CN204031591U - The soft-hard composite board of substrate mopping - Google Patents
The soft-hard composite board of substrate mopping Download PDFInfo
- Publication number
- CN204031591U CN204031591U CN201420378046.2U CN201420378046U CN204031591U CN 204031591 U CN204031591 U CN 204031591U CN 201420378046 U CN201420378046 U CN 201420378046U CN 204031591 U CN204031591 U CN 204031591U
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- base plate
- copper
- clad base
- silver foil
- flexible pcb
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Abstract
The utility model discloses a kind of soft-hard composite board of substrate mopping, comprise flexible PCB and copper-clad base plate, the obverse and reverse of described flexible PCB is respectively equipped with silver foil, described copper-clad base plate comprise with the first copper-clad base plate of the positive pressing of described flexible PCB and with the second copper-clad base plate of described flexible PCB reverse side pressing, described in any one, copper-clad base plate is printed with the skin of paint for isolating described silver foil and described copper-clad base plate in the one side to described silver foil just.Compared with prior art, the utility model is provided with the skin of paint for isolating described silver foil and described copper-clad base plate, between described silver foil and described copper-clad base plate, is not easy adhesion, in the time tearing copper-clad base plate waste material off, described silver foil is not easy by sticky removing, and silver foil is more complete, has improved properties of product.
Description
Technical field
The utility model designs a kind of soft-hard composite board, relates in particular to a kind of soft-hard composite board of substrate mopping.
Background technology
Soft-hard composite board be a kind of pliability of soft board and supportive of hardboard utilized in conjunction with the diversification circuit board forming, it has the advantage of soft board and hardboard concurrently, is therefore widely used in Circuits System.In existing application, refer to shown in Fig. 1, soft-hard composite board is general first forms FPC (flexible PCB) by silver foil 3, cover lay (table sheath) 4 and Copper Foil 5 pressings, again by pure glue-line 2 by copper-clad base plate 1 and FPC pressing, remove copper-clad base plate waste material 6 and expose silver foil 3 finally by crossing laser cutting copper-clad base plate 1.
Need to be under hot environment when copper-clad base plate and FPC pressing, temperature, up to 180 DEG C, because hot mastication can produce certain viscosity, therefore, in the time removing waste material, is easy to part silver foil to stick out between copper-clad base plate and silver foil, causes silver foil breakage.
Therefore, be necessary to provide a kind of new soft-hard composite board to solve the problems referred to above.
Utility model content
The purpose of this utility model is to provide a kind of can prevent that silver foil is by the soft-hard composite board of the substrate mopping of sticky removing.
To achieve these goals, the technical scheme that the utility model adopts is as follows:
A kind of soft-hard composite board of substrate mopping, comprise flexible PCB and copper-clad base plate, the obverse and reverse of described flexible PCB is respectively equipped with silver foil, described copper-clad base plate comprise with the first copper-clad base plate of the positive pressing of described flexible PCB and with the second copper-clad base plate of described flexible PCB reverse side pressing, described in any one, copper-clad base plate is printed with the skin of paint for isolating described silver foil and described copper-clad base plate in the one side to described silver foil just.
Preferably, described soft-hard composite board also comprises the pure glue-line for bonding described flexible PCB and described copper-clad base plate.
Preferably, described pure glue-line comprises the first pure glue-line of and described first copper-clad base plate positive for bonding described flexible PCB and the second pure glue-line for bonding described flexible PCB reverse side and described the second copper-clad base plate.
Preferably, the region between described skin of paint and described silver foil is not provided with described pure glue-line.
Compared with prior art, the beneficial effect of the soft-hard composite board of the utility model substrate mopping is: the soft-hard composite board of the utility model substrate mopping is provided with the skin of paint for isolating described silver foil and described copper-clad base plate, between described silver foil and described copper-clad base plate waste material, be not easy adhesion, in the time tearing described substrate waste material off, described silver foil is not easy by sticky removing, silver foil is more complete, has improved properties of product.
Brief description of the drawings
Fig. 1 is the structural representation of existing soft-hard composite board;
Fig. 2 is structural representation of the present utility model.
Embodiment
Below in conjunction with specific embodiment, the utility model is further described.
Refer to shown in Fig. 2, the soft-hard composite board of the utility model substrate mopping comprises flexible PCB, copper-clad base plate 1 and pure glue-line 2, the obverse and reverse of described flexible PCB is respectively equipped with silver foil 3, in the present embodiment, described flexible PCB is individual layer, in other embodiments, described flexible PCB can be multilayer.
Described copper-clad base plate 1 comprises and positive the first copper-clad base plate of pressing of described flexible PCB and the second copper-clad base plate of described flexible PCB reverse side pressing, described in any one, copper-clad base plate 1 is just being printed with the skin of paint 7 for isolating described silver foil 3 and described copper-clad base plate 1 to the one side of described silver foil 3, and the region between described skin of paint 7 and described silver foil 3 is not provided with described pure glue-line 2.
Described pure glue-line 2 is for bonding described flexible PCB and described copper-clad base plate 1, and described pure glue-line 2 comprises the first pure glue-line of and described first copper-clad base plate positive for bonding described flexible PCB and the second pure glue-line for bonding described flexible PCB reverse side and described the second copper-clad base plate.
When concrete application, with copper-clad base plate described in laser cutting 1 and remove copper-clad base plate waste material 6, described copper-clad base plate waste material 6 is just printed with described skin of paint 7 to the one side of described silver foil 3, due to the isolating function of skin of paint 7, in the time tearing described copper-clad base plate waste material 6 off, described silver foil 3 is not easy by sticky removing, and silver foil 3 is more complete, has improved properties of product.
Below schematically the utility model and execution mode thereof are described, this description does not have restricted, and shown in accompanying drawing is also one of execution mode of the present utility model, and actual structure is not limited to this.So, if those of ordinary skill in the art is enlightened by it, in the situation that not departing from the utility model creation aim, without the creationary frame mode similar to this technical scheme and the embodiment of designing, all should belong to protection range of the present utility model.
Claims (4)
1. the soft-hard composite board of a substrate mopping, comprise flexible PCB and copper-clad base plate, the obverse and reverse of described flexible PCB is respectively equipped with silver foil, described copper-clad base plate comprise with the first copper-clad base plate of the positive pressing of described flexible PCB and with the second copper-clad base plate of described flexible PCB reverse side pressing, it is characterized in that: described in any one, copper-clad base plate is printed with the skin of paint for isolating described silver foil and described copper-clad base plate in the one side to described silver foil just.
2. soft-hard composite board as claimed in claim 1, is characterized in that, described soft-hard composite board also comprises the pure glue-line for bonding described flexible PCB and described copper-clad base plate.
3. soft-hard composite board as claimed in claim 2, it is characterized in that, described pure glue-line comprises the first pure glue-line of and described first copper-clad base plate positive for bonding described flexible PCB and the second pure glue-line for bonding described flexible PCB reverse side and described the second copper-clad base plate.
4. soft-hard composite board as claimed in claim 2, is characterized in that, the region between described skin of paint and described silver foil is not provided with described pure glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420378046.2U CN204031591U (en) | 2014-07-09 | 2014-07-09 | The soft-hard composite board of substrate mopping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420378046.2U CN204031591U (en) | 2014-07-09 | 2014-07-09 | The soft-hard composite board of substrate mopping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204031591U true CN204031591U (en) | 2014-12-17 |
Family
ID=52071411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420378046.2U Active CN204031591U (en) | 2014-07-09 | 2014-07-09 | The soft-hard composite board of substrate mopping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204031591U (en) |
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2014
- 2014-07-09 CN CN201420378046.2U patent/CN204031591U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |