CN204014253U - A kind of accurate wiring board of PCB multilayer with Novel protective structure - Google Patents

A kind of accurate wiring board of PCB multilayer with Novel protective structure Download PDF

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Publication number
CN204014253U
CN204014253U CN201420328071.XU CN201420328071U CN204014253U CN 204014253 U CN204014253 U CN 204014253U CN 201420328071 U CN201420328071 U CN 201420328071U CN 204014253 U CN204014253 U CN 204014253U
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CN
China
Prior art keywords
heat dissipating
square shape
substrate
shape sheet
radiation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420328071.XU
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Chinese (zh)
Inventor
王树波
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SHENZHEN SPRINT CIRCUIT Co Ltd
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SHENZHEN SPRINT CIRCUIT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201420328071.XU priority Critical patent/CN204014253U/en
Application granted granted Critical
Publication of CN204014253U publication Critical patent/CN204014253U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model discloses a kind of accurate wiring board of PCB multilayer with Novel protective structure, on substrate (1), be provided with the first heat radiation module and the second heat radiation module; The first described heat radiation module comprises 2 square shape sheet heat dissipating layers (2) and 4 posts that lead (5); 2 square shape sheet heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 through holes along substrate thickness direction (4) that 4 posts that lead (5) correspondence is inserted on substrate connect 2 described square shape sheet heat dissipating layers; The square shape sheet heat dissipating layer and the disc heat dissipating layer that are positioned at upper surface of base plate are respectively provided with a finned radiator (7); Be positioned at the square shape sheet heat dissipating layer of base lower surface and the outer surface of disc heat dissipating layer is provided with fold (6); The relative both sides of substrate are respectively provided with an end chuck (8) for reinforcing.This accurate wiring board radiating effect of PCB multilayer with Novel protective structure is good, and strong shock resistance, can long-term stable operation.

Description

A kind of accurate wiring board of PCB multilayer with Novel protective structure
Technical field
The utility model relates to a kind of accurate wiring board of PCB multilayer with Novel protective structure.
Background technology
The accurate wiring board of existing PCB, there is no special-purpose cooling mechanism, can only rely on the natural heat dissipation of plate body, or locate to increase radiator fan etc. at the large device of caloric value (as CPU), but radiating effect is good not, plate body easily seriously causes line fault because generating heat;
In addition, the accurate wiring board barrier propterty of existing PCB multilayer is not good, therefore it structurally need to be reinforced.
Therefore be necessary to design the accurate wiring board of a kind of novel PCB multilayer.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of accurate wiring board of PCB multilayer with Novel protective structure, and this accurate wiring board radiating effect of PCB multilayer with Novel protective structure is good, and strong shock resistance, can long-term stable operation.
The technical solution of utility model is as follows:
The accurate wiring board of PCB multilayer with Novel protective structure is provided with the first heat radiation module and the second heat radiation module on substrate (1);
The first described heat radiation module comprises 2 square shape sheet heat dissipating layers (2) and 4 posts that lead (5); 2 square shape sheet heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 through holes along substrate thickness direction (4) that 4 posts that lead (5) correspondence is inserted on substrate connect 2 described square shape sheet heat dissipating layers;
The second described heat radiation module comprises 2 disc heat dissipating layers (3) and 4 posts that lead (5); 2 former shape heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 through holes along substrate thickness direction (4) that 4 posts that lead (5) correspondence is inserted on substrate connect 2 described disc heat dissipating layers;
The square shape sheet heat dissipating layer and the disc heat dissipating layer that are positioned at upper surface of base plate are respectively provided with a finned radiator (7);
Be positioned at the square shape sheet heat dissipating layer of base lower surface and the outer surface of disc heat dissipating layer is provided with fold (6);
The diameter of through hole is 1.2mm, and the length of side of square shape sheet heat dissipating layer is 5mm; The radius of disc heat dissipating layer is 4.5mm;
The relative both sides of substrate are respectively provided with an end chuck (8) for reinforcing.
The first described heat radiation module and the second heat radiation module are a plurality of.
Beneficial effect:
The accurate wiring board of PCB multilayer with Novel protective structure of the present utility model, by the square shape sheet heat dissipating layer in the first heat radiation module and the second heat radiation module and disc heat dissipating layer and the preliminary heat radiation of the post that leads realization, more further dispels the heat by radiator.
The fold that is positioned at the square shape sheet heat dissipating layer of base lower surface and the outer surface setting of disc heat dissipating layer has increased the area of heat radiation, better heat-radiation effect.
In addition, this square shape sheet heat dissipating layer with the accurate wiring board of PCB multilayer of Novel protective structure is all connected with ground wire with disc heat dissipating layer, and the antijamming capability of whole pcb board is strengthened.
The effect of end chuck is to reinforce substrate, makes it when receiving that external force is hit in a state of excitement, not be prone to interlayer dislocation and causes fault;
Generally speaking, the accurate wiring board radiating effect of this PCB multilayer with Novel protective structure is good, and strong shock resistance, can long-term stable operation.
Accompanying drawing explanation
Fig. 1 is the generalized section with the accurate wiring board of PCB multilayer of Novel protective structure;
Fig. 2 is the structural representation while being unkitted radiator of the accurate wiring board upper surface of PCB multilayer with Novel protective structure.
Label declaration: 1-substrate, 2-square shape sheet heat dissipating layer, 3-disc heat dissipating layer, 4-through hole, the 5-post that leads, 6-fold, 7-radiator, 8-end chuck.
Embodiment
Below with reference to the drawings and specific embodiments, the utility model is described in further details:
Embodiment 1:
As shown in Figure 1-2, a kind of accurate wiring board of PCB multilayer with Novel protective structure is provided with the first heat radiation module and the second heat radiation module on substrate 1;
The first described heat radiation module comprises 2 square shape sheet heat dissipating layers 2 and 4 posts 5 that lead; 2 square shape sheet heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 post 5 correspondences of leading are inserted into 42 described square shape sheet heat dissipating layers of through hole 4 connection along substrate thickness direction on substrate;
The second described heat radiation module comprises 2 disc heat dissipating layers 3 and 4 posts 5 that lead; 2 former shape heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 post 5 correspondences of leading are inserted into 42 described disc heat dissipating layers of through hole 4 connection along substrate thickness direction on substrate;
The square shape sheet heat dissipating layer and the disc heat dissipating layer that are positioned at upper surface of base plate are respectively provided with a finned radiator 7;
Be positioned at the square shape sheet heat dissipating layer of base lower surface and the outer surface of disc heat dissipating layer is provided with fold 6;
The diameter of through hole is 1.2mm, and the length of side of square shape sheet heat dissipating layer is 5mm; The radius of disc heat dissipating layer is 4.5mm;
The relative both sides of substrate are respectively provided with an end chuck 8 for reinforcing.
In addition, the first described heat radiation module and the second heat radiation module all can be set to a plurality of.Better heat-radiation effect is set when a plurality of.

Claims (2)

1. the accurate wiring board of PCB multilayer with Novel protective structure, is characterized in that, is provided with the first heat radiation module and the second heat radiation module on substrate (1);
The first described heat radiation module comprises 2 square shape sheet heat dissipating layers (2) and 4 posts that lead (5); 2 square shape sheet heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 through holes along substrate thickness direction (4) that 4 posts that lead (5) correspondence is inserted on substrate connect 2 described square shape sheet heat dissipating layers;
The second described heat radiation module comprises 2 disc heat dissipating layers (3) and 4 posts that lead (5); 2 former shape heat dissipating layers are separately positioned on upper surface and the lower surface of substrate; 4 through holes along substrate thickness direction (4) that 4 posts that lead (5) correspondence is inserted on substrate connect 2 described disc heat dissipating layers;
The square shape sheet heat dissipating layer and the disc heat dissipating layer that are positioned at upper surface of base plate are respectively provided with a finned radiator (7);
Be positioned at the square shape sheet heat dissipating layer of base lower surface and the outer surface of disc heat dissipating layer is provided with fold (6);
The diameter of through hole is 1.2mm, and the length of side of square shape sheet heat dissipating layer is 5mm; The radius of disc heat dissipating layer is 4.5mm;
The relative both sides of substrate are respectively provided with an end chuck (8) for reinforcing.
2. the accurate wiring board of PCB multilayer with Novel protective structure according to claim 1, is characterized in that, the first described heat radiation module and the second heat radiation module are a plurality of.
CN201420328071.XU 2014-06-19 2014-06-19 A kind of accurate wiring board of PCB multilayer with Novel protective structure Expired - Fee Related CN204014253U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420328071.XU CN204014253U (en) 2014-06-19 2014-06-19 A kind of accurate wiring board of PCB multilayer with Novel protective structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420328071.XU CN204014253U (en) 2014-06-19 2014-06-19 A kind of accurate wiring board of PCB multilayer with Novel protective structure

Publications (1)

Publication Number Publication Date
CN204014253U true CN204014253U (en) 2014-12-10

Family

ID=52054188

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420328071.XU Expired - Fee Related CN204014253U (en) 2014-06-19 2014-06-19 A kind of accurate wiring board of PCB multilayer with Novel protective structure

Country Status (1)

Country Link
CN (1) CN204014253U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141210

Termination date: 20190619