CN203982422U - In contact type intelligent card, expect - Google Patents
In contact type intelligent card, expect Download PDFInfo
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- CN203982422U CN203982422U CN201420391483.8U CN201420391483U CN203982422U CN 203982422 U CN203982422 U CN 203982422U CN 201420391483 U CN201420391483 U CN 201420391483U CN 203982422 U CN203982422 U CN 203982422U
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Abstract
The utility model discloses in a kind of contact type intelligent card and expect, it comprises an insulating substrate, this insulating substrate is provided with hole, in this hole, be fixed with an IC, on the welding region of described IC, be welded with two substantially parallel wires, on this insulating substrate, be also laid with an insulated coil, this insulated coil comprises top part and end portion, this top part, end portion respectively with a wire bonds.The utility model product structure is simply ingenious, in welding process, soldered joint does not generate heat, just top part, end portion, the conductor overheating of coil, partial melting is welded and fixed, thereby has avoided producing a large amount of, large-area high heat on insulating substrate, IC, can or IC not burnt insulating substrate burn-through, stable and reliable product quality, can significantly reduce the production cost of enterprise, enhances productivity.
Description
Technical field
The utility model relates to smart card and manufactures field, in the preparation method who particularly expects in a kind of contactless smart card and contact type intelligent card obtained by this method, expects.
Background technology
IC-card is that the English of integrated circuit card is called for short, and is also referred to as smart card, smart card, chip card etc. in some country.A special integrated circuit (IC) chip is embedded in plastic substrate, is packaged into the similar card form of profile and magnetic card, make a sheet smart card.
In the manufacture process of smart card, be generally the preparation of first carrying out middle material, namely on insulating substrate, lay insulated coil, fixing IC, and insulated coil and IC are welded.Complete after the preparation of material, the upper and lower surface of the insulating substrate top layer that is all adhesively fixed, completes the production run of smart card.
In existing middle material manufacturing technique, generally directly top part, the end portion of insulated coil to be welded on IC, in traditional welding manner, the soldered joint adopting all can send high heat, in the process of welding, the larger soldered joint of volume is when near insulating substrate, operate and careless slightlyly even IC is burnt just easily by insulating substrate burn-through, middle material fraction defective is higher, thereby caused the production cost of enterprise higher, production efficiency is low.
Summary of the invention
The purpose of this utility model is, provide in a kind of contactless smart card and expect, its simple and ingenious structure, avoid producing a large amount of, large-area high heat on insulating substrate, IC, can or IC not burnt insulating substrate burn-through, stable and reliable product quality, can significantly reduce the production cost of enterprise, enhances productivity.
The technical scheme that the utility model adopted is for achieving the above object:
In a kind of contact type intelligent card, expect, it comprises an insulating substrate, this insulating substrate is provided with hole, in this hole, be fixed with an IC, on the welding region of described IC, be welded with two substantially parallel wires, on this insulating substrate, be also laid with an insulated coil, this insulated coil comprises top part and end portion, this top part, end portion respectively with a wire bonds.
Described insulating substrate is plastic sheet, and the thickness of this insulating substrate is 0.1-0.2mm.
Described insulated coil is formed by enamel covered wire coiling, and the diameter of this enamel covered wire is 0.1-0.12mm.
Described wire is tinned wird, and the diameter of this tinned wird is 0.1-0.12mm.
A preparation method who expects in contactless smart card, it comprises the following steps:
(1) on insulating substrate, lay insulated coil, this insulated coil comprises top part and end portion;
(2) IC is fixed in the hole on insulating substrate;
(3) two wires are welded in respectively on the welding region of this IC, these two wires are substantially parallel;
(4) by the top part of this insulated coil, end portion respectively with a wire bonds.
In described step (3), a wire in two wires is contacted with the welding region surface of IC, the part two ends that contact with IC welding region at this wire arrange respectively an electrode A and an electrode B, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electrode B from electrode A by wire, makes the part contacting with IC welding region of wire produce heat, thereby partial melting, is fixed on the welding region of IC this wire bonds; Another wire is carried out to same operation, another wire bonds is fixed on the welding region of IC.
In described step (4), the top part of insulated coil is contacted with a wire in two wires, at the part two ends that contact with top insulated coil part this wire, an electrode A and an electrode B are set respectively, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electric current B from electrode A by wire, make the part contacting with top insulated coil part wire produce heat, thereby partial melting, makes the top part of insulated coil and wire generation be welded and fixed effect;
The end portion of insulated coil is contacted with another wire in two wires, at the part two ends that contact with end portion insulated coil this wire, an electrode A and an electrode B are set respectively, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electric current B from electrode A by wire, make the part contacting with end portion insulated coil wire produce heat, thereby partial melting, makes the end portion of insulated coil and wire generation be welded and fixed effect.
Described step (1), (2) order are in no particular order.
Described insulating substrate is plastic sheet, and the thickness of this insulating substrate is 0.1-0.2mm.
Described insulated coil is formed by enamel covered wire coiling, and the diameter of this enamel covered wire is 0.1-0.12mm.
Described wire is tinned wird, and the diameter of this tinned wird is 0.1-0.12mm.
The beneficial effects of the utility model are: the utility model product structure is simply ingenious, in welding process, soldered joint does not generate heat, just top part, end portion, the conductor overheating of coil, partial melting is welded and fixed, thereby has avoided producing a large amount of, large-area high heat on insulating substrate, IC, can or IC not burnt insulating substrate burn-through, stable and reliable product quality, can significantly reduce the production cost of enterprise, enhances productivity.
Below in conjunction with accompanying drawing and embodiment, the utility model is further illustrated.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Embodiment: as shown in Figure 1, in a kind of contact type intelligent card of the utility model, expect, it comprises an insulating substrate 1, this insulating substrate 1 is provided with hole, in this hole, be fixed with an IC3, on the welding region of described IC3, be welded with two substantially parallel wires 4, on this insulating substrate 1, be also laid with an insulated coil 2, this insulated coil 2 comprises top part 21 and end portion 22, and this top part 21, end portion 22 are welded with a wire 4 respectively.
Described insulating substrate 1 is plastic sheet, and the thickness of this insulating substrate 1 is 0.1-0.2mm.
Described insulated coil 2 is formed by enamel covered wire coiling, and this insulated coil 2 is rectangle, can be also other rule or irregular shapes, and the diameter of this enamel covered wire is 0.1-0.12mm.
Described wire 4 is tinned wird, and the diameter of this tinned wird is 0.1-0.12mm.
The preparation method who expects in described contactless smart card, it comprises the following steps:
(1) on insulating substrate 1, lay insulated coil 2, this insulated coil 2 comprises top part 21 and end portion 22;
(2) IC3 is fixed in the hole on insulating substrate 1;
(3) two wires 4 are welded in respectively on the welding region of this IC3, these two wires 4 are substantially parallel;
(4) the top part 21 of this insulated coil 2, end portion 22 are welded with a wire 4 respectively.
In described step (3), a wire 4 in two wires 4 is contacted with the welding region surface of IC3, the part two ends that contact with IC3 welding region at this wire 4 arrange respectively an electrode A and an electrode B, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electrode B from electrode A by wire 4, make the part contacting with IC3 welding region of wire 4 produce heat, thereby partial melting, is fixedly welded on the welding region of IC3 this wire 4; Another wire 4 is carried out to same operation, another wire 4 is fixedly welded on the welding region of IC3.
In described step (4), the top part 21 of insulated coil is contacted with a wire 4 in two wires 4, at the part two ends that contact with top insulated coil part 21 this wire 4, an electrode A and an electrode B are set respectively, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electric current B from electrode A by wire 4, make the part contacting with top insulated coil part 21 wire 4 produce heat, thereby partial melting, makes the top part 21 of insulated coil produce and be welded and fixed effect with wire 4;
The end portion 22 of insulated coil is contacted with another wire 4 in two wires 4, the part two ends that contact in end portion 22 this wire 4 and insulated coil arrange respectively an electrode A and an electrode B, this electrode A, electrode B are connected a stabilized power source, export a burning voltage by this stabilized power source, electric current flows to electric current B from electrode A by wire 4, make the part that end portion 22 wire 4 and insulated coil contacts produce heat, thereby partial melting, makes the end portion 22 of insulated coil produce and be welded and fixed effect with wire 4.
Described step (1), (2) order are in no particular order.
Described insulating substrate 1 is plastic sheet, and the thickness of this insulating substrate 1 is 0.1-0.2mm.
Described insulated coil 2 is formed by enamel covered wire coiling, and this insulated coil 2 is rectangle, can be also other rule or irregular shapes, and the diameter of this enamel covered wire is 0.1-0.12mm.
Described wire 4 is tinned wird, and the diameter of this tinned wird is 0.1-0.12mm.
In welding process, soldered joint does not generate heat, and just top part 21, end portion 22, the wire 4 of insulated coil 2 generate heat, and partial melting is welded and fixed, thereby avoid producing a large amount of, large-area high heat on insulating substrate 1, IC3, can or IC3 not burnt insulating substrate 1 burn-through.The utility model product structure is simply ingenious, and stable and reliable product quality can significantly reduce the production cost of enterprise, enhances productivity.
The foregoing is only preferred embodiment of the present utility model, all equalizations of doing according to the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (4)
1. in a contact type intelligent card, expect, it is characterized in that: it comprises an insulating substrate, this insulating substrate is provided with hole, in this hole, be fixed with an IC, on the welding region of described IC, be welded with two substantially parallel wires, on this insulating substrate, be also laid with an insulated coil, this insulated coil comprises top part and end portion, this top part, end portion respectively with a wire bonds.
2. in contact type intelligent card according to claim 1, expect, it is characterized in that, described insulating substrate is plastic sheet, and the thickness of this insulating substrate is 0.1-0.2mm.
3. in contact type intelligent card according to claim 1 and 2, expect, it is characterized in that, described insulated coil is formed by enamel covered wire coiling, and the diameter of this enamel covered wire is 0.1-0.12mm.
4. in contact type intelligent card according to claim 1 and 2, expect, it is characterized in that, described wire is tinned wird, and the diameter of this tinned wird is 0.1-0.12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420391483.8U CN203982422U (en) | 2014-07-16 | 2014-07-16 | In contact type intelligent card, expect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420391483.8U CN203982422U (en) | 2014-07-16 | 2014-07-16 | In contact type intelligent card, expect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203982422U true CN203982422U (en) | 2014-12-03 |
Family
ID=51979849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420391483.8U Active CN203982422U (en) | 2014-07-16 | 2014-07-16 | In contact type intelligent card, expect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203982422U (en) |
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2014
- 2014-07-16 CN CN201420391483.8U patent/CN203982422U/en active Active
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