CN205016503U

CN205016503U - Continuous processing apparatus of non -contact wafer

Info

Publication number: CN205016503U
Application number: CN201520787858.7U
Authority: CN
Inventors: 王义正; 王鹏进; 黄汉民
Original assignee: See Good Technology Corp
Current assignee: See Good Technology Corp
Priority date: 2015-10-12
Filing date: 2015-10-12
Publication date: 2016-02-03
Anticipated expiration: 2025-10-12

Abstract

The utility model provides a continuous processing apparatus of non -contact wafer, include a work platform, a first gaseous supply unit, the gaseous supply unit of a second and a plurality of processing unit, this work platform includes a feed end, a discharge end of keeping away from this feed end, a plurality of first gas pockets that provide a come -up gas, the region is handled to a plurality of second gas pocket and a plurality of technologies from this feed end range to this discharge end of floating gas in one side of providing, this first gaseous supply unit is connected with these a little first gas pockets, this second gaseous supply unit be connected with these a little second gas pockets, regional top is handled in order to handle a pending wafer in these a little technologies to corresponding setting of these a little processing unit. This pending wafer of mode transport of usable non -contact carries out the continuous processing processing with the superficial gas of this side through providing this come -up gas.

Description

Contactless wafer apparatus for continous treatment

Technical field

The utility model relates to a kind of wafer processing device, particularly a kind of contactless wafer apparatus for continous treatment.

Background technology

Wafer (Wafer) refers to the silicon wafer that Si semiconductor production of integrated circuits is used, wafer is the carrier producing used in integrated circuits, the manufacturing process of integrated circuit is nearly tens of to hundreds of steps, as technology such as oxide layer growth, micro-shadow technology, etching, cleaning, Impurity Diffusion, implanted ions and thin film depositions, and along with the precision of semiconductor technology more and more higher, when carrying out different technique, be all and utilize mechanical arm to move wafer to next process area, to carry out technique.

And carry " mechanical arm of conveying wafer " of the mechanical arm as No. M264083rd, TaiWan, China patent announcement of wafer, it includes a body and an adsorption tank, this body has the bearing end of half circular open, this bearing end is by a wafer carrying thereon, and the center of gravity of this wafer is the center of circle of the semicircle opening coinciding with this bearing end, this adsorption tank is formed at the surface of this bearing end and utilizes vacuum adsorption force to be lived by this wafer adsorption.

But after Long-Time Service, this bearing end may offset because of the position picking and placeing this wafer, and this wafer of scratch, cause process yields to decline, therefore, how reducing mechanical arm offsets and the problem of this wafer of scratch, is a large problem in fact.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of contactless wafer apparatus for continous treatment, to solve because offseting after mechanical arm Long-Time Service, and then the problem of scratch wafer.

To achieve these goals, the utility model provides a kind of contactless wafer apparatus for continous treatment, and in order to carry the pending wafer that carries out continuous processing process, wherein, this contactless wafer apparatus for continous treatment includes:

One workbench, include a feed end, one away from this feed end discharge end, to be multiplely arranged between this feed end and this discharge end and the first pore of a floating gas is provided, is multiplely arranged between this feed end and this discharge end and the second pore providing side to float gas and multiplely arrange PROCESS FOR TREATMENT region to this discharge end from this feed end, this floating gas sprays along a longitudinal direction, this side is floated gas and is sprayed along a pushing direction, this longitudinal direction angle crossing with this pushing direction;

One the first gas supply unit be connected with the plurality of first pore;

One the second gas supply unit be connected with the plurality of second pore; And

Multiple correspondence is arranged at the plurality of PROCESS FOR TREATMENT overlying regions with the processing unit processed this pending wafer.

Above-mentioned contactless wafer apparatus for continous treatment, wherein, this workbench also includes one and is arranged at this discharge end to keep out the stop part of this pending wafer.

Above-mentioned contactless wafer apparatus for continous treatment, wherein, this workbench also includes one and is arranged at this stop part and provides the 3rd pore of a lateral gas towards this feed end, and this lateral gas sprays along a transverse direction.

Above-mentioned contactless wafer apparatus for continous treatment, wherein, also includes the 3rd gas supply unit be connected with the 3rd pore.

Above-mentioned contactless wafer apparatus for continous treatment, wherein, also includes the control unit that is electrically connected at this first gas supply unit, this second gas supply unit and the 3rd gas supply unit.

Above-mentioned contactless wafer apparatus for continous treatment, wherein, also includes one and is arranged at the sensing element of this workbench adjacent to this discharge end.

Beneficial functional of the present utility model is:

The utility model provides this floating gas and this second pore to provide this side to float gas by this first pore, can this wafer be made to carry out technique by those PROCESS FOR TREATMENT regions by non-contacting mode of transport, therefore can reduce the situation causing this wafer to damage because of contact-impact.

Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.

Accompanying drawing explanation

Fig. 1 is the part section structural representation of the utility model first embodiment;

Fig. 2 A-2C is the local continuous running schematic diagram of the utility model first embodiment;

Fig. 3 is the part section structural representation of the utility model second embodiment;

Fig. 4 is the part section structural representation of the utility model the 3rd embodiment.

Embodiment

Below in conjunction with accompanying drawing, structural principle of the present invention and operation principle are described in detail:

Referring to shown in Fig. 1 and Fig. 2 A to Fig. 2 C, is part section structural representation and the local continuous operation chart of the utility model first embodiment.The utility model is a kind of contactless wafer apparatus for continous treatment, carry the pending wafer 80 that carries out continuous processing process, this contactless wafer apparatus for continous treatment includes a workbench 10, one first gas supply unit 20, one second gas supply unit 30 and multiple processing unit 50, this workbench 10 includes a feed end 11, one away from the discharge end 12 of this feed end 11, multiple first pore 13, multiple second pore 14 and multiple PROCESS FOR TREATMENT regions 15, those first pores 13 to be arranged between this feed end 11 and this discharge end 12 and to provide a floating gas, and this floating gas sprays along a longitudinal direction, those second pores 14 to be arranged between this feed end 11 and this discharge end 12 and to provide side to float gas, and this side is floated gas and is sprayed along a pushing direction, this longitudinal direction angle crossing with this pushing direction, 15, those PROCESS FOR TREATMENT regions arrange to this discharge end 12 from this feed end 11, this first gas supply unit 20 is connected to those the first pores 13, this second gas supply unit 30 is connected to those the second pores 14, those processing unit 50 correspondences are arranged at above those PROCESS FOR TREATMENT regions 15, and PROCESS FOR TREATMENT can be carried out to this pending wafer 80, those processing units 50 carry out different PROCESS FOR TREATMENT separately, as cleaning, dry, the techniques such as etching.In this embodiment, those PROCESS FOR TREATMENT regions 15 each other for being interconnected, but also can arrange gate (not shown) or chamber (not shown) is spaced, with the demand with the use of person or technique.In addition, in the utility model, also there is the control unit 60 that is electrically connected at this first gas supply unit 20, this second gas supply unit 30, to control the output that gas is floated in this floating gas and this survey.

Continuous collocation is consulted shown in Fig. 2 A to Fig. 2 C, during running, this pending wafer 80 inputs from this feed end 11, gas is floated in this floating gas and this survey can provide a floating power and to promote power respectively, this floating power can make this pending wafer 80 keep a distance with this workbench 10, this pending wafer 80 then can be carried toward this discharge end 12 by this promotion power, then, input this pending wafer 80a next again, same, this floating power and this promotion power make this pending wafer 80a and workbench 10 keep this distance and carry toward this discharge end 12, afterwards, and then this pending wafer 80b inputs from this feed end 11.

And when this pending wafer 80,80a, 80b are through those PROCESS FOR TREATMENT regions 15, those processing units 50 be arranged at above those PROCESS FOR TREATMENT regions 15 can carry out various PROCESS FOR TREATMENT to this pending wafer 80 of process, 80a, 80b, as cleaning, drying, etching etc., therefore, continuous print PROCESS FOR TREATMENT can be carried out when not touching this pending wafer 80,80a, 80b, preventing from causing this pending wafer 80,80a, 80b damage because of contact-impact.

Continuous collocation is consulted shown in Fig. 3, for the second embodiment of the present utility model, in this embodiment, this workbench 10 also includes the stop part 16 that is arranged at this discharge end 12, when this pending wafer 80 is transported to this discharge end 12, this stop part 16 can keep out this pending wafer 80, drop to prevent this pending wafer 80, and the material of this stop part 16 can be the material that rubber etc. has cushioning effect, when striking this stop part 16 to prevent this pending wafer 80 and cracked damage, and also in this workbench 10, one sensing element 70 can be set adjacent to this discharge end 12 place, this discharge end 12 whether is arrived to sense this pending wafer 80, and operating personnel can be reminded or issue a signal transmitted to a fetching device (not shown) to collect this pending wafer 80.

Continuous collocation is consulted shown in Fig. 4, for the 3rd embodiment of the present utility model, with the second embodiment unlike, this workbench 10 also includes one and is arranged at this stop part 16 and provides the 3rd pore 17 of a lateral gas towards this feed end 11, 3rd pore 17 is connected to one the 3rd gas supply unit 40, and this control unit 60 is also electrically connected at the 3rd gas supply unit 40, to control the output of this lateral gas, and this lateral gas sprays along a transverse direction, and provide one to keep out this pending wafer 80 keep out power, prevent this pending wafer 80 from striking this stop part 16 and damaging.

In sum, the utility model has following characteristics:

One, providing this floating gas by this first pore, this second pore provides this survey to float gas, continuous print PROCESS FOR TREATMENT can be carried out when not touching this pending wafer, and prevent from causing because of contact-impact this pending wafer to damage.

Two, by the setting of this stop part, this pending wafer can be kept out, prevent this pending wafer from dropping.

Three, the material of this stop part can for having the material of cushioning effect, therefore, when can prevent this pending wafer from striking this stop part and cracked damage.

Four, sense this pending wafer by this sensing element and whether arrive at this discharge end, and operating personnel can be reminded or send and make a fetching device collect this pending wafer.

Five, by being arranged at the 3rd pore of this stop part, providing this lateral gas having and keep out this pending wafer, can prevent this pending wafer from striking this stop part and damaging.

Certainly; the utility model also can have other various embodiments; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the utility model.

Claims

1. a contactless wafer apparatus for continous treatment, in order to carry the pending wafer that carries out continuous processing process, is characterized in that, this contactless wafer apparatus for continous treatment includes:

One the first gas supply unit be connected with the plurality of first pore;

2. contactless wafer apparatus for continous treatment according to claim 1, is characterized in that, this workbench also includes one and is arranged at this discharge end to keep out the stop part of this pending wafer.

3. contactless wafer apparatus for continous treatment according to claim 2, is characterized in that, this workbench also includes one and is arranged at this stop part and provides the 3rd pore of a lateral gas towards this feed end, and this lateral gas sprays along a transverse direction.

4. contactless wafer apparatus for continous treatment according to claim 3, is characterized in that, also includes the 3rd gas supply unit be connected with the 3rd pore.

5. contactless wafer apparatus for continous treatment according to claim 4, is characterized in that, also includes the control unit that is electrically connected at this first gas supply unit, this second gas supply unit and the 3rd gas supply unit.

6. contactless wafer apparatus for continous treatment according to claim 1, is characterized in that, also includes one and is arranged at the sensing element of this workbench adjacent to this discharge end.