CN204130529U - 一种多色led灯 - Google Patents
一种多色led灯 Download PDFInfo
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- CN204130529U CN204130529U CN201420575850.XU CN201420575850U CN204130529U CN 204130529 U CN204130529 U CN 204130529U CN 201420575850 U CN201420575850 U CN 201420575850U CN 204130529 U CN204130529 U CN 204130529U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
本实用新型涉及一种多色LED灯,包括底座,所述底座中部设置有公共阴极端子,所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片,所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极,所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接,所述底座与透明外壳形成封闭结构。本实用新型结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色,可以实现不同颜色的发光。
Description
技术领域
本实用新型涉及一种半导体LED灯,尤其涉及一种多色LED灯。
背景技术
LED是发光二极管,是20世纪中期发展起来的新技术。它依靠半导体异质结中的电子通过势垒产生的能量迁越直接发光。通过LED制作的灯具由于发光过程不产生热量,能量转换效率接近百分之百,寿命超长,是深圳广聚照明照明技术的不断发展方向。
随着生活物质文化的提高,对照明灯的艺术性、美观性、潮流性提出更高要求。
实用新型内容
本实用新型所要解决的技术问题是提供一种结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色,可以实现不同颜色发光的LED灯。
本实用新型解决上述技术问题的技术方案如下:一种多色LED灯,包括底座,所述底座中部设置有公共阴极端子,所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片,所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极,所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接,所述底座与透明外壳形成封闭结构。
当绿色LED芯片、红色LED芯片导通发光时,多色LED会发出黄色光;当绿色LED芯片、蓝色LED芯片导通发光时,多色LED会发出青色光,当红色LED芯片、蓝色LED芯片导通发光时,多色LED会发出品红色光,当绿色LED芯片、红色LED芯片、蓝色LED芯片同时导通时,多色LED会发出白色光;因此使用红、蓝、绿三基色进行调色,可实现任意颜色发光。
在上述技术方案的基础上,本实用新型还可以做如下改进。
进一步,所述底座为绝缘材质,用于公共阴极端子与绿光阳极、红光阳极、蓝光阳极之间的绝缘。
进一步,所述绿光阳极、红光阳极、蓝光阳极为镀铜阳极,所述镀铜阳极电阻率低、电导特性好,有利于多色LED灯内耗的降低,使多色LED灯更加节能。
进一步,所述透明外壳为环氧树脂材质,所述环氧树脂材质硬性强度大,散射均匀,有利于光线的均匀分布。
本实用新型的有益效果是:结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色,可以实现不同颜色的发光。
附图说明
图1为本实用新型一种多色LED灯结构示意图;
附图中,各标号所代表的部件列表如下:1、底座,2、引线,3、透明外壳,4、绿色LED芯片,5、红色LED芯片,6、蓝色LED芯片,7、蓝色光阳极,8、公共阴极端子,9、红色光阳极,10、绿色光阳极。
具体实施方式
以下结合附图对本实用新型的原理和特征进行描述,所举实例只用于解释本实用新型,并非用于限定本实用新型的范围。
如图1所示,一种多色LED灯,包括底座1,所述底座2中部设置有公共阴极端子8,所述公共阴极端子8顶部设置有绿色LED芯片4、红色LED芯片5、蓝色LED芯片6,所述底座1两端分别设置有绿光阳极10、红光阳极9、蓝光阳极7,所述绿光阳极10、红光阳极9、蓝光阳极7分别通过引线2与之对应的绿色LED芯片4、红色LED芯片5、蓝色LED芯片6连接,所述底座1与透明外壳形3成封闭结构。
当绿色LED芯片4、红色LED芯片5导通发光时,多色LED会发出黄色光;当绿色LED芯片4、蓝色LED芯片6导通发光时,多色LED会发出青色光,当红色LED芯片5、蓝色LED芯片6导通发光时,多色LED会发出品红色光,当绿色LED芯片4、红色LED芯片5、蓝色LED芯片6同时导通时,多色LED会发出白色光;因此使用红、蓝、绿三基色进行调色,可实现任意颜色发光。
所述底座1为绝缘材质,用于公共阴极端子8与绿光阳极10、红光阳极9、蓝光阳极7之间的绝缘;所述绿光阳极10、红光阳极9、蓝光阳极7为镀铜阳极,所述镀铜阳极电阻率低、电导特性好,有利于多色LED灯内耗的降低,使多色LED灯更加节能;所述透明外壳3为环氧树脂材质,所述环氧树脂材质硬性强度大,散射均匀,有利于光线的均匀分布。
以上所述仅为本实用新型的较佳实施例,并不用以限制本实用新型,凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。
Claims (4)
1.本实用新型涉及一种多色LED灯,其特征在于,包括底座,所述底座中部设置有公共阴极端子,所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片,所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极,所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接,所述底座与透明外壳形成封闭结构。
2.根据权利要求1所述一种多色LED灯,其特征在于,所述底座为绝缘材质。
3.根据权利要求1所述一种多色LED灯,其特征在于,所述绿光阳极、红光阳极、蓝光阳极为镀铜阳极。
4.根据权利要求1所述一种多色LED灯,其特征在于,所述透明外壳为环氧树脂材质。
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CN201420575850.XU CN204130529U (zh) | 2014-09-30 | 2014-09-30 | 一种多色led灯 |
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CN201420575850.XU CN204130529U (zh) | 2014-09-30 | 2014-09-30 | 一种多色led灯 |
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- 2014-09-30 CN CN201420575850.XU patent/CN204130529U/zh not_active Expired - Fee Related
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