CN204088371U - A kind of LED - Google Patents

A kind of LED Download PDF

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Publication number
CN204088371U
CN204088371U CN201420517479.1U CN201420517479U CN204088371U CN 204088371 U CN204088371 U CN 204088371U CN 201420517479 U CN201420517479 U CN 201420517479U CN 204088371 U CN204088371 U CN 204088371U
Authority
CN
China
Prior art keywords
led chip
led
substrate
boss
bent plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420517479.1U
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Chinese (zh)
Inventor
陈瑜
陈琦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU YULONG TECHNOLOGY Co Ltd
Original Assignee
HANGZHOU YULONG TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU YULONG TECHNOLOGY Co Ltd filed Critical HANGZHOU YULONG TECHNOLOGY Co Ltd
Priority to CN201420517479.1U priority Critical patent/CN204088371U/en
Application granted granted Critical
Publication of CN204088371U publication Critical patent/CN204088371U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of LED, comprise LED chip, substrate, cooling stand, fixed support pin and transparent bent plate, it is characterized in that, described substrate upper end is provided with rectangular boss and low side is provided with rectangular base, described LED chip is fixedly installed on the boss of substrate, and is provided with positive pole and negative pole at LED chip; The boss periphery that the described transparent bent plate in semicircle ball is located on substrate seals LED chip.The utility model has the advantages that: LED chip be fixed on substrate that heat sink material makes or around LED, be provided with the cooling stand that Heat Conduction Material makes, the radiating rate around LED chip can be accelerated, improve radiating efficiency, thus reduce the temperature around LED chip.So, after the LED adopting the utility model embodiment to provide, because LED chip environment temperature reduces relatively, LED chip loss rate is slowed down, and then extends the useful life of LED.

Description

A kind of LED
Technical field
The utility model relates to LED (Light Emitting Diode, light-emitting diode) technical field, is specially a kind of LED of modified node method.
Background technology
LED directly can be converted into light electricity, and the heart of LED is the LED wafer of a semiconductor.At least there are the following problems to adopt existing LED technology: because LED wafer exists resistance, certain heat can be produced in the process of electric current by LED wafer, these heats are collected in around LED wafer for a long time, cannot discharge in the epoxy resin being closed in packaged LED, cause LED wafer environment temperature higher.If light LED for a long time, be subject to the impact of higher temperature around LED wafer, LED wafer and fluorescent material accelerate loss, cause LED life time decay, and brightness reduces, and even cannot meet normal illumination and optics needs.
Summary of the invention
The technical problems to be solved in the utility model is, overcomes deficiency of the prior art, provides a kind of LED light source of voltage stabilizing function.
For technical solution problem, solution of the present invention is:
A kind of LED is provided, comprise LED chip, substrate, cooling stand, fixed support pin and transparent bent plate, it is characterized in that, described substrate upper end is provided with rectangular boss and low side is provided with rectangular base, described LED chip is fixedly installed on the boss of substrate, and be provided with positive pole and negative pole at LED chip, positive pole and negative pole are connected to wire; The boss periphery that the described transparent bent plate in semicircle ball is located on substrate seals LED chip; Described substrate peripheral is equipped with cooling stand, and described fixed support pin runs through by being connected in transparent bent plate in the middle of cooling stand.
In the utility model, described cooling stand is a kind of bracing frame of heat-conducting.
In the utility model, described transparent bent plate is a kind of transparent curved slab of epoxy resin material.
In the utility model, described substrate boss is round boss, square boss or hexagon boss.
Compared with prior art, the utility model has the advantages that:
LED chip be fixed on substrate that heat sink material makes or around LED, be provided with the cooling stand that Heat Conduction Material makes, the radiating rate around LED chip can be accelerated, improve radiating efficiency, thus reduce the temperature around LED chip.So, after the LED adopting the utility model embodiment to provide, because LED chip environment temperature reduces relatively, LED chip loss rate is slowed down, and then extends the useful life of LED.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in below describing is only embodiments more of the present utility model, for those of ordinary skills, under the prerequisite not paying creative work, other embodiment and accompanying drawing thereof can also be obtained according to these accompanying drawing illustrated embodiments.
Fig. 1 is overall structure schematic diagram of the present utility model;
Wherein: transparent bent plate 1, LED chip 2, wire 3, cooling stand 4, fixed support pin 5, substrate 6.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described.
The utility model provides the specific embodiment of a kind of LED, comprise LED chip 2, substrate 6, cooling stand 4, fixed support pin 5 and transparent bent plate 1, as shown in Figure 1, this LED comprises the substrate 6 that Heat Conduction Material is made, described substrate 6 is fixed with LED chip 2, and the side of described substrate 6 is provided with the transparent bent plate 1 be encapsulated by described LED chip 2.
In general, described transparent bent plate 1 can adopt epoxy resin to make, and while the light that LED chip 2 sends can be appeared by described transparent bent plate 1, epoxy resin can ensure that this LED has the function of antidetonation; The heat that LED chip 2 produces then can be conducted to outside transparent bent plate 1 by described substrate 6, thus reduces the temperature around LED chip 2.
For the ease of accessing power supply in described LED chip 2, LED described in the utility model embodiment also comprises the leg (not shown) for connecting feeder ear, and described leg comprises the part being encapsulated in described transparent bent plate inside and the part be exposed at outside described transparent bent plate, and positive pole, the negative pole of described LED chip 2 are connected with the part described leg being encapsulated in described transparent bent plate inside respectively by two wires 3.Wire in the utility model can adopt gold thread, silver-colored line or other conductive material, and because wire is very thin, the basic difficulty of naked eyes is seen clearly, needs microscopic examination, so can not affect the light that LED chip 2 sends.
Leg can take in prior art in multiple packaged type any one, at present, the mode of LED luminescence mainly comprises top luminous (Top View) and side luminescence (Side View) two kinds of modes.
When practice, described substrate 6 can be made into flat shape, also can be made into boss shape as shown in Figure 1, described LED chip 2 is fixed on the top of substrate boss, and it is inner described substrate boss to be encapsulated in described transparent bent plate 1.In fact, the substrate boss in the utility model embodiment can be round boss, also can be other polygon boss, as: square boss, hexagon boss etc.
The Heat Conduction Material that in the utility model embodiment, substrate 6 adopts includes but not limited to following material: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
Owing to LED chip 2 being fixed on substrate that heat sink material makes, the radiating rate around LED chip 2 can be accelerated, improve radiating efficiency, thus the temperature reduced around LED chip 2, LED chip 2 loss rate is slowed down, and then extends the useful life of LED.
Above-described embodiment is only for illustrating technical conceive of the present utility model and feature; its object is to person skilled in the art can be understood content of the present utility model and be implemented; protection range of the present utility model can not be limited with this; all equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed in protection range of the present utility model.

Claims (4)

1. a LED, comprise LED chip, substrate, cooling stand, fixed support pin and transparent bent plate, it is characterized in that, described substrate upper end is provided with rectangular boss and low side is provided with rectangular base, described LED chip is fixedly installed on the boss of substrate, and be provided with positive pole and negative pole at LED chip, positive pole and negative pole are connected to wire; Described transparent bent plate is semicircle ball, and the boss periphery being located on substrate seals LED chip; Described substrate peripheral is equipped with cooling stand, and described fixed support pin runs through by being connected in transparent bent plate in the middle of cooling stand.
2. a kind of LED according to claim 1, is characterized in that, described cooling stand is a kind of bracing frame of heat-conducting.
3. a kind of LED according to claim 1, is characterized in that, described transparent bent plate is a kind of transparent curved slab of epoxy resin material.
4. a kind of LED according to claim 1, is characterized in that, described substrate boss is round boss, square boss or hexagon boss.
CN201420517479.1U 2014-09-11 2014-09-11 A kind of LED Expired - Fee Related CN204088371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420517479.1U CN204088371U (en) 2014-09-11 2014-09-11 A kind of LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420517479.1U CN204088371U (en) 2014-09-11 2014-09-11 A kind of LED

Publications (1)

Publication Number Publication Date
CN204088371U true CN204088371U (en) 2015-01-07

Family

ID=52181047

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420517479.1U Expired - Fee Related CN204088371U (en) 2014-09-11 2014-09-11 A kind of LED

Country Status (1)

Country Link
CN (1) CN204088371U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150107

Termination date: 20150911

EXPY Termination of patent right or utility model