) is arranged in the shell (21), and the limiting hole (23) is formed in the shell (21);
the telescopic air bag (22) is fixed inside the shell (21) and the limiting hole (23) through glue;
the air duct (17) is arranged inside the telescopic air bag (22) in a penetrating way.
8. The wafer non-contact alignment machine according to claim 1, wherein: the air duct (17) is connected with the second driven gear (15) and the center of the arrangement assembly (19) in a rotating way.
CN202310262684.1A 2023-03-17 2023-03-17 Non-contact wafer arranging machine Pending CN116238849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310262684.1A CN116238849A (en) 2023-03-17 2023-03-17 Non-contact wafer arranging machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310262684.1A CN116238849A (en) 2023-03-17 2023-03-17 Non-contact wafer arranging machine

Publications (1)

Publication Number Publication Date
CN116238849A true CN116238849A (en) 2023-06-09

Family

ID=86629521

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310262684.1A Pending CN116238849A (en) 2023-03-17 2023-03-17 Non-contact wafer arranging machine

Country Status (1)

Country Link
CN (1) CN116238849A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101353108A (en) * 2007-07-24 2009-01-28 因诺瓦专利有限责任公司 Bearing unit for a conveying installation for the transport of goods by way of a conveyor belt
CN204332929U (en) * 2014-12-17 2015-05-13 王义正 Contactless wafter delivery appts
CN214651194U (en) * 2021-02-05 2021-11-09 安徽省光宥自动化设备科技有限公司 Special belt conveyor for clean room
WO2022126874A1 (en) * 2020-12-18 2022-06-23 华能威海发电有限责任公司 Belt replacement bracket for belt conveyor and belt replacement method
CN217507289U (en) * 2022-05-27 2022-09-27 武汉智勤兴合电子科技有限公司 Wafer non-contact arrangement machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101353108A (en) * 2007-07-24 2009-01-28 因诺瓦专利有限责任公司 Bearing unit for a conveying installation for the transport of goods by way of a conveyor belt
CN204332929U (en) * 2014-12-17 2015-05-13 王义正 Contactless wafter delivery appts
WO2022126874A1 (en) * 2020-12-18 2022-06-23 华能威海发电有限责任公司 Belt replacement bracket for belt conveyor and belt replacement method
CN214651194U (en) * 2021-02-05 2021-11-09 安徽省光宥自动化设备科技有限公司 Special belt conveyor for clean room
CN217507289U (en) * 2022-05-27 2022-09-27 武汉智勤兴合电子科技有限公司 Wafer non-contact arrangement machine

Similar Documents

Publication Publication Date Title
US4756141A (en) Apparatus for rotating and compressing a stack of pads
CN100582624C (en) Freeze dryer
CN107840166B (en) A kind of cloth wrap-up with discharging and packaging function
CN111645919A (en) Blanking machine for quantitative packaging of needle bearing
CN105845598A (en) Silicon wafer separation device and silicon wafer loading and unloading system
CN107399476B (en) A kind of feed device of box packing machine
JP2012110961A (en) Powder compression molding machine
CN106314857A (en) Automatic encasement device and method for round plastic container bottles with bottle bodies irregular
CN116238849A (en) Non-contact wafer arranging machine
CN107866848A (en) A kind of capsule automatic cutting device and cutting method
CN114194437B (en) POGOPIN probe split charging equipment
JP2008164595A (en) Apparatus for raising/lowering temperature, and high and low temperature test handler
CN107185848A (en) Sheet metal intelligent screening equipment
CN111361810B (en) Food packaging equipment
CN207482249U (en) Wrapping machine
CN212556973U (en) Lamination loading attachment of four sides packaging machine
CN105845611A (en) Take-up mechanism and silicon wafer loading and unloading system
CN214702624U (en) Air leakage detection device for packaged food
CN115402787A (en) Chip burning and testing integrated machine
CN115790131A (en) Grain drying-machine that can quantitative transport
CN210592543U (en) Full-automatic annular feeding device of food packaging equipment
CN111361786B (en) Packing treatment method for rolled cloth
CN107671525A (en) 8 word ring production equipments and method
CN209209926U (en) It is a kind of for store sponge and can automatic blanking outbound device
CN208005815U (en) A kind of integrated circuit element packaging cutting die collating unit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination