CN204130669U - Based on the coplanar waveguide ultra wide band filter of interdigital coupling - Google Patents
Based on the coplanar waveguide ultra wide band filter of interdigital coupling Download PDFInfo
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- CN204130669U CN204130669U CN201420450662.4U CN201420450662U CN204130669U CN 204130669 U CN204130669 U CN 204130669U CN 201420450662 U CN201420450662 U CN 201420450662U CN 204130669 U CN204130669 U CN 204130669U
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Abstract
The utility model discloses the coplanar waveguide ultra wide band filter based on interdigital coupling, comprise dielectric substrate, dielectric substrate is rectangle, on dielectric substrate surface, print applies a metal level, be etched with the center conduction band of 1 width inequality on the metal layer, be etched with ground plate respectively in conduction band both sides, center, between ground plate and center conduction band, there is gap.The centre of described center conduction band and the Width of centrally conduction band has the multiple cracks be positioned on 1 straight line, be etched with the rectangle finger perpendicular to crack place straight line, and adjacent rectangle finger is directed in opposite directions, submission finger-like between adjacent crack.Ground plate is etched with two groups of rectangle defect ground minor matters and two groups of class back-shaped defect ground minor matters.The utility model overcomes co-planar waveguide and to be coupled weak problem, and improves the characteristic inside and outside ultra-wide band filter passband.
Description
Technical field
The utility model belongs to microwave technical field, particularly based on the coplanar waveguide ultra wide band filter of interdigital coupling.
Background technology
Along with the fast development of the Technology of Ultra and the raising day by day of microwave device integrated level, develop the focus that microwave monolithic integrated circuit (MMIC) becomes microwave regime energetically.On the one hand, there is various microwave planar transmission line, as fin line, the line of rabbet joint, the micro-band of suspension, co-planar waveguide and coplanar striplines etc.On the other hand, from 2002 FCC (FCC) frequency range between 3. 1-10. 6GHz is lifted a ban, and allow to be applied in ultra-wideband devices, ultra broadband (Ultra-wideband, UWB) technology causes one research boom in academia and industrial quarters, ultra-wide band filter is as a kind of core devices in radio ultra wide band system, and playing the important function selecting signal, is requisite critical elements in super broad band radio communication system.Co-planar waveguide has many good qualities: no matter be active or passive circuit, is all easy to realize series connection or be connected in parallel and need not hole on substrate; Parasitic parameter is little; Be easy to improve integrated circuit density; Dispersion characteristics are better than microstrip line, make it in research in recent years, be subject to the attention of more and more many experts and scholars.These advantages of co-planar waveguide are applied in design of filter by imagination, evade the defect of co-planar waveguide weak coupling simultaneously, based on this, devise the described coplanar waveguide ultra wide band filter based on interdigital coupling.
Utility model content
In order to solve the technical problem that background technology exists, the utility model aims to provide the coplanar waveguide ultra wide band filter based on interdigital coupling, overcomes co-planar waveguide and to be coupled weak problem, and improve the characteristic inside and outside ultra-wide band filter passband.
In order to realize above-mentioned technical purpose, the technical solution of the utility model is:
Based on the coplanar waveguide ultra wide band filter of interdigital coupling, comprise dielectric substrate, dielectric substrate is rectangle, on dielectric substrate surface, print applies a metal level, be etched with the center conduction band of 1 width inequality on the metal layer, the two ends of this center conduction band are extended down to the edge of dielectric substrate a pair opposite side respectively, and center conduction band is perpendicular to a pair opposite side of aforementioned dielectric substrate, be etched with ground plate respectively in conduction band both sides, center, between ground plate and center conduction band, there is gap; The centre of described center conduction band and the Width of centrally conduction band has the multiple cracks be positioned on 1 straight line, be etched with the rectangle finger perpendicular to crack place straight line, and adjacent rectangle finger is directed in opposite directions, submission finger-like between adjacent crack; The ground plate of conduction band both sides, center is all etched with 1 group of rectangle defect ground minor matters and 1 group of class back-shaped defect ground minor matters, often organize rectangle defect ground minor matters and comprise at least 1 rectangle defect ground minor matters, and one end of these rectangle defect ground minor matters is connected on the gap between ground plate and center conduction band, described class back-shaped defect ground minor matters of often organizing comprise at least 1 class back-shaped defect ground minor matters, and one end of such back-shaped defect ground minor matters is connected on the gap between ground plate and center conduction band.
Wherein, the quantity of the rectangle defect ground minor matters that 2 groups of rectangle defects ground minor matters comprise is identical, and 2 groups of rectangle defects ground minor matters are symmetrical about center conduction band; The quantity of the class back-shaped defect ground minor matters that 2 groups of class back-shaped defects ground minor matters comprise is identical, and 2 groups of class back-shaped defects ground minor matters are symmetrical about center conduction band.
Wherein, often organize rectangle defect ground minor matters and comprise 2 rectangle defect ground minor matters, and symmetrical about crack place straight line with 2 rectangle defect ground minor matters of group; Often organize class back-shaped defect ground minor matters and comprise 2 class back-shaped defect ground minor matters, and symmetrical about crack place straight line with 2 classes back-shaped defect ground minor matters of group.
Wherein, the quantity of rectangle finger is 5.
Wherein, each rectangle finger is measure-alike.
The beneficial effect adopting technique scheme to bring is:
The utility model adopts interdigital structure, compared with the coupling of conventional co-planar waveguide, greatly strengthen stiffness of coupling, improves pass band width, better meet the requirement of modernization wireless communication system miniaturization.Adopt coplanar waveguide structure, conduction band and ground plate are on the same face, and structure is very compact, decreases difficulty of processing, reduces processing cost.Utilize defect ground structure to suppress passband internal loss to obtain wider cut off band width at high frequency treatment simultaneously.The filter construction of the utility model design is simple, is convenient to processing and integrated, pass band width greatly, for the exploitation of super broad band radio communication filter provides technological reserve.
Accompanying drawing explanation
Fig. 1 is the tomograph that the utility model prints coating metal layer on dielectric substrate.
Fig. 2 is the schematic diagram of the co-planar waveguide that the utility model designs on dielectric substrate.
Fig. 3 is structural representation of the present utility model.
Fig. 4 is S parameter analogous diagram of the present utility model.
Label declaration: 1: dielectric substrate; 2: metal level; 3: crack; 4: rectangle finger; 5.1,5.2,5.3,5.4: rectangle defect ground minor matters; 6.1,6.2,6.3,6.4: class back-shaped defect ground minor matters.
Embodiment
Below with reference to accompanying drawing, the technical solution of the utility model is described in detail.
Based on the coplanar waveguide ultra wide band filter of interdigital coupling, comprise dielectric substrate 1, dielectric substrate 1 is rectangle, and on dielectric substrate 1 surface, print applies a metal level 2, as shown in Figure 1.Metal level 2 is etched with the center conduction band of 1 width inequality, the two ends of this center conduction band are extended down to the edge of dielectric substrate a pair opposite side respectively, and center conduction band is perpendicular to a pair opposite side of aforementioned dielectric substrate, ground plate is etched with respectively in conduction band both sides, center, gap is there is, as shown in Figure 2 between ground plate and center conduction band.The centre of described center conduction band and the Width of centrally conduction band has the multiple cracks 3 be positioned on 1 straight line, be etched with the rectangle finger 4 perpendicular to crack place straight line, and adjacent rectangle finger 4 is directed in opposite directions, submission finger-like between adjacent crack 3.The ground plate of conduction band both sides, center is all etched with 1 group of rectangle defect ground minor matters and 1 group of class back-shaped defect ground minor matters, often organize rectangle defect ground minor matters and comprise at least 1 rectangle defect ground minor matters, and one end of these rectangle defect ground minor matters is connected on the gap between ground plate and center conduction band, described class back-shaped defect ground minor matters of often organizing comprise at least 1 class back-shaped defect ground minor matters, and one end of such back-shaped defect ground minor matters is connected on the gap between ground plate and center conduction band.
In the present embodiment, as shown in Figure 3, described rectangle finger 4 has 5, and each rectangle finger 4 is measure-alike.
In the present embodiment, as shown in Figure 3, ground plate is etched with 4 rectangle defect ground minor matters 5.1,5.2,5.3,5.4, ground plate is etched with 4 class back-shaped defect ground minor matters 6.1,6.2,6.3,6.4, wherein, 5.1 and 5.2,5.3 and 5.4,6.1 and 6.3,6.2 and 6.4 is symmetrical about crack 3 place straight line, and 5.1 and 5.3,5.2 and 5.4,6.1 and 6.2,6.3 and 6.4 is symmetrical about center conduction band.
In the present embodiment, dielectric substrate 1 adopts Rogers 3010 dielectric-slab, and its dielectric constant is 10.2, and thickness is 0.8 millimeter.
The utility model realizes broadband couple device by interdigital structure, and meanwhile, etching defect ground structure at grade, suppresses pass-band loss and this filter passband at high band passband well, improve the performance inside and outside band of filter.And pole is beneficial to process.
Ultra-wide band filter of the present utility model has good band-pass behavior, and as shown in Fig. 4, abscissa is frequency (unit: GHz), and ordinate is S parameter (unit: decibel).Wherein Simulated S21 curve represents the variation tendency of transmission coefficient, Simulated S11 curve represents the variation tendency of reflection coefficient, it is 5.6GHz that simulation result obtains centre frequency, three dB bandwidth is 1.53GHz ~ 9.7GHz, bandwidth is 8.17GHz, relative bandwidth is about 146%, and in-band insertion loss is about 1.5dB ,-15dB cut off band width is 5.27GHz (9.955GHz ~ 15.23GHz).
Above embodiment is only and technological thought of the present utility model is described; protection range of the present utility model can not be limited with this; every technological thought according to the utility model proposes, any change that technical scheme basis is done, all falls within the utility model protection range.
Claims (5)
1. based on the coplanar waveguide ultra wide band filter of interdigital coupling, it is characterized in that: comprise dielectric substrate, dielectric substrate is rectangle, on dielectric substrate surface, print applies a metal level, be etched with the center conduction band of 1 width inequality on the metal layer, the two ends of this center conduction band are extended down to the edge of dielectric substrate a pair opposite side respectively, and center conduction band is perpendicular to a pair opposite side of aforementioned dielectric substrate, be etched with ground plate respectively in conduction band both sides, center, between ground plate and center conduction band, there is gap; The centre of described center conduction band and the Width of centrally conduction band has the multiple cracks be positioned on 1 straight line, be etched with the rectangle finger perpendicular to crack place straight line, and adjacent rectangle finger is directed in opposite directions, submission finger-like between adjacent crack; The ground plate of conduction band both sides, center is all etched with 1 group of rectangle defect ground minor matters and 1 group of class back-shaped defect ground minor matters, often organize rectangle defect ground minor matters and comprise at least 1 rectangle defect ground minor matters, and one end of these rectangle defect ground minor matters is connected on the gap between ground plate and center conduction band, described class back-shaped defect ground minor matters of often organizing comprise at least 1 class back-shaped defect ground minor matters, and one end of such back-shaped defect ground minor matters is connected on the gap between ground plate and center conduction band.
2. according to claim 1 based on the coplanar waveguide ultra wide band filter of interdigital coupling, it is characterized in that: the quantity of the rectangle defect ground minor matters that 2 groups of rectangle defects ground minor matters comprise is identical, and 2 groups of rectangle defects ground minor matters are symmetrical about center conduction band; The quantity of the class back-shaped defect ground minor matters that 2 groups of class back-shaped defects ground minor matters comprise is identical, and 2 groups of class back-shaped defects ground minor matters are symmetrical about center conduction band.
3. according to claim 2 based on the coplanar waveguide ultra wide band filter of interdigital coupling, it is characterized in that: often organize rectangle defect ground minor matters and comprise 2 rectangle defect ground minor matters, and symmetrical about crack place straight line with 2 rectangle defect ground minor matters of group; Often organize class back-shaped defect ground minor matters and comprise 2 class back-shaped defect ground minor matters, and symmetrical about crack place straight line with 2 classes back-shaped defect ground minor matters of group.
4. according to claim 1 based on the coplanar waveguide ultra wide band filter of interdigital coupling, it is characterized in that: the quantity of described rectangle finger is 5.
5. according to claim 1 based on the coplanar waveguide ultra wide band filter of interdigital coupling, it is characterized in that: described each rectangle finger measure-alike.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420450662.4U CN204130669U (en) | 2014-08-12 | 2014-08-12 | Based on the coplanar waveguide ultra wide band filter of interdigital coupling |
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| CN201420450662.4U CN204130669U (en) | 2014-08-12 | 2014-08-12 | Based on the coplanar waveguide ultra wide band filter of interdigital coupling |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105048031A (en) * | 2015-06-19 | 2015-11-11 | 南京邮电大学 | Micro-strip ultra wide band filter realized by using UC-PBG and interdigital structure |
| CN105762449A (en) * | 2016-05-06 | 2016-07-13 | 联想(北京)有限公司 | Filter and filtering control method |
| CN106450606A (en) * | 2016-12-21 | 2017-02-22 | 广西科技大学鹿山学院 | Ultra-wideband limiting filter based on left-handed material |
| CN107204504A (en) * | 2016-02-16 | 2017-09-26 | 通用汽车环球科技运作有限责任公司 | Embedded Broadband Glass Coplanar Waveguide Coupler |
| WO2018171181A1 (en) * | 2017-03-18 | 2018-09-27 | 深圳市景程信息科技有限公司 | Multimode triple-passband filter structure |
-
2014
- 2014-08-12 CN CN201420450662.4U patent/CN204130669U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105048031A (en) * | 2015-06-19 | 2015-11-11 | 南京邮电大学 | Micro-strip ultra wide band filter realized by using UC-PBG and interdigital structure |
| CN105048031B (en) * | 2015-06-19 | 2017-11-17 | 南京邮电大学 | The micro band superwide band wave filter realized using UC PBG and interdigital structure |
| CN107204504A (en) * | 2016-02-16 | 2017-09-26 | 通用汽车环球科技运作有限责任公司 | Embedded Broadband Glass Coplanar Waveguide Coupler |
| US10381704B2 (en) | 2016-02-16 | 2019-08-13 | GM Global Technology Operations LLC | Embedded broadband glass coplanar waveguide coupler |
| CN107204504B (en) * | 2016-02-16 | 2021-02-09 | 通用汽车环球科技运作有限责任公司 | Embedded broadband glass coplanar waveguide coupler |
| CN105762449A (en) * | 2016-05-06 | 2016-07-13 | 联想(北京)有限公司 | Filter and filtering control method |
| CN106450606A (en) * | 2016-12-21 | 2017-02-22 | 广西科技大学鹿山学院 | Ultra-wideband limiting filter based on left-handed material |
| WO2018171181A1 (en) * | 2017-03-18 | 2018-09-27 | 深圳市景程信息科技有限公司 | Multimode triple-passband filter structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Nanyou IOT Technology Park Ltd. Assignor: Nanjing Post & Telecommunication Univ. Contract record no.: 2016320000210 Denomination of utility model: Coplanar waveguide ultra-wideband filter based on interdigital coupling Granted publication date: 20150128 License type: Common License Record date: 20161114 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Jiangsu Nanyou IOT Technology Park Ltd. Assignor: Nanjing Post & Telecommunication Univ. Contract record no.: 2016320000210 Date of cancellation: 20180116 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20200812 |