CN204189779U - 电子部件收纳用封装件以及电子装置 - Google Patents

电子部件收纳用封装件以及电子装置 Download PDF

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Publication number
CN204189779U
CN204189779U CN201390000411.XU CN201390000411U CN204189779U CN 204189779 U CN204189779 U CN 204189779U CN 201390000411 U CN201390000411 U CN 201390000411U CN 204189779 U CN204189779 U CN 204189779U
Authority
CN
China
Prior art keywords
framework
electronic unit
packaging part
protuberance
unit storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201390000411.XU
Other languages
English (en)
Chinese (zh)
Inventor
内田刚生
久岛洸
浅野稔弘
山冈壮大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Application granted granted Critical
Publication of CN204189779U publication Critical patent/CN204189779U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Packaging Frangible Articles (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201390000411.XU 2012-04-27 2013-04-19 电子部件收纳用封装件以及电子装置 Expired - Fee Related CN204189779U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-102199 2012-04-27
JP2012102199 2012-04-27
PCT/JP2013/061608 WO2013161695A1 (ja) 2012-04-27 2013-04-19 電子部品収納用パッケージおよび電子装置

Publications (1)

Publication Number Publication Date
CN204189779U true CN204189779U (zh) 2015-03-04

Family

ID=49483015

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201390000411.XU Expired - Fee Related CN204189779U (zh) 2012-04-27 2013-04-19 电子部件收纳用封装件以及电子装置

Country Status (3)

Country Link
JP (1) JPWO2013161695A1 (ja)
CN (1) CN204189779U (ja)
WO (1) WO2013161695A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590433A (ja) * 1991-07-08 1993-04-09 Shinko Electric Ind Co Ltd 電子部品用パツケージのメタル壁形成方法
JP2005114199A (ja) * 2003-10-03 2005-04-28 Toyo Radiator Co Ltd 熱交換器のヘッダおよびその製造方法
JP2010062181A (ja) * 2008-09-01 2010-03-18 Sumitomo Metal Electronics Devices Inc 電子部品収納用パッケージ
JP5484874B2 (ja) * 2009-12-02 2014-05-07 株式会社マルナカ エンジンマウント用金属パイプの製造方法とエンジンマウントの製造方法

Also Published As

Publication number Publication date
JPWO2013161695A1 (ja) 2015-12-24
WO2013161695A1 (ja) 2013-10-31

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150304

Termination date: 20210419

CF01 Termination of patent right due to non-payment of annual fee