CN204046929U - A kind of hybrid film integrated circuit - Google Patents
A kind of hybrid film integrated circuit Download PDFInfo
- Publication number
- CN204046929U CN204046929U CN201420504712.2U CN201420504712U CN204046929U CN 204046929 U CN204046929 U CN 204046929U CN 201420504712 U CN201420504712 U CN 201420504712U CN 204046929 U CN204046929 U CN 204046929U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- lamella
- hybrid
- thin film
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A kind of hybrid film integrated circuit, thin film integrated circuit lamella (2) has one group of hole and one group of groove, the side of thin film integrated circuit lamella (2) is welded on thick film hybrid integrated circuit lamella (1) side, hybrid precast element layer (3) is welded on the opposite side of thin film integrated circuit lamella (2), and the component pin of hybrid precast element layer (3) is welded in one group of hole of thin film integrated circuit lamella (2), in one group of groove and on thick film hybrid integrated circuit lamella (1) respectively.Advantage is: top ventilating hole element in the mode of metal lead wire through three layers of compages, avoid the through hole cracking of flexible circuit, the potential risk broken under high and low temperature operating ambient temperature, cost is low, solves in ceramic thick-film circuit production process and avoids increasing through hole and the problem that increases considerably cost.
Description
Technical field
The utility model relates to field of circuit boards, is specifically related to a kind of hybrid film integrated circuit.
Background technology
At present, thick film hybrid integrated circuit technique is a kind of circuit design and manufacturing process of having certain change, he mainly carries out the integrated of thick film circuit and manufactures on ceramic matrix material, perfect heat-dissipating, but perforate cost is high on thick film ceramic carrier, the thick film hybrid integrated circuit energy resource consumption adopting low temperature co-fired technology to manufacture is large, qualification rate is not high, production cost is high, technical difficulty is large.Thin film integrated circuit is suitable for connecting up on soft material, not too be applicable to bonding power type element and through hole type element, the through hole that multilayer is crossed between line easily causes through hole to rupture under industry, automobile or accurate military operational environment, cause product failure, simultaneously thin film integrated circuit and Carrier-matching inconvenience.How thick film hybrid integrated circuit technique is combined with thin-film IC process, make full use of their advantage, form the new technology of having complementary advantages, it is the difficult problem on circuit and electronic goods design and manufaction, the utility model is exactly utilize the existing thick film hybrid integrated circuit technique platform combination of enterprise to the design of thin film integrated circuit and application experience, thick-thin hybrid film integrated circuit new technology of the one that independent design goes out.He can solve the problem that thick-thin hybrid film integrated circuit combines, the advantageous feature of two kinds of techniques can be given full play to, avoid respective shortcoming and difficult point to greatest extent, design design philosophy that two kinds of techniques combine and finished product product design solution based on this with creating property with independent, modern design, has novelty, for high side circuitry Production requirement, there is practicality, real cost of production is lower, and properties of product are reliable and stable, and the scope of application is extensive.
Utility model content
The purpose of this utility model is exactly for deficiency above-mentioned at present, and provides a kind of hybrid film integrated circuit.
The utility model comprises thick film hybrid integrated circuit lamella, thin film integrated circuit lamella and hybrid precast element layer, thick film hybrid integrated circuit lamella and thin film integrated circuit lamella have one group of corresponding hole and one group of groove, the side of thin film integrated circuit lamella is welded on thick film hybrid integrated circuit lamella side, hybrid precast element layer is welded on the opposite side of thin film integrated circuit lamella, and in the component pin of hybrid precast element layer one group of hole being welded on thick film hybrid integrated circuit lamella and thin film integrated circuit lamella respectively and one group of groove.
The utility model advantage is: 1, top ventilating hole element in the mode of metal lead wire through three layers of compages, avoid the through hole cracking of flexible circuit, the potential risk broken under high and low temperature operating ambient temperature, the line density of integrated circuit is high, integrated circuit manufacturing process is very not complicated simultaneously, cost is low, solves in ceramic thick-film circuit production process and avoids increasing through hole and the problem that increases considerably cost.2, avoid adopting low temperature co-fired technology to solve complicated line design and great number cost payout problem with rational new technology and new design.3, utilize thin film circuit to mix the carrier problem solving thin film circuit with thick film circuit, solve the problem that the hot property of integrated circuit is bad.
accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model end view structural representation.
Fig. 3 is thick film hybrid integrated circuit lamella.
Fig. 4 is thin film integrated circuit lamella.
Fig. 5 is hybrid precast element layer.
Embodiment
As Fig. 1, 2, 3, 4, shown in 5, the utility model comprises thick film hybrid integrated circuit lamella 1, thin film integrated circuit lamella 2 and hybrid precast element layer 3, thick film hybrid integrated circuit lamella 1 and thin film integrated circuit lamella 2 have one group of corresponding hole and one group of groove, the side of thin film integrated circuit lamella 2 is welded on thick film hybrid integrated circuit lamella 1 side, hybrid precast element layer 3 is welded on the opposite side of thin film integrated circuit lamella 2, and in the component pin of hybrid precast element layer 3 one group of hole being welded on thick film hybrid integrated circuit lamella 1 and thin film integrated circuit lamella 2 respectively and one group of groove.
Claims (1)
1. a hybrid film integrated circuit, it is characterized in that it comprises thick film hybrid integrated circuit lamella (1), thin film integrated circuit lamella (2) and hybrid precast element layer (3), thin film integrated circuit lamella (2) has one group of hole and one group of groove, the side of thin film integrated circuit lamella (2) is welded on thick film hybrid integrated circuit lamella (1) side, hybrid precast element layer (3) is welded on the opposite side of thin film integrated circuit lamella (2), and the component pin of hybrid precast element layer (3) is welded in one group of hole of thin film integrated circuit lamella (2) respectively, in one group of groove and on thick film hybrid integrated circuit lamella (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420504712.2U CN204046929U (en) | 2014-09-03 | 2014-09-03 | A kind of hybrid film integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420504712.2U CN204046929U (en) | 2014-09-03 | 2014-09-03 | A kind of hybrid film integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204046929U true CN204046929U (en) | 2014-12-24 |
Family
ID=52247546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420504712.2U Expired - Fee Related CN204046929U (en) | 2014-09-03 | 2014-09-03 | A kind of hybrid film integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204046929U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817648A (en) * | 2017-11-21 | 2019-05-28 | 湖北东光电子股份有限公司 | A kind of thick film hybrid integrated circuit and its batch production control method |
| CN109817563A (en) * | 2019-03-18 | 2019-05-28 | 昆山福烨电子有限公司 | A kind of production technology of three layers of ceramic thick-film circuit |
-
2014
- 2014-09-03 CN CN201420504712.2U patent/CN204046929U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817648A (en) * | 2017-11-21 | 2019-05-28 | 湖北东光电子股份有限公司 | A kind of thick film hybrid integrated circuit and its batch production control method |
| CN109817563A (en) * | 2019-03-18 | 2019-05-28 | 昆山福烨电子有限公司 | A kind of production technology of three layers of ceramic thick-film circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20170903 |