CN104745911A - Preparation method and application of high-viscosity low-melting-point metal heat-conducting fin - Google Patents
Preparation method and application of high-viscosity low-melting-point metal heat-conducting fin Download PDFInfo
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- CN104745911A CN104745911A CN201510077335.8A CN201510077335A CN104745911A CN 104745911 A CN104745911 A CN 104745911A CN 201510077335 A CN201510077335 A CN 201510077335A CN 104745911 A CN104745911 A CN 104745911A
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Abstract
The invention relates to a preparation method and application of a high-viscosity low-melting-point metal heat-conducting fin. The high-viscosity low-melting-point metal heat-conducting fin is obtained by uniformly mixing low-melting-point metals, copper powder and copper oxide according to a certain proportion and method. The low-melting-point metals comprise gallium-base binary alloy, indium-base alloy and bismuth-base alloy. The viscosity and the heat conductivity of the low-melting-point metals can be improved by the copper powder. Affinity of copper oxide and low-melting-point metals under action of copper powder is strong so that the viscosity of the low-melting-point metals can be further improved. The high-viscosity low-melting-point metal heat-conducting fin can quickly absorb heat of a high-temperature object and quickly transmit the heat to a radiator to radiate to reduce the working temperature of the heat source so as to work under low temperature. The high-viscosity low-melting-point metal heat-conducting fin is obvious in heat transmission speed, remarkable in effect and long in service life and can be widely applied in heat conduction radiating fields of spaceflight heat control, advanced energy sources, information electronics and the like.
Description
Technical field
The invention provides a kind of preparation method and application of high viscosity low melting point metal conducting strip, this kind of high viscosity low melting point metal can absorb rapidly the heat of high temp objects, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.The heat conduction and heat radiation fields such as space flight thermal control, the advanced energy, information electronic can be widely used in.
Background technology
Heat-conducting silicone grease is the key component of cooling electronic component.Between electron device surface and scatterer, there is imperceptible rough space, if be directly installed on together by them, the real contact area between them approximately only has 10% of foot of radiator area, and all the other are clearance.Due to the poor conductor that air is heat, thermal contact resistance will be formed between electronic component and scatterer, reduce the usefulness of scatterer.Heat-conducting silicone grease by being filled in get rid of air wherein between electronic heater members and scatterer, and sets up effective thermal conduction path betwixt, reduces thermal contact resistance, promotes heat transfer property.
The low melting point metal heat-conducting cream developed gradually is in recent years the thermal conductivity of a kind of high-end heat interfacial material, its ultra-traditional heat-conducting cream far away, and heat-transfer effect is remarkable.Common low melting point metal heat-conducting cream is gallium-base alloy, because its fusing point is low, be in a liquid state, be suitable as interface heat sink material most under normal temperature, but its mobility is very much not easy to apply, easily occurs trickling Problem of Failure.Subsequently, other investigator adds metal oxide or organism in liquid metal, its adhesivity is improved greatly, is easy to smear, more convenient to operate.But, due to metal oxide or organic thermal conductivity very low, the heat transfer property of low melting point metal heat-conducting cream will be reduced.
For solving the problem, the present invention proposes a kind of preparation method and application of high viscosity low melting point metal conducting strip, and this kind of high viscosity low melting point metal conducting strip can absorb rapidly the heat of high temp objects, heat is passed to rapidly scatterer and dispels the heat.
Summary of the invention
The object of the present invention is to provide a kind of preparation method and application of high viscosity low melting point metal conducting strip, this high viscosity low melting point metal conducting strip can absorb rapidly the heat of high temp objects, after fusing, one can be formed with thermal source and scatterer, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.Meanwhile, copper powder add low melting point metal, low melting point metal viscosity is improved greatly, though low melting point metal fusing, also there will not be the problem that metal is revealed.
Technical scheme of the present invention is as follows:
The preparation method of high viscosity low melting point metal conducting strip and an application, is characterized in that, it is mixed with mode in certain proportion by low melting point metal, copper powder and cupric oxide and obtains;
Described low melting point metal is gallium base binary alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
Described gallium base binary alloy is the one in gallium-indium alloy, gallium lead alloy or gallium mercury alloys.
Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin zinc alloy.
Described indium-base alloy is the one in indium bismuth copper alloy or indium bismuth tin alloy.
Described bismuth-base alloy is bismuth tin alloy.
In described indium bismuth tin alloy, the massfraction of each metal is respectively indium 51%, bismuth 32.5%, tin 16.5%.
Described copper powder particle diameter range is 1 μm ~ 5mm.
In described high viscosity low melting point metal, the massfraction scope of each component is as follows: copper powder is 0.01% ~ 50%, and cupric oxide is 0.01% ~ 20%, and all the other are low melting point metal.
The preparation method of described high viscosity low melting point metal conducting strip is as follows: prepared by (1) high viscosity low melting point metal: after low melting point metal heat fused, both copper powder and cupric oxide can be added in multiple times in the low melting point metal of fusing on a small quantity, or a small amount of surface attachment of adding certain mass mark in multiple times in the low melting point metal of fusing has the copper powder of cupric oxide, simultaneously, low melting point metal is stirred, until copper powder and cupric oxide mix with low melting point metal; (2) high viscosity low melting point metal conducting strip preparation: regular rectangular parallelepiped made by the low melting point metal of the fusing (1) step obtained, then be placed on milling train and be rolled, namely obtain a kind of high viscosity low melting point metal conducting strip of the present invention.
The thickness range of described high viscosity low melting point metal conducting strip is 0.01mm ~ 0.15mm.
During use, high viscosity low melting point metal conducting strip is placed between thermal source and scatterer, and closely fixes.First time is when using, conducting strip and be hard contact between thermal source and scatterer, and thermal contact resistance is larger, therefore raise gradually along with heat source temperature, when reaching the fusing point of conducting strip, conducting strip will melt, due to the existence of copper powder, low melting point metal can not be revealed because of fusing.After metal cools is solidified, high viscosity low melting point metal conducting strip and combining closely between thermal source and scatterer, thermal contact resistance reduces greatly, when reusing, no matter whether metal melts, and it all can absorb rapidly the heat of thermal source, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.
The preparation method of a kind of high viscosity low melting point metal conducting strip of the present invention and application, tool has the following advantages:
(1) high viscosity low melting point metal conducting strip of the present invention is made up of metal and cupric oxide, and without any volatile matter, life-time service also can not lose efficacy because volatilization becomes dry, and the life-span is long.
(2) high viscosity low melting point metal conducting strip of the present invention is easy to use, and to thermal source and scatterer corrosion-free.
(3) after high viscosity low melting point metal conducting strip fusing of the present invention, viscosity is very high, and there will not be the phenomenon that trickling is leaked, compare with conducting strip with existing heat-conducting cream, advantage is obvious especially.
(4) the present invention adds viscosity and the thermal conductivity that copper powder can improve low melting point metal in low melting point metal, can improve again the affinity of cupric oxide and low melting point metal.
Accompanying drawing explanation
Fig. 1 is that in embodiment 1, a kind of high viscosity low melting point metal conducting strip is applied to the structural representation in heat-removal system.
Description of reference numerals: 1-high viscosity low melting point metal conducting strip, 2-scatterer, 3-thermal source.
Embodiment
The present invention is further described below in conjunction with drawings and the specific embodiments.
Embodiment 1
Embodiment 1 illustrates a kind of typically used of a kind of high viscosity low melting point metal conducting strip in the present invention.Fig. 1 is the structural representation that a kind of high viscosity low melting point metal conducting strip is applied in heat-removal system.Wherein: 1 is high viscosity low melting point metal conducting strip, and 2 is scatterer, and 3 is thermal source.
A kind of high viscosity low melting point metal conducting strip of the present embodiment, low melting point metal is bismuth indium stannum alloy (alloy mass mark is: Bi 32.5%, In 51%, Sn 16.5%), and fusing point is 60 ° of C.The massfraction of copper powder accounts for 10%, and particle diameter is 4 μm.The massfraction of cupric oxide accounts for 0.01%.Conducting strip thickness is 0.05mm.
During use, high viscosity low melting point metal conducting strip is placed between thermal source and scatterer, and closely fixes.First time is when using, conducting strip and be hard contact between thermal source and scatterer, and thermal contact resistance is larger, therefore raise gradually along with heat source temperature, when reaching the fusing point of conducting strip, conducting strip will melt, due to the existence of copper powder, low melting point metal can not be revealed because of fusing.After metal cools is solidified, high viscosity low melting point metal conducting strip and combining closely between thermal source and scatterer, thermal contact resistance reduces greatly, when reusing, no matter whether metal melts, and it all can absorb rapidly the heat of thermal source, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.
During experiment, the conducting strip of existing widely used typical rich grace heat-conducting cream and the present embodiment is adopted to be contrast experiment.Experiment shows, by measuring and calculating, for the temperature difference between thermal source and scatterer, the conducting strip using the present embodiment relatively with rich grace heat-conducting cream, the temperature difference is low 3 ° of about C.
Embodiment 2
Fig. 1 is the structural representation that a kind of high viscosity low melting point metal conducting strip is applied in heat-removal system.Wherein: 1 is high viscosity low melting point metal conducting strip, and 2 is scatterer, and 3 is thermal source.
A kind of high viscosity low melting point metal conducting strip of the present embodiment, low melting point metal is bismuth indium stannum alloy (alloy mass mark is: Bi 32.5%, In 5 1%, Sn 16.5%), and fusing point is 60 ° of C.The massfraction of copper powder accounts for 50%, and particle diameter is 1 μm.The massfraction of cupric oxide accounts for 0.01%.Conducting strip thickness is 0.01mm.
During use, high viscosity low melting point metal conducting strip is placed between thermal source and scatterer, and closely fixes.First time is when using, conducting strip and be hard contact between thermal source and scatterer, and thermal contact resistance is larger, therefore raise gradually along with heat source temperature, when reaching the fusing point of conducting strip, conducting strip will melt, due to the existence of copper powder, low melting point metal can not be revealed because of fusing.After metal cools is solidified, high viscosity low melting point metal conducting strip and combining closely between thermal source and scatterer, thermal contact resistance reduces greatly, when reusing, no matter whether metal melts, and it all can absorb rapidly the heat of thermal source, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.
During experiment, the conducting strip of existing widely used typical rich grace heat-conducting cream and the present embodiment is adopted to compare experiment.Experiment shows, by measuring and calculating, for the temperature difference between thermal source and scatterer, the conducting strip using the present embodiment relatively with rich grace heat-conducting cream, the temperature difference is low 4 ° of about C.
Embodiment 3
Fig. 1 is the structural representation that a kind of high viscosity low melting point metal conducting strip is applied in heat-removal system.Wherein: 1 is high viscosity low melting point metal conducting strip, and 2 is scatterer, and 3 is thermal source.
A kind of high viscosity low melting point metal conducting strip of the present embodiment, low melting point metal is bismuth indium stannum alloy (alloy mass mark is: Bi 32.5%, In 51%, Sn 16.5%), and fusing point is 60 ° of C.The massfraction of copper powder accounts for 5%, and particle diameter is 5mm.The massfraction of cupric oxide accounts for 20%.Conducting strip thickness is 0.15mm.
During use, high viscosity low melting point metal conducting strip is placed between thermal source and scatterer, and closely fixes.First time is when using, conducting strip and be hard contact between thermal source and scatterer, and thermal contact resistance is larger, therefore raise gradually along with heat source temperature, when reaching the fusing point of conducting strip, conducting strip will melt, due to the existence of copper powder, low melting point metal can not be revealed because of fusing.After metal cools is solidified, high viscosity low melting point metal conducting strip and combining closely between thermal source and scatterer, thermal contact resistance reduces greatly, when reusing, no matter whether metal melts, and it all can absorb rapidly the heat of thermal source, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.
During experiment, the conducting strip of existing widely used typical rich grace heat-conducting cream and the present embodiment is adopted to be contrast experiment.Experiment shows, by measuring and calculating, for the temperature difference between thermal source and scatterer, the conducting strip using the present embodiment relatively with rich grace heat-conducting cream, the temperature difference is low 2 ° of about C.
Embodiment 4
Fig. 1 is the structural representation that a kind of high viscosity low melting point metal conducting strip is applied in heat-removal system.Wherein: 1 is high viscosity low melting point metal conducting strip, and 2 is scatterer, and 3 is thermal source.
A kind of high viscosity low melting point metal conducting strip of the present embodiment, low melting point metal is bismuth indium stannum alloy (alloy mass mark is: Bi 32.5%, In 51%, Sn 16.5%), and fusing point is 60 ° of C.The massfraction of copper powder accounts for 0.01%.The massfraction of cupric oxide accounts for 10%.Conducting strip thickness is 0.05mm.
During use, high viscosity low melting point metal conducting strip is placed between thermal source and scatterer, and closely fixes.First time is when using, conducting strip and be hard contact between thermal source and scatterer, and thermal contact resistance is larger, therefore raise gradually along with heat source temperature, when reaching the fusing point of conducting strip, conducting strip will melt, due to the existence of copper powder, low melting point metal can not be revealed because of fusing.After metal cools is solidified, high viscosity low melting point metal conducting strip and combining closely between thermal source and scatterer, thermal contact resistance reduces greatly, when reusing, no matter whether metal melts, and it all can absorb rapidly the heat of thermal source, and heat is passed to rapidly scatterer and dispel the heat, reduce the working temperature of thermal source, can work at a lower temperature.
During experiment, the conducting strip of existing widely used typical rich grace heat-conducting cream and the present embodiment is adopted to be contrast experiment.Experiment shows, by measuring and calculating, for the temperature difference between thermal source and scatterer, the conducting strip using the present embodiment relatively with rich grace heat-conducting cream, the temperature difference is low 2 ° of about C.
Finally illustrate, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted.Although with reference to embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, modify to technical scheme of the present invention or equivalent replacement, do not depart from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (10)
1. the preparation method of high viscosity low melting point metal conducting strip and an application, it is characterized in that, it is mixed with method in certain proportion by low melting point metal, copper powder and cupric oxide and obtains;
Described low melting point metal is gallium base binary alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
2., by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 1, it is characterized in that, described gallium base binary alloy is the one in gallium-indium alloy, gallium lead alloy or gallium mercury alloys.
3., by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 1, it is characterized in that, described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin zinc alloy.
4. by the preparation method of a kind of high viscosity low melting point metal conducting strip according to claim 1 and application, it is characterized in that, described indium-base alloy is the one in indium bismuth copper alloy or indium bismuth tin alloy.
5., by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 1, it is characterized in that, described bismuth-base alloy is bismuth tin alloy.
6., by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 4, it is characterized in that, in described indium bismuth tin alloy, the massfraction of each metal is respectively indium 51%, bismuth 32.5%, tin 16.5%.
7., by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 1, it is characterized in that, described copper powder particle diameter range is 1 μm ~ 5mm.
8. by preparation method and the application of a kind of high viscosity low melting point metal conducting strip according to claim 1, it is characterized in that, in described high viscosity low melting point metal, the massfraction scope of each component is as follows: copper powder is 0.01% ~ 50%, cupric oxide is 0.01% ~ 20%, and all the other are low melting point metal.
9. the preparation method and application of a high viscosity low melting point metal conducting strip, it is characterized in that, the preparation method of described high viscosity low melting point metal conducting strip is as follows: prepared by (1) high viscosity low melting point metal: after low melting point metal heat fused, both copper powder and cupric oxide can be added in multiple times in the low melting point metal of fusing on a small quantity, or a small amount of surface attachment of adding certain mass mark in multiple times in the low melting point metal of fusing has the copper powder of cupric oxide, simultaneously, low melting point metal is stirred, until copper powder and cupric oxide mix with low melting point metal; (2) high viscosity low melting point metal conducting strip preparation: regular rectangular parallelepiped made by the low melting point metal of the fusing (1) step obtained, then be placed on milling train and be rolled, namely obtain a kind of high viscosity low melting point metal conducting strip of the present invention.
10. preparation method and application for high viscosity low melting point metal conducting strip, is characterized in that, the thickness range of described high viscosity low melting point metal conducting strip is 0.01mm ~ 0.15mm.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104966374A (en) * | 2015-07-08 | 2015-10-07 | 北京依米康科技发展有限公司 | Low-melting point metal thermoelectric fire alarm device |
| CN104992742A (en) * | 2015-07-08 | 2015-10-21 | 北京依米康科技发展有限公司 | High-viscosity and low-melting-point metal conductive paste and preparation method and application thereof |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
| CN105400497A (en) * | 2015-10-28 | 2016-03-16 | 苏州天脉导热科技有限公司 | All-metal heat conducting paste and preparation method thereof |
| CN105838919A (en) * | 2016-05-04 | 2016-08-10 | 无锡市嘉邦电力管道厂 | Low-melting-point metal alloy heat conduction material and preparing method thereof |
| CN110343927A (en) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | A method of reducing liquid metal alloy thermally conductive sheet thermal resistance |
| CN111690381A (en) * | 2020-07-22 | 2020-09-22 | 福建美庆热传科技有限公司 | Liquid metal heat-conducting paste and preparation method thereof |
| CN112358854A (en) * | 2020-10-12 | 2021-02-12 | 湖南中材盛特新材料科技有限公司 | Liquid metal heat-conducting paste and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104966374A (en) * | 2015-07-08 | 2015-10-07 | 北京依米康科技发展有限公司 | Low-melting point metal thermoelectric fire alarm device |
| CN104992742A (en) * | 2015-07-08 | 2015-10-21 | 北京依米康科技发展有限公司 | High-viscosity and low-melting-point metal conductive paste and preparation method and application thereof |
| CN105400497A (en) * | 2015-10-28 | 2016-03-16 | 苏州天脉导热科技有限公司 | All-metal heat conducting paste and preparation method thereof |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
| CN105838919A (en) * | 2016-05-04 | 2016-08-10 | 无锡市嘉邦电力管道厂 | Low-melting-point metal alloy heat conduction material and preparing method thereof |
| CN110343927A (en) * | 2019-07-18 | 2019-10-18 | 深圳前海量子翼纳米碳科技有限公司 | A method of reducing liquid metal alloy thermally conductive sheet thermal resistance |
| CN110343927B (en) * | 2019-07-18 | 2021-01-08 | 深圳前海量子翼纳米碳科技有限公司 | Method for reducing thermal resistance of liquid metal alloy heat-conducting fin |
| CN111690381A (en) * | 2020-07-22 | 2020-09-22 | 福建美庆热传科技有限公司 | Liquid metal heat-conducting paste and preparation method thereof |
| CN112358854A (en) * | 2020-10-12 | 2021-02-12 | 湖南中材盛特新材料科技有限公司 | Liquid metal heat-conducting paste and preparation method and application thereof |
| CN115213430A (en) * | 2021-10-08 | 2022-10-21 | 湖南云箭集团有限公司 | 3D printing powder material forming temperature field blank slow-seepage device and application thereof |
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