CN204114879U - LED module and LED light device - Google Patents
LED module and LED light device Download PDFInfo
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- CN204114879U CN204114879U CN201420433777.2U CN201420433777U CN204114879U CN 204114879 U CN204114879 U CN 204114879U CN 201420433777 U CN201420433777 U CN 201420433777U CN 204114879 U CN204114879 U CN 204114879U
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- semiconductor refrigerating
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- luminescence unit
- led luminescence
- refrigerating unit
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Abstract
The utility model relates to LED module, this LED module comprises chip substrate, at least one LED luminescence unit and semiconductor refrigerating unit, described LED luminescence unit is arranged at the side of described chip substrate, the heat that described semiconductor refrigerating unit sends for cooling described LED luminescence unit.The utility model also provides a kind of LED light device.Described LED module of the present utility model in use, described LED luminescence unit produces heat when luminescence, this heat can pass to described semiconductor refrigerating unit, described semiconductor refrigerating unit initiatively cools described LED luminescence unit, be conducive to the temperature reducing described LED luminescence unit, to improve the service life of described LED luminescence unit.
Description
Technical field
The utility model relates to LED technology field, particularly relates to a kind of LED module and LED light device.
Background technology
Light emitting diode (Light Emitting Diode, be called for short LED) as Energy--Saving Illuminating Source of new generation, it is a kind of solid-state light emitters, because of its have efficiently, the distinguishing feature of energy-saving and environmental protection, be widely used in the lighting fields such as indoor and outdoor lighting, display backlight, bulkhead lamp capable, Tunnel Lamp, street lamp, along with its application of decline gradually of LED price is more wide.There is the light-emitting device of several LED chip as light source, replaced tradition gradually and there is the light-emitting device of cold-cathode tube as light source, become main product in the market, become the lighting source of forth generation gradually.
But, there is the defect waiting to overcome in light emitting diode, namely, the luminescence performance of LED (as luminosity and send the colour temperature of light source) impact of the temperature of itself temperature and environment residing for it can be subject to, and once LED is in overheated environment for a long time, its luminosity just can be decayed rapidly, causes the obvious shortening in LED service life.But LED module in use can produce heat, this heat is concentrated in the LED light emitting cell region of LED module, more difficult lost, thus affects the service life of LED module.
Therefore, how a kind of LED module is provided, the service life of LED luminescence unit can be improved, become the technology that those skilled in the art need to solve.
Utility model content
The LED module existing problems of prior art, the utility model provides a kind of LED module that can solve the problem.
The utility model provides a kind of LED module, comprise chip substrate, at least one LED luminescence unit and semiconductor refrigerating unit, described LED luminescence unit is arranged at the side of described chip substrate, the heat that described semiconductor refrigerating unit sends for cooling described LED luminescence unit.
Further, in described LED module, described semiconductor refrigerating unit is arranged at the side that described chip substrate deviates from described LED luminescence unit, and the cold junction of described semiconductor refrigerating unit connects the surface that described chip substrate deviates from the side of described LED luminescence unit.
Further, in described LED module, described LED luminescence unit is side view type light emitting unit, described semiconductor refrigerating unit is arranged at the side that described LED luminescence unit deviates from described chip substrate, and the cold junction of described semiconductor refrigerating unit connects the surface that described LED luminescence unit deviates from the side of described chip substrate.
Further, in described LED module, the side that LED luminescence unit described in each deviates from described chip substrate all has semiconductor refrigerating unit described in.
Further, in described LED module, it is right that described semiconductor refrigerating unit comprises at least one refrigeration, described refrigeration is to comprising a P-type semiconductor element and a N-type semiconductor element, the cold junction of the P-type semiconductor element that described refrigeration is right is connected by a conductive electrode with the cold junction of N-type semiconductor element, and the hot junction of the P-type semiconductor element that described refrigeration is right and the hot junction of N-type semiconductor element are respectively used to access power supply.
Further, in described LED module, described LED module also comprises a cooling base, and described cooling base is fixed on the hot junction of described semiconductor refrigerating unit.
Further, in described LED module, described cooling base is thermally conductive substrate.
Further, in described LED module, described LED luminescence unit is connected same power supply with semiconductor refrigerating unit, by same Power supply; Or described LED luminescence unit and semiconductor refrigerating unit are connected two different power supplys respectively, by two different Power supplies.
Further, in described LED module, described chip substrate is thermally conductive substrate.
According to another side of the present utility model, the utility model also provides a kind of LED light device, possesses LED module as above.
Compared with prior art, the LED module that the utility model provides has the following advantages:
In LED module of the present utility model, described LED luminescence unit is arranged at the side of described chip substrate, the heat that described semiconductor refrigerating unit sends for cooling described LED luminescence unit, compared with prior art, when described LED module in use, described LED luminescence unit produces heat when luminescence, this heat can pass to described semiconductor refrigerating unit, described semiconductor refrigerating unit initiatively cools described LED luminescence unit, be conducive to the temperature reducing described LED luminescence unit, to improve the service life of described LED luminescence unit.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the LED module of the utility model first embodiment;
Fig. 2 is the schematic diagram of the LED module of the utility model second embodiment.
Detailed description of the invention
In the LED module of prior art, in LED module, the release of the heat that LED luminescence unit sends is comparatively slow, thus affects the service life of LED luminescence unit.Applicant is through finding the further investigation of prior art LED module, if arrange semiconductor refrigeration unit on described LED module, described semiconductor refrigerating unit can cool described LED luminescence unit, then can increase the service life of described LED luminescence unit.
Because above-mentioned research, the utility model provides a LED module, comprise chip substrate, at least one LED luminescence unit and semiconductor refrigerating unit, described LED luminescence unit is arranged at the side of described chip substrate, the heat that described semiconductor refrigerating unit sends for cooling described LED luminescence unit.When described LED module in use, described LED luminescence unit produces heat when luminescence, this heat can pass to described semiconductor refrigerating unit, described semiconductor refrigerating unit cools described LED luminescence unit, be conducive to the temperature reducing described LED luminescence unit, to improve the service life of described LED luminescence unit.
Further, described LED module also comprises a cooling base, the pyroconductivity of described cooling base is better than described LED module, described cooling base is fixed on the hot junction of described semiconductor refrigerating unit, the heat in the hot junction of described semiconductor refrigerating unit is delivered in environment by described cooling base, thus the temperature difference increased between the cold junction of described semiconductor refrigerating unit and hot junction, to increase the semiconductor refrigerating efficiency of described semiconductor refrigerating unit.
Refer to Fig. 1, Fig. 1 is the schematic diagram of the LED module of the utility model first embodiment.In the present embodiment, described LED module 10 comprises chip substrate 110, at least one LED luminescence unit 120 and semiconductor refrigerating unit 130, described LED luminescence unit 120 is arranged at the side of described chip substrate 110, the heat that described semiconductor refrigerating unit 130 sends for cooling described LED luminescence unit 120.Wherein, described LED luminescence unit 120 is the chip structure comprising PN junction.Described LED module 10 shown in Fig. 1 comprises 3 described LED luminescence units 120, but the quantity of described LED luminescence unit 120 and arrangement mode do not limit, and can arrange according to specific needs.
In the present embodiment, described semiconductor refrigerating unit 130 is arranged at the side that described chip substrate 110 deviates from described LED luminescence unit 120, the cold junction of described semiconductor refrigerating unit 130 connects the surface that described chip substrate 110 deviates from the side of described LED luminescence unit 120, when described LED module 10 in use, described LED luminescence unit 120 produces heat when luminescence, this heat can pass to described semiconductor refrigerating unit 130 by described chip substrate 110, and described semiconductor refrigerating unit 130 cools described LED luminescence unit 120.Preferably, described chip substrate 110 can be thermally conductive substrate, namely the pyroconductivity of described chip substrate 110 is higher, generally, the pyroconductivity of described chip substrate 110 is higher than the pyroconductivity of described LED luminescence unit 120, such as described chip substrate 110 is metal heat conduction substrate, can improve the capacity of heat transmission of described chip substrate 110, thus improves the cooling effectiveness of described semiconductor refrigerating unit 130 to described LED luminescence unit 120.
Wherein, described semiconductor refrigerating unit 130 comprises at least one refrigeration to 130A, described refrigeration comprises P-type semiconductor element 131 and a N-type semiconductor element 132 to 130A, described refrigeration is connected by a conductive electrode 133 with the cold junction of N-type semiconductor element 132 cold junction of the P-type semiconductor element 131 of 130A, and all described refrigeration form the cold junction of described semiconductor refrigerating unit 130 jointly to the cold junction of the P-type semiconductor element 131 of 130A and the cold junction of N-type semiconductor element 132; Described refrigeration is respectively used to access power supply to the hot junction of the P-type semiconductor element 131 of 130A and the hot junction of N-type semiconductor element 132, and all described refrigeration form the hot junction of described semiconductor refrigerating unit 130 jointly to the hot junction of the P-type semiconductor element 131 of 130A and the hot junction of N-type semiconductor element 132.In the present embodiment, described semiconductor refrigerating unit 130 comprises 5 described refrigeration to 130A, but described refrigeration does not limit the quantity of 130A and arrangement mode, can arrange according to specific needs.When described semiconductor refrigerating unit 130 has multiple described refrigeration to 130A, the adjacent P-type semiconductor element 131 of adjacent described refrigeration to 130A can be connected by wire with N-type semiconductor element 132, to make to freeze described in each to 130A access power supply.
After described refrigeration is to 130A energising, at the cold junction of described semiconductor refrigerating unit 130, P-type semiconductor element 131 absorbs heat, produce and create electron-hole pair, electron-hole pair is separated under the effect of electric field force, and wherein electronics forms free electron, and free electron enters into P-type semiconductor element 131, and being transferred to the hot junction of P-type semiconductor element 131, free electron is release heat in hot junction and hole-recombination; In like manner, the hole be separated under electric field force effect is under the effect of electric field force, and enter into N-type semiconductor element 132 and be transferred to the hot junction of N-type semiconductor element 132, hole is release heat in hot junction and free electron compound; By said process, the delivered heat being positioned at cold junction has been arrived the hot junction of semiconductor refrigerating unit 130 by semiconductor refrigerating unit 130, thus achieves the function of refrigeration.Thus the cold junction of described semiconductor refrigerating unit 130 can absorb described chip substrate 110 and transmit next heat, produces refrigeration, lowers the temperature to described LED luminescence unit 120.In like manner, in the hot junction of described semiconductor refrigerating unit 130, due to the compound of electron-hole pair, releases heat, outwardly heat release, by the thermal release that absorbs from described chip substrate 110 to the external world, realize described chip substrate 110 continued down, to improve the service life of described LED luminescence unit 120.
In the present embodiment, described LED module 10 also comprises a cooling base 140, described cooling base 140 is fixed on the hot junction of described semiconductor refrigerating unit 130, the heat in the hot junction of described semiconductor refrigerating unit 130 is delivered in environment by described cooling base 140, thus the temperature difference increased between the cold junction of described semiconductor refrigerating unit 130 and hot junction, to increase the semiconductor refrigerating efficiency of described semiconductor refrigerating unit 130.Described cooling base 140 is thermally conductive substrate, namely the pyroconductivity of described cooling base 140 is higher, generally, the pyroconductivity of described cooling base 140 is higher than the pyroconductivity in described semiconductor refrigerating unit 130 hot junction, such as described cooling base 140 is metal heat conduction substrate, the capacity of heat transmission of described cooling base 140 can be improved, thus improve the temperature difference between cold junction and hot junction increasing described semiconductor refrigerating unit 130.
Wherein, described LED luminescence unit 120 and semiconductor refrigerating unit 130 can be connected same power supply 150, as shown in Figure 1, are powered by same power supply 150.But described LED luminescence unit 120 and semiconductor refrigerating unit 130 are not limited to be connected same power supply 150, described LED luminescence unit 120 and semiconductor refrigerating unit 130 are connected two different power supplys respectively, by two different Power supplies, also within thought range of the present utility model.
When described LED module 10 in use, described LED luminescence unit 120 produces heat when luminescence, this heat can pass to described semiconductor refrigerating unit 130, described semiconductor refrigerating unit 130 cools described LED luminescence unit 120, be conducive to the temperature reducing described LED luminescence unit 120, to improve the service life of described LED luminescence unit 120.
The described LED module 10 of present embodiment can be applied to LED light device, realizes LED luminescence.
Refer to Fig. 2, Fig. 2 is the schematic diagram of the LED module of the utility model second embodiment, and in fig. 2, reference number represents the element that the statement identical with Fig. 1 is identical with the first embodiment.The LED module 20 of described second embodiment is substantially identical with the LED module 10 of described first embodiment, its difference is: described LED luminescence unit 120 is side view type light emitting unit, described semiconductor refrigerating unit 230 is arranged at the side that described LED luminescence unit 120 deviates from described chip substrate 110, and the cold junction of described semiconductor refrigerating unit 230 connects the surface that described LED luminescence unit 120 deviates from the side of described chip substrate 110.When described LED module 20 in use, described LED luminescence unit 120 produces heat when luminescence, this heat is directly passed to described semiconductor refrigerating unit 230, described semiconductor refrigerating unit 230 cools described LED luminescence unit 120, be conducive to the temperature reducing described LED luminescence unit 120, to improve the service life of described LED luminescence unit 120.
In the present embodiment, the side that LED luminescence unit 120 described in each deviates from described chip substrate 110 all has semiconductor refrigerating unit 230 described in, and wherein, described semiconductor refrigerating unit 230 comprises described at least one and freezing to 130A.But, be not limited to the side that LED luminescence unit 120 described in each deviates from described chip substrate 110 and all there is semiconductor refrigerating unit 230 described in, the surface that can also deviate from the side of described chip substrate 110 at all described LED luminescence units 120 covers the enough large described semiconductor refrigerating unit 230 of an area simultaneously, described semiconductor refrigerating unit 230 can cover all described LED luminescence units 120, also within thought range of the present utility model.
Wherein, in the present embodiment, the hot junction of semiconductor refrigerating unit 130 described in each all has a cooling base 240, as shown in Figure 2, the enough large described cooling base 240 of an area can also be covered in the hot junction of all described semiconductor refrigerating unit 230 simultaneously, described cooling base 240 can cover all described semiconductor refrigerating unit 230, also within thought range of the present utility model.In addition, when a described semiconductor refrigerating unit 230 covers all described LED luminescence units 120, a described cooling base 240 is fixed on the hot junction of described semiconductor refrigerating unit 230, the heat in the hot junction of described semiconductor refrigerating unit 230 is delivered in environment by described cooling base 240, the temperature difference between the cold junction of described semiconductor refrigerating unit 230 and hot junction can also be increased, also the semiconductor refrigerating efficiency of described semiconductor refrigerating unit 230 can be increased, also within thought range of the present utility model.
In the present embodiment, described LED luminescence unit 120 and semiconductor refrigerating unit 230 are connected two different power supplys 251 and power supply 252 respectively, by two different Power supplies, but described LED luminescence unit 120 can also be connected same power supply with semiconductor refrigerating unit 230, also within thought range of the present utility model.
The utility model is not limited to above embodiment, such as: described semiconductor refrigerating unit is not limited to be positioned at the side being arranged at described chip substrate and deviating from described LED luminescence unit, or be arranged at the side that described LED luminescence unit deviates from described chip substrate, the side of described chip substrate can also be arranged at, the heat transmission with described LED luminescence unit can also be realized, also within thought range of the present utility model by described chip substrate.
Although the utility model discloses as above in a preferred embodiment thereof, the utility model is not defined in this.Any those skilled in the art, not departing from spirit and scope of the present utility model, all can do various change with
Amendment, therefore protection domain of the present utility model should be as the criterion with claim limited range.
Claims (10)
1. a LED module, it is characterized in that, comprise chip substrate, at least one LED luminescence unit and semiconductor refrigerating unit, described LED luminescence unit is arranged at the side of described chip substrate, the heat that described semiconductor refrigerating unit sends for cooling described LED luminescence unit.
2. LED module as claimed in claim 1, it is characterized in that: described semiconductor refrigerating unit is arranged at the side that described chip substrate deviates from described LED luminescence unit, the cold junction of described semiconductor refrigerating unit connects the surface that described chip substrate deviates from the side of described LED luminescence unit.
3. LED module as claimed in claim 1, it is characterized in that: described LED luminescence unit is side view type light emitting unit, described semiconductor refrigerating unit is arranged at the side that described LED luminescence unit deviates from described chip substrate, and the cold junction of described semiconductor refrigerating unit connects the surface that described LED luminescence unit deviates from the side of described chip substrate.
4. LED module as claimed in claim 3, is characterized in that: the side that LED luminescence unit described in each deviates from described chip substrate all has semiconductor refrigerating unit described in.
5. LED module as claimed in claim 1, it is characterized in that: it is right that described semiconductor refrigerating unit comprises at least one refrigeration, described refrigeration is to comprising a P-type semiconductor element and a N-type semiconductor element, the cold junction of the P-type semiconductor element that described refrigeration is right is connected by a conductive electrode with the cold junction of N-type semiconductor element, and the hot junction of the P-type semiconductor element that described refrigeration is right and the hot junction of N-type semiconductor element are respectively used to access power supply.
6. LED module as claimed in claim 1, it is characterized in that: described LED module also comprises a cooling base, described cooling base is fixed on the hot junction of described semiconductor refrigerating unit.
7. LED module as claimed in claim 6, is characterized in that: described cooling base is thermally conductive substrate.
8. as the LED module in claim 1-7 as described in any one, it is characterized in that: described LED luminescence unit is connected same power supply with semiconductor refrigerating unit, by same Power supply; Or described LED luminescence unit and semiconductor refrigerating unit are connected two different power supplys respectively, by two different Power supplies.
9. LED module as claimed in claim 1, is characterized in that: described chip substrate is thermally conductive substrate.
10. a LED light device, is characterized in that, possesses as the LED module in claim 1-9 as described in any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420433777.2U CN204114879U (en) | 2014-08-01 | 2014-08-01 | LED module and LED light device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420433777.2U CN204114879U (en) | 2014-08-01 | 2014-08-01 | LED module and LED light device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204114879U true CN204114879U (en) | 2015-01-21 |
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ID=52332186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420433777.2U Expired - Fee Related CN204114879U (en) | 2014-08-01 | 2014-08-01 | LED module and LED light device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204114879U (en) |
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2014
- 2014-08-01 CN CN201420433777.2U patent/CN204114879U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20150801 |
|
| EXPY | Termination of patent right or utility model |