CN202499837U - High-temperature-resistant parting type adhesive tape - Google Patents
High-temperature-resistant parting type adhesive tape Download PDFInfo
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- CN202499837U CN202499837U CN201220121657XU CN201220121657U CN202499837U CN 202499837 U CN202499837 U CN 202499837U CN 201220121657X U CN201220121657X U CN 201220121657XU CN 201220121657 U CN201220121657 U CN 201220121657U CN 202499837 U CN202499837 U CN 202499837U
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- parting type
- type adhesive
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Abstract
The utility model relates to the technical field of insulation materials, and in particular relates to a parting type adhesive tape with high temperature resistance. Compared with the prior art, the high-temperature-resistant parting type adhesive tape is of three-layer structure design, wherein an outer layer is an adhesive coating, an intermediate layer is a PA66 (polyamide) layer, and the base layer is a modified TPX (Poly-4-methyl-1-pentene) layer; the high-temperature-resistant parting type adhesive tape is of five-layer structure design, wherein the first layer is an adhesive coating, the second layer and the fourth layer are the PA66 layers, the third layer is the PA6 layer, and the base layer is the modified TPX layer; the surface tension of a parting type layer is smaller than 28mN/m, and the adhesive tape can work for a long term at the temperature of 180 DEG C and can work for a short term of 20min at the temperature of 200 DEG C; and simultaneously, the insulativity is excellent, the whole performance can be close to performances of PI (polyimide) and PET (polyethylene terephthalate), and thus the parting type adhesive tape can completely replace an adhesive tape made of PI and PET materials, and has an excellent use effect and economical performance.
Description
Technical field
The present invention relates to the insulating material technical field, particularly a kind of release adhesive tape that possesses high temperature resistant character.
Background technology
In the printing of FPC (flexible PCB) circuit card, LED encapsulation and other high-temperature insulation protection field, demand is a to possess high temperature resistant release adhesive tape simultaneously, and the resistance to elevated temperatures of common release adhesive tape (like polyolefine such as PE/PP) can't meet the demands.
Summary of the invention
For solving existing defective of adhesive tape and problem in the prior art, a kind of release adhesive tape that possesses high temperature resistant character is provided.
The technical scheme that the present invention is adopted for its technical problem of solution is: high temperature resistant release adhesive tape of the present invention adopts the three-decker design, and skin is the glue coat, and the middle layer is the PA66 layer, and bottom is a modification TPX layer.
Employing five-layer structure design, the first layer is the glue coat, and the second layer and the 4th layer are the PA66 layer, and the 3rd layer is the PA6 layer, and bottom is a modification TPX layer.
The invention has the beneficial effects as follows: compared with prior art; High temperature resistant release adhesive tape film of the present invention adopts three layers or five-layer structure design, and adopts combining of PA66 and modification TPX material, makes its release layer surface tension less than 28mN/m; Adhesive tape can be when temperature be 180 ℃ can long term operation; Can short-term job when temperature is 200 ℃ 20 minutes, possess good insulation performance property simultaneously, overall performance and polyimide PI, polyethyleneterephthalate PET are approaching; Can replace the adhesive tape that PI and PET material are processed fully, have good result of use and economic performance.
Description of drawings
Below in conjunction with accompanying drawing and embodiment high temperature resistant release adhesive tape of the present invention is described further.
Fig. 1 is the three-decker synoptic diagram of high temperature resistant release adhesive tape of the present invention;
Fig. 2 is the five-layer structure synoptic diagram of high temperature resistant release adhesive tape of the present invention.
Embodiment
As shown in Figure 1; Fig. 1 is embodiments of the invention one; In the present embodiment, high temperature resistant release adhesive tape of the present invention adopts the three-decker design, is respectively the outer glue coat 1 that is; Glue coat 1 can adopt materials such as acrylic PMMA or organosilicon to process, glue coat 1 with pasting face and directly combining.The middle layer is a PA66 layer 2, and PA66 layer 2 is a bonding coat, and material is 100% PA66, and PA66 is a polyamide 66.Bottom is a modification TPX layer 3, and TPX layer 3 is a release layer, and release layer and release face fit, and TPX layer 3 adopts modification TPX material to process, and TPX is the polymkeric substance of 4-methylpentene, abbreviates PMP as, and TPX layer 3 can form good binding with PA66.
As shown in Figure 2, Fig. 2 is embodiments of the invention two, in the present embodiment; High temperature resistant release adhesive tape of the present invention adopts the five-layer structure design, and the first layer is a glue coat 1, and the second layer and the 4th layer are PA66 layer 2; The 3rd layer is PA6 layer 4, and bottom is a modification TPX layer 3.Adopt the five-layer structure design can make adhesive tape high temperature resistant better with release performance.
The explanation of comprehensive above-mentioned two embodiment; High temperature resistant release adhesive tape film of the present invention adopts three layers or five-layer structure design, and adopts combining of PA66 and modification TPX material, makes its release layer surface tension less than 28mN/m; Adhesive tape can be when temperature be 180 ℃ can long term operation; Can short-term job when temperature is 200 ℃ 20 minutes, possess good insulation performance property simultaneously, overall performance and polyimide PI, polyethyleneterephthalate PET are approaching; Can replace the adhesive tape that PI and PET material are processed fully, have good result of use and economic performance.
According to embodiments of the invention describing the present invention property and nonrestrictive description, but should be understood that and do not breaking away under the situation of the relevant protection domain that limits claim that those skilled in the art can make change and/or revise.
Claims (2)
1. high temperature resistant release adhesive tape is characterized in that, adopts the three-decker design, and skin is the glue coat, and the middle layer is the PA66 layer, and bottom is a modification TPX layer.
2. high temperature resistant release adhesive tape is characterized in that, adopts the five-layer structure design, and the first layer is the glue coat, and the second layer and the 4th layer are the PA66 layer, and the 3rd layer is the PA6 layer, and bottom is a modification TPX layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220121657XU CN202499837U (en) | 2012-03-28 | 2012-03-28 | High-temperature-resistant parting type adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220121657XU CN202499837U (en) | 2012-03-28 | 2012-03-28 | High-temperature-resistant parting type adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202499837U true CN202499837U (en) | 2012-10-24 |
Family
ID=47036457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220121657XU Expired - Lifetime CN202499837U (en) | 2012-03-28 | 2012-03-28 | High-temperature-resistant parting type adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202499837U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104629640A (en) * | 2015-02-13 | 2015-05-20 | 厦门新旺新材料科技有限公司 | High temperature resistant release adhesive tape as well as preparation method and use of adhesive tape |
| CN106273959A (en) * | 2016-08-11 | 2017-01-04 | 厦门新旺新材料科技有限公司 | Three layers of resistance glue mould release membrance |
-
2012
- 2012-03-28 CN CN201220121657XU patent/CN202499837U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104629640A (en) * | 2015-02-13 | 2015-05-20 | 厦门新旺新材料科技有限公司 | High temperature resistant release adhesive tape as well as preparation method and use of adhesive tape |
| CN106273959A (en) * | 2016-08-11 | 2017-01-04 | 厦门新旺新材料科技有限公司 | Three layers of resistance glue mould release membrance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XIAMEN XINWANG NEW MATERIALS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: XIAMEN XINWANG INDUSTRY + TRADE CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian Province, Jimei District, the town of white rock road, No. 55 4-5F Patentee after: Xiamen Xinwang New Material Technology Co., Ltd. Address before: 361000 Fujian Province, Jimei District, the town of white rock road, No. 55 4-5F Patentee before: Xiamen XinWang Industry & Trade Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121024 |