CN203968553U - A kind of low-melting-point metal radiator - Google Patents
A kind of low-melting-point metal radiator Download PDFInfo
- Publication number
- CN203968553U CN203968553U CN201420291166.9U CN201420291166U CN203968553U CN 203968553 U CN203968553 U CN 203968553U CN 201420291166 U CN201420291166 U CN 201420291166U CN 203968553 U CN203968553 U CN 203968553U
- Authority
- CN
- China
- Prior art keywords
- melting
- low
- point metal
- radiator
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 58
- 239000002184 metal Substances 0.000 title claims abstract description 58
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 230000003647 oxidation Effects 0.000 claims abstract description 6
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 6
- 230000009849 deactivation Effects 0.000 claims abstract description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical group [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 238000009423 ventilation Methods 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000006071 cream Substances 0.000 description 5
- 239000004519 grease Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of low-melting-point metal radiator, and it is made up of radiating fin, low-melting-point metal layer and anti-oxidation pad pasting.Described radiating fin is for cross-ventilation heat radiation.Described low-melting-point metal layer is coated on radiating fin bottom by spraying coating process by low-melting-point metal and forms; Melted by heat when low-melting-point metal layer is worked at radiator, fills gap between thermal source and radiating fin, reduces contact heat resistance.Described anti-oxidation pad pasting can completely cut off air, prevents low-melting-point metal oxidation deactivation.A kind of low-melting-point metal radiator heat-dissipation effect of the present utility model is remarkable, designs ingeniously, easy to use, can be widely used in the field of radiatings such as CPU, LED and laser.
Description
Technical field
The utility model relates to a kind of low-melting-point metal radiator, and it utilizes spraying coating process to make low-melting-point metal be overlying on radiating fin bottom, and when radiator work, gap between radiating fin and thermal source is filled in low-melting-point metal fusing, reduces contact heat resistance.Anti-oxidation pad pasting can prevent low-melting-point metal oxidation before radiator uses, and avoids reducing the heat-transfer effect of low-melting-point metal.
Background technology
The radiator of the equipment such as existing CPU, LED, when use, is all that heat-conducting silicone grease is applied between thermal source and radiator artificially.Some heat-conducting silicone greases, need low temperature to preserve, to ensure that its active ingredient did not lose efficacy, and had increased operation maintenance cost.Radiator separates transport with heat-conducting silicone grease, and user is by manually smearing or screen printing mode makes both combinations, cost of transportation high and use not convenient.Manually smear or silk screen printing, heat-conducting silicone grease has certain waste, and thickness, applying amount, the more difficult control of scribble effect, has increased the uncertainty of the process of smearing, and affects the result of use of heat-conducting silicone grease.
Low-melting-point metal is the natural metal alloy of a class, has advantages of that thermal conductivity is high, stable performance, life-span be long.In addition, low-melting-point metal is as simple metal heat-conducting cream, do not have in traditional heat-conducting cream organic substance volatilization, the heat-conducting cream problem losing efficacy that becomes dry of being heated.Based on this new material of low-melting-point metal, low-melting-point metal heat-conducting cream and conducting strip are developed at present, both all have good heat-transfer effect, but it is the same with traditional heat-conducting silicone grease, has inconvenient problem with use, for this reason, the present invention proposes a kind of low-melting-point metal radiator, utilizes low-melting-point metal spraying coating process to make low-melting-point metal adhere to radiating fin bottom, makes low-melting-point metal and radiating fin integrated, in the middle of reducing, smear link, easy to use.
Summary of the invention
The utility model provides a kind of low-melting-point metal radiator, and this kind of radiator adopts metal spraying technique, makes low-melting-point metal adhere to radiating fin bottom, for reducing the contact heat resistance between thermal source and radiating fin; Anti-oxidation pad pasting seals low-melting-point metal, can prevent low-melting-point metal oxidation, avoids reducing the radiating effect of radiator.A kind of low-melting-point metal radiator heat-dissipation effect of the present utility model is remarkable, designs ingenious, easy to use; Can be widely used in the field of radiatings such as CPU, LED and laser.
A kind of low-melting-point metal radiator that the utility model provides, it is composed as follows:
One radiating fin;
One low-melting-point metal layer;
One anti-oxidation pad pasting.
Described low-melting-point metal is gallium-base alloy or bismuth-base alloy.
Described bismuth-base alloy is bismuth indium stannum alloy or bismuth indium red brass.
Described low-melting-point metal layer forms for low-melting-point metal being coated on to radiating fin bottom by spraying coating process.Melted by heat when low-melting-point metal layer is worked at radiator, fills gap between thermal source and radiator, reduces contact heat resistance.
Described radiating fin material is aluminium, copper or nickel.
The effect of described anti-oxidation pad pasting is to prevent low-melting-point metal oxidation deactivation.
Described antistatic pad pasting material is PP, PE, PET, PC or PVC.
Compared with existing radiator, the utility model has the advantage of:
(1) low-melting-point metal heat conductivility excellence, can significantly reduce the contact heat resistance between thermal source and radiator; And the problem nontoxic, long-time use also there will not be evaporation to lose efficacy, can make cooling system reliable and stable.
(2) low-melting-point metal is overlying on radiating fin bottom by spraying coating process, without manually smearing heat-conducting cream, easy to use.
(3) anti-oxidation pad pasting can prevent low-melting-point metal oxidation effectively, avoids affecting the radiating effect of radiator.
When use, carefully take antistatic pad pasting off, radiating fin bottom is fixed on to thermal source place, along with heat source temperature is increased to low-melting-point metal fusing point (as 60 degrees Celsius), low-melting-point metal fusing, be filled in the air gap between thermal source and radiating fin bottom, effectively reduce the contact heat resistance between thermal source and radiating fin, improve the heat dispersion of radiator.
brief description of the drawings
Fig. 1 is the low-melting-point metal radiator schematic diagram of the utility model embodiment.
Description of reference numerals: 1-radiator; 2-low-melting-point metal; 3-antistatic pad pasting.
embodiment
Further describe the present invention below in conjunction with drawings and the specific embodiments.
Embodiment 1
The present embodiment radiator material is aluminium, and low-melting-point metal composition is bismuth indium stannum alloy, and its fusing point is 60 ° of C, and antistatic adhesive film material is PP.
When use, carefully take antistatic pad pasting off, radiator bottom is fixed on to thermal source place, along with heat source temperature is increased to 60 ° of C, low-melting-point metal fusing, is filled in the air gap between thermal source and radiating fin bottom, effectively reduces the contact resistance between thermal source and radiating fin, improve the heat dispersion of radiator, thereby can indirectly extend the thermal source life-span.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of embodiment of the present invention technical scheme.
Claims (7)
1. a low-melting-point metal radiator, is characterized in that, it is composed as follows:
One radiating fin;
One low-melting-point metal layer;
One anti-oxidation pad pasting.
2. by a kind of low-melting-point metal radiator claimed in claim 1, it is characterized in that, described low-melting-point metal is gallium-base alloy or bismuth-base alloy.
3. by a kind of low-melting-point metal radiator claimed in claim 2, it is characterized in that, described bismuth-base alloy is bismuth indium stannum alloy or bismuth indium red brass.
4. by a kind of low-melting-point metal radiator claimed in claim 1, it is characterized in that, described low-melting-point metal layer forms for low-melting-point metal being coated on to radiating fin bottom by spraying coating process; Melted by heat when low-melting-point metal layer is worked at radiator, fills gap between thermal source and radiating fin, reduces contact heat resistance.
5. by a kind of low-melting-point metal radiator claimed in claim 1, it is characterized in that, described radiating fin material is aluminium, copper or nickel.
6. by a kind of low-melting-point metal radiator claimed in claim 1, it is characterized in that, the effect of described anti-oxidation pad pasting is to prevent low-melting-point metal oxidation deactivation.
7. by a kind of low-melting-point metal radiator claimed in claim 1, it is characterized in that, described anti-oxidation pad pasting material is PP, PE, PET, PC or PVC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420291166.9U CN203968553U (en) | 2014-06-04 | 2014-06-04 | A kind of low-melting-point metal radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420291166.9U CN203968553U (en) | 2014-06-04 | 2014-06-04 | A kind of low-melting-point metal radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203968553U true CN203968553U (en) | 2014-11-26 |
Family
ID=51929086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420291166.9U Expired - Lifetime CN203968553U (en) | 2014-06-04 | 2014-06-04 | A kind of low-melting-point metal radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203968553U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3159700A1 (en) * | 2015-10-21 | 2017-04-26 | Honeywell International Inc. | Air data probe heater utilizing low melting point metal |
-
2014
- 2014-06-04 CN CN201420291166.9U patent/CN203968553U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3159700A1 (en) * | 2015-10-21 | 2017-04-26 | Honeywell International Inc. | Air data probe heater utilizing low melting point metal |
| CN106610304A (en) * | 2015-10-21 | 2017-05-03 | 霍尼韦尔国际公司 | Air data probe heater utilizing low melting point metal |
| US9791304B2 (en) | 2015-10-21 | 2017-10-17 | Honeywell International Inc. | Air data probe heater utilizing low melting point metal |
| CN106610304B (en) * | 2015-10-21 | 2021-08-03 | 霍尼韦尔国际公司 | Air data probe heater using low melting point metal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100039, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Patentee after: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. Address before: 100039, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Patentee before: BEIJING EMIKON TECHNOLOGY DEVELOPMENT CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20230420 Granted publication date: 20141126 |
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| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20240604 Granted publication date: 20141126 |