CN204204827U - A kind of movable wafer jig of wet-cleaned groove - Google Patents
A kind of movable wafer jig of wet-cleaned groove Download PDFInfo
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- CN204204827U CN204204827U CN201420748914.1U CN201420748914U CN204204827U CN 204204827 U CN204204827 U CN 204204827U CN 201420748914 U CN201420748914 U CN 201420748914U CN 204204827 U CN204204827 U CN 204204827U
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Abstract
The utility model discloses a kind of movable wafer jig of wet-cleaned groove, be arranged in rinse bath, for wafer being fixed and cleaning, fixture comprises two synchronous initiatively roller bearing and driven roller bearings axially arranging by wafer, roller bearing two end rotates fixing at rinse bath sidewall, initiatively roller bearing connects driver element, driven roller bearing is positioned at below two active roller bearings and forms del setting, some wafer draw-in grooves are provided with around roller bearing radial surface correspondence, initiatively, driven roller bearing is cleaned to carry out rotation by the corresponding wafer of each draw-in groove pop-up, the flowing space of liquid can be increased, improve mobility and the performance of flushing of liquid, particle is easily departed from from fixture, thus the cleaning performance of subsequent wafer batch can be promoted, increase yield and output, and the time of preventive maintenance can be reduced.
Description
Technical field
The utility model relates to semiconductor integrated circuit apparatus technical field, more specifically, relates to a kind of movable wafer jig of wet-cleaned groove.
Background technology
Along with characteristic size continue reduce, more and more harsher to the purity requirements of crystal column surface in integrated circuit fabrication process.Crystal column surface must be clean before standing various technique, once crystal column surface is stain, pollutant just must be removed by cleaning.The target of wafer cleaning removes all surface contaminations: particle, organic substance, metal and natural oxidizing layer.Each step manufacturing process be all the contamination source that on wafer, device is potential, run through whole integrated circuit fabrication process process, every wafer will be cleaned about hundreds of take second place many.According to statistics, matting accounts for 20 ~ 30% of whole integrated circuit fabrication process, therefore, wafer cleaning becomes one of operation most important, the most rigorous in integrated circuit fabrication process, and wafer cleaning technology and wash result (cleanliness factor) also become affects one of most important factor of wafer yield, device quality and reliability.
Method for cleaning wafer generally comprises wet-cleaned and dry method cleaning.Wherein, wet-cleaned can adopt multi-disc to clean or monolithic cleaning form, still occupies dominant position so far, and is improving to obtaining more effective cleaning performance.
The main body of multi-disc wet clean equipment adopts rinse bath form usually, the advantages such as it has, and structure is simple, low cost, high production, high reliability and excellent Selection radio.When cleaning, more wafers being put into rinse bath, being vertically fixed on the fixture of bottom of rinse bath side by side, then, cleaning process can be completed according to menu input cleaning liquid.
Wafer fabrication is limited to the reason such as technological process, cost, is often arranged in the mixing cleaning that same wet clean equipment successively carries out product batches after different process, causes producing in cleaning liquid and having accumulated more particle.And the relation that the wafer jig of existing rinse bath designs due to device hardware, have employed overall fixed structure.Wafer is fixed and is clamped on fixture, and each wafer interval is each other only about 5mm.Because the gap between fixture and wafer is too small, and between wafer with fixture, keep relative stationary state, near making to clean the binding site of liquid between wafer and fixture, flow velocity is slack-off, the particle of generation is caused to be not easy to be washed removal from fixture, and cumulatively become a sources of particles, have impact on the cleaning performance of subsequent wafer batch, thus cause reducing yield, output, and add the time of preventive maintenance.
Utility model content
The purpose of this utility model is the above-mentioned defect overcoming prior art existence, a kind of movable wafer jig of new wet-cleaned groove is provided, existing overall stationary fixture is improved to and has initiatively and the floating holder of driven roller bearing, and draw-in groove is set in each described roller surface corresponding wafer is held, by the rotation of active roller bearing, wafer and driven roller bearing synchronous axial system is driven to realize rotating cleaning successively, the flowing space of liquid can be increased, improve mobility and the performance of flushing of liquid, particle is easily departed from from fixture, thus the particle solving prior art existence is difficult to remove from fixture and cause becoming the problem of sources of particles.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of movable wafer jig of wet-cleaned groove, be arranged in described rinse bath, for wafer being fixed and cleaning, described fixture comprises two synchronous initiatively roller bearing and driven roller bearings axially arranging by wafer, described roller bearing two end rotates fixing at described rinse bath sidewall, described active roller bearing connects driver element, described driven roller bearing is positioned at below two described active roller bearings and forms del setting, some wafer draw-in grooves are provided with around described roller bearing radial surface correspondence, described active, driven roller bearing is cleaned to carry out rotation by the corresponding wafer of each described draw-in groove pop-up.
Preferably, the elongated end of two described active roller bearings outside described rinse bath sidewall connects described driver element respectively by Timing Belt, and drives described driven roller bearing to form synchronous axial system by wafer.
Preferably, described driver element is servomotor, and the elongated end of two described active roller bearings outside described rinse bath sidewall connects the rotating shaft of described servomotor respectively by Timing Belt, and drives described driven roller bearing to form synchronous axial system by wafer.
Preferably, two described active roller bearings are symmetrically set in the both sides, top of described driven roller bearing.
Preferably, described driven roller bearing can arrange multiple in the below of described active roller bearing, and with contact in the lower half circle week of wafer.
Preferably, the quantity of the described draw-in groove on described active roller bearing and driven roller bearing is 25 or 50.
Preferably, also comprise the monitor speed unit of described roller bearing, be located at outside described rinse bath, and connect described active roller bearing or driven roller bearing.
Preferably, described monitor speed unit is located at described active roller bearing or the wherein side elongated end of driven roller bearing outside described rinse bath sidewall.
Preferably, described roller bearing has plastic surface.
Preferably, described roller bearing has plasticity corrosion-inhibiting coating surface.
As can be seen from technique scheme, the utility model has the following advantages:
1, existing overall stationary fixture is improved to the floating holder with active and driven roller bearing wafer is held, wafer and driven roller bearing synchronous axial system is driven successively by the rotation of active roller bearing, realize rotating cleaning, the contact position of roller bearing and wafer is changing by rotating always, the flowing space of liquid can be increased, improve mobility and the performance of flushing of liquid, particle is easily departed from from fixture, avoid that particle is cumulative on fixture becomes a sources of particles, thus improve the cleaning performance of subsequent wafer batch, add yield and output, and reduce the time of preventive maintenance,
2, by arranging draw-in groove in roller surface, corresponding wafer stabilizing can be held, preventing wafer from rotation cleaning process, producing skew and damage;
3, by being processed as by roller bearing, there is plasticity corrosion-inhibiting coating surface, both can play the effect reducing roller bearing and corroded by liquid, rigid contact between wafer can be avoided again and cause producing new particle;
4, by arranging monitor speed unit on roller bearing, the rotating speed of roller bearing can be monitored, reaching and rotating with certain speed control roller bearing the needs carrying out cleaning.
Accompanying drawing explanation
Fig. 1 is the structural representation of the movable wafer jig of a kind of wet-cleaned of the utility model groove;
Fig. 2 is the side-looking direction structure schematic diagram of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
It should be noted that, in following embodiment, when describing execution mode of the present utility model in detail, in order to clearly represent structure of the present utility model so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as to restriction of the present utility model.
In the prior art, the relation that the wafer jig of wafer wet cleaning equipment rinse bath designs due to device hardware, have employed overall fixed structure.Wafer is fixed and is clamped on fixture, and each wafer interval is each other only about 5mm.Because the gap between fixture and wafer is too small, and between wafer with fixture, keep relative stationary state, near making to clean the binding site of liquid between wafer and fixture, flow velocity is slack-off, the particle of generation is caused to be not easy to be washed removal from fixture, and cumulatively become a sources of particles, have impact on the cleaning performance of subsequent wafer batch, thus cause reducing yield, output, and add the time of preventive maintenance.
The utility model is to this has been improvement, provide a kind of movable wafer jig of new wet-cleaned groove, existing overall stationary fixture is improved to and has initiatively and the floating holder of driven roller bearing, and draw-in groove is set in each described roller surface corresponding wafer is held, by the rotation of active roller bearing, wafer and driven roller bearing synchronous axial system is driven to realize rotating cleaning successively, the flowing space of liquid can be increased, improve mobility and the performance of flushing of liquid, particle is easily departed from from fixture, thus the particle solving prior art existence is difficult to remove from fixture and cause becoming the problem of sources of particles.
In following embodiment of the present utility model, refer to Fig. 1, Fig. 1 is the structural representation of the movable wafer jig of a kind of wet-cleaned of the utility model groove.As shown in Figure 1, the movable wafer jig of wet-cleaned groove of the present utility model, is arranged on the lower inside region of described rinse bath 1, for being fixed by wafer 2 and cleaning.Described fixture comprises two synchronous initiatively roller bearing 3 and driven roller bearings 5 axially arranging by wafer 2.Two ends of described roller bearing 3,5 are rotatably mounted on the sidewall of described rinse bath 1, to obtain the support of described rinse bath 1, and can rotate.
Please continue to refer to Fig. 1.In order to realize the synchronous axial system of two described active roller bearings 3, two described active roller bearings 3 are connected to a driver element 6.Optionally, described driver element 6 is servomotor.Two described active roller bearings 3 can be connected to described servomotor 6 respectively by a Timing Belt 4, and drive described active roller bearing 3 to form synchronous axial system (such as illustrating the direction indication of the other hollow arrow of roller bearing 3) by described servomotor 6.
Refer to Fig. 2, Fig. 2 is the side-looking direction structure schematic diagram of Fig. 1.As shown in Figure 2, two described active roller bearings 3 with the concrete connected mode of described servomotor 6 are: two described active roller bearings 3 described rinse bath 1 sidewall side link to described rinse bath 1 extension out, overlap respectively at its elongated end and have a Timing Belt 4 (only demonstrating in figure near the syndeton between the active roller bearing and servomotor of drawing side), the other end of Timing Belt 4 is enclosed within the rotating shaft of described servomotor 6, by the rotation of described servomotor 6 rotating shaft, two described active roller bearings 3 can be driven to form synchronous axial system.Servomotor 6 can require automatically to control rotating speed according to cleaning, to reach the needs controlling roller bearing 3 rotating speed.
Please continue to refer to Fig. 1.Described driven roller bearing 5 is positioned at the below of two described active roller bearings 3, and forms the setting position of del between two described active roller bearings 3.Wafer 2 according to being undertaken setting by the size of cleaning wafer 2 and being fixed on the sidewall of described rinse bath 1, and can hold up along the circumference of wafer 2 by the relative position between two described active roller bearings 3 and described driven roller bearing 5.Like this, by controlling the rotation of described servomotor 6 rotating shaft, two described active roller bearings 3 are driven to form synchronous axial system with Timing Belt 4, drive wafer 2 synchronous axial system (such as illustrating the direction indication of the other hollow arrow of wafer 2) held up again, and drive the synchronous axial system of described driven roller bearing 5 (such as illustrating the direction indication of the other hollow arrow of driven roller bearing 5) by wafer 2, the Integral synchronous forming two described active roller bearings 3, described driven roller bearing 5 and wafer 2 rotates, and realizes cleaning the rotation of wafer 2.
Please continue to refer to Fig. 2.The utility model is applicable to and carries out batch cleaning to more wafers simultaneously.In order to each wafer stabilizing is held, prevent wafer from rotation cleaning process, producing skew and damage, be processed with side by side on the surface of two described active roller bearings 3, described driven roller bearing 5 some with wafer number, draw-in groove 8 (exemplarily showing three draw-in grooves in figure) corresponding to spacing.Draw-in groove 8 is arranged around the radial surface of each described roller bearing 3,5.When cleaning, wafer puts into rinse bath 1 by mechanical arm, and snaps in one by one in draw-in groove 8 corresponding on described roller bearing 3,5.Like this, wafer, namely by each described draw-in groove 8 of correspondence, is held up to carry out rotation cleaning reposefully by described active, driven roller bearing 3,5.
The clamp structure design utilizing the utility model above-mentioned, when the rotation cleaning carrying out wafer, contact position between roller bearing draw-in groove and wafer is by rotating and will change always, like this, the flowing space of cleaning liquid can be increased, improve mobility and the performance of flushing of liquid, make particle easily from fixture (specifically three roller bearings, particularly draw-in groove are inner) disengaging, avoid that particle is cumulative on fixture becomes a sources of particles, thus improve the cleaning performance of subsequent wafer batch, add yield and output, and reduce the time of preventive maintenance.
Please continue to refer to Fig. 1.As a preferred embodiment of the present utility model, two described active roller bearings 3 can be symmetrically set in the both sides, top of described driven roller bearing 5, to improve the integrally-built stability of fixture.As other embodiment of the present utility model, described driven roller bearing 5 can according to the total weight size of wafer 2, arrange multiple in the below of two described active roller bearings 3, and be arranged to and contact in the lower half circle week of wafer 2, to ensure that fixture has enough weight capacities.
Please continue to refer to Fig. 2.As another embodiment of the utility model, on described active roller bearing 3 and driven roller bearing 5, the quantity of the corresponding described draw-in groove 8 arranged can be 25 or 50 (exemplarily showing wherein three draw-in grooves in figure).General, the cleaning batch of a collection of wafer is 25, the quantity of draw-in groove 8 is arranged to equal with batch wafer or is its two times, so that batch management of cleaning, can also ensure the specific yield cleaned, improve the utilance of cleaning equipment.
Please continue to refer to Fig. 2.When carrying out wafer cleaning, being keep the stability of rotation of wafer, preventing from causing damage because rotating too fast generations shake, even because the wafer that causes out of control departs from lifting of fixture, strictly must control the rotating speed of two active roller bearings 3 well.Therefore, need the monitor speed unit that roller bearing is set, monitor the rotating speed of roller bearing, reach and rotate with certain speed control roller bearing the needs carrying out cleaning.Alternatively, described monitor speed unit 7 can be located at outside described rinse bath 1, and connects described active roller bearing 3 or driven roller bearing 5 (principle is described active roller bearing and driven roller bearing is synchronous axial system).Alternatively, described monitor speed unit 7 can adopt such as general rotational speed meters.In the present embodiment further alternatively, by described driven roller bearing 5, in the side (being illustrated as right side) of described rinse bath 1 sidewall, link to described rinse bath 1 extension out, described rotational speed meters 7 can be arranged on the elongated end of described driven roller bearing 5 according to operation instruction, get final product the rotating speed of precise monitoring roller bearing, thus the rotation of wafer is control effectively.
In addition, causing producing new particle in order to avoid producing rigid contact between roller bearing 3,5 and wafer 2, roller bearing 3,5 can be processed as the relative soft surface with plasticity; Meanwhile, corroded by liquid to reduce and delaying roller bearing 3,5, resistant material processing and fabricating roller bearing 3,5 can be used.As a preferred embodiment of the present utility model, corrosion resistant such as Teflon material can be adopted, apply on described roller bearing 3,5 surface, to form the soft composite coating of corrosion resistant plasticity on each roller bearing 3,5 surface.
Above-describedly be only preferred embodiment of the present utility model; described embodiment is also not used to limit scope of patent protection of the present utility model; therefore the equivalent structure that every utilization specification of the present utility model and accompanying drawing content are done changes, and in like manner all should be included in protection range of the present utility model.
Claims (10)
1. the movable wafer jig of a wet-cleaned groove, be arranged in described rinse bath, for wafer being fixed and cleaning, it is characterized in that, described fixture comprises two synchronous initiatively roller bearing and driven roller bearings axially arranging by wafer, described roller bearing two end rotates fixing at described rinse bath sidewall, described active roller bearing connects driver element, described driven roller bearing is positioned at below two described active roller bearings and forms del setting, some wafer draw-in grooves are provided with around described roller bearing radial surface correspondence, described active, driven roller bearing is cleaned to carry out rotation by the corresponding wafer of each described draw-in groove pop-up.
2. the movable wafer jig of wet-cleaned groove according to claim 1, it is characterized in that, the elongated end of two described active roller bearings outside described rinse bath sidewall connects described driver element respectively by Timing Belt, and drives described driven roller bearing to form synchronous axial system by wafer.
3. the movable wafer jig of wet-cleaned groove according to claim 2, it is characterized in that, described driver element is servomotor, the elongated end of two described active roller bearings outside described rinse bath sidewall connects the rotating shaft of described servomotor respectively by Timing Belt, and drives described driven roller bearing to form synchronous axial system by wafer.
4. the movable wafer jig of the wet-cleaned groove according to claims 1 to 3 any one, is characterized in that, two described active roller bearings are symmetrically set in the both sides, top of described driven roller bearing.
5. the movable wafer jig of the wet-cleaned groove according to claims 1 to 3 any one, is characterized in that, described driven roller bearing can arrange multiple in the below of described active roller bearing, and with contact in the lower half circle week of wafer.
6. the movable wafer jig of wet-cleaned groove according to claim 1, is characterized in that, the quantity of the described draw-in groove on described active roller bearing and driven roller bearing is 25 or 50.
7. the movable wafer jig of the wet-cleaned groove according to claims 1 to 3 or 6, is characterized in that, also comprises the monitor speed unit of described roller bearing, is located at outside described rinse bath, and connects described active roller bearing or driven roller bearing.
8. the movable wafer jig of wet-cleaned groove according to claim 7, is characterized in that, described monitor speed unit is located at described active roller bearing or the wherein side elongated end of driven roller bearing outside described rinse bath sidewall.
9. the movable wafer jig of the wet-cleaned groove according to claims 1 to 3,6 or 8, is characterized in that, described roller bearing has plasticity composite bed surface.
10. the movable wafer jig of wet-cleaned groove according to claim 9, is characterized in that, described roller bearing has plasticity corrosion-inhibiting coating surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420748914.1U CN204204827U (en) | 2014-12-03 | 2014-12-03 | A kind of movable wafer jig of wet-cleaned groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420748914.1U CN204204827U (en) | 2014-12-03 | 2014-12-03 | A kind of movable wafer jig of wet-cleaned groove |
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| CN204204827U true CN204204827U (en) | 2015-03-11 |
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| CN201420748914.1U Active CN204204827U (en) | 2014-12-03 | 2014-12-03 | A kind of movable wafer jig of wet-cleaned groove |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706144A (en) * | 2017-09-14 | 2018-02-16 | 德淮半导体有限公司 | Wafer cleaning fixing device and cleaning equipment |
| CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
-
2014
- 2014-12-03 CN CN201420748914.1U patent/CN204204827U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706144A (en) * | 2017-09-14 | 2018-02-16 | 德淮半导体有限公司 | Wafer cleaning fixing device and cleaning equipment |
| CN114345778A (en) * | 2021-12-27 | 2022-04-15 | 浙江光特科技有限公司 | Wafer cleaning device |
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