CN205069610U - Non -contact wafer handling device - Google Patents
Non -contact wafer handling device Download PDFInfo
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- CN205069610U CN205069610U CN201520762072.XU CN201520762072U CN205069610U CN 205069610 U CN205069610 U CN 205069610U CN 201520762072 U CN201520762072 U CN 201520762072U CN 205069610 U CN205069610 U CN 205069610U
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Abstract
The utility model provides a non -contact wafer handling device, be used for carrying a wafer, which comprises a base and four movable fixing elements, a transfer arm, a body, a vacuum device, an upper cover and a spacing module, this transfer arm and this base pin joint have the operation end of keeping away from this base, this body sets up in this transfer arm, have a passageway and one with this passageway intercommunication and the absorption mouth held formed at this operation, this vacuum device connects in this passageway and makes this absorption mouthful produce an adsorption affinity, this upper cover extends outwards and has a periphery from this operation end, this spacing module setting is in this periphery, include a locating part that extends from this periphery and one connect the elastic unit between this locating part and this periphery. When placeeing this wafer, provide a cushioning effect by this elastic unit, make this upper cover can not touch this wafer.
Description
Technical field
The utility model relates to a kind of wafter delivery appts, particularly relates to a kind of contactless wafter delivery appts.
Background technology
Make a wafer and need carry out tens of even hundreds of roads technique, such as be oxidized, etch, clean, Impurity Diffusion, implanted ions and thin film deposition etc., and along with scientific and technological progress, the precision of semiconductor technology is more and more higher, the produced pollution and error in manual operation, nearly all technique has been marched toward Automated condtrol operating in dust free room all, to improve yield and to increase production capacity.
Wafer mode of transport common is at present mainly back-contact, mechanical arm be contacted with the bottom of wafer and carry, as " the wafer transfer robot arm " of No. 586996th, TaiWan, China patent announcement, include arm body on the other hand, this arm body has a wafer carrying plane, one first vacuum passage and one second vacuum passage, this wafer carrying plane has multiple first vacuum hole and multiple second vacuum hole, those first vacuum holes are formed at the inner edge of this wafer carrying plane and are connected conducting with this first vacuum passage, those second vacuum holes are formed at the outer rim of this wafer carrying plane and are connected conducting with this second vacuum passage, this second vacuum passage and this first vacuum passage are not connected to each other conducting, and produce vacuum respectively, to adsorb the bottom of a wafer, this wafer can not be dropped in handling process.When to place this wafer on a platform time, this wafer carrying plane can decline and this wafer is placed on be arranged on the buffering protruding part of this platform more, to cushion the power produced when this wafer declines, so those buffering protruding parts need to should wafer and this wafer carrying plane position and arrange, and comprehensive correspondence cannot be arranged at the bottom of this wafer, after repeatedly carrying, the damages such as this wafer bow may be caused because of unbalance stress.
And other wafer mode of transport are as " the front absorption type wafer acquisition arm " of No. I283036th, TaiWan, China patent announcement, it includes at least one mechanical arm, a upper arm module and a driver module, this at least one mechanical arm has the taper seat of absorption one wafer, this upper arm model calling is in this at least one mechanical arm with this at least one mechanical arm mobile, and this driver module is electrically connected at this upper arm module to control the running of this upper arm module.By this taper seat of this mechanical arm, and the upper surface of this wafer adsorbable, and then carry this wafer.But, after long-term use, its position picking and placeing this wafer may produce skew, and when to place this wafer on a platform time, due to the relation of skew, this mechanical arm excessive descent may be made, and be pressed onto this wafer, therefore be easy to weigh wounded or the surface of this wafer of scratch, cause the breaking-up of this wafer.
Therefore, the damages such as this wafer bow are caused in the bottom of how to reduce this wafer because of unbalance stress, and reduce the problem this wafer being damaged because of the skew of mechanical arm, and real is the required problem solved of relevant dealer.
Utility model content
Main purpose of the present utility model, is the bottom solving this wafer of minimizing causes this wafer to damage problem because of unbalance stress.
Another object of the present utility model, is to solve the problem reducing and because of the skew of mechanical arm, wafer is damaged.
For reaching above-mentioned purpose, the utility model provides a kind of contactless wafter delivery appts, and in order to carry a wafer, it includes:
One pedestal;
One with this pedestal pivot joint and relative to the transfer arm of this pedestal movement, and this transfer arm has one away from the operating side of this pedestal;
One is arranged at the body among this transfer arm, and this body includes the passage and one and this channel connection be formed at the suction port of this operating side of an accommodating fluid;
One is connected to this passage and makes this suction port produce the negative pressure device of the absorption affinity of this wafer of absorption;
One upper cover extended outwardly from this operating side, this upper cover has a periphery; And
The one spacing module being arranged at this periphery, include one from this periphery extend and with form a wafer accommodation space between this upper cover and the locating part and limiting this wafer level movement is connected between this locating part and this periphery to provide the Flexible element of the vertical shift reciprocately of this locating part one.
Above-mentioned contactless wafter delivery appts, wherein this upper cover is a disc-shape.
Above-mentioned contactless wafter delivery appts, wherein this Flexible element is a spring.
Above-mentioned contactless wafter delivery appts, wherein more comprises the sensing element that is arranged at this operating side.
Above-mentioned contactless wafter delivery appts, wherein this fluid is gas or liquid.
Above-mentioned contactless wafter delivery appts, wherein this spacing module more includes one and is arranged at first auxiliary member of this locating part away from the side of this wafer accommodation space, and this first auxiliary member is contacted with this upper cover.
Above-mentioned contactless wafter delivery appts, wherein this spacing module more includes one second auxiliary member, and this second auxiliary member is arranged at the side of this first auxiliary member this transfer arm adjacent, and this second auxiliary member is contacted with an end face of this upper cover.
Above-mentioned contactless wafter delivery appts, wherein this spacing module more includes one and is arranged at the buffer substrate tablet of this second auxiliary member adjacent to this end face.
In sum, the utility model has following characteristics:
One, make this suction port produce this absorption affinity by this negative pressure device is connected to this passage and adsorbs this wafer, and make this wafer and this operating side keep an operating distance, therefore the utility model can carry this wafer when not contacting this wafer, damage to prevent this wafer.
Two, by the setting of this locating part, this wafer can being limited and be positioned at this wafer accommodation space, preventing this wafer in handling process because dropping away from this suction port being positioned at this operating side, to reduce production cost and to increase process yields.
Three, by this locating part and this Flexible element, and when the utility model can be made to place this wafer to one platform, this locating part can first be contacted with this platform, this upper cover presses down this Flexible element again, because this absorption affinity makes this wafer and this operating side keep this operating distance, therefore, what can make the bottom uniform force of this wafer when this upper cover presses down is placed on this platform, the mode of transport reducing existing back-contact can make non-comprehensive the touching in the bottom of this wafer be arranged at buffering protruding part on this platform more, causes the infringements such as this wafer bow because of unbalance stress.
When four, producing skew when this transfer arm Long-Time Service, this upper cover is understood excessive descent and is pressed onto this wafer, and therefore, this locating part and arranging of this Flexible element can provide a cushioning effect, can reduce this wafer and be damaged by pressure or scratch by this upper cover.
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of the utility model first embodiment;
Fig. 2 A ~ Fig. 2 D is the continuous illustrative view of the utility model first embodiment;
Fig. 3 is the sectional structure schematic diagram of the utility model second embodiment;
Fig. 4 is the sectional structure schematic diagram of the utility model the 3rd embodiment.
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present utility model and operation principle are described in detail:
Relate to detailed description of the present utility model and technology contents, the existing accompanying drawing that just coordinates is described as follows:
Referring to shown in Fig. 1 and Fig. 2 A to Fig. 2 D, is sectional structure schematic diagram and the continuous illustrative view of the utility model first embodiment.The utility model is a kind of contactless wafter delivery appts, carry a wafer 80, include a pedestal 10, one transfer arm 20, one body 30, one negative pressure device 40, one upper cover 50 and a spacing module 60, this transfer arm 20 also moves relative to this pedestal 10 with this pedestal 10 pivot joint, and have one away from the operating side 21 of this pedestal 10, this body 30 is arranged among this transfer arm 20, the passage 31 and one including an accommodating fluid is communicated with this passage 31 and is formed at the suction port 32 of this operating side 21, this negative pressure device 40 is connected to this passage 31 and makes this suction port 32 produce the absorption affinity of this wafer 80 of an absorption, this absorption affinity makes this operating side 21 keep an operating distance with this wafer 80, and can when do not touch this wafer 80 carry this wafer 80, prevent the damage caused because of contact, this upper cover 50 extends outwardly from this operating side 21, there is a periphery, this spacing module 60 is arranged at this periphery, include one extend from this periphery and be connected between this locating part 61 and this periphery to provide the Flexible element 62 of the vertical shift reciprocately of this locating part 61 1 with forming a wafer accommodation space 63 between this upper cover 50 and limit the locating part 61 and that this wafer 80 moves horizontally.
In this embodiment, this transfer arm 20 more includes multiple support arm 22 and multiple rotating unit 23 be arranged between those support arms 22, by the running of those rotating units 23, and the relative position of those support arms 22 can be controlled, this transfer arm 20 can be operated in a specific range.In addition, this pedestal 10 more includes an articulated part 11, and this transfer arm 20 through this articulated part 11 with this pedestal 10 pivot joint, and this body 30 may extend to this pedestal 10 is connected with this negative pressure device 40 again, so this body 30 also only can be arranged at this transfer arm 20, and does not extend to this pedestal 10.
This upper cover 50 then to should wafer 80 shape and be a disc-shape, and be more provided with a sensing element 70 in this operating side 21, to sense the distance of this wafer 80 and this operating side 21, if this operating side 21 does not keep this operating distance with this wafer 80, then this negative pressure device 40 can finely tune this absorption affinity, this operating side 21 is made to be held in this operating distance with this wafer 80, prevent from making because this absorption affinity is too strong this wafer 80 be contacted with this operating side 21 and this upper cover 50 and cause the damages such as scratch, or prevent from making because this absorption affinity is too weak this wafer 80 to drop caused damage.
Continuous collocation is consulted shown in Fig. 2 A to Fig. 2 D, for the continuous illustrative view of the utility model first embodiment, as shown in Figure 2 A, this negative pressure device 40 carries out operating and producing a negative pressure to this fluid in this passage 31, and make this suction port 32 produce the absorption affinity of this wafer 80 of an absorption, this wafer 80 is by this absorption affinity or utilize the viscous force between this fluid and this operating side 21 and adsorbed, and be positioned at this wafer accommodation space 63, this locating part 61 can prevent this wafer 80 in handling process because dropping away from this suction port 32 being positioned at this operating side 21, to reduce production cost and to increase process yields, then, as shown in Figure 2 B, when this wafer 80 will be positioned on a platform, this transfer arm 20 makes this locating part 61 first be contacted with this platform through the running of those rotating units 23, now, because this wafer 80 is held in this operating distance with this operating side 21, this wafer 80 is not placed on this platform, then as shown in Figure 2 C, this upper cover 50 presses down this Flexible element 62, and make this wafer 80 be placed on this platform, because the bottom of this wafer 80 is for touch this platform simultaneously, therefore this wafer 80 can not cause because of bottom unbalance stress this wafer 80 to bend and wait damage, and if this transfer arm 20 produces skew during because of Long-Time Service, this locating part 61 provides a cushioning effect with this Flexible element 62, this upper cover 50 can not be weighed wounded or this wafer 80 of scratch.Finally, as shown in Figure 2 D, this wafer 80 is placed on this platform, and this negative pressure device 40 decommissions and this absorption affinity is disappeared, and this transfer arm 20 then can go to carry next wafer 80 again.
In the utility model, this Flexible element 62 can be a spring, or other have flexible object, and this fluid can be liquid or gas, wherein, this liquid can select the liquid with clean or other functions, makes this wafer 80 in time carrying, the pre-process of technique can be carried out, to reduce the process operation time simultaneously.In addition, if during this fluid liquid, prior to a upper surface of this wafer 80 forms one deck liquid, then this wafer 80 can be drawn via this absorption affinity that this suction port 32 produces.
Continuous collocation is consulted shown in Fig. 3, for the second embodiment of the present utility model, with the first embodiment unlike, this spacing module 60 more includes one and is arranged at first auxiliary member 64 of this locating part 61 away from the side of this wafer accommodation space 63, and this first auxiliary member 64 is contacted with this upper cover 50, in addition, the side that can also be contacted with this upper cover 50 in this first auxiliary member 64 arranges a slide rail (not shown), make this upper cover 50 can slippage on this first auxiliary member 64, by this, the shaking amplitude of this Flexible element 62 can be reduced, to drop in handling process damage to prevent this wafer 80.And this locating part 61 and this first auxiliary member 64 also can be formed in one and be made.
Continuous collocation is consulted shown in Fig. 4, for the 3rd embodiment of the present utility model, with the second embodiment unlike, this spacing module 60 more includes one second auxiliary member 65, this second auxiliary member 65 is arranged at the side of this first auxiliary member 64 this transfer arm 20 adjacent, and this second auxiliary member 65 is contacted with an end face 51 of this upper cover 50, therefore, this second auxiliary member 65 can have the function of keeping out this upper cover 50, unlimited this Flexible element 62 that stretches of this upper cover 50 and this locating part 61 can be prevented, to reduce the speed of this Flexible element 62 elastic fatigue, and can consumables cost be reduced.
In the present embodiment, this spacing module 60 more can include one and be arranged at the buffer substrate tablet 66 of this second auxiliary member 65 adjacent to this end face 51, cushion the power that this upper cover 50 strikes this second auxiliary member 65, to increase the useful life of this upper cover 50 and this second auxiliary member 65, and then reduce costs.And this second auxiliary member 65 can also with this locating part 61, the first auxiliary member 64 is one-body molded is made for this, reduces the time that assembling is arranged.
In sum, the utility model has following characteristics:
One, make this suction port produce this absorption affinity by this negative pressure device, making this operating side and this wafer keep this operating distance, and this wafer can be carried when not touching this wafer, preventing the damage caused because touching this wafer.
Two, by the setting of this locating part, can prevent this wafer in handling process because dropping away from this suction port being positioned at this operating side, to reduce production cost and to increase process yields.
Three, press down this Flexible element and this wafer and this operating side by this upper cover and be held in this operating distance, and make the bottom of this wafer can touch this platform simultaneously, therefore this wafer can not cause the damages such as wafer bow because of bottom unbalance stress.
Four, when this transfer arm produces skew because of Long-Time Service, this locating part and this Flexible element can provide a cushioning effect, this upper cover can not be weighed wounded or this wafer of scratch.
Five, by the setting of this first auxiliary member, the shaking amplitude of this Flexible element can be reduced, drop in handling process damage to prevent this wafer.
Six, utilize this second auxiliary member to keep out this upper cover, prevent this upper cover and this locating part from infinitely to stretch this Flexible element, to reduce the speed of this Flexible element elastic fatigue, and can consumables cost be reduced.
Seven, cushion by this buffer substrate tablet the power that this upper cover strikes this second auxiliary member, to increase the useful life of this upper cover and this second auxiliary member, and then reduce costs.
Eight, this locating part, this first auxiliary member and this second auxiliary member can be formed in one and be made, to reduce the time that assembling is arranged.
Certainly; the utility model also can have other various embodiments; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the utility model.
Claims (8)
1. a contactless wafter delivery appts, in order to carry a wafer, is characterized in that, includes:
One pedestal;
One with this pedestal pivot joint and relative to the transfer arm of this pedestal movement, and this transfer arm has one away from the operating side of this pedestal;
One is arranged at the body among this transfer arm, and this body includes the passage and one and this channel connection be formed at the suction port of this operating side of an accommodating fluid;
One is connected to this passage and makes this suction port produce the negative pressure device of the absorption affinity of this wafer of absorption;
One upper cover extended outwardly from this operating side, this upper cover has a periphery; And
The one spacing module being arranged at this periphery, include one from this periphery extend and with form a wafer accommodation space between this upper cover and the locating part and limiting this wafer level movement is connected between this locating part and this periphery to provide the Flexible element of the vertical shift reciprocately of this locating part one.
2. contactless wafter delivery appts according to claim 1, is characterized in that, this upper cover is a disc-shape.
3. contactless wafter delivery appts according to claim 1, is characterized in that, this Flexible element is a spring.
4. contactless wafter delivery appts according to claim 1, is characterized in that, more comprises the sensing element that is arranged at this operating side.
5. contactless wafter delivery appts according to claim 1, is characterized in that, this fluid is gas or liquid.
6. contactless wafter delivery appts according to claim 1, is characterized in that, this spacing module more includes one and is arranged at first auxiliary member of this locating part away from the side of this wafer accommodation space, and this first auxiliary member is contacted with this upper cover.
7. contactless wafter delivery appts according to claim 6, it is characterized in that, this spacing module more includes one second auxiliary member, and this second auxiliary member is arranged at the side of this first auxiliary member this transfer arm adjacent, and this second auxiliary member is contacted with an end face of this upper cover.
8. contactless wafter delivery appts according to claim 7, is characterized in that, this spacing module more includes one and is arranged at the buffer substrate tablet of this second auxiliary member adjacent to this end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520762072.XU CN205069610U (en) | 2015-09-29 | 2015-09-29 | Non -contact wafer handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520762072.XU CN205069610U (en) | 2015-09-29 | 2015-09-29 | Non -contact wafer handling device |
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| Publication Number | Publication Date |
|---|---|
| CN205069610U true CN205069610U (en) | 2016-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520762072.XU Active CN205069610U (en) | 2015-09-29 | 2015-09-29 | Non -contact wafer handling device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813387A (en) * | 2016-03-30 | 2016-07-27 | 广东正业科技股份有限公司 | Reinforcing machine and pick-and-place assembly thereof |
| CN107492508A (en) * | 2016-06-12 | 2017-12-19 | 奇勗科技股份有限公司 | A kind of substrate processing apparatus |
| CN109817561A (en) * | 2017-11-22 | 2019-05-28 | 北京北方华创微电子装备有限公司 | Mechanical finger, chip transmission method and manipulator |
-
2015
- 2015-09-29 CN CN201520762072.XU patent/CN205069610U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813387A (en) * | 2016-03-30 | 2016-07-27 | 广东正业科技股份有限公司 | Reinforcing machine and pick-and-place assembly thereof |
| CN107492508A (en) * | 2016-06-12 | 2017-12-19 | 奇勗科技股份有限公司 | A kind of substrate processing apparatus |
| CN109817561A (en) * | 2017-11-22 | 2019-05-28 | 北京北方华创微电子装备有限公司 | Mechanical finger, chip transmission method and manipulator |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |