CN204189824U - LED wafer and light emitting diode (LED) display screen - Google Patents

LED wafer and light emitting diode (LED) display screen Download PDF

Info

Publication number
CN204189824U
CN204189824U CN201420369927.8U CN201420369927U CN204189824U CN 204189824 U CN204189824 U CN 204189824U CN 201420369927 U CN201420369927 U CN 201420369927U CN 204189824 U CN204189824 U CN 204189824U
Authority
CN
China
Prior art keywords
electrode
led
led wafer
conductive connecting
connecting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420369927.8U
Other languages
Chinese (zh)
Inventor
卢长军
余杰
刘志勇
潘彤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leyard Optoelectronic Co Ltd
Original Assignee
Leyard Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leyard Optoelectronic Co Ltd filed Critical Leyard Optoelectronic Co Ltd
Priority to CN201420369927.8U priority Critical patent/CN204189824U/en
Application granted granted Critical
Publication of CN204189824U publication Critical patent/CN204189824U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of LED wafer and light emitting diode (LED) display screen, wherein, this LED wafer comprises LED wafer body; First electrode, is arranged on the first end of LED wafer body; Second electrode, is arranged on the second end relative with first end of LED wafer body, and wherein, the second electrode is contrary with the polarity of the first electrode; First conductive connecting element, is arranged on the surface of first end, is electrically connected with the first electrode; Second conductive connecting element, is arranged on the surface of the second end, is electrically connected with the second electrode.The utility model solves existing LED wafer, and only at one end arranging conductive connecting element causes the technical problem that the reliability of this wafer is lower, reaches the technique effect of the reliability improving LED wafer.

Description

LED wafer and light emitting diode (LED) display screen
Technical field
The utility model relates to display screen field, in particular to a kind of LED wafer and light emitting diode (LED) display screen.
Background technology
At present, the LED chip used in light-emitting diode (LED, Light Emitting Diode) display screen is a kind of solid-state semiconductor device, and also referred to as LED wafer, it directly can be converted into light electricity.Be illustrated in figure 1 end view and the vertical view of traditional LED wafer, LED wafer in conventional package technique comprises wafer body 102 and conductive connecting element 108, wherein, the one end 104 in wafer body 102 is as an electrode, and other end substrate 106 is as another electrode.Only at one end 104 (as shown in Figure 1) arranged a conductive connecting element 108 to usual LED wafer.Further, as shown in Figure 2, in LED display, one end 104 (as shown in Figure 2) of LED wafer is by conductive connecting element 108 and wire 204, be connected on light emitting diode (LED) display screen substrate 202 by a pole of above-mentioned LED wafer, the other end utilizes crystal-bonding adhesive to be connected on light emitting diode (LED) display screen substrate 202 by the substrate 106 of LED wafer
Because the LED wafer of above-mentioned conventional package only at one end arranges conductive connecting element 108, to make above-mentioned LED wafer electrode realize being electrically connected with LED display substrate 202, on the contrary, the other end then realizes being connected with LED display substrate 202 by substrate 106.When after certain hour, crystal-bonding adhesive for connecting substrate no longer solidifies, above-mentioned wafer and LED display substrate 202 loose contact will be made, and then cause LED display to occur display dim spot, affect the display effect of LED display, that is, the reliability of the LED wafer that this area uses at present is lower, cannot ensure the display effect of LED display.
For above-mentioned problem, at present effective solution is not yet proposed.
Utility model content
The utility model embodiment provides a kind of LED wafer and light emitting diode (LED) display screen, and at least to solve existing LED wafer, only at one end arranging conductive connecting element causes the technical problem that the reliability of this wafer is lower.
According to an aspect of the utility model embodiment, provide a kind of LED wafer, comprising: LED wafer body; First electrode, is arranged on the first end of above-mentioned LED wafer body; Second electrode, is arranged on the second end relative with above-mentioned first end of above-mentioned LED wafer body, and wherein, above-mentioned second electrode is contrary with the polarity of above-mentioned first electrode; First conductive connecting element, is arranged on the surface of above-mentioned first end, is electrically connected with above-mentioned first electrode; Second conductive connecting element, is arranged on the surface of above-mentioned the second end, is electrically connected with above-mentioned second electrode.
Alternatively, above-mentioned second conductive connecting element is one or more conductive connecting element.
Alternatively, above-mentioned multiple conductive connecting element is mutually isolated on the surface of above-mentioned the second end opens.
Alternatively, above-mentioned multiple conductive connecting element is two conductive connecting elements, and wherein, above-mentioned two conductive connecting elements are positioned at the two ends on the surface of above-mentioned the second end.
Alternatively, above-mentioned second conductive connecting element is pad.
Alternatively, above-mentioned first electrode is positive pole, and above-mentioned second electrode is negative pole, or above-mentioned first electrode is negative pole, and above-mentioned second electrode is positive pole.
According to the another aspect of the utility model embodiment, additionally provide a kind of light emitting diode (LED) display screen, comprising: above-mentioned LED wafer; Light emitting diode (LED) display screen substrate, comprise: third electrode and the 4th electrode, wherein, above-mentioned third electrode is by above-mentioned first Electrode connection in above-mentioned first conductive connecting element and above-mentioned LED wafer, and above-mentioned 4th electrode is by above-mentioned second Electrode connection in above-mentioned second conductive connecting element and above-mentioned LED wafer.
Alternatively, above-mentioned third electrode is one or more electrode, and wherein, above-mentioned first electrode is connected to an above-mentioned third electrode respectively by each above-mentioned first conductive connecting element.
Alternatively, above-mentioned 4th electrode is one or more electrode, and wherein, above-mentioned second electrode is connected to above-mentioned 4th electrode respectively by each above-mentioned second conductive connecting element.
Alternatively, above-mentioned second electrode is fixed on above-mentioned light emitting diode (LED) display screen substrate by conduction immobilization material by above-mentioned second conductive connecting element.
According to the another aspect of the utility model embodiment, additionally provide a kind of manufacture method of LED wafer, it is characterized in that, weld the first conductive connecting element at the first end of LED wafer body, weld the second conductive connecting element at the second end of LED wafer body.
In the utility model embodiment, by the two ends in LED wafer, all conductive connecting element is set, realize the connection with light emitting diode (LED) display screen substrate, overcome one end in existing LED wafer and connected the defect easily causing loose contact by substrate, only at one end arranging conductive connecting element causes the technical problem that the reliability of this wafer is lower to solve existing LED wafer, thus the reliability that raising LED wafer is connected with light emitting diode (LED) display screen substrate, further improve the electric property of light emitting diode (LED) display screen, and ensure that the display effect of light emitting diode (LED) display screen.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present utility model, and form a application's part, schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the schematic diagram of a kind of LED wafer according to prior art;
Fig. 2 is the schematic diagram of a kind of light emitting diode (LED) display screen according to prior art;
Fig. 3 is the schematic diagram of a kind of optional LED wafer according to the utility model embodiment;
Fig. 4 is the schematic diagram according to the optional LED wafer of the another kind of the utility model embodiment;
Fig. 5 is the schematic diagram of a kind of optional light emitting diode (LED) display screen according to the utility model embodiment;
Fig. 6 is the schematic diagram according to the optional light emitting diode (LED) display screen of the another kind of the utility model embodiment;
Fig. 7 is the schematic diagram of another the optional light emitting diode (LED) display screen according to the utility model embodiment;
Fig. 8 is the schematic diagram of another the optional light emitting diode (LED) display screen according to the utility model embodiment;
Fig. 9 is another the optional schematic diagram sending out light emitting diode (LED) display screen according to the utility model embodiment; And
Figure 10 is the schematic diagram according to the optional LED wafer of the another kind of the utility model embodiment.
Embodiment
Hereinafter also describe the utility model in detail with reference to accompanying drawing in conjunction with the embodiments.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
Embodiment 1
According to the utility model embodiment, provide a kind of LED wafer, as shown in Figure 3, this LED wafer comprises:
1) LED wafer body 302;
2) the first electrode 304, is arranged on the first end of LED wafer body 302;
3) the second electrode 306, is arranged on the second end relative with first end of LED wafer body 302, and wherein, the second electrode 306 is contrary with the polarity of the first electrode 304;
4) the first conductive connecting element 308, is arranged on the surface of first end, is electrically connected with the first electrode 304;
5) the second conductive connecting element 310, is arranged on the surface of the second end, is electrically connected with the second electrode 306.
Alternatively, in the present embodiment, above-mentioned LED wafer can be applied in LED display screen, and wherein, above-mentioned LED display comprises multiple LED wafer as above.Such as, suppose that the first electrode 304 is positive pole, second electrode 306 is negative pole, the first end (top as shown in Figure 3) of the just very LED wafer of above-mentioned each LED wafer, the first conductive connecting element 308 arranged on the surface by first end realizes being electrically connected with the positive pole on LED display substrate by the positive pole of above-mentioned LED wafer; The negative pole of above-mentioned each LED wafer is the second end (bottom as shown in Figure 3) relative with first end in LED wafer, the second conductive connecting element 310 that the negative pole of above-mentioned LED wafer will be arranged on the surface by the second end, realizes being electrically connected with the negative pole on LED display substrate.Above-mentioned citing is a kind of example, and the present embodiment does not do any restriction to this.
Alternatively, in the present embodiment, the first electrode 304 in above-mentioned LED wafer is contrary with the polarity of the second electrode 306, wherein, above-mentioned first electrode 304 can be positive pole, then the second electrode 306 is negative pole, or above-mentioned first electrode 304 is negative pole, then the second electrode 306 is positive pole.
Alternatively, in the present embodiment, above-mentioned second conductive connecting element 310 can be, but not limited to as one or more conductive connecting element.Such as, above-mentioned second conductive connecting element 310 can be, but not limited to be two conductive connecting elements, wherein, above-mentioned two conductive connecting elements can be, but not limited to the two ends on the surface being positioned at wafer body 102 the second end, as Fig. 4 to show the second conductive connecting element 310 be two conductive connecting elements time end view and vertical view, above-mentioned second conductive component is positioned at relative two ends, the second end surface.
Alternatively, in the present embodiment, above-mentioned multiple conductive connecting element is mutually isolated on the surface of the second end to be opened, and to make above-mentioned second electrode 306 can provide multiple electrode connecting end, alternatively, these electrode connecting end backup each other.
Alternatively, in the present embodiment, above-mentioned second conductive connecting element 310 can be, but not limited to as pad.
By the embodiment that the application provides, be electrically connected with the first electrode by arranging the first conductive connecting element at the first end of LED wafer, arrange the second conductive connecting element at the second end to be electrically connected with the second electrode, can can realize being electrically connected with peripheral components by conductive connecting element to make above-mentioned LED wafer, improve the reliability that LED wafer connects, and improve the electric property of LED wafer, thus ensure that the display effect of LED wafer.
The utility model provides a kind of preferred embodiment to make an explanation to the utility model further, but it should be noted that the preferred embodiment is just in order to better describe the utility model, does not form and limits improperly the utility model.
Embodiment 2
According to the utility model embodiment, additionally provide a kind of light emitting diode (LED) display screen, as shown in Figure 5, this light emitting diode (LED) display screen comprises:
1) above-mentioned LED wafer;
2) light emitting diode (LED) display screen substrate 502, comprise: third electrode 504 and the 4th electrode 506, wherein, third electrode 504 is connected with the first electrode 304 in LED wafer by the first conductive connecting element 308, and the 4th electrode 506 is connected with the second electrode 306 in LED wafer by the second conductive connecting element 310.
Alternatively, in the present embodiment, the third electrode 504 on above-mentioned light emitting diode (LED) display screen substrate 502 is identical with the polarity of the first electrode 304, and the 4th electrode 506 is identical with the polarity of the second electrode 306.
Alternatively, in the present embodiment, above-mentioned light emitting diode (LED) display screen substrate 502 also comprises: drive circuit, above-mentioned drive circuit is connected with third electrode 504 and the 4th electrode 506, and then realizes the control to the voltage between the first electrode 304 in LED wafer and the second electrode 306 and/or electric current by third electrode 504 and the 4th electrode 506.
Alternatively, in the present embodiment, by wire 508, above-mentioned first conductive connecting element 308 is connected on above-mentioned light emitting diode (LED) display screen substrate 502.
Alternatively, in the present embodiment, by conduction immobilization material 510, above-mentioned second conductive connecting element 310 is fixed on above-mentioned light emitting diode (LED) display screen substrate 502.
By the embodiment that the application provides, above-mentioned light emitting diode (LED) display screen comprises above-mentioned LED wafer, be connected with light emitting diode (LED) display screen substrate by the second conductive connecting element, overcome in prior art and use the substrate of LED wafer to be connected the defect of the loose contact that can cause with light emitting diode (LED) display screen substrate, improve the electric property of light emitting diode (LED) display screen, thus ensure that the technique effect of the display of light emitting diode (LED) display screen.
As the optional scheme of one, above-mentioned third electrode 504 is one or more electrode, and wherein, above-mentioned first electrode 304 is connected to a third electrode 504 respectively by each first conductive connecting element 308.Such as, as Fig. 6 show two third electrodes 504 are set time, the first electrode 304 of LED wafer is connected respectively to by two wires 508 on two third electrodes 504 on above-mentioned light emitting diode (LED) display screen substrate 502.
Alternatively, in the present embodiment, above-mentioned multiple third electrode 504 can be positioned at the homonymy (as shown in Figure 6) of LED wafer, also can be positioned at the heteropleural (as shown in Figure 7) of LED wafer.
By the embodiment that the application provides, LED wafer is connected with the multiple third electrodes on light emitting diode (LED) display screen substrate by multiple wire, for above-mentioned LED wafer provides as connection for subsequent use, further increase the reliability of light emitting diode (LED) display screen, ensure that the display effect of light emitting diode (LED) display screen.
As the optional scheme of one, above-mentioned 4th electrode 506 is one or more electrode, and wherein, above-mentioned second electrode 306 is connected to the 4th electrode 506 respectively by each second conductive connecting element 310.
Alternatively, in the present embodiment, as shown in Figure 8, when above-mentioned 4th electrode 506 is two electrodes, above-mentioned LED wafer is connected with above-mentioned two the 4th electrodes 506 respectively by two the second conductive connecting elements 310 (such as, two pads).
Alternatively, in the present embodiment, shown in composition graphs 9-10, above-mentioned third electrode 504 be multiple (such as, two) electrode time, above-mentioned 4th electrode 506 also can be multiple electrode, wherein, above-mentioned 4th electrode 506 can be positioned at the homonymy (as shown in Figure 9) of above-mentioned LED wafer 902, also can be positioned at the heteropleural (as shown in Figure 10) of above-mentioned LED wafer 902.
By the embodiment that the application provides, by arranging multiple first link and third electrode, and/or, multiple second link and the 4th electrode, make above-mentioned light emitting diode (LED) display screen can comprise many mutually redundant connections, and then achieve the reliability improving light emitting diode (LED) display screen, ensure that the display effect of light emitting diode (LED) display screen.
The utility model provides a kind of preferred embodiment to make an explanation to the utility model further, but it should be noted that the preferred embodiment is just in order to better describe the utility model, does not form and limits improperly the utility model.
From above description, can find out, the utility model is by all arranging conductive connecting element at the two ends of LED wafer, realize the connection with light emitting diode (LED) display screen substrate, overcome one end in existing LED wafer and connected the defect easily causing loose contact by substrate, reach the object improving the reliability that LED wafer is connected with light emitting diode (LED) display screen substrate, improve the electric property of light emitting diode (LED) display screen, thus ensure that the technique effect of the display of light emitting diode (LED) display screen, and then only at one end arranging conductive connecting element causes the technical problem that the reliability of this wafer is lower to solve existing LED wafer.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.

Claims (10)

1. a LED wafer, is characterized in that, comprising:
LED wafer body;
First electrode, is arranged on the first end of described LED wafer body;
Second electrode, is arranged on the second end relative with described first end of described LED wafer body, and wherein, described second electrode is contrary with the polarity of described first electrode;
First conductive connecting element, is arranged on the surface of described first end, is electrically connected with described first electrode;
Second conductive connecting element, is arranged on the surface of described the second end, is electrically connected with described second electrode.
2. LED wafer according to claim 1, is characterized in that, described second conductive connecting element is one or more conductive connecting element.
3. LED wafer according to claim 2, is characterized in that, described multiple conductive connecting element is mutually isolated on the surface of described the second end to be opened.
4. LED wafer according to claim 2, is characterized in that, described multiple conductive connecting element is two conductive connecting elements, and wherein, described two conductive connecting elements are positioned at the two ends on the surface of described the second end.
5. LED wafer according to any one of claim 1 to 4, is characterized in that, described second conductive connecting element is pad.
6. LED wafer according to any one of claim 1 to 4, is characterized in that, described first electrode is positive pole, and described second electrode is negative pole, or described first electrode is negative pole, and described second electrode is positive pole.
7. a light emitting diode (LED) display screen, is characterized in that, comprising:
LED wafer as described in claim 1-6;
Light emitting diode (LED) display screen substrate, comprise: third electrode and the 4th electrode, wherein, described third electrode is by described first Electrode connection in described first conductive connecting element and described LED wafer, and described 4th electrode is by described second Electrode connection in described second conductive connecting element and described LED wafer.
8. light emitting diode (LED) display screen according to claim 7, is characterized in that, described third electrode is one or more electrode, and wherein, described first electrode is connected to a described third electrode respectively by each described first conductive connecting element.
9. light emitting diode (LED) display screen according to claim 7, is characterized in that, described 4th electrode is one or more electrode, and wherein, described second electrode is connected to described 4th electrode respectively by each described second conductive connecting element.
10. the light emitting diode (LED) display screen according to any one of claim 7 to 9, is characterized in that, described second electrode is fixed on described light emitting diode (LED) display screen substrate by conduction immobilization material by described second conductive connecting element.
CN201420369927.8U 2014-07-04 2014-07-04 LED wafer and light emitting diode (LED) display screen Active CN204189824U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420369927.8U CN204189824U (en) 2014-07-04 2014-07-04 LED wafer and light emitting diode (LED) display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420369927.8U CN204189824U (en) 2014-07-04 2014-07-04 LED wafer and light emitting diode (LED) display screen

Publications (1)

Publication Number Publication Date
CN204189824U true CN204189824U (en) 2015-03-04

Family

ID=52621799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420369927.8U Active CN204189824U (en) 2014-07-04 2014-07-04 LED wafer and light emitting diode (LED) display screen

Country Status (1)

Country Link
CN (1) CN204189824U (en)

Similar Documents

Publication Publication Date Title
CN204083927U (en) A kind of chip upside-down mounting type LED daylight lamp
CN104733598A (en) Semiconductor light emitting structure and semiconductor packaging structure
CN205863213U (en) A kind of encapsulating structure of LED drive chip
CN204189824U (en) LED wafer and light emitting diode (LED) display screen
CN205264699U (en) Energy -efficient LED filament
CN107482108A (en) A kind of new SMD lamp beads
CN205028918U (en) LED support and LED packaging body
CN203260633U (en) LED package structure requiring no welding line
CN105870291A (en) Light emitting diode module and manufacturing method thereof
CN203608403U (en) Alternate current electric-drive LED lamp
CN207165614U (en) A kind of new SMD lamp beads
CN203367267U (en) Solder dosage-self adaptive rectifier structure
CN202268386U (en) LED (Light Emitting Diode) packaging structure
CN101872833B (en) LED signal lamp, PCB (Printed Circuit Board) substrate structure thereof and light source assembly
CN206878031U (en) One kind reinforces LED wire welded structures
CN204088297U (en) Heavy-duty diode device
CN204927331U (en) Ruddiness LED wrapper spare
CN206878032U (en) A kind of LED wires welding structure
CN104661353A (en) Alternate current electric-drive LED lamp and manufacturing method thereof
CN104124320A (en) Light emitting diode
CN103022315B (en) Light-emitting diode assembly
CN103594587A (en) Method for manufacturing wire bonding electrode of light emitting diode
CN203746909U (en) Filament type LED
CN203445157U (en) Directly-surface mounted type LED lamp bead
CN218827220U (en) Structure for preventing open circuit inside LED

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant