CN204332569U - The thermistor of high stability - Google Patents
The thermistor of high stability Download PDFInfo
- Publication number
- CN204332569U CN204332569U CN201420868537.5U CN201420868537U CN204332569U CN 204332569 U CN204332569 U CN 204332569U CN 201420868537 U CN201420868537 U CN 201420868537U CN 204332569 U CN204332569 U CN 204332569U
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- thermistor
- ceramic
- chip
- thermistor chip
- ceramic shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model discloses a kind of thermistor of high stability, include NTC thermistor chip or PTC thermistor chip and ceramic shell, the pin of thermistor chip stretches out outside ceramic shell, of ceramic solidification body is filled with in the accommodation space of ceramic shell, thermistor chip is buried to be fixed in this of ceramic solidification body, extraneous air and water are effectively isolated, improve the NTC themistor/thermal endurance of PTC themistor product, thermal diffusivity, there is better durability and stability.After being wrapped in a heat of the ceramic solidification physical efficiency own absorption resistance chip generation outside NTC thermistor chip/PTC thermistor chip outward, by heat release slow outside ceramic case entirety.Therefore, the heat that thermistor chip produces can be communicated to ceramic case more fast, improves cooling effectiveness, can make thermistor chip recovery characteristics at short notice.
Description
Technical field
The utility model relates to NTC themistor/PTC themistor art, refers in particular to a kind of thermistor of high stability.
Background technology
Thermistor is the electronic component utilizing the temperature variant characteristic of thermo-sensitive material resistivity and make, and wherein comprises negative temperature coefficient (NTC) thermistor element that resistance value raises with temperature and positive temperature coefficient (PTC) thermistor element of increase or resistance value reduce with temperature rising.NTC themistor has been widely used in Inrush current restraining, temperature survey, control, temperature-compensating etc.; PTC themistor is widely used in overcurrent protection, the startup of circuit and electronic component, and flow velocity, flow, the pertinent instruments of radionetric survey and application.
But the NTC themistor/PTC themistor of existing encapsulation still has the problem of thermal endurance, thermal diffusivity deficiency, easily cause the aging of material, have impact on serviceability and the useful life of thermistor, along with all kinds of power supplys such as air-conditioning, refrigerator, microwave equipment and automobile and the stability requirement of circuit to thermistor more and more higher, be necessary that analysis and research have better thermal endurance, thermal diffusivity, thus improve the thermistor of product stability, to adapt to the needs of market requirements at the higher level and competition.
Utility model content
The utility model is for the disappearance of prior art existence, its main purpose is to provide that a kind of thermal endurance, thermal diffusivity are better, the thermistor of performance high stability, it has better durability and excellent insulating properties, stability, uses under adapting to the environment of requirements at the higher level.
For achieving the above object, the utility model adopts following technical scheme:
A kind of thermistor of high stability, include NTC thermistor chip or PTC thermistor chip and ceramic shell, the pin of NTC thermistor chip or PTC thermistor chip stretches out outside ceramic shell, be filled with of ceramic solidification body in the accommodation space of ceramic shell, NTC thermistor chip or PTC thermistor chip are buried to be fixed in this of ceramic solidification body.
As a kind of preferred version, described ceramic shell is open ports in the front that it has larger area.
As a kind of preferred version, described thermistor is a Vertical Heat sensitive resistor, and the base plate of ceramic shell is provided with short slot, and the pin of described NTC thermistor chip or PTC thermistor chip stretches out from the short slot the base plate of ceramic shell.
As a kind of preferred version, described short slot from-inner-to-outer runs through the front of ceramic shell, and short slot above-below direction runs through whole base plate.
As a kind of preferred version, described pin is provided with a location turn of bilge, this location turn of bilge is positioned at the outside of the base plate of foregoing ceramic housing.
As a kind of preferred version, described pin is provided with two location turn of bilges, this two location turn of bilge is positioned in the both sides of the base plate of foregoing ceramic housing respectively.
As a kind of preferred version, described NTC thermistor chip or PTC thermistor chip are also coated with a resin protective layer.
As a kind of preferred version, described thermistor is a horizontal thermistor, the internal face of the side plate of ceramic shell is provided with detent, this detent from inside to outside through go out the front of ceramic shell, detent is non-through side plate laterally, is embedded in this detent after aforementioned pin bending.
As a kind of preferred version, the bottom surface of described detent exceeds aforementioned accommodation space bottom surface, is provided with the boss being supported in NTC thermistor chip or PTC thermistor die bottom surface in the middle part of the bottom surface of accommodation space.
As a kind of preferred version, the biside plate front of described ceramic shell is provided with projection.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution, it is by being placed in ceramic shell by NTC thermistor chip or PTC thermistor chip, and utilize of ceramic solidification body NTC thermistor chip or PTC thermistor chip landfill to be fixed, make NTC thermistor chip/PTC thermistor chip can not be subject to the erosion of air or moisture content, improve the NTC themistor/thermal endurance of PTC themistor product, thermal diffusivity, have and better there is better durability and stability.After being wrapped in a heat of the ceramic solidification physical efficiency own absorption resistance chip generation outside NTC thermistor chip/PTC thermistor chip outward, by heat release slow outside ceramic case entirety.Therefore, the heat that resistance chip occurs can be communicated to ceramic case more fast, improves radiating efficiency, resistance chip can be made to recover resistance characteristic at short notice.It has the coated and protection of ceramic shell and the dual ceramic material of of ceramic solidification body simultaneously, and temperature can diffuse to the heat radiation of product lateral surface equably, and product can not produce temperature rise and fall sharply, possesses more stable properties characteristic.
For more clearly setting forth architectural feature of the present utility model, technological means and the specific purposes reached thereof and function, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in further detail:
Accompanying drawing explanation
Fig. 1 is the assembling schematic perspective view of first embodiment of the utility model.
Fig. 2 is the perspective exploded view of first embodiment of the utility model.
Fig. 3 is the first embodiment assembling schematic cross-section of the utility model.
Fig. 4 is the assembling schematic cross-section of another kind of pin in first embodiment of the utility model.
Fig. 5 is the assembling schematic cross-section of another pin in first embodiment of the utility model.
Fig. 6 is the assembling schematic perspective view of second embodiment of the utility model.
Fig. 7 is the perspective exploded view of second embodiment of the utility model.
Fig. 8 is the second embodiment assembling schematic cross-section of the utility model.
Accompanying drawing identifier declaration:
10, resistance chip, 11, pin, 12, location turn of bilge;
20, ceramic shell, 21, accommodation space, 22, base plate, 23, short slot, 24, detent, 25, projection, 26, boss;
30, of ceramic solidification body.
Embodiment
Please refer to shown in Fig. 1 to Fig. 3, that show the concrete structure of first preferred embodiment of the utility model, the present embodiment is described for a kind of vertical high stability thermistor, it includes resistance chip 10 and ceramic shell 20, and the pin 11 of resistance chip 10 stretches out outside ceramic shell 20.
Described ceramic shell 20 has accommodation space 21, accommodation space 21 is open ports in the front of the larger area of ceramic shell, the base plate 22 of ceramic shell 20 is provided with short slot 23, and described short slot 23 from-inner-to-outer runs through the front of ceramic shell 20, and short slot 23 runs through whole base plate 22.
Aforementioned resistance chip 10 can be negative temperature coefficient (NTC) thermistor chip or positive temperature coefficient (PTC) thermistor chip.NTC thermistor chip in the present embodiment figure or PTC thermistor chip are not coated with protective layer outward, and certainly, the essence according to product needs, and also can be coated with a resin protective layer accordingly.
Described NTC thermistor chip or PTC thermistor chip 10 have two pins 11, and its two pins 11 stretches out respectively from two short slots 23 base plate of ceramic shell.Its pin 11 can be linear as shown in Figure 3, also can be as shown in Figure 4, pin 11 is provided with location turn of bilge 12, this location turn of bilge 12 is positioned at the outside of the base plate 22 of ceramic shell, this location turn of bilge 12 needed before loading ceramic shell 20 that just bending and molding is out, to utilize this location turn of bilge 12 can locate the position of resistance chip 10 in ceramic shell 20, and utilize this location turn of bilge 12 can be butted between ceramic shell 20 and circuit board face, control the distance between ceramic shell 20 and circuit board.Can also be as shown in Figure 5, pin 11 is provided with two location turn of bilges 12, this two location turn of bilge 12 be located in the both sides up and down of ceramic shell base plate 22 respectively, the assembling of resistance chip 10 is located and more precisely puts in place.
Being filled with in the accommodation space 21 of described ceramic shell 20 by oxides such as silicon, magnesium, aluminium, calcium, barium is the of ceramic solidification body 30 of Main Ingredients and Appearance, and NTC thermistor chip or PTC thermistor chip 10 are buried to be fixed in this of ceramic solidification body 30.More specifically way is, first prepare the ceramic shell 20 that has large area open ports, the ceramic size of part is first injected in the bottom of the accommodation space 21 of ceramic shell 20, then resistance chip 10 is placed in the accommodation space 21 of this ceramic shell, the pin 11 of resistance chip 10 is placed in this short slot 23, then in the accommodation space 21 of ceramic shell 20, re-inject ceramic size, cover whole resistance chip body 10.After having poured into, need whole product to be heating and curing, make ceramic size be frozen into of ceramic solidification body 30.
It should be noted that due in the process of perfusion ceramic size, ceramic size can overflow a part from short slot 23, therefore before being heating and curing, also need the slurry that ceramic shell bottom surface is overflowed to wipe off or shaping, in order to avoid affect the laminating location between resistor and circuit board after solidification.
By the thermistor that aforementioned manner is obtained, its NTC thermistor chip/PTC thermistor chip 10 by buried in of ceramic solidification body 30, extraneous air and water are effectively isolated, make NTC thermistor chip/PTC thermistor chip 10 can not be subject to the erosion of air or moisture content, there is better durability and stability.
After being wrapped in a heat of the of ceramic solidification body 30 energy own absorption resistance chip generation outside NTC thermistor chip/PTC thermistor chip 10 outward, by heat release slow outside ceramic case entirety.Therefore, the heat that resistance chip 10 occurs is communicated to ceramic shell 20 more fast than in air, improves cooling effectiveness, resistance chip 10 can be made to recover resistance characteristic at short notice, can guard against apply the inrush current of power supply next time.
And it has the coated and protection of ceramic shell 20 and the dual ceramic material of of ceramic solidification body 30, temperature can diffuse to the heat radiation of product lateral surface equably, and product can not produce temperature rise and fall sharply, possesses more stable properties characteristic.
Please refer to shown in Fig. 6 to Fig. 8, the concrete structure of second preferred embodiment of the utility model, the present embodiment is described for a kind of horizontal high stability thermistor.The present embodiment is substantially identical with the structural principle of aforementioned first embodiment, there is ceramic shell 20, NTC thermistor chip or PTC thermistor chip 10 equally, and NTC thermistor chip or PTC thermistor chip 10 are buried equally in of ceramic solidification body 30.Difference is, previous embodiment is a kind of vertical thermistor, and the present embodiment is a kind of horizontal thermistor product.
Described NTC thermistor chip in the present embodiment or PTC thermistor chip are coated with a resin protective layer, and this resin is preferably silicone material.
Its ceramic shell 20 arranges opening in the side of its larger area equally, but because when it is assembled, towards the side of circuit, it has the larger area side of opening just, therefore on its right plate 22, pin outs is no longer a short slot running through whole right plate.It is provided with detent 24 on the internal face of the side plate of described ceramic shell, this detent 24 from inside to outside through go out the front of ceramic shell 20, detent 24 is non-through side plate laterally, and the bottom surface of detent 24 exceeds aforementioned accommodation space 21 bottom surface, two boss 26 being supported in NTC thermistor chip or PTC thermistor chip 10 bottom surface are provided with in the middle part of the bottom surface of accommodation space 21, this boss 26 can be circular or square, also can be a wider boss, also can be two or more small boss.Be embedded at after aforementioned pin bending 90 degree in this detent 24.Utilize this detent 24, more easily resistance chip 10 can be carried out assembling location when assembling circuit chip 10, ensure the quality consistency of production assembling.
And, the biside plate being better than most ceramic shell 20 is provided with opening towards identical projection 25, this projection 25 is utilized can directly to press on circuit board face, limit the assembled height of this thermistor, and avoid the irregular lateral surface of of ceramic solidification body directly to contact with circuit board face, make the installation of thermistor steady.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every above embodiment is done according to technical spirit of the present utility model any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (10)
1. the thermistor of a high stability, it is characterized in that: include NTC thermistor chip or PTC thermistor chip and ceramic shell, the pin of NTC thermistor chip or PTC thermistor chip stretches out outside ceramic shell, be filled with of ceramic solidification body in the accommodation space of ceramic shell, NTC thermistor chip or PTC thermistor chip are buried to be fixed in this of ceramic solidification body.
2. the thermistor of high stability according to claim 1, is characterized in that: described ceramic shell is open ports in the front that it has larger area.
3. the thermistor of high stability according to claim 2, it is characterized in that: described thermistor is a Vertical Heat sensitive resistor, the base plate of ceramic shell is provided with short slot, and the pin of described NTC thermistor chip or PTC thermistor chip stretches out from the short slot the base plate of ceramic shell.
4. the thermistor of high stability according to claim 3, is characterized in that: described short slot from-inner-to-outer runs through the front of ceramic shell, and short slot above-below direction runs through whole base plate.
5. the thermistor of high stability according to claim 4, is characterized in that: described pin is provided with a location turn of bilge, this location turn of bilge is positioned at the outside of the base plate of foregoing ceramic housing.
6. the thermistor of high stability according to claim 4, is characterized in that: described pin is provided with two location turn of bilges, and this two location turn of bilge is positioned in the both sides of the base plate of foregoing ceramic housing respectively.
7. the thermistor of high stability according to claim 1, is characterized in that: described NTC thermistor chip or PTC thermistor chip are also coated with a resin protective layer.
8. the thermistor of high stability according to claim 1, it is characterized in that: described thermistor is a horizontal thermistor, the internal face of the side plate of ceramic shell is provided with detent, this detent from inside to outside through go out the front of ceramic shell, detent is non-through side plate laterally, is embedded in this detent after aforementioned pin bending.
9. the thermistor of high stability according to claim 8, it is characterized in that: the bottom surface of described detent exceeds aforementioned accommodation space bottom surface, is provided with the boss being supported in NTC thermistor chip or PTC thermistor die bottom surface in the middle part of the bottom surface of accommodation space.
10. the thermistor of high stability according to claim 8, is characterized in that: the biside plate front of described ceramic shell is provided with projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420868537.5U CN204332569U (en) | 2014-12-29 | 2014-12-29 | The thermistor of high stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420868537.5U CN204332569U (en) | 2014-12-29 | 2014-12-29 | The thermistor of high stability |
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| Publication Number | Publication Date |
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| CN204332569U true CN204332569U (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420868537.5U Active CN204332569U (en) | 2014-12-29 | 2014-12-29 | The thermistor of high stability |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105788782A (en) * | 2016-05-05 | 2016-07-20 | 广东百圳君耀电子有限公司 | Anti-explosion long-service-life piezoresistor |
| EP3416456A1 (en) * | 2017-06-13 | 2018-12-19 | Eberspächer catem GmbH & Co. KG | Electric heating device and ptc heating element for same |
| CN109682490A (en) * | 2019-02-19 | 2019-04-26 | 兴勤（宜昌）电子有限公司 | The thermally conductive temperature transducer of modularity |
| CN111105912A (en) * | 2019-12-30 | 2020-05-05 | 南京时恒电子科技有限公司 | High-temperature durable NTC thermistor element and manufacturing method thereof |
| CN113380479A (en) * | 2021-06-09 | 2021-09-10 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
| EP4057301A1 (en) * | 2021-03-12 | 2022-09-14 | Smart Electronics, Inc. | Circuit protection device |
-
2014
- 2014-12-29 CN CN201420868537.5U patent/CN204332569U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105788782A (en) * | 2016-05-05 | 2016-07-20 | 广东百圳君耀电子有限公司 | Anti-explosion long-service-life piezoresistor |
| EP3416456A1 (en) * | 2017-06-13 | 2018-12-19 | Eberspächer catem GmbH & Co. KG | Electric heating device and ptc heating element for same |
| CN109682490A (en) * | 2019-02-19 | 2019-04-26 | 兴勤（宜昌）电子有限公司 | The thermally conductive temperature transducer of modularity |
| CN111105912A (en) * | 2019-12-30 | 2020-05-05 | 南京时恒电子科技有限公司 | High-temperature durable NTC thermistor element and manufacturing method thereof |
| EP4057301A1 (en) * | 2021-03-12 | 2022-09-14 | Smart Electronics, Inc. | Circuit protection device |
| CN115087258A (en) * | 2021-03-12 | 2022-09-20 | 斯玛特电子公司 | Circuit protection device |
| CN113380479A (en) * | 2021-06-09 | 2021-09-10 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
| CN113380479B (en) * | 2021-06-09 | 2022-05-17 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |