CN202303296U

CN202303296U - Light emitting diode (LED) power supply for outdoor illumination

Info

Publication number: CN202303296U
Application number: CN2011203433571U
Authority: CN
Inventors: 秦彪
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-09-04
Filing date: 2011-09-04
Publication date: 2012-07-04
Anticipated expiration: 2021-09-04

Abstract

The utility model provides an open type light emitting diode (LED) power supply for outdoor illumination. A basic structure is similar to that of the existing standard switch power supply, and the LED power supply is mainly characterized in that an insulation sealing layer (5) filled and encapsulated by sealant is arranged at the B side of a printed circuit board (PCB) (7), a layer of continuous insulation film is covered on the surface of a device arranged on the A side (the plug-in unit side) of the PCB (7), the effective damp-proof and rain-proof effects are realized, the structure is simple, the manufacture cost is low, the characteristic of high heat radiation performance of the open type structure is also sufficiently realized, the case of the existing standard switch power supply can be adopted, and the manufacture cost is also reduced.

Description

A kind of LED power supply that is used for outdoor lighting

Technical field

The utility model belongs to the LED lighting technical field, specially refers to the heat radiation and the moisture-proof construction technology of the LED driving power that is used for outdoor lighting.

Technical background

Because superiority energy-conservation and environmental protection, LED is considered to human lighting engineering of future generation, because cost problem, the LED illumination is popularized and stopped.Street lamp is long owing to the working time, and the quilt first-selection is the user of LED illuminating lamp, and as the LED street lamp of outdoor lighting, environment is abominable, and moistureproof anti-rainwater is the basic demand that the LED power supply must reach.Existing LED street lamp framework causes the LED power supply must adopt whole full encapsulation type structure; Such structure not only cost increases (roughly increasing by 30%), and the radiating effect of power supply is also poor, and the accident of many blackouts all is because the components and parts in the power supply; Electrochemical capacitor particularly; Long-time hot operation, components and parts lost efficacy, and caused power supply to damage and caused.

Chinese patent " a kind of LED street lamp " (patent No.: ZL201020629623.2) disclose a kind of new architecture LED street lamp; Be provided with power supply room, rainwater can not get in the power supply room, and power supply is as long as satisfy moistureproof the requirement; Thereby the LED power supply just can adopt Open architecture; Guarantee that easily the components and parts operating temperature in the power supply is low, but the concrete structure of power supply is not disclosed this patent, how to realize the moisture preventive measure under the Open architecture situation.

Summary of the invention

The utility model is exactly to above-mentioned Open architecture LED power supply, proposes concrete structure, realizes reliable moistureproof requirement easily; Even anti-rainwater requirement, and cost is low, and power pack can directly adopt existing standard switch power pack; Not only price is low, has also saved the mould development expense of power pack.

The technical scheme of the utility model is: the LED power supply includes Shell Plate, casing cover and pcb board, and pcb board is provided with components and parts, and casing cover has many passages; Shell Plate includes base plate and side plate; Base plate and side plate are rectangular, adopt the aluminum plate material to process, and pcb board is parallel with base plate; And near base plate; The radiating surface of the prominent power tube element (such as power switch pipe, rectifying tube) on the pcb board is attached on the side plate or through heat-conducting plate and links to each other with side plate, and the heat that this power component produces passes to Shell Plate, and the power pack shell is utilized makes fin; This just side plate and base plate adopt the reason of aluminum material, above-described architectural feature is similar with existing standard switch power supply.The characteristic of the utility model is: pcb board is provided with thickness greater than 2.0mm towards that face (be called as pcb board B face in the utility model, one side then is called as the A face in addition) of base plate, has adopted the insulated enclosure layer of fluid sealant; Components and parts exposed surface on the pcb board A face is coated with, the dielectric film that has adopted whole dipping of pcb board or pcb board integral spray technology to process.

The utility model adopts Open architecture, and the main heating amount outwards sheds through metal-back, and the heat radiation air gets into through the passage on the casing cover; The components and parts of pcb board A face (mainly being plug-in unit); Special thermally sensitive electrochemical capacitor of life-span can directly contact with the heat radiation cold air, thereby guarantee that easily the components and parts operating temperature is low; The electrochemical capacitor life-span is long, is difficult for losing efficacy.Pcb board B face circuit configuration is intensive; Thereby adopt the fluid sealant embedding to process the insulated enclosure layer, because pcb board B face is the pin solder joint face of plug-in type components and parts, leg is protruding; And surperficial subsides formula components and parts generally are located at pcb board B face; Thereby the insulated enclosure layer thickness on the pcb board B face should to paste components and parts greater than the height of leg and surface thick, the utility model proposes the thickness of the insulated enclosure layer on the pcb board B face and should generally get more than the 3.0mm greater than 2.0mm; So just can effectively solve the protection against the tide of pcb board B face, even the problem of waterproof.

Pcb board A face is not generally established the surface and is pasted components and parts; Even do not lay circuit, and having only the plug-in type components and parts, the electrical body that exposes has only those to expose pin; Spacing (creep age distance) between general is all distant, thereby the protection against the tide of pcb board A face employing dielectric film just can be to purpose.Pcb board integral body is soaked insulated paint or pcb board integral spray insulated paint, and the components and parts exposed surface that can obtain on the pcb board A face is covered by the continuous insulated paint of one deck (film), so just can solve the moistureproof problem of pcb board A face simply.By contrast, dipping method and to be added with the negative pressure operation better.The pin that exposes of the components and parts on the pcb board A face puts insulating sleeve, just can reduce to expose the area of electrical body, adds dipping or spraying coating process again; Insulated paint is crammed the slit extremely; The moistureproof and waterproof effect of pcb board A face just further improves, and insulating sleeve adopts heat-shrink tube, better effects if.Dipping or spraying process can be before or after the moulding of insulated enclosure layer encapsulating, preferably after.

Description of drawings

Below in conjunction with accompanying drawing and specific embodiments the utility model is described further.

Fig. 1 is a kind of feature structure three-dimensional cutaway view of the utility model, shows the essential characteristic structure of the utility model.

Fig. 2 is the feature structure generalized section of the pcb board among Fig. 1, has adopted vinyl disc, is convenient to the embedding of pcb board B face insulated enclosure layer.

Fig. 3 is a kind of feature structure three-dimensional cutaway view of the utility model, has set up fin, and pcb board A face also is provided with the insulated enclosure layer.

Among the figure: 1, side plate, 2, the power tube element, 3, Shell Plate, 4, base plate, 5, the insulated enclosure layer, 6, vinyl disc, 7, pcb board, 8, casing cover, 9, fin.

Specific embodiments

The utility model shown in Figure 1, casing cover 8 are processed by punched-plate, and surrounding air can get in the power supply swimmingly, makes the components and parts on the pcb board 7 obtain efficiently radiates heat; Base plate 4 in the Shell Plate 3 is that same aluminium sheet is processed into side plate 1; The radiating surface of the power tube element 2 on the A face of pcb board 7 (outside transmission of heat by contact face) is attached to the medial surface of side plate 1; The heat that power tube element 2 produces directly passes on the side plate 1; Also can adopt the heat-conducting plate structure, the radiating surface of power tube element is attached on the heat-conducting plate, and heat-conducting plate is connected with side plate again.Shell Plate 3 is utilized makes fin; As main fin; The heat radiation of prominent power tube element just should be passed through Shell Plate (3), and Shell Plate 3 just should adopt the aluminum plate material, and thickness can not be too thin; Must not be less than 0.5mm, side plate 1 is processed into (shown in figure) with the preferably same aluminium sheet of base plate 4.

Shown in Fig. 1, the B face of pcb board 7 is provided with insulated enclosure layer 5, also has vinyl disc 6, and the main effect of vinyl disc 6 is the encapsulating moulding that make things convenient for insulated enclosure layer 5.As shown in Figure 2, pcb board 7 is arranged in the vinyl disc 6, and fluid sealant is poured into, and fluid sealant is filled the space between the trying to get to the heart of a matter of pcb board 7 and vinyl disc 6, if adopted the negative pressure operation, has just further improved the quality of insulated enclosure layer 5.

The manufacturing of vinyl disc 6 can be adopted plastic uptake technology or mould pressing process, and plastic uptake technology is: plastic tab is heated to softening, places on the shaping mould of vinyl disc; Adopt the negative pressure ventilation method; Make to produce negative pressure in the negative mold chamber, make softening plastic tab distortion, suck the die moulding or on plastic tab, add the malleation air blowing; Plastic tab distortion with softening is pressed into the die moulding.So-called mould pressing process is exactly: after the plastic tab thermoplastic, through putting between punch and the die, punch-die is afterburning to be merged, and plastic tab is molded into the shape that is designed.

The utility model shown in Figure 3 and difference shown in Figure 1 have: 1, be coated with insulated enclosure layer 5 at the A of pcb board 7 face, adopt and the same fluid sealant of B face, thickness should can improve protection against the tide, the waterproof ability of pcb board A face like this greater than 1.0mm; 2, be provided with the fin 9 of rib-type expansion heat-transfer surface at the lateral surface of base plate 4, the further like this heat dispersion that improves power supply also can be established same fin at the lateral surface of side plate.

The installation of power supply is provided with preferably image pattern 1, the setting attitude shown in 3, and pcb board 7 is upright, even water is arranged on the pcb board, also can flow down, and is difficult for resting on the pcb board 7.

Claims

1. a LED power supply that is used for outdoor lighting includes Shell Plate (3), casing cover (8) and pcb board (7), and pcb board (7) is provided with components and parts; Casing cover (8) has many passages, and Shell Plate (3) includes base plate (4) and side plate (1), base plate (4)) rectangular with side plate (1); Adopt the aluminum plate material to process; Pcb board (7) is fixed on the Shell Plate (3), and pcb board (7) is parallel with base plate (4), and the radiating surface of the prominent power tube element (2) on the pcb board (7) is attached to side plate (1) and upward or through heat-conducting plate links to each other with side plate (1); It is characterized in that: pcb board (7) B face is provided with thickness greater than 2.0mm, has adopted the insulated enclosure layer (5) of fluid sealant; Components and parts exposed surface on pcb board (7) the A face is coated with, the dielectric film that has adopted whole dipping of pcb board or pcb board integral spray technology to process.

2. LED power supply according to claim 1 is characterized in that: insulated enclosure layer (5) thickness on pcb board (7) the B face is greater than 3.0mm.

3. LED power supply according to claim 2 is characterized in that: be coated with thickness greater than 1.0mm on pcb board (7) the A face, adopted the insulated enclosure layer (5) of fluid sealant.

4. according to claim 1 or 2 or 3 described LED power supplys; It is characterized in that: pcb board (7) is arranged in the vinyl disc (6); The fluid sealant filling has been adopted in space between the trying to get to the heart of a matter of pcb board (7) and this vinyl disc (6), has constituted the insulated enclosure layer (5) on pcb board (7) the B face.

5. LED power supply according to claim 4 is characterized in that: vinyl disc (6) is the working of plastics that adopts plastic uptake technology or mould pressing process to process.

6. LED power supply according to claim 1 is characterized in that: be provided with the fin (9) that rib-type is expanded heat-transfer surface at base plate (4) or side plate (1) lateral surface.

7. LED power supply according to claim 1 is characterized in that: the pin that exposes of the components and parts on pcb board (7) the A face is with insulating sleeve.

8. LED power supply according to claim 7 is characterized in that: this insulating sleeve has adopted heat-shrink tube.