High temperature resistant release adhesive tape
Technical field
The present invention relates to the insulating material technical field, particularly a kind of release adhesive tape that possesses high temperature resistant character.
Background technology
In the printing of FPC (flexible PCB) circuit card, LED encapsulation and other high-temperature insulation protection field, demand is a to possess high temperature resistant release adhesive tape simultaneously, and the resistance to elevated temperatures of common release adhesive tape (like polyolefine such as PE/PP) can't meet the demands.
Summary of the invention
For solving existing defective of adhesive tape and problem in the prior art, a kind of release adhesive tape that possesses high temperature resistant character is provided.
The technical scheme that the present invention is adopted for its technical problem of solution is: high temperature resistant release adhesive tape of the present invention adopts the three-decker design, and skin is the glue coat, and the middle layer is the PA66 layer, and bottom is a modification TPX layer.
Employing five-layer structure design, the first layer is the glue coat, and the second layer and the 4th layer are the PA66 layer, and the 3rd layer is the PA6 layer, and bottom is a modification TPX layer.
The invention has the beneficial effects as follows: compared with prior art; High temperature resistant release adhesive tape film of the present invention adopts three layers or five-layer structure design, and adopts combining of PA66 and modification TPX material, makes its release layer surface tension less than 28mN/m; Adhesive tape can be when temperature be 180 ℃ can long term operation; Can short-term job when temperature is 200 ℃ 20 minutes, possess good insulation performance property simultaneously, overall performance and polyimide PI, polyethyleneterephthalate PET are approaching; Can replace the adhesive tape that PI and PET material are processed fully, have good result of use and economic performance.
Description of drawings
Below in conjunction with accompanying drawing and embodiment high temperature resistant release adhesive tape of the present invention is described further.
Fig. 1 is the three-decker synoptic diagram of high temperature resistant release adhesive tape of the present invention;
Fig. 2 is the five-layer structure synoptic diagram of high temperature resistant release adhesive tape of the present invention.
Embodiment
As shown in Figure 1; Fig. 1 is embodiments of the invention one; In the present embodiment, high temperature resistant release adhesive tape of the present invention adopts the three-decker design, is respectively the outer glue coat 1 that is; Glue coat 1 can adopt materials such as acrylic PMMA or organosilicon to process, glue coat 1 with pasting face and directly combining.The middle layer is a PA66 layer 2, and PA66 layer 2 is a bonding coat, and material is 100% PA66, and PA66 is a polyamide 66.Bottom is a modification TPX layer 3, and TPX layer 3 is a release layer, and release layer and release face fit, and TPX layer 3 adopts modification TPX material to process, and TPX is the polymkeric substance of 4-methylpentene, abbreviates PMP as, and TPX layer 3 can form good binding with PA66.
As shown in Figure 2, Fig. 2 is embodiments of the invention two, in the present embodiment; High temperature resistant release adhesive tape of the present invention adopts the five-layer structure design, and the first layer is a glue coat 1, and the second layer and the 4th layer are PA66 layer 2; The 3rd layer is PA6 layer 4, and bottom is a modification TPX layer 3.Adopt the five-layer structure design can make adhesive tape high temperature resistant better with release performance.
The explanation of comprehensive above-mentioned two embodiment; High temperature resistant release adhesive tape film of the present invention adopts three layers or five-layer structure design, and adopts combining of PA66 and modification TPX material, makes its release layer surface tension less than 28mN/m; Adhesive tape can be when temperature be 180 ℃ can long term operation; Can short-term job when temperature is 200 ℃ 20 minutes, possess good insulation performance property simultaneously, overall performance and polyimide PI, polyethyleneterephthalate PET are approaching; Can replace the adhesive tape that PI and PET material are processed fully, have good result of use and economic performance.
According to embodiments of the invention describing the present invention property and nonrestrictive description, but should be understood that and do not breaking away under the situation of the relevant protection domain that limits claim that those skilled in the art can make change and/or revise.