CN104347609A - 一种多色led灯 - Google Patents

一种多色led灯 Download PDF

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Publication number
CN104347609A
CN104347609A CN201410522874.3A CN201410522874A CN104347609A CN 104347609 A CN104347609 A CN 104347609A CN 201410522874 A CN201410522874 A CN 201410522874A CN 104347609 A CN104347609 A CN 104347609A
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anode
led chip
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blue
led
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CN201410522874.3A
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夏洪贵
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Priority to CN201410522874.3A priority Critical patent/CN104347609A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本发明涉及一种多色LED灯，包括底座，所述底座中部设置有公共阴极端子，所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片，所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极，所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接，所述底座与透明外壳形成封闭结构。本发明结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色，可以实现不同颜色的发光。

Description

一种多色LED灯
技术领域
本发明涉及一种半导体LED灯，尤其涉及一种多色LED灯。
背景技术
LED是发光二极管，是20世纪中期发展起来的新技术。它依靠半导体异质结中的电子通过势垒产生的能量迁越直接发光。通过LED制作的灯具由于发光过程不产生热量，能量转换效率接近百分之百，寿命超长，是深圳广聚照明照明技术的不断发展方向。
随着生活物质文化的提高，对照明灯的艺术性、美观性、潮流性提出更高要求。
发明内容
本发明所要解决的技术问题是提供一种结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色，可以实现不同颜色发光的LED灯。
本发明解决上述技术问题的技术方案如下：一种多色LED灯，包括底座，所述底座中部设置有公共阴极端子，所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片，所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极，所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接，所述底座与透明外壳形成封闭结构。
当绿色LED芯片、红色LED芯片导通发光时，多色LED会发出黄色光；当绿色LED芯片、蓝色LED芯片导通发光时，多色LED会发出青色光，当红色LED芯片、蓝色LED芯片导通发光时，多色LED会发出品红色光，当绿色LED芯片、红色LED芯片、蓝色LED芯片同时导通时，多色LED会发出白色光；因此使用红、蓝、绿三基色进行调色，可实现任意颜色发光。
在上述技术方案的基础上，本发明还可以做如下改进。
进一步，所述底座为绝缘材质，用于公共阴极端子与绿光阳极、红光阳极、蓝光阳极之间的绝缘。
进一步，所述绿光阳极、红光阳极、蓝光阳极为镀铜阳极，所述镀铜阳极电阻率低、电导特性好，有利于多色LED灯内耗的降低，使多色LED灯更加节能。
进一步，所述透明外壳为环氧树脂材质，所述环氧树脂材质硬性强度大，散射均匀，有利于光线的均匀分布。
本发明的有益效果是：结构简单、制造成本低廉、通过绿色LED芯片、红色LED芯片、蓝色LED芯片的调色，可以实现不同颜色的发光。
附图说明
图1为本发明一种多色LED灯结构示意图；
附图中，各标号所代表的部件列表如下：1、底座，2、引线，3、透明外壳，4、绿色LED芯片，5、红色LED芯片，6、蓝色LED芯片，7、蓝色光阳极，8、公共阴极端子，9、红色光阳极，10、绿色光阳极。
具体实施方式
以下结合附图对本发明的原理和特征进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
如图1所示，一种多色LED灯，包括底座1，所述底座2中部设置有公共阴极端子8，所述公共阴极端子8顶部设置有绿色LED芯片4、红色LED芯片5、蓝色LED芯片6，所述底座1两端分别设置有绿光阳极10、红光阳极9、蓝光阳极7，所述绿光阳极10、红光阳极9、蓝光阳极7分别通过引线2与之对应的绿色LED芯片4、红色LED芯片5、蓝色LED芯片6连接，所述底座1与透明外壳形3成封闭结构。
当绿色LED芯片4、红色LED芯片5导通发光时，多色LED会发出黄色光；当绿色LED芯片4、蓝色LED芯片6导通发光时，多色LED会发出青色光，当红色LED芯片5、蓝色LED芯片6导通发光时，多色LED会发出品红色光，当绿色LED芯片4、红色LED芯片5、蓝色LED芯片6同时导通时，多色LED会发出白色光；因此使用红、蓝、绿三基色进行调色，可实现任意颜色发光。
所述底座1为绝缘材质，用于公共阴极端子8与绿光阳极10、红光阳极9、蓝光阳极7之间的绝缘；所述绿光阳极10、红光阳极9、蓝光阳极7为镀铜阳极，所述镀铜阳极电阻率低、电导特性好，有利于多色LED灯内耗的降低，使多色LED灯更加节能；所述透明外壳3为环氧树脂材质，所述环氧树脂材质硬性强度大，散射均匀，有利于光线的均匀分布。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (4)

1.本发明涉及一种多色LED灯，其特征在于，包括底座，所述底座中部设置有公共阴极端子，所述公共阴极端子顶部设置有绿色LED芯片、红色LED芯片、蓝色LED芯片，所述底座两端分别设置有绿光阳极、红光阳极、蓝光阳极，所述绿光阳极、红光阳极、蓝光阳极分别通过引线与之对应的绿色LED芯片、红色LED芯片、蓝色LED芯片连接，所述底座与透明外壳形成封闭结构。
2.根据权利要求1所述一种多色LED灯，其特征在于，所述底座为绝缘材质。
3.根据权利要求1所述一种多色LED灯，其特征在于，所述绿光阳极、红光阳极、蓝光阳极为镀铜阳极。
4.根据权利要求1所述一种多色LED灯，其特征在于，所述透明外壳为环氧树脂材质。
CN201410522874.3A 2014-09-30 2014-09-30 一种多色led灯 Pending CN104347609A (zh)

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CN201410522874.3A CN104347609A (zh) 2014-09-30 2014-09-30 一种多色led灯

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Application Number Priority Date Filing Date Title
CN201410522874.3A CN104347609A (zh) 2014-09-30 2014-09-30 一种多色led灯

Publications (1)

Publication Number Publication Date
CN104347609A true CN104347609A (zh) 2015-02-11

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Application publication date: 20150211