CN204303488U - A kind of Thermal protection type piezo-resistance - Google Patents
A kind of Thermal protection type piezo-resistance Download PDFInfo
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- CN204303488U CN204303488U CN201420802436.8U CN201420802436U CN204303488U CN 204303488 U CN204303488 U CN 204303488U CN 201420802436 U CN201420802436 U CN 201420802436U CN 204303488 U CN204303488 U CN 204303488U
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- fuse
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- pedestal
- chip varistor
- resistance
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Abstract
The utility model relates to a kind of Thermal protection type piezo-resistance, and base of ceramic and chip varistor large area are close to, and hollow is close to containing fusible link and the ceramic base of flux, effective perception chip temperature, and alarm fuses; After base of ceramic plays and effectively ensures fuse disruption, Xi Shui and chip varistor are isolated, and avoid arcing degree; Pedestal is arranged fluting for fusible link fracture simultaneously, leave and take the space that enough fuses, ensure effectively to disconnect; Fuse surface is coated with PUR, pin hole, bubble bad order that the follow-up painting operation avoiding cavity to cause occurs, and before ensureing fusible link fracture, PUR is in flow-like, and avoiding affects fuse disruption simultaneously; Finished product outermost layer uses conventional epoxies parcel, plays the effect such as protection against the tide, insulation.
Description
Technical field
The utility model relates to piezo-resistance field, especially a kind of Thermal protection type piezo-resistance.
Background technology
Varistor is according to its superior volt-ampere characteristic, low production cost, be widely used in electronic circuit overvoltage, surge protection, but circuit is because of overvoltage too much in electronic circuit exception, varistor is caused to take place frequently action, occur that performance reduces, lost efficacy, serious time occur that varistor self punctures, combustion phenomena, cause other resistor assemblies of periphery to burn, cause larger loss;
The traditional finished product fuse of general employing and piezo-resistance cascaded structure on existing market, as mainly there is following several deficiency:
1, fuse failure, headspace is less, effectively cannot disconnect after the fusing of guarantee insurance silk;
2, fuse and chip contact area less, be unfavorable for that heat is passed to fuse;
3, product component assembling is complicated, is unfavorable for automation, large-scale production.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of Thermal protection type piezo-resistance, and not only product with compact structure, fusible link reaction speed are fast, outward appearance shape rule; And be suitable for automation, large-scale production, fusible link according to piezo-resistance needs, can select different size fuse, is applicable to occasion extensive.
The utility model solves the technical scheme that its technical problem adopts: a kind of Thermal protection type piezo-resistance, the lead electrode comprising pedestal, be arranged on the chip varistor on pedestal and be connected with external electronic component, described base-plates surface offers downward groove; Thermo-fuse is placed in described groove; Described thermo-fuse surface-coated PUR; Described PUR fills up whole groove inner chamber; The side of described groove is provided with through hole; One end of described thermo-fuse directly connects lead electrode; The other end of thermo-fuse is connected with chip varistor through through hole; Described chip varistor connects another lead electrode.
Further, thermo-fuse described in the utility model directly and the tie point of lead electrode junction as the first solder joint; The tie point of thermo-fuse and chip varistor junction is the second solder joint; The tie point of described chip varistor and another lead electrode junction is the 3rd solder joint; The first described solder joint is wrapped in groove by PUR; The second described solder joint place also welds and is provided with signal pins.
Further say, in order to fuse in time, thermo-fuse described in the utility model is hollow-core construction and hollow lumen has flux.
In order to can effective perception chip temperature, pedestal described in the utility model be alumina porcelain pedestal; The one side of described chip varistor is welded with lead electrode; Another side and pedestal are close to bonding.
For the ease of locating and machining, the edge, side of pedestal described in the utility model is provided with spacing seam.
Production technology of the present utility model, comprises the following steps:
1) base of ceramic and chip varistor are bonded by gluing assembling;
2) offer groove on base of ceramic surface, place thermo-fuse at groove inner close fitting base of ceramic;
3) one end of thermo-fuse is directly connected lead electrode; The other end of thermo-fuse is connected with chip varistor through through hole; Chip varistor connects another lead electrode;
4) at thermo-fuse surface injection moulding cover heating melten gel continuously; Make PUR complete cover heating fuse surface and fill up whole groove;
5) wrap up at product surface surface coverage epoxy resin.
The beneficial effects of the utility model are, solve the defect existed in background technology, and base of ceramic and chip varistor large area are close to, and hollow is close to containing fusible link and the ceramic base of flux, effective perception chip temperature, and alarm fuses; After base of ceramic plays and effectively ensures fuse disruption, Xi Shui and chip varistor are isolated, and avoid arcing degree; Pedestal is arranged fluting for fusible link fracture simultaneously, leave and take the space that enough fuses, ensure effectively to disconnect; Fuse surface is coated with PUR, pin hole, bubble bad order that the follow-up painting operation avoiding cavity to cause occurs, and before ensureing fusible link fracture, PUR is in flow-like, and avoiding affects fuse disruption simultaneously; Finished product outermost layer uses conventional epoxies parcel, plays the effect such as protection against the tide, insulation.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the structural representation of prior art;
Fig. 2 is the structure cutaway view of Fig. 1;
Fig. 3 is structural representation of the present utility model;
Fig. 4 is the structure cutaway view of Fig. 3;
Fig. 5 is the structural representation of the utility model band signal pin
Fig. 6 is the structure cutaway view of Fig. 5;
In figure: 1, pedestal; 2, chip varistor; 3, lead electrode; 4, groove; 5, thermo-fuse; 6, spacing seam; 7, PUR; 8, through hole.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
The thermistor of the prior art shown in Fig. 1-2; Its weak point as described in the background art, no longer repeated description herein.
Fig. 3-4 is embodiments of the present utility model, a kind of Thermal protection type piezo-resistance, the lead electrode comprising pedestal, be arranged on the chip varistor on pedestal and be connected with external electronic component, and base-plates surface offers downward groove; Thermo-fuse is placed in groove; For the ease of locating and machining, the edge, side of pedestal is provided with spacing seam.
Thermo-fuse surface-coated PUR; PUR fills up whole groove inner chamber; The side of groove is provided with through hole; One end of thermo-fuse directly connects lead electrode; The other end of thermo-fuse is connected with chip varistor through through hole; Chip varistor connects another lead electrode.
Thermo-fuse directly and the tie point of lead electrode junction as the first solder joint; The tie point of thermo-fuse and chip varistor junction is the second solder joint; The tie point of chip varistor and another lead electrode junction is the 3rd solder joint; First solder joint is wrapped in groove by PUR; In order to increase practicality, signalization pin can also be welded at the second solder joint place; As seen in figs. 5-6.
Pedestal is alumina porcelain pedestal; The one side of chip varistor is welded with lead electrode; Another side and pedestal are close to bonding.Base of ceramic and chip varistor large area are close to, and hollow is close to containing fusible link and the ceramic base of flux, effective perception chip temperature, and alarm fuses.After base of ceramic plays and effectively ensures fuse disruption, Xi Shui and chip varistor are isolated, and avoid arcing degree, pedestal are arranged fluting for fusible link fracture simultaneously, leave and take the space that enough fuses, ensure effectively to disconnect; In order to fuse in time, thermo-fuse is hollow-core construction and hollow lumen has flux.
Fuse surface is coated with PUR, pin hole, bubble bad order that the follow-up painting operation avoiding cavity to cause occurs, and before ensureing fusible link fracture, PUR is in flow-like, and avoiding affects fuse disruption simultaneously; The most layer of finished product uses conventional epoxies parcel, plays the effect such as protection against the tide, insulation.
Manufacture craft is: after base and chip portfolio, adopts that automation wire, fuse weld job, continuously injection heat melten gel are shaping, application epoxy resin automated job, greatly improves automatically, large-scale production operation at performance guarantee simultaneously, and concrete steps are as follows:
1) base of ceramic and chip varistor are bonded by gluing assembling;
2) offer groove on base of ceramic surface, place thermo-fuse at groove inner close fitting base of ceramic;
3) one end of thermo-fuse is directly connected lead electrode; The other end of thermo-fuse is connected with chip varistor through through hole; Chip varistor connects another lead electrode;
4) at thermo-fuse surface injection moulding cover heating melten gel continuously; Make PUR complete cover heating fuse surface and fill up whole groove;
5) wrap up at product surface surface coverage epoxy resin.
The utility model according to customer demand, can be selected different temperatures, diameter thermo-fuse, is widely used in various temperature, overvoltage protection occasion.
The just embodiment of the present utility model described in above specification, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (5)
1. a Thermal protection type piezo-resistance, the lead electrode comprising pedestal, be arranged on the chip varistor on pedestal and be connected with external electronic component, is characterized in that: described base-plates surface offers downward groove; Thermo-fuse is placed in described groove; Described thermo-fuse surface-coated PUR; Described PUR fills up whole groove inner chamber; The side of described groove is provided with through hole; One end of described thermo-fuse directly connects lead electrode; The other end of thermo-fuse is connected with chip varistor through through hole; Described chip varistor connects another lead electrode.
2. a kind of Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: described thermo-fuse directly and the tie point of lead electrode junction as the first solder joint; The tie point of thermo-fuse and chip varistor junction is the second solder joint; The tie point of described chip varistor and another lead electrode junction is the 3rd solder joint; The first described solder joint is wrapped in groove by PUR; The second described solder joint place also welds and is provided with signal pins.
3. a kind of Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: described thermo-fuse is hollow-core construction and hollow lumen has flux.
4. a kind of Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: described pedestal is alumina porcelain pedestal; The one side of described chip varistor is welded with lead electrode; Another side and pedestal are close to bonding.
5. a kind of Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: the edge, side of described pedestal is provided with spacing seam.
Priority Applications (1)
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CN201420802436.8U CN204303488U (en) | 2014-12-17 | 2014-12-17 | A kind of Thermal protection type piezo-resistance |
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CN201420802436.8U CN204303488U (en) | 2014-12-17 | 2014-12-17 | A kind of Thermal protection type piezo-resistance |
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CN204303488U true CN204303488U (en) | 2015-04-29 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104517694A (en) * | 2014-12-17 | 2015-04-15 | 兴勤(常州)电子有限公司 | Thermally-protected pressure-sensitive resistor and production process thereof |
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2014
- 2014-12-17 CN CN201420802436.8U patent/CN204303488U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104517694A (en) * | 2014-12-17 | 2015-04-15 | 兴勤(常州)电子有限公司 | Thermally-protected pressure-sensitive resistor and production process thereof |
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